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US3725220A - Electrodeposition of copper from acidic baths - Google Patents

Electrodeposition of copper from acidic baths Download PDF

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Publication number
US3725220A
US3725220A US00248160A US3725220DA US3725220A US 3725220 A US3725220 A US 3725220A US 00248160 A US00248160 A US 00248160A US 3725220D A US3725220D A US 3725220DA US 3725220 A US3725220 A US 3725220A
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United States
Prior art keywords
sulfonium
plating bath
copper plating
acid copper
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00248160A
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English (en)
Inventor
R Kessler
F Nobel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
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LeaRonal Inc
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Filing date
Publication date
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Publication of US3725220A publication Critical patent/US3725220A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Definitions

  • ABSTRACT An acid copper plating bath which contains a copper metal salt and a minor amount of a sulfoniumalkanesulfonate or sulfoniumalkanecarboxylate as a brightening agent.
  • lllustrative sulfonium compounds are N-cyclohexyl-2-benzothiazol sulfonium-l propanesulfonate, bis (dimethylthiocarbamyl) sulfonium-l-propanesulfonate, and his (dimethylthiocarbamyl) sulfonium-l-propanecarboxylate.
  • Preferred amounts of the sulfonium compounds range from about 0.001 to 1.0 grams per liter. The use of such acid copper plating baths in the electrodeposition of copper metal is also disclosed.
  • the present invention relates to the electroplating of copper from an aqueous acidic bath. More particularly the invention pertains to an acid copper platingbath containing a minor proportion of a novel brightening agent.
  • Brightening agents such as the organic sulfonic acids and carboxylic acids or their salts offered considerable promise but suffer from certain serious disadvantages. For example, these brighteners have a limited low current density brightness range.
  • novel sulfonium sulfonate or earboxylate brightening agents of this invention have the following formula:
  • each R radical which may be the same or different, is selected from the group, consisting of hydrogen; alkyl having from one to eight carbon atoms, for example; methyl or ethyl; aryl having from six to 12 carbon atoms, for example; phenyl or naphthyl;
  • each R radical may be the same or different and is a lower alkyl having from one to six carbon atoms; and r is l or zero; n is an integer from 1 to 6; R" is selected from the group consisting of hydrogen and the methyl radical; and Z is an anion selected from the group consisting of S0 and COO.
  • the preferred brightening agents are those of the general formula wherein r is zero and each R is lower alkyl having from one to six carbon atoms; Z is SO; and n is an integer from 1 to 6. Especially preferred is the brightening agent wherein eachR' is methyl; n is 3; Z is S0 and r is zero.
  • r is zero and each R is lower alkyl having from one to six carbon atoms; Z is SO; and n is an integer from 1 to 6.
  • eachR' is methyl; n is 3; Z is S0 and r is zero.
  • other brightening agents of this invention also provide satisfactory results.
  • dialkylsulfoniumalkanesulfonates having from one to 18 carbon atoms in the alkyl radical
  • Typical sulfoniumalkanesulfonates include for example: N-cyclophenxyl-2-benzothiazol "sulfonium-1- propanesulfonate;
  • R is a lower aliphatic radical
  • Q and Q are selected from the group consisting of hydrogen, lower alkyl and lower hydroxy-alkyl
  • X, Y and Z are selected from the group consisting of oxygen, sulfur, nitrogen, and the imino radical, at least one of them being sulfur
  • X, Y', and Z are selected from the group consisting of oxygen, sulfur, nitrogen and the imino radical, at least one of them being sulfur.
  • sulfoniumalkanecarboxylates which can be effectively employed as brightening agents in the practice of the present invention are similar to the above described classes of sulfoniumalkanesulfonates except that a carboxyl radical is substituted for the sulfonate radical.
  • Typical sulfoniumalkanecarboxylates include:
  • Bis(dimethylthiocarbamyl)sulfonium-Lpropanesulfonate can be prepared by the reaction of tetramethyl thiuram monosulfide and propane sultone in accordance with the procedure described by Gaertner in U.S. Pat. No. 2,813,898.
  • Other sulfonium sulfonates can be prepared by the same general procedure utilizing the appropriate sulfides and sultones.
  • the corresponding bis(dimethylthiocarbamyl)sulfonium-l-propanecarboxylate can be prepared by the Gaertner procedure, except that propriolactone is substituted for the propane sultone.
  • novel stable brightening agents of this invention may be employed by themselves to obtain very satisfactory brightening effects in the electroplating of copper, they may also be utilized in conjunction with known brightening agents or other additives to improve further the brightening and leveling.
  • the use of the brightening agents of this invention in conjunction with such prior art substances as the carbon-oxygen compounds disclosed in U.S. Pat. No. 3,288,690; polyethylene glycols and methoxy polyethyleneglycols imparts excellent brightness and leveling qualities to the electroplated product.
  • the qualities of the electroplated end product can be enhanced by the inclusion in the electroplating bath of such materials as amine dyes such as described in U.S. Pat. Nos.
  • Preferred other additives include polyethylene glycols and methoxy polyethylene glycols such as Carbowax 5000 having a molecular weight range of 2,000 to 6,000; aminothiazoles and aminothiazolines such as 2- thiazolidinethione; and dyes such as Methyl Violet, Crystal Violet, and Fuchsin. Mixtures of these other additives may also be employed. In general, these other additives are utilized in minor, conventional amounts.
  • a minor but effective amount of the novel brightening agents of this invention are incorporated into the aqueous plating bath prior to the inception of the electrolytic plating operation.
  • the amount of the novel brightening agent to be incorporated into the'plating bath should be sufficient to obtain the brightening effeet desired in each particular case as may be determined by the worker skilled in the art. It has been found in practice that satisfactory results are obtained when the novel brightening agents are present in the electrolyte plating bath in a concentration of from about 0.0001 to 1.5 grams per liter, and most preferably from 0.001 to L0 gram per liter.
  • the usual bath will have the following composition:
  • the sulfuric acid may be substituted with sulfamic or fluoboric acids, while the copper may be salts of other acids such as sulfamic or fluoboric.
  • Example 3 The procedure of Example 1 was followed except that the following materials were also incorporated into the plating bath Material Concentration Carbowax 5000 0.4 gm./liter Methyl violet 0.0l5 gm./liter The copper deposit on the plated material was very bright and leveled in the range of from 1 to l00 ASP,
  • Example 3 Material Concentration Carbowax 5000 Methyl violet 2'Thiazolidienethione 0.4 gmJliter 0.015 gm./liter 0.001 gmJliter EXAMPLE
  • the electroplating bath of Example 3 was set aside and allowed to remain standing for a period of 30 days. Thereafter, Hull cells were rerun in accordance with the procedure set forth in Example 1 yielding a plated final product which showed no substantial deterioration of the brightness or low current density dullness. In addition no brightener decomposition products formed in the plating tank.
  • an acid copper electroplating bath containing a salt of copper and a free acid as the essential constituents, the improvement which comprises the addition to said bath of an amount, sufficient to provide a bright electrodeposit, of a sulfoniurn compound having the structure wherein R is a radical selected from the group consisting of hydrogen; alkyl having from one to eight carbon atoms; aryl having from six to 12 carbon atoms;
  • R is a lower alkyl radical having from oneto six carbon atoms, and r is l or zero; n is an integer from 1 to 6; .R" is selected from 'thegroup consisting of hydrogen and methyl; and Z is an anion selected from the group consisting of S0 and COO. 2. 1n the acid copper plating bath of claim 1 wherein the sulfonium compound is added to said bath in an amount ranging from about 0.001 to 1.0 gram per liter.
  • the sulfonium compound is N-cyclohexyl-2- benzothiazol sulfonium-l-propanesulfonate.
  • the sulfonium compound is bis(dimethylthiocarbamyl) sulfoniuml -propanesulfonate.
  • the sulfonium compound is bis(dimethylthiocarbamyl) sulfoniuml -propanecarboxylate.
  • the sulfonium compound is bis(benzothiazole)sulfonium-l -propanesulfonate.
  • the bath also contains a glycol selected from the group consisting of polyethylene glycol and methoxypolyethylene glycol in an amount sufficient to enhance the brightness of the electrodeposit.
  • the step which comprises electrolyzing an aqueous acid copper solution containing a copper metal salt and an amount, sufficient to provide a bright electrodeposit, of a sulfonium compound having the structure.
  • R is a radical selected from the group consisting of hydrogen; alkyl having from one to eight carbon atoms; aryl having from six to 12 carbon atoms;

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
US00248160A 1972-04-27 1972-04-27 Electrodeposition of copper from acidic baths Expired - Lifetime US3725220A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24816072A 1972-04-27 1972-04-27

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US (1) US3725220A (de)
DE (1) DE2255584C2 (de)
FR (1) FR2186544B1 (de)
GB (1) GB1354840A (de)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
WO1997011591A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Flexible circuits with bumped interconnection capability
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
WO2000026444A1 (en) * 1998-11-03 2000-05-11 The John Hopkins University Copper metallization structure and method of construction
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20040222088A1 (en) * 2003-05-06 2004-11-11 Applied Materials, Inc. Electroformed sputtering target
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20050247576A1 (en) * 2004-05-04 2005-11-10 Tom Glenn M Electrochemical drive circuitry and method
US20060102475A1 (en) * 2004-04-27 2006-05-18 Jianwen Han Methods and apparatus for determining organic component concentrations in an electrolytic solution
US20070170052A1 (en) * 2005-11-25 2007-07-26 Applied Materials, Inc. Target for sputtering chamber
US20080093222A1 (en) * 2004-11-24 2008-04-24 Sumitomo Electric Inudstries Ltd. Molten Salt Bath, Deposit, and Method of Producing Metal Deposit
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US20080308416A1 (en) * 2007-06-18 2008-12-18 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US20080314757A1 (en) * 2007-06-22 2008-12-25 Maria Nikolova Acid copper electroplating bath composition
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
CN115536561A (zh) * 2022-10-11 2022-12-30 广东利尔化学有限公司 一种适用于酸性电镀铜液的光亮剂及其制备方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2910413A (en) * 1955-01-19 1959-10-27 Dehydag Gmbh Brighteners for electroplating baths
US3101305A (en) * 1957-03-16 1963-08-20 Riedel & Co Acid copper plating bath
US3203878A (en) * 1961-02-02 1965-08-31 Dehydag Deutsche Hydriewerke G Acid metal electroplating bath containing an organic sulfonic acid-thioureadithiocarbamic acid reaction product
US3276979A (en) * 1961-08-31 1966-10-04 Dehydag Gmbh Baths and processes for the production of metal electroplates
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3359297A (en) * 1961-07-08 1967-12-19 Dehydag Gmbh Process for the preparation of sulfonic acids having dithiocarbamic acid ester and thiourea or thiosemicarbazide groups
US3400059A (en) * 1964-03-07 1968-09-03 Dehydag Gmbh Acidic copper electroplating baths and method
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
US3502551A (en) * 1966-08-20 1970-03-24 Schering Ag Acid electrolyte for the deposition of bright,levelling copper coatings
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2910413A (en) * 1955-01-19 1959-10-27 Dehydag Gmbh Brighteners for electroplating baths
US3101305A (en) * 1957-03-16 1963-08-20 Riedel & Co Acid copper plating bath
US3203878A (en) * 1961-02-02 1965-08-31 Dehydag Deutsche Hydriewerke G Acid metal electroplating bath containing an organic sulfonic acid-thioureadithiocarbamic acid reaction product
US3359297A (en) * 1961-07-08 1967-12-19 Dehydag Gmbh Process for the preparation of sulfonic acids having dithiocarbamic acid ester and thiourea or thiosemicarbazide groups
US3276979A (en) * 1961-08-31 1966-10-04 Dehydag Gmbh Baths and processes for the production of metal electroplates
US3400059A (en) * 1964-03-07 1968-09-03 Dehydag Gmbh Acidic copper electroplating baths and method
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3502551A (en) * 1966-08-20 1970-03-24 Schering Ag Acid electrolyte for the deposition of bright,levelling copper coatings
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
WO1997011591A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Flexible circuits with bumped interconnection capability
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
US6284121B1 (en) 1997-10-08 2001-09-04 Novellus Systems, Inc. Electroplating system including additive for filling sub-micron features
WO2000026444A1 (en) * 1998-11-03 2000-05-11 The John Hopkins University Copper metallization structure and method of construction
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US7297247B2 (en) 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
US20070246346A1 (en) * 2003-05-06 2007-10-25 Applied Materials, Inc. Electroformed sputtering target
US20040222088A1 (en) * 2003-05-06 2004-11-11 Applied Materials, Inc. Electroformed sputtering target
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20060102475A1 (en) * 2004-04-27 2006-05-18 Jianwen Han Methods and apparatus for determining organic component concentrations in an electrolytic solution
US7427344B2 (en) 2004-04-27 2008-09-23 Advanced Technology Materials, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US20050247576A1 (en) * 2004-05-04 2005-11-10 Tom Glenn M Electrochemical drive circuitry and method
US7427346B2 (en) 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US9512530B2 (en) * 2004-11-24 2016-12-06 Sumitomo Electric Industries, Ltd. Molten salt bath, deposit, and method of producing metal deposit
US20080093222A1 (en) * 2004-11-24 2008-04-24 Sumitomo Electric Inudstries Ltd. Molten Salt Bath, Deposit, and Method of Producing Metal Deposit
US11658016B2 (en) 2005-10-31 2023-05-23 Applied Materials, Inc. Shield for a substrate processing chamber
US10347475B2 (en) 2005-10-31 2019-07-09 Applied Materials, Inc. Holding assembly for substrate processing chamber
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US20070173059A1 (en) * 2005-11-25 2007-07-26 Applied Materials, Inc. Process kit components for titanium sputtering chamber
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20070170052A1 (en) * 2005-11-25 2007-07-26 Applied Materials, Inc. Target for sputtering chamber
US8790499B2 (en) 2005-11-25 2014-07-29 Applied Materials, Inc. Process kit components for titanium sputtering chamber
US20080308416A1 (en) * 2007-06-18 2008-12-18 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US20080314757A1 (en) * 2007-06-22 2008-12-25 Maria Nikolova Acid copper electroplating bath composition
TWI399462B (zh) * 2007-06-22 2013-06-21 Macdermid Inc 酸性銅電鍍浴組成物
EP2195474A4 (de) * 2007-06-22 2013-01-23 Macdermid Inc Zusammensetzung für säurebad zur kupfergalvanisierung
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
JP2010530928A (ja) * 2007-06-22 2010-09-16 マクダーミッド インコーポレーテッド 酸性銅電気めっき浴組成物
EP2195474A2 (de) * 2007-06-22 2010-06-16 MacDermid, Incorporated Zusammensetzung für säurebad zur kupfergalvanisierung
WO2009002385A3 (en) * 2007-06-22 2010-01-21 Macdermid, Incorporated Acid copper electroplating bath composition
WO2009002385A2 (en) 2007-06-22 2008-12-31 Macdermid, Incorporated Acid copper electroplating bath composition
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
CN115536561A (zh) * 2022-10-11 2022-12-30 广东利尔化学有限公司 一种适用于酸性电镀铜液的光亮剂及其制备方法

Also Published As

Publication number Publication date
DE2255584C2 (de) 1983-02-17
FR2186544B1 (de) 1976-06-04
FR2186544A1 (de) 1974-01-11
GB1354840A (en) 1974-06-05
DE2255584A1 (de) 1973-11-08

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