MY196583A - Heater Chip Unit - Google Patents
Heater Chip UnitInfo
- Publication number
- MY196583A MY196583A MYPI2022004865A MYPI2022004865A MY196583A MY 196583 A MY196583 A MY 196583A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY 196583 A MY196583 A MY 196583A
- Authority
- MY
- Malaysia
- Prior art keywords
- trowel
- heater chip
- contact
- temperature measuring
- anchoring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Control Of Resistance Heating (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Resistance Heating (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
There is provided a heater chip unit (1) that allows a temperature measuring portion of a temperature sensor to be brought into sufficient contact with an anchoring portion of a heater chip (2). Specifically, in a heater chip unit (1) in which a thermocouple (3) is attached to a plate-shaped heater chip (2) for thermally press-fitting a terminal lead wire to a terminal member, the heater chip (2) includes a trowel portion (6) having a trowel tip portion (13) to be in contact with the terminal lead wire in a trowel main body (11); a pair of connecting arm portions (7) that are extended upward from left and right end portions of the trowel main body (11) while spaced from each other, and causes current from a power supply to flow into the trowel main body (11) to increase a temperature of the trowel portion (6); and a temperature measuring anchoring portion (35) which is provided to the trowel portion (6) and to which a temperature measuring contact (3a) of the thermocouple (3) is anchored, the temperature measuring anchoring portion (35) includes a pair of anchoring contact surfaces (35a) with which the temperature measuring contact (3a) comes into contact, and an interval distance between the anchoring contact surfaces (35a) is set to gradually increase as going upward from a trowel portion (6) side. (Figure 3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020151045A JP7137237B2 (en) | 2020-09-09 | 2020-09-09 | heater chip unit |
| PCT/JP2021/027196 WO2022054421A1 (en) | 2020-09-09 | 2021-07-20 | Heater tip unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY196583A true MY196583A (en) | 2023-04-19 |
Family
ID=80632533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2022004865A MY196583A (en) | 2020-09-09 | 2021-07-20 | Heater Chip Unit |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7137237B2 (en) |
| KR (1) | KR102772591B1 (en) |
| CN (1) | CN115461180A (en) |
| MY (1) | MY196583A (en) |
| TW (1) | TWI865823B (en) |
| WO (1) | WO2022054421A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889928B (en) * | 2022-12-15 | 2023-09-05 | 东莞顺为半导体有限公司 | Welding head structure and welding head temperature compensation method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127097A (en) * | 1979-03-20 | 1980-10-01 | Matsushita Electric Ind Co Ltd | Photocurable resin composition and solder resist |
| US4424930A (en) * | 1981-06-29 | 1984-01-10 | Cooper Industries, Inc. | Carbon-based soldering and de-soldering tip and method of manufacturing same |
| US5297716A (en) * | 1993-04-12 | 1994-03-29 | Honeywell Inc. | Soldering tool with attached thermocouple |
| JP3968205B2 (en) | 2000-03-30 | 2007-08-29 | 太陽誘電株式会社 | Heater chip for thermocompression bonding and manufacturing method thereof |
| JP4224050B2 (en) * | 2005-10-31 | 2009-02-12 | 日本アビオニクス株式会社 | Heater chip thermocouple mounting structure and thermocouple mounting method |
| KR20100097984A (en) * | 2009-02-27 | 2010-09-06 | (주)엠에스테크비젼 | Soldering iron and soldering apparatus therewith |
| US20100243712A1 (en) * | 2009-03-27 | 2010-09-30 | Ats Automation Tooling Systems Inc. | Thermode, clamping arrangment therefor, and method of manufacture |
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP5457107B2 (en) * | 2009-05-19 | 2014-04-02 | ミヤチテクノス株式会社 | Heater chip and joining device |
| JP2012183552A (en) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | Heater tip, joining device, and joining method |
| JP5794577B2 (en) * | 2011-10-21 | 2015-10-14 | 株式会社アマダミヤチ | Heater chip, joining device, joining method, and conductor thin wire and terminal connection structure |
| US10799977B2 (en) * | 2015-08-28 | 2020-10-13 | Kobo Pda Co., Ltd. | Heater chip, joining apparatus and joining method |
| JP6677406B2 (en) * | 2015-09-25 | 2020-04-08 | 株式会社 工房Ｐｄａ | Heater chip, joining device and joining method |
| JP6851610B2 (en) * | 2016-07-19 | 2021-03-31 | 株式会社 工房Ｐｄａ | Heater tip and joining device and joining method |
-
2020
- 2020-09-09 JP JP2020151045A patent/JP7137237B2/en active Active
-
2021
- 2021-07-20 WO PCT/JP2021/027196 patent/WO2022054421A1/en active Application Filing
- 2021-07-20 KR KR1020227030266A patent/KR102772591B1/en active Active
- 2021-07-20 MY MYPI2022004865A patent/MY196583A/en unknown
- 2021-07-20 CN CN202180027313.4A patent/CN115461180A/en active Pending
- 2021-09-06 TW TW110133049A patent/TWI865823B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220130802A (en) | 2022-09-27 |
| TW202211744A (en) | 2022-03-16 |
| JP2022045444A (en) | 2022-03-22 |
| JP7137237B2 (en) | 2022-09-14 |
| TWI865823B (en) | 2024-12-11 |
| KR102772591B1 (en) | 2025-02-26 |
| WO2022054421A1 (en) | 2022-03-17 |
| CN115461180A (en) | 2022-12-09 |
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