FR2186544A1 - - Google Patents

Info

Publication number: FR2186544A1
Authority: FR; France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

FR7240334A

Other languages

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shipley Co Inc

Original Assignee

LeaRonal Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1972-04-27

Filing date

1972-11-14

Publication date

1974-01-11

1972-11-14 Application filed by LeaRonal Inc filed Critical LeaRonal Inc

1974-01-11 Publication of FR2186544A1 publication Critical patent/FR2186544A1/fr

1976-06-04 Application granted granted Critical

1976-06-04 Publication of FR2186544B1 publication Critical patent/FR2186544B1/fr

Status Expired legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Manufacturing Of Printed Wiring (AREA)

FR7240334A 1972-04-27 1972-11-14 Expired FR2186544B1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US24816072A	1972-04-27	1972-04-27

Publications (2)

Publication Number	Publication Date
FR2186544A1 true FR2186544A1 (de)	1974-01-11
FR2186544B1 FR2186544B1 (de)	1976-06-04

Family

ID=22937944

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7240334A Expired FR2186544B1 (de)	1972-04-27	1972-11-14

Country Status (4)

Country	Link
US (1)	US3725220A (de)
DE (1)	DE2255584C2 (de)
FR (1)	FR2186544B1 (de)
GB (1)	GB1354840A (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4038161A (en) *	1976-03-05	1977-07-26	R. O. Hull & Company, Inc.	Acid copper plating and additive composition therefor
US4134803A (en) *	1977-12-21	1979-01-16	R. O. Hull & Company, Inc.	Nitrogen and sulfur compositions and acid copper plating baths
US4376685A (en) *	1981-06-24	1983-03-15	M&T Chemicals Inc.	Acid copper electroplating baths containing brightening and leveling additives
US4948474A (en) *	1987-09-18	1990-08-14	Pennsylvania Research Corporation	Copper electroplating solutions and methods
WO1997011591A1 (en) *	1995-09-22	1997-03-27	Minnesota Mining And Manufacturing Company	Flexible circuits with bumped interconnection capability
US6024857A (en) *	1997-10-08	2000-02-15	Novellus Systems, Inc.	Electroplating additive for filling sub-micron features
US6309969B1 (en)	1998-11-03	2001-10-30	The John Hopkins University	Copper metallization structure and method of construction
AU1298299A (en) *	1998-11-03	2000-05-22	Johns Hopkins University, The	Copper metallization structure and method of construction
US6652731B2 (en) *	2001-10-02	2003-11-25	Shipley Company, L.L.C.	Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en)	2002-06-13	2004-03-23	Advanced Technology Materials, Inc.	Method for determining concentrations of additives in acid copper electrochemical deposition baths
US7297247B2 (en) *	2003-05-06	2007-11-20	Applied Materials, Inc.	Electroformed sputtering target
US20050067304A1 (en) *	2003-09-26	2005-03-31	King Mackenzie E.	Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) *	2003-11-25	2005-05-26	Mackenzie King	On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) *	2004-04-07	2005-10-13	Jun Liu	Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) *	2004-04-27	2006-01-10	Advanced Technology Material, Inc.	Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en)	2004-04-30	2008-10-14	Advanced Technology Materials, Inc.	Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) *	2004-05-04	2008-09-23	Advanced Technology Materials, Inc.	Electrochemical drive circuitry and method
JP4636563B2 (ja) *	2004-11-24	2011-02-23	住友電気工業株式会社	溶融塩浴および金属析出物の製造方法
US9127362B2 (en)	2005-10-31	2015-09-08	Applied Materials, Inc.	Process kit and target for substrate processing chamber
US20070125646A1 (en) *	2005-11-25	2007-06-07	Applied Materials, Inc.	Sputtering target for titanium sputtering chamber
US8968536B2 (en) *	2007-06-18	2015-03-03	Applied Materials, Inc.	Sputtering target having increased life and sputtering uniformity
US7887693B2 (en) *	2007-06-22	2011-02-15	Maria Nikolova	Acid copper electroplating bath composition
US7901552B2 (en)	2007-10-05	2011-03-08	Applied Materials, Inc.	Sputtering target with grooves and intersecting channels
CN115536561B (zh) *	2022-10-11	2024-08-16	广东利尔化学有限公司	一种适用于酸性电镀铜液的光亮剂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1007592B (de) *	1955-01-19	1957-05-02	Dehydag Gmbh	Bad zur Herstellung von galvanischen Metallueberzuegen
DE1152863B (de) *	1957-03-16	1963-08-14	Riedel & Co	Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen
NL134137C (de) *	1961-02-02
DE1177142B (de) *	1961-07-08	1964-09-03	Dehydag Gmbh	Verfahren zur Herstellung von Sulfonsaeure-gruppen enthaltenden Dithiocarbaminsaeure-esterderivaten
DE1184172B (de) *	1961-08-31	1964-12-23	Dehydag Gmbh	Verfahren zum galvanischen Abscheiden festhaftender und hochglaenzender Kupferueberzuege
DE1248415B (de) *	1964-03-07	1967-08-24	Dehydag Gmbh	Saure galvanische Kupferbaeder
US3414493A (en) *	1965-10-19	1968-12-03	Lea Ronal Inc	Electrodeposition of copper
US3328273A (en) *	1966-08-15	1967-06-27	Udylite Corp	Electro-deposition of copper from acidic baths
SE322956B (de) *	1966-08-20	1970-04-20	Schering Ag
US3542655A (en) *	1968-04-29	1970-11-24	M & T Chemicals Inc	Electrodeposition of copper

1972
- 1972-04-27 US US00248160A patent/US3725220A/en not_active Expired - Lifetime
- 1972-11-02 GB GB5059472A patent/GB1354840A/en not_active Expired
- 1972-11-13 DE DE2255584A patent/DE2255584C2/de not_active Expired
- 1972-11-14 FR FR7240334A patent/FR2186544B1/fr not_active Expired

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number	Publication date
DE2255584C2 (de)	1983-02-17
US3725220A (en)	1973-04-03
FR2186544B1 (de)	1976-06-04
GB1354840A (en)	1974-06-05
DE2255584A1 (de)	1973-11-08

Publication	Publication Date	Title
AU465432B2 (de)	1975-09-09
JPS48104011U (de)	1973-12-05
CH559120A5 (de)	1975-02-28
CH579521A5 (de)	1976-09-15
BG18370A1 (de)	1974-10-25
BG19718A1 (de)	1975-10-10
CH1526973A4 (de)	1975-08-15
CH16372A4 (de)	1974-05-15
CH314673A4 (de)	1974-11-15
CH553443A (de)	1974-08-30
CH555446A (de)	1974-10-31
CH559034A5 (de)	1975-02-28
CH559156A5 (de)	1975-02-28
CH560463A5 (de)	1975-03-27
CH560639A5 (de)	1975-04-15
CH560800A (de)	1975-04-15
CH560961A5 (de)	1975-04-15
CH560965A5 (de)	1975-04-15
CH561134A5 (de)	1975-04-30
CH561277A5 (de)	1975-04-30
CH561444A (de)	1975-04-30
CH561463A5 (de)	1975-04-30
CH562955A5 (de)	1975-06-13
CH563047A5 (de)	1975-06-13
CH564163A5 (de)	1975-07-15

Legal Events

Date	Code	Title
1991-09-27	ST	Notification of lapse
1991-12-06	DA	Annulment of decision of lapse
1992-09-25	ST	Notification of lapse