JP1727916S - Carrier substrate for handling - Google Patents
Carrier substrate for handlingInfo
- Publication number
- JP1727916S JP1727916S JP2021022501F JP2021022501F JP1727916S JP 1727916 S JP1727916 S JP 1727916S JP 2021022501 F JP2021022501 F JP 2021022501F JP 2021022501 F JP2021022501 F JP 2021022501F JP 1727916 S JP1727916 S JP 1727916S
- Authority
- JP
- Japan
- Prior art keywords
- handling
- resin
- article
- carrier substrate
- microstructure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
本物品は微小構造体や薄化されたウエハを取り扱うためのハンドリング用キャリア基板である。本物品は、例えば直径５０～４５０ｍｍのシリコンウエハ等の円盤状の板上に透明樹脂を備えており、前記樹脂上に半導体素子、マイクロＬＥＤ素子等の微小構造体や薄化されたウエハを載置し、ハンドリングするために用いられる。前記微小構造体や薄化されたウエハを前記樹脂上に載置した状態で例えば、洗浄、加工、運搬、他基板への転写等の工程が施される。また、本物品は前記透明樹脂表面に格子状に配置されている凸型形状突起を備えている。この凸型形状突起の形状は四角錐台形状である。The article is a handling carrier substrate for handling microstructures and thinned wafers. The article comprises a transparent resin on a disc-shaped plate such as a silicon wafer having a diameter of 50 to 450 mm, and a microstructure such as a semiconductor element, a micro LED element, or a thinned wafer is placed on the resin. used for placement and handling. For example, steps such as cleaning, processing, transportation, and transfer to another substrate are performed while the microstructure and the thinned wafer are mounted on the resin. Further, the article has convex-shaped protrusions arranged in a grid pattern on the surface of the transparent resin. The shape of this convex-shaped projection is a truncated quadrangular pyramid.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022501F JP1727916S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
| US29/835,098 USD1054388S1 (en) | 2021-10-15 | 2022-04-15 | Carrier substrate for handling |
| TW112302142F TWD227746S (en) | 2021-10-15 | 2022-04-15 | Career substrate for handling microstructure and thinned wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022501F JP1727916S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1727916S true JP1727916S (en) | 2022-10-21 |
Family
ID=83638433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021022501F Active JP1727916S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1727916S (en) |
| TW (1) | TWD227746S (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1658652S (en) | 2019-08-07 | 2020-04-27 |
-
2021
- 2021-10-15 JP JP2021022501F patent/JP1727916S/en active Active
-
2022
- 2022-04-15 TW TW112302142F patent/TWD227746S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD227746S (en) | 2023-09-21 |
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