TWI768172B - cutting device - Google Patents

Abstract

[Subject] To obtain a dicing device capable of easily and surely cleaning a blade detection unit that detects a dicing blade. [Solution] In the cutting device for cutting the workpiece with the cutting blade of the cutting unit while cutting and feeding the table, it is provided that a cleaning mechanism is provided, and the cleaning mechanism includes a storage case, a storage case, and a storage case. The sliding member is also provided with an opening that allows the sliding member to enter and exit freely; the positioning component selectively locates the sliding member to the receiving position accommodated in the receiving housing, inserts it between the light-emitting part and the light-receiving part, and washes it. a clean cleaning position; and a sliding assembly for sliding the sliding member and the blade detection assembly relative to each other, and positioning the sliding member at the cleaning position and sliding the sliding member so that the sliding member is responsive to the light-emitting portion and the The light-receiving part is cleaned.

Description

cutting device

Field of Invention The present invention relates to a cutting device.

Background of the Invention Precision dicing devices such as dicing devices that divide and process workpieces such as semiconductor wafers are provided with a non-contact height sensor that detects the vertical direction of the dicing blade ( Z direction) position to detect the wear of the cutting blade. The non-contact height sensor is formed with a light-emitting part and a light-receiving part, and the peripheral edge of the cutting blade is arranged between the light-emitting part and the light-receiving part, so as to detect the wear of the cutting blade according to the light-receiving state of the light-receiving part .

The cutting chips generated by cutting the workpiece with the cutting blade are absorbed into the cutting liquid, and are scattered around with the high-speed rotation of the cutting blade. If the cutting liquid containing the cutting dust adheres to the non-contact height measuring sensor and contaminates the light-emitting part or the light-receiving part, the light-emitting amount or the light-receiving amount will decrease, so that it becomes impossible to detect the correct cutting blade. Row.

As a countermeasure for this, a cutting device including a nozzle for supplying washing water and air to a light-emitting portion or a light-receiving portion of a non-contact height sensor has been proposed (see, for example, Patent Document 1), or A dicing device that removes contamination from a light-emitting portion or a light-receiving portion with a cleaning brush attached to a spindle (see, for example, Patent Document 2). prior art literature Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2001-298001 Patent Document 2: Japanese Patent Laid-Open No. 2014-78544

Summary of Invention The problem to be solved by the invention When a large amount of contamination adheres to the light-emitting portion or the light-receiving portion and the adhesion of the contamination is strong, sufficient cleaning performance may not be obtained only by the supply of washing water and air as in Patent Document 1. In addition, the cleaning brush of Patent Document 2 is structured to be attached to the main shaft of the rotary drive of the cutting blade. Therefore, the cleaning operation has to be performed by replacing the cutting blade with the cleaning brush, and there is a problem that the time during which cleaning can be performed is limited.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a dicing device that can surely clean a blade detection unit that detects a dicing blade at a suitable timing. means of solving problems

The present invention relates to a cutting device, wherein the cutting device is provided with: a work chuck for holding a workpiece; a cutting assembly, which is provided with a cutting blade, and the cutting blade is used for cutting the workpiece held on the work chuck. A ring-shaped cutting blade for cutting objects; a cutting feed assembly, which cuts and feeds the workpiece held on the work chuck in the X-axis direction; and a blade detection assembly, which has a light-emitting part and a light-receiving part, the light-emitting part and the The light-receiving parts are arranged to face each other by sandwiching the cutting edge of the cutting blade. It is characterized in that: a cleaning mechanism is provided, and the cleaning mechanism has: a sliding member inserted between the light-emitting portion and the light-receiving portion for cleaning, wherein the light-emitting portion and the light-receiving portion are arranged in the blade detection assembly facing each other; The accommodating case accommodates the sliding member and is provided with an opening that allows the sliding member to enter and exit; the positioning assembly selectively locates the sliding member to the accommodating position accommodated in the accommodating casing, and inserts the light-emitting part and the light-receiving part A cleaning position for cleaning between them; and a sliding assembly for sliding the sliding contact member and the blade detection assembly relative to each other, and positioning the sliding contact member at the cleaning position and sliding it by the sliding component, so as to make the sliding contact The member cleans the light-emitting portion and the light-receiving portion.

According to the above dicing device, since the light-emitting portion and the light-receiving portion are cleaned by the sliding member that slides relative to the blade detection unit, an excellent cleaning effect can be obtained. Since the sliding member is arranged so as to be movable in and out of the housing case provided separately from the cutting unit, cleaning can be performed at an arbitrary timing without changing the configuration of the cutting unit.

The blade detection unit may be arranged on the cutting feed unit, and the cutting feed unit may be used as a sliding unit. In this embodiment, the sliding member is positioned at the cleaning position, and the blade detection member is slid in the X-axis direction by the cutting feed member, thereby cleaning the light-emitting portion and the light-receiving portion by the sliding member. Since the cutting and feeding unit for cutting and feeding the work chuck functions as a sliding unit during cleaning, the configuration of the cleaning mechanism can be simplified. Invention effect

As described above, according to the dicing device of the present invention, it becomes possible to surely clean the blade detection unit that detects the dicing blade at a suitable timing.

Form for carrying out the invention Hereinafter, the cutting device of the present embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view showing the whole of the cutting device according to the present embodiment, and FIGS. 2 to 8 are views showing a part of the cutting device. In each drawing, the cutting feed direction in the cutting device is shown as the X-axis direction, and the index feed (index movement feed) direction perpendicular to the cutting feed direction is the Y-axis direction. It is shown by assuming that the cutting direction (up and down direction) perpendicular to the cutting feed direction and the indexing feed direction is the Z-axis direction.

The dicing apparatus 10 shown in FIG. 1 is an apparatus for dicing a wafer W (see FIG. 2 ) that is a workpiece. As shown in FIG. 2 , on the front surface of the wafer W, grid-shaped planned dividing lines are formed, and devices such as semiconductor wafers are formed in each region defined by the planned dividing lines. The wafer W is conveyed to the dicing apparatus 10 in a state supported by the ring-shaped ring frame F through the dicing tape T attached to the back surface.

An opening 12 is formed on the upper surface of the base 11 of the cutting device 10 so as to extend in the X-axis direction. The opening 12 is covered by the X-axis table 14 that can move in the X-axis direction together with the work clamp table 13 and the accordion-shaped waterproof cover 15 . In FIG. 2, the illustration of the waterproof cover 15 is abbreviate|omitted.

As shown in FIG. 2 , a cutting and feeding unit 16 for cutting and feeding the work chuck 13 in the X-axis direction is provided in the opening 12 . The cutting and feeding unit 16 includes a pair of X-axis guide rails 17 arranged on the base 11 and extending in the X-axis direction, an X-axis table 14 supported slidably in the X-axis direction with respect to each X-axis guide rail 17, and a ball screw 18 located between a pair of X-axis guide rails 17 and extending in the X-axis direction. The ball screw 18 is rotatable around an axis in the X-axis direction by a motor 19 provided at the end. The X-axis table 14 has a nut (not shown) to which the ball screw 18 is screwed. When the ball screw 18 is rotated by the motor 19, the X-axis table 14 is moved in the X-axis direction.

On the X-axis table 14, the work chuck 13 is rotatably supported around the axis in the Z-axis direction through the θ table 20. FIG. The table 13 is provided with a holding surface 21 formed of a porous ceramic material on the upper surface side, and a negative pressure can be applied to the holding surface 21 by a suction source (not shown). By this negative pressure, the wafer W can be sucked and held on the holding surface 21 with the dicing tape T sandwiched therebetween. Four clamps 22 are provided around the work chuck 13 , and the ring frame F around the wafer W can be clamped and fixed by each clamp 22 .

As shown in FIG. 1 , a portal-shaped column portion 25 is provided on the upper surface of the base 11, and the column portion 25 is erected so as to span the movement paths of the table 13 and the X-axis table 14 in the X-axis direction. set up. The column portion 25 is provided with an indexing feed unit 31 for indexing and feeding the cutting unit 30 in the Y-axis direction, and a cutting feed unit 32 for cutting and feeding the cutting unit 30 in the Z-axis direction.

The indexing feed unit 31 includes a pair of Y-axis guide rails 33 arranged on the front surface of the column portion 25 and extending in the Y-axis direction, a Y-axis table 34 slidably supported on each Y-axis guide rail 33, and a pair of Y-axis guide rails 34 . A ball screw 35 between the Y-axis guide rails 33 and extending in the Y-axis direction. The ball screw 35 is rotatable around the axis of the Y-axis direction by a motor provided at the end (it is located behind the Y-axis table 34 in FIG. 1 and not shown). The Y-axis table 34 has a nut (not shown) to which the ball screw 35 is screwed. When the ball screw 35 is driven to rotate by a motor, the Y-axis table 34 is moved in the Y-axis direction along the Y-axis guide 33 .

The plunge feed unit 32 includes a pair of Z-axis guide rails 36 arranged on the Y-axis table 34 and extending in the Z-axis direction, a Z-axis table 37 slidably supported on each Z-axis guide rail 36, and a pair of Z-axis guide rails 37 . A ball screw 38 between the Z-axis guide rails 36 and extending in the Z-axis direction. The ball screw 38 is rotatable around an axis in the Z-axis direction by a motor 39 provided at the end. The Z-axis table 37 has a nut (not shown) to which the ball screw 38 is screwed, and when the ball screw 38 is rotated and driven by the motor 39 , the Z-axis table 37 is moved in the Z-axis direction along the Z-axis guide rail 36 .

As shown in FIGS. 5 and 6 , the cutting unit 30 is configured by attaching a cutting blade 41 to a main shaft 40 that rotates around an axis 40x in the Y-axis direction. The cutting blade 41 is arranged along a plane perpendicular to the axis 40x of the main shaft 40, and has an annular cutting edge with the axis 40x as the center at the peripheral edge. Dicing is performed by cutting the dicing blade 41 with respect to the wafer W held on the table 13 while rotating the dicing blade 41 about the axis 40x. The cutting unit 30 by the indexing feeding unit 31 is appropriately moved (cutting feeding) in the X-axis direction of the table 13 (X-axis table 14 ) by the cutting feeding unit 16 . Movement in the Y-axis direction of the (Y-axis table 34 ) (indexing feed), and movement in the Z-axis direction of the cutting unit 30 (Z-axis table 37 ) by the plunging feed unit 32 (plunging feed unit 32 ) ), a dicing process along the dividing line on the front surface of the wafer W can be performed.

More specifically, the table 13 is moved toward the wafer W by the dicing feed unit 16 while aligning the dicing blade 41 with the planned dividing line of the dicing target and cutting the dicing edge of the rotating dicing blade 41 into the wafer W. The cutting feed in the X-axis direction is used for cutting. After the cutting of one cutting line is completed, the cutting and feeding assembly 32 can be actuated to pull the cutting assembly 30 upward, and then the indexing and feeding assembly 31 is used to move the cutting assembly 30 in the Y-axis direction, so that the The cutting blade 41 aligns the next planned dividing line, and similarly cuts. After the cutting of all the planned dividing lines arranged in the Y-axis direction is completed, the table 13 is rotated 90 degrees so that the uncut planned dividing lines are aligned in the Y-axis direction, and the uncut dividing lines are arranged in the Y-axis direction. The predetermined line is similarly cut. After the cutting of all the planned dividing lines is completed, the cutting and feeding assembly 16 can be actuated, so that the work clamp table 13 is moved closer to the front side (the right side in FIG. 5 ) than the cutting assembly 30 in the X-axis direction, and It is positioned so that the processed wafer W can be carried out from the dicing apparatus 10 .

The cutting device 10 includes a control unit 45 (see FIG. 1 ) that integrally controls each part. The control unit 45 controls the actions of the work table 13 or the cutting unit 30 according to various instructions input by the operator who operates the cutting device 10 . The control unit 45 is constituted by a processor, a memory, or the like for operating each component of the cutting device 10 .

The cutting device 10 is provided with a blade detection assembly 50 as a non-contact height-measuring sensor, and the aforementioned non-contact height-measuring sensor measures the cutting direction (Z-axis direction) corresponding to the wear of the cutting blade 41 in the cutting assembly 30 The sensor that detects the reference position. As shown in FIGS. 3 and 4 , the blade detection unit 50 has a base portion 52 near the front end of the support leg portion 51 supported on the X-axis table 14 , and an opposing portion 53 and an opposing portion that are spaced apart in the Y-axis direction and face each other. The portion 54 protrudes from the base portion 52 . The light-emitting portion 55 is arranged in the facing portion 53 , and the light-receiving portion 56 is arranged in the facing portion 54 . A groove portion 57 into which the peripheral edge portion of the cutting blade 41 can enter is formed between the facing portion 53 and the facing portion 54 . In the facing portion 53, a light projection window in the light emitting portion 55 is formed on the surface facing the groove portion 57 side (the surface facing the facing portion 54). In the facing portion 54 , a light receiving window in the light receiving portion 56 is formed on the surface facing the groove portion 57 side (the surface facing the facing portion 53 ). The light emitted from the light source (not shown) is guided to the light-emitting portion 55 through an optical fiber or the like, and is projected from the light-projecting window toward the light-receiving portion 56 . The light from the light-emitting portion 55 enters the light-receiving window of the light-receiving portion 56, is photoelectrically converted by the light-receiving element, and outputs a voltage corresponding to the light-receiving amount.

When the cutting blade 41 is detected by the blade detection unit 50 , the cutting edge of the cutting blade 41 is caused to enter from above with respect to the groove portion 57 . When the cutting blade 41 is positioned at a position where the light emitted from the light-emitting portion 55 is not blocked, the amount of light received by the light-receiving portion 56 is maximized. When the cutting blade 41 is lowered and the amount of light blocked by the cutting blade 41 is gradually increased, the amount of light received by the light receiving unit 56 is decreased, and the output voltage is lowered. By referring to this output voltage, the wear state of the cutting edge of the cutting blade 41 or the reference position in the cutting direction can be detected. For example, the output voltage of the blade detection unit 50 at the position where the peripheral edge of the cutting blade 41 is in contact with the holding surface 21 of the table 13 is set as the reference voltage, and the reference voltage is input to the storage unit of the control unit 45 . In addition, at the time of mounting, the reference position of the dicing blade 41 can be determined by comparing the output voltage of the blade detection unit 50 with the reference voltage while lowering the dicing blade 41 to be the target.

The base 52 of the blade detection assembly 50 is further provided with two washing water nozzles 60, 61 and two air nozzles 62, 63, and the two washing water nozzles 60, 61 are used for spraying from the washing water supply source (illustration omitted) to deliver the washing water, the aforementioned two air nozzles 62 and 63 are used for jetting air delivered from a compressed air supply source (illustration omitted). The washing water nozzle 60 and the air nozzle 62 respectively face the light projection window of the light emitting unit 55 , and the washing water nozzle 61 and the air nozzle 63 face the light receiving window of the light receiving unit 56 , respectively. The washing water can be supplied from the washing water nozzle 60 to the light projection window of the light emitting unit 55 , and the water droplets and the like attached to the light projection window can be blown away by the air sprayed from the air nozzle 62 . Similarly, washing water can be supplied to the light receiving window of the light receiving unit 56 from the washing water nozzle 61 , and water droplets and the like that have adhered to the light receiving window can be blown away by the air sprayed from the air nozzle 63 .

The blade detection unit 50 is provided with an openable and closable protective cover 65 . The shield 65 has a box shape that can cover the base 52 from above, and is rotatably supported around a hinge pin 66 arranged on the side of the base 52 and extending in the X-axis direction. 1 and 2 show a state in which the protective cover 65 is closed. In this state, the opposing portion 53 (light-emitting portion 55 ) and opposing portion 54 (light-receiving portion 56 ), the groove portion 57 , the washing water nozzles 60 and 61 , and the air nozzles 62 and 63 on the base portion 52 are all protected. The cover 65 is covered from above. 3 and 4 show a state in which the protective cover 65 is opened by the rotation of the hinge pin 66 as an axis. In this state, the above elements on the base portion 52 are exposed. During the dicing process such as the wafer W, when the blade inspection unit 50 is not in use, the protective cover 65 is closed. When the reference position in the cutting direction (Z-axis direction) of the cutting blade 41 is detected by the blade detection unit 50, the guard 65 is opened.

When the wafer W is diced by the dicing unit 30 , the dicing fluid is supplied from the dicing fluid supply nozzle provided in the dicing unit 30 toward the dicing blade 41 and its surroundings. Cutting chips (contaminants) generated by cutting are absorbed into the cutting liquid, and the cutting liquid containing the cutting chips is scattered around by the spindle 40 or the cutting blade 41 rotating at a high speed. When the cutting debris and cutting liquid formed in this way adhere to the blade detection unit 50 and contaminate the light-emitting portion 55 or the light-receiving portion 56, the amount of light emitted from the light-emitting portion 55 or the amount of light received by the light-receiving portion 56 is reduced, and there is a possibility that the cutting blade may be damaged. The position detection accuracy of 41 may be affected.

During dicing of the wafer W, as shown in FIG. 1 , FIG. 2 and FIG. 5 , the protective cover 65 is closed, and the protective cover 65 can prevent the dicing chips or dicing liquid from emitting light to the blade detection unit 50 to a certain extent. part 55 or the light-receiving part 56 is attached. However, as shown in FIG. 1 or FIG. 5 , in the dicing apparatus 10 , the blade detection unit 50 is arranged at a position near the table 13 where the dicing process of the wafer W is performed, and there are scattered dicing chips or The cutting liquid easily falls on the positional relationship of the blade detection assembly 50 . In addition, during the cutting process, the cutting blade 41 is rotated in the direction of the arrow R in FIG. 1 , and this rotation direction is the direction in which the cutting chips or cutting liquid are splashed from the side of the table 13 to the side of the blade detection unit 50 in the X-axis direction. . Therefore, it is difficult to completely protect the blade detection assembly 50 from the contamination accompanying the cutting process only by the protective cover 65 .

In order to surely clean the blade detection unit 50 under such conditions, the dicing device 10 is equipped with a sliding member that can be directly cleaned in addition to the cleaning water nozzles 60 and 61 and the air nozzles 62 and 63 . A cleaning mechanism for the light-emitting portion 55 and the light-receiving portion 56 . The cleaning mechanism of this embodiment is constituted by the cleaning unit 70 and the cutting and feeding unit 16 .

As shown in FIGS. 1 and 2 , a side wall 26 protruding upward from the base 11 is provided at a position facing the one end portion in the X-axis direction of the opening 12 . The support leg 51 of the blade detection unit 50 is extended in the X-axis direction from the X-axis table 14 toward the side wall 26 side. A cleaning unit 70 (see FIG. 2 ) is provided on the side surface of the side wall 26 facing the opening 12 side. When viewed from the top as shown in FIG. 5 , the cleaning unit 70 is located on the extension of the blade detection assembly 50 in the X-axis direction.

The cleaning unit 70 includes a box-shaped sponge accommodating case 71 fixed to the side wall 26 , and a sponge member 72 , which is a sliding member for cleaning that can be accommodated in the sponge accommodating case 71 . As shown in FIGS. 7 and 8 , the sponge accommodating case 71 has an opening 71a at the lower end portion through which the sponge member 72 can be inserted and withdrawn, and is provided with an opening and closing cover 73 that opens and closes the opening 71a. The opening and closing cover 73 is opened and closed relative to the opening 71a by rotating the hinge pin 74 extending in the Y-axis direction as an axis, and is directed to close the opening by a potential energy imparting element (torsion spring, etc.) not shown in the figure. The position of 71a (Fig. 7) is given potential energy.

The sponge accommodating housing 71 is provided with a sponge positioning assembly 75 . The sponge positioning assembly 75 is provided with a piston rod 76, and the aforementioned piston rod 76 can advance and retreat in the Z-axis direction relative to the cylinder tube fixed in the sponge containing housing 71, and can be driven downward by the driving force of the driving source. The protrusion amount of the piston rod 76 changes. As the drive source of the sponge positioning unit 75, an arbitrary drive source such as compressed air and an actuator can be used.

A sponge member 72 is attached to the lower end of the piston rod 76 . The sponge member 72 is made of a material having flexibility, and has a substantially rectangular parallelepiped shape whose sides extend in the X-axis direction, the Y-axis direction, and the Z-axis direction. The sponge member 72 has a width in the Y-axis direction that can be inserted between the opposing portion 53 and the opposing portion 54 while being compressed and deformed (ie, slightly larger than the width of the groove portion 57 ). Moreover, the sponge member 72 has a shape longer than the opposing part 53 and the opposing part 54 in the X-axis direction (refer FIG. 3, FIG. 4, and FIG. 8).

The sponge positioning assembly 75 selectively positions the sponge member 72 at the accommodating position ( FIG. 7 ) and the washing position ( FIGS. 4 and 8 ) by advancing and retreating the piston rod 76 in the Z-axis direction. In the accommodating position, the entire sponge member 72 is accommodated in the sponge accommodating housing 71, and the opening and closing cover 73 is closed by imparting a force with potential energy. In the cutting process performed by the cutting unit 30, the sponge member 72 is held in the storage position, and is protected so as not to adhere to scattered cutting chips or cutting liquid.

In the washing position, the sponge member 72 protrudes below the sponge accommodating case 71 while being opened against the force imparted to the opening and closing cover 73 with potential energy. The sponge member 72 in the cleaning position is located at the same height position as the facing portion 53 and the facing portion 54 of the blade detection unit 50 in the Z-axis direction, and is located between the facing portion 53 and the facing portion 54 in the Y-axis direction. The positions corresponding to the grooves 57 between them. That is, the sponge member 72 in the washing position is located on the extension of the groove portion 57 in the X-axis direction, and when the blade detection unit 50 and the sponge member 72 are relatively close to each other in the X-axis direction, the sponge member 72 can be It is inserted into the groove portion 57 .

As shown in FIGS. 7 and 8 , the sponge housing case 71 is provided with a water supply unit 77 that can supply water to the sponge member 72 located at the storage position constantly or intermittently. The water supply portion 77 is connected to a water supply source (not shown) provided in the base 11, and by supplying water from the water supply portion 77, the sponge member 72 can be kept moist and suitable for cleaning without drying the sponge member 72. state. In addition, the contamination or the like adhering to the sponge member 72 due to washing may be washed away by the jet of water from the water supply unit 77 . A drainage channel (not shown) is formed inside the sponge housing case 71 , and the drainage channel can discharge water to the outside even in the state where the opening and closing cover 73 is closed, and allow the water that washes the sponge member 72 to drain. It does not stay in the sponge accommodating case 71 .

As described above, when the wafer W is diced by the dicing unit 30 , the table 13 (X-axis table 14 ) is moved in the X-axis direction by the dicing feed unit 16 (dicing feed ). 5 shows a state in which the axis 40x of the main shaft 40 of the cutting unit 30 passes through the center of the holding surface 21 of the table 13, and this state becomes the center position of the motion range of the cutting feed.

The first position 50A and the second position 50B of the blade detection unit 50 shown by the one-dot chain line in FIG. 5 are hypothetically shown as follows: the movement amount from the above-mentioned central position to the radius corresponding to the holding surface 21 is The position of the blade detection unit 50 in the X-axis direction changes when the X-axis table 14 is moved back and forth. In addition, for easy viewing, the first position 50A and the second position 50B in FIG. 5 are drawn in a state where the actual blade detection unit 50 is shifted in the Y-axis direction. Since the diameter of the wafer W held on the work chuck 13 does not exceed the diameter of the holding surface 21 , in order to cut the longest planned dividing line on the wafer W, a work of at least the diameter of the holding surface 21 is required. The cutting feed amount of the clamping table 13 is sufficient. That is, during the cutting process by the cutting device 10, the movement range of the blade detection unit 50 that moves in the X-axis direction together with the work chuck 13 does not exceed the movement range from the first position 50A shown in FIG. 5 . to 2nd position 50B. As shown in FIG. 5 , even at the first position 50A that has moved most toward the side wall 26, the blade detection unit 50 has a positional relationship with respect to the cleaning unit 70 in the X-axis direction. Therefore, even if the table 13 is cut and fed during the cutting process by the cutting unit 30, the blade detection unit 50 and the cleaning unit 70 do not interfere with each other.

When the cleaning unit 70 is used to clean the blade detection unit 50 , the cutting feed unit 16 moves the X-axis table 14 more toward the operating range (the first position 50A of the blade detection unit 50 ) than the operating range during the cutting process (the first position 50A of the blade detection unit 50 ). The side wall 26 side moves. At this time, the blade detection unit 50 is in a state in which the shield 65 is opened in advance and the groove portion 57 is exposed as shown in FIG. 3 . The opening action of the protective cover 65 can be performed manually or mechanically.

When the protective cover 65 is mechanically opened, the following mechanism can be used as an example. Potential energy is imparted to the protective cover 65 at the locked position shown in FIGS. 1 and 2 in advance by a potential energy imparting element such as a torsion spring. Also, a pressed portion protruding from the protective cover 65 is provided. Fixing objects such as the base 11 and the side wall 26 are provided with pressing portions for contacting the pressed portions of the shield 65 when the blade detection unit 50 moves in the X-axis direction and approaches the side walls 26 . A cam surface, a guide surface, or the like is formed at the contact portion between the pressed portion and the pressing portion so that the moving force in the X-axis direction generates a component force that presses the shield 65 in the opening direction. Furthermore, when the blade detection assembly 50 approaches the side wall 26 in the X-axis direction, the protective cover 65 can be opened by pressing the pressed portion against the pressing portion against the potential imparting force of the potential imparting element. Conversely, when the blade detection component 50 moves in the direction away from the side wall 26 in the X-axis direction, the pressing by the pressing portion can be released, and the protective cover can be removed by the imparting potential energy of the potential energy imparting component. 65 turns off automatically.

When cleaning the blade detection unit 50, on the side of the cleaning unit 70, as shown in FIG. 8, the sponge positioning unit 75 moves the sponge member 72 from the storage position to the cleaning position. At the time of this movement, the sponge member 72 resists the imparting of the potential force to open the opening and closing cover 73 .

Then, when the blade detection unit 50 moved in the X-axis direction by the cutting and feeding unit 16 reaches a position (below the sponge accommodating case 71 ) overlapping the cleaning unit 70 as shown in FIGS. 6 and 8 , as shown in FIG. As shown in FIG. 4 , the sponge member 72 is inserted into the groove portion 57 . The sponge member 72 enters the groove portion 57 while being slightly compressed and deformed in the Y-axis direction, and both side surfaces of the sponge member 72 are in a state of sliding contact with a predetermined contact pressure with respect to the opposing surfaces of the opposing portion 53 and the opposing portion 54 . . In this state, as shown by the thick arrow S in FIG. 4 , FIG. 6 and FIG. 8 , the X-axis table 14 is moved back and forth in the X-axis direction by the cutting and feeding unit 16 , whereby the sponge member 72 and the blade are detected. The assemblies 50 slide relatively. As a result, the sponge member 72 slidably in contact with the opposing surfaces of the opposing portion 53 and the opposing portion 54 removes contamination such as cutting chips adhering to the groove portion 57 and cleans the blade detection unit 50 . In particular, the light-projecting window of the light-emitting portion 55 facing the groove portion 57 or the light-receiving window of the light-receiving portion 56 can be wiped clean by sliding contact with the sponge member 72 . That is, the cutting and feeding unit 16 for the relative sliding of the sponge member 72 and the blade detecting unit 50 during cleaning functions as a cleaning mechanism together with the cleaning unit 70 .

Since the sponge member 72 is kept in a state of preliminarily containing water by the water supply portion 77 in the sponge housing case 71, it is possible to perform effective cleaning immediately at the stage of protruding toward the cleaning position. 4, in the state where the sponge member 72 is inserted into the groove portion 57, since the washing water nozzles 60, 61 are located in the vicinity of the sponge member 72, the washing water from the washing water nozzles 60, 61 can be supply is also used for cleaning. In addition, after the cleaning by the sponge member 72, the water droplets adhering to the cleaned light-emitting portion 55 or the light-receiving portion 56 can be removed by jetting air from the air nozzles 62 and 63.

The sponge member 72 may also contain an abrasive. By the abrasive contained in the sponge member 72, the removal effect of the contamination adhering to the periphery of the groove part 57 of the blade detection unit 50 can be improved, and more efficient cleaning can be realized.

After the cleaning by the cleaning unit 70 is completed, the X-axis table 14 is moved in a direction away from the side wall 26 . The protective cover 65 opened during cleaning can be closed manually or mechanically. However, when the detection of the cutting blade 41 by the blade detection unit 50 is performed immediately after cleaning (without cutting), the protective cover 65 may be opened as it is.

Moreover, after washing, the sponge positioning unit 75 moves the sponge member 72 from the washing position ( FIGS. 4 and 8 ) to the storage position ( FIG. 7 ). The dirt adhering to the sponge member 72 due to cleaning can be washed away by the water supplied from the water supply unit 77 at the storage position. Preferably, in order to perform the cleaning of the sponge member 72 as described above, the water supply unit 77 is preferably configured to spray water with a strong force on the entire sponge member 72 .

The cleaning process using the blade detection unit 50 of the cleaning unit 70 above is programmed by setting the control unit 45 of the cutting device 10 to the cleaning mode in advance, and the operator who operates the cutting device 10 can select the cleaning process. Clean mode automatically executes a series of actions. Alternatively, each operation of cleaning may be performed sequentially by manual input by an operator.

As described above, the dicing device 10 of the present embodiment includes the cleaning unit 70 in the vicinity of the dicing unit 30 , and the sponge member 72 faces the blade detection unit 50 in a state where the blade detection unit 50 is brought close to the cleaning unit 70 . Swipe to wash. This cleaning can be performed at a convenient point in time without removing the cutting blade 41 from the cutting assembly 30, and can be performed easily and with little effort. In addition, since the cleaning is performed by sliding the sponge member 72 with respect to the blade detection unit 50, a higher cleaning effect can be obtained as compared with the case where only the cleaning water is sprayed.

In addition, since the cutting and feeding unit 16 for cutting and feeding the table 13 also functions as a sliding unit for sliding the sponge member 72 and the blade detection unit 50 relative to each other, there is no drive unit dedicated to the sliding unit. , and the structure of the cleaning mechanism can be formed to be simpler. In addition, although the side of the blade detection unit 50 is actuated during sliding, the blade detection unit 50 itself can be constructed without a separate operating part (except for the opening and closing mechanism of the protective cover 65), so there is no detection of the blade. The detection accuracy of the assembly 50 raises concerns about adverse effects.

Modifications different from the above-described embodiments may also be employed. For example, in the above-described embodiment, the cutting feed unit 16 is used to slide the sponge member 72 relative to the blade detection unit 50 . In contrast to this, the sponge positioning element 75 can also be used as a sliding element, and the sponge member 72 can slide relative to the blade detection element 50 through the movement of the sponge member 72 in the X-axis direction. That is, it is also possible to move the sponge member 72 side instead of the blade detection unit 50 side to perform sliding during cleaning. Alternatively, the cutting feed unit 16 and the sponge positioning unit 75 may be used together as a sliding unit, and both the blade detection unit 50 side and the sponge member 72 side may be operated.

Moreover, you may provide the rotation drive part which rotates the sponge member 72 toward the axial center of the Z-axis direction with respect to the sponge accommodating case 71, and may use this rotation drive part as a slide unit. In this case, when the shape of the sponge member 72 is changed and formed into a cylindrical shape centered on the axis in the Z-axis direction, fluctuations in the contact pressure to the blade detection unit 50 during rotation of the sponge member 72 can be suppressed.

The sliding contact member for cleaning provided in the cleaning unit 70 is required to be able to be slidably connected to the light projecting window of the light emitting portion 55 or the light receiving window of the light receiving portion 56 and cleaned without being damaged. Projecting window or receiving window. Since the sponge member 72 of the above-described embodiment has flexibility and can retain moisture, it is an ideal material that satisfies these requirements. However, the material of the sliding contact member may be selected other than sponge, and its shape, structure, and the like may be arbitrarily selected. For example, a brush may be used instead of the sponge member 72 as a sliding member for cleaning. Also, a sliding contact member of a multilayer structure in which the central portion in the Y-axis direction is formed of rubber or resin, and the portions in contact with the light-emitting portion 55 or the light-receiving portion 56 on both sides thereof are formed of sponge or cloth.

In the above-described embodiment, a configuration in which the washing water nozzles 60 and 61 or the air nozzles 62 and 63 provided in the blade detection unit 50 is omitted may be selected.

The material of the workpiece to be cut by the cutting device to which the present invention is applied, the types of devices formed on the workpiece, and the like are not limited. For example, in addition to semiconductor device wafers, various workpieces such as optical device wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, green ceramic substrates, and piezoelectric substrates can be used as workpieces. As the semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation can also be used. As the optical device wafer, a sapphire wafer or a silicon carbide wafer after device formation can also be used. Further, CSP (Chip Size Package) substrates may be used as package substrates, silicon, gallium arsenide, etc. may be used as semiconductor substrates, and sapphire, ceramics, glass, etc. may be used as inorganic material substrates. In addition, lithium tantalate and lithium niobate after device formation or before device formation can also be used as oxide wafers.

In addition, although each embodiment of this invention has been described, as another embodiment of this invention, the form which combined the above-mentioned embodiment and modification in whole or part may be sufficient.

In addition, the embodiment of the present invention is not limited to the above-described embodiment and modification examples, and various changes, substitutions, and deformations can be made within the scope not departing from the spirit of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement. Therefore, the scope of the patent application covers all the embodiments that can be included in the scope of the technical idea of the present invention. industrial availability

As described above, according to the dicing device of the present invention, the blade detection component that detects the dicing blade can be surely cleaned at a suitable timing, and the operation efficiency or convenience of the dicing device can be significantly improved.

10‧‧‧Cutting device 11‧‧‧Abutment 12‧‧‧Opening 13‧‧‧Working table 14‧‧‧X-axis table 15‧‧‧Waterproof cover 16‧‧‧Cutting feed assembly (cleaning mechanism, sliding assembly) 17‧‧‧X-axis guide 18, 35, 38‧‧‧ball screw 19, 39‧‧‧motor 20‧‧‧θ Workbench 21‧‧‧Maintaining Surface 22‧‧‧ Fixtures 25‧‧‧Pillar 26‧‧‧Sidewall 30‧‧‧Cutting components 31‧‧‧Indexing feed components 32‧‧‧Plunge feed assembly 33‧‧‧Y-axis guide 34‧‧‧Y-axis table 36‧‧‧Z-axis guide 37‧‧‧Z-axis table 40‧‧‧Spindle 40x‧‧‧Axis 41‧‧‧Cutting blades 45‧‧‧Control components 50‧‧‧Blade detection kit 50A‧‧‧1st position 50B‧‧‧2nd position 51‧‧‧Support feet 52‧‧‧Base 53, 54‧‧‧Department 55‧‧‧Light-emitting part 56‧‧‧Light Receiver 57‧‧‧Goube 60, 61‧‧‧Washing water nozzle 62, 63‧‧‧Air Nozzle 65‧‧‧Protective cover 66, 74‧‧‧Hinge pin 70‧‧‧Cleaning unit (cleaning mechanism) 71‧‧‧Sponge housing (receiving housing) 71a‧‧‧Opening 72‧‧‧Sponge components (sliding components) 73‧‧‧Opening and closing cover 75‧‧‧Sponge positioning assembly (positioning assembly) 76‧‧‧Piston rod 77‧‧‧Water Supply Department F‧‧‧Ring Frame R‧‧‧arrow S‧‧‧Thick arrow T‧‧‧Cutting Tape W‧‧‧Wafer (Workpiece) X, Y, Z‧‧‧ directions

FIG. 1 is a perspective view showing a cutting device according to this embodiment. FIG. 2 is an enlarged perspective view of a part of the cutting device. 3 is a perspective view showing a relationship between a blade detection unit and a cleaning mechanism included in the cutting device. 4 is a perspective view showing a state in which the blade detection unit is cleaned with a sponge member. FIG. 5 is a plan view showing the positions of the work chuck and the blade detection unit during cutting. 6 is a plan view showing the positions of the work chuck and the blade detection unit during cleaning. FIG. 7 is a side view showing a part of the state of the cleaning mechanism at the time of cutting through perspective. FIG. 8 is a side view showing a part of the state of the washing mechanism at the time of washing in a perspective view.

50‧‧‧Blade detection kit

51‧‧‧Support feet

52‧‧‧Base

53, 54‧‧‧Department

55‧‧‧Light-emitting part

56‧‧‧Light Receiver

57‧‧‧Goube

60, 61‧‧‧Washing water nozzle

62, 63‧‧‧Air Nozzle

65‧‧‧Protective cover

66‧‧‧Hinge pins

70‧‧‧Cleaning unit (cleaning mechanism)

71‧‧‧Sponge housing (receiving housing)

72‧‧‧Sponge components (sliding components)

75‧‧‧Sponge positioning assembly (positioning assembly)

76‧‧‧Piston rod

X, Y, Z‧‧‧ directions

Claims (2)

A cutting device is provided with: a work clamping table for holding a workpiece; a cutting assembly equipped with a cutting blade, the cutting blade having an annular cutting blade for cutting the workpiece held on the work clamping table A cutting edge; a cutting and feeding assembly, which cuts and feeds the workpiece held on the working chuck in the X-axis direction; and a blade detection assembly, which has a light-emitting part and a light-receiving part, and the light-emitting part and the light-receiving part are used to sandwich the cutting The cutting edges of the blade are arranged facing each other, and the aforementioned cutting device is characterized by: Equipped with a cleaning mechanism, the aforementioned cleaning mechanism has: A sliding member is inserted between the light-emitting portion and the light-receiving portion that are arranged facing each other for cleaning; an accommodating casing, accommodating the sliding member and having an opening that allows the sliding member to enter and exit freely; a positioning assembly for selectively positioning the sliding member to an accommodation position accommodated in the accommodation casing, and a cleaning position inserted between the light-emitting portion and the light-receiving portion for cleaning; and a sliding assembly, so that the sliding member and the blade detection assembly slide relative to each other, The sliding member is positioned at the cleaning position and is slid by the sliding assembly, so that the sliding member cleans the light-emitting portion and the light-receiving portion. The cutting device of claim 1, wherein the blade detection component is disposed on the cutting feed component, the slide assembly is the cutting feed assembly, The sliding member is positioned at the cleaning position, and the blade detection assembly is slid in the X-axis direction by the cutting and feeding assembly, so that the sliding member cleans the light-emitting portion and the light-receiving portion.

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