TWI865823B - 加熱嘴單元 - Google Patents

加熱嘴單元 Download PDF

Info

Publication number: TWI865823B
Authority: TW; Taiwan
Prior art keywords: temperature measuring; heating nozzle; wire; soldering iron; fixing
Prior art date: 2020-09-09

Application number

TW110133049A

Other languages

English (en)

Chinese (zh)

Other versions

TW202211744A (zh

Inventor

須賀伸一郎

Original Assignee

日商阿波羅技研股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-09-09

Filing date

2021-09-06

Publication date

2024-12-11

2021-09-06 Application filed by 日商阿波羅技研股份有限公司 filed Critical 日商阿波羅技研股份有限公司

2022-03-16 Publication of TW202211744A publication Critical patent/TW202211744A/zh

2024-12-11 Application granted granted Critical

2024-12-11 Publication of TWI865823B publication Critical patent/TWI865823B/zh

Images

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Control Of Resistance Heating (AREA)
Pressure Welding/Diffusion-Bonding (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Electrodes For Cathode-Ray Tubes (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Resistance Heating (AREA)
Measuring Temperature Or Quantity Of Heat (AREA)

TW110133049A 2020-09-09 2021-09-06 加熱嘴單元 TWI865823B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2020151045A JP7137237B2 (ja)	2020-09-09	2020-09-09	ヒーターチップユニット
JP2020-151045		2020-09-09

Publications (2)

Publication Number	Publication Date
TW202211744A TW202211744A (zh)	2022-03-16
TWI865823B true TWI865823B (zh)	2024-12-11

Family

ID=80632533

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW110133049A TWI865823B (zh)	2020-09-09	2021-09-06	加熱嘴單元

Country Status (6)

Country	Link
JP (1)	JP7137237B2 (ja)
KR (1)	KR102772591B1 (ja)
CN (1)	CN115461180A (ja)
MY (1)	MY196583A (ja)
TW (1)	TWI865823B (ja)
WO (1)	WO2022054421A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN115889928B (zh) *	2022-12-15	2023-09-05	东莞顺为半导体有限公司	一种焊头结构及焊头温度补偿方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS586773A (ja) *	1981-06-29	1983-01-14	ク−パ−・インダストリ−ズ・インコ−ポレイテツド	ハンダ付け及びハンダ除去用こて先き、及びその製造方法
US5297716A (en) *	1993-04-12	1994-03-29	Honeywell Inc.	Soldering tool with attached thermocouple
CN103084694A (zh) *	2011-10-21	2013-05-08	株式会社工房Pda	热压焊头及接合装置及接合方法以及细线与端子的连接构造
JP6148800B1 (ja) *	2015-08-28	2017-06-14	株式会社工房Ｐｄａ	ヒータチップ及び接合装置及び接合方法
JP2018012200A (ja) *	2016-07-19	2018-01-25	株式会社工房Ｐｄａ	ヒータチップ及び接合装置及び接合方法

Family Cites Families (9)

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Publication number	Priority date	Publication date	Assignee	Title
JPS55127097A (en) *	1979-03-20	1980-10-01	Matsushita Electric Ind Co Ltd	Photocurable resin composition and solder resist
JP3968205B2 (ja)	2000-03-30	2007-08-29	太陽誘電株式会社	熱圧着用ヒーターチップ及びその製造方法
JP4224050B2 (ja) *	2005-10-31	2009-02-12	日本アビオニクス株式会社	ヒーターチップの熱電対取付構造および熱電対取付方法
KR20100097984A (ko) *	2009-02-27	2010-09-06	(주)엠에스테크비젼	납땜용 인두기 및 이를 포함하는 납땜용 인두 장치
US20100243712A1 (en) *	2009-03-27	2010-09-30	Ats Automation Tooling Systems Inc.	Thermode, clamping arrangment therefor, and method of manufacture
JP2010253503A (ja) *	2009-04-23	2010-11-11	Miyachi Technos Corp	ヒータチップ及び接合装置
JP5457107B2 (ja) *	2009-05-19	2014-04-02	ミヤチテクノス株式会社	ヒータチップ及び接合装置
JP2012183552A (ja) *	2011-03-04	2012-09-27	Miyachi Technos Corp	ヒータチップ及び接合装置及び接合方法
JP6677406B2 (ja) *	2015-09-25	2020-04-08	株式会社工房Ｐｄａ	ヒータチップ及び接合装置及び接合方法

2020
- 2020-09-09 JP JP2020151045A patent/JP7137237B2/ja active Active
2021
- 2021-07-20 WO PCT/JP2021/027196 patent/WO2022054421A1/ja active Application Filing
- 2021-07-20 KR KR1020227030266A patent/KR102772591B1/ko active Active
- 2021-07-20 MY MYPI2022004865A patent/MY196583A/en unknown
- 2021-07-20 CN CN202180027313.4A patent/CN115461180A/zh active Pending
- 2021-09-06 TW TW110133049A patent/TWI865823B/zh active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS586773A (ja) *	1981-06-29	1983-01-14	ク−パ−・インダストリ−ズ・インコ−ポレイテツド	ハンダ付け及びハンダ除去用こて先き、及びその製造方法
US5297716A (en) *	1993-04-12	1994-03-29	Honeywell Inc.	Soldering tool with attached thermocouple
CN103084694A (zh) *	2011-10-21	2013-05-08	株式会社工房Pda	热压焊头及接合装置及接合方法以及细线与端子的连接构造
JP6148800B1 (ja) *	2015-08-28	2017-06-14	株式会社工房Ｐｄａ	ヒータチップ及び接合装置及び接合方法
JP2018012200A (ja) *	2016-07-19	2018-01-25	株式会社工房Ｐｄａ	ヒータチップ及び接合装置及び接合方法

Also Published As

Publication number	Publication date
KR20220130802A (ko)	2022-09-27
TW202211744A (zh)	2022-03-16
JP2022045444A (ja)	2022-03-22
JP7137237B2 (ja)	2022-09-14
KR102772591B1 (ko)	2025-02-26
MY196583A (en)	2023-04-19
WO2022054421A1 (ja)	2022-03-17
CN115461180A (zh)	2022-12-09

Publication	Publication Date	Title
US10799977B2 (en)	2020-10-13	Heater chip, joining apparatus and joining method
TWI865823B (zh)	2024-12-11	加熱嘴單元
TWI867246B (zh)	2024-12-21	加熱嘴及加熱嘴單元
KR102772592B1 (ko)	2025-02-26	히터 칩 유닛
CN116076161B (zh)	2024-10-15	加热嘴单元
JP2019133965A (ja)	2019-08-08	半導体装置及びその製造方法
US20100243712A1 (en)	2010-09-30	Thermode, clamping arrangment therefor, and method of manufacture
US8282432B2 (en)	2012-10-09	Weld terminal, switch assembly and methods of attachment
JP2008182078A (ja)	2008-08-07	チップ型金属板抵抗器
EP3498413A1 (en)	2019-06-19	Dissimilar-metal bonding structure, bonding method therefor, and electrical-product production method
JP2011248818A (ja)	2011-12-08	非接触型通信媒体およびその製造方法
JP4246449B2 (ja)	2009-04-02	ボンディング用ストリップおよび該ストリップを用いたボンディング方法
JP3522434B2 (ja)	2004-04-26	パルスヒート方式溶接機のヒータツール構造
KR0136161Y1 (ko)	1999-02-18	마운트 헤드
CN101123197A (zh)	2008-02-13	用于承载导线架的加热治具
JP2005268410A (ja)	2005-09-29	リードフレーム及びそれを用いた電子部品