JP2020032477A - Processing device - Google Patents

Abstract

To provide a processing device which can remove mist-like liquid remaining in a processing chamber with a simple mechanism.SOLUTION: A processing device includes: a processing chamber which houses a chuck table and a processing unit; a processing chamber drain which discharges liquid used in the processing chamber; and a gas-liquid separation unit which discharges gas and mist-like liquid from the processing chamber and separates the gas from the liquid. The gas-liquid separation unit includes: a suction duct which suctions the gas and the mist-like liquid from the processing chamber and discharges the gas and the mist-like liquid; a liquid tank which stores the liquid supplied from the processing chamber drain; a duct connection part which connects the suction duct with the liquid tank so that the gas and the mist-like liquid are jetted to a liquid surface of the liquid stored in the liquid tank; an exhaust opening which is provided at the liquid tank and in which the mist-like liquid jetted from the suction duct is captured by the liquid stored in the liquid tank and the gas separated from the liquid is exhausted; and a drain part which discharges the liquid from the liquid tank.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing apparatus that performs processing such as processing and cleaning on an object to be processed.

  When processing a workpiece represented by a semiconductor wafer, a package substrate, a ceramic substrate, a glass substrate, and the like, various processing apparatuses that perform processing such as cutting, grinding, and polishing on the workpiece are used. These processing apparatuses include a chuck table for holding a workpiece, and a spindle on a tip of which a tool (processing tool) for processing the workpiece is mounted.

  For example, when cutting a workpiece, a cutting device in which an annular cutting blade for cutting the workpiece is mounted on a spindle is used. The workpiece is cut by rotating the spindle to rotate the cutting blade and cutting the workpiece into the workpiece held by the chuck table.

  When processing a workpiece using a processing device, the processing chamber in which the processing of the workpiece is performed is used to cool the processing tool and the workpiece and to wash away debris (processing debris) generated by the processing. A large amount of liquid (working fluid) is supplied. When the workpiece is processed by the processing tool, the liquid in contact with the processing tool is scattered, and a mist-like liquid is generated in the processing chamber.

  If the mist-like liquid adheres to the components of the processing device, there is a possibility that rust of the processing device or failure of electronic equipment included in the processing device may occur. Therefore, the mist-like liquid generated in the processing chamber is discharged to the outside of the processing apparatus together with the atmosphere in the processing chamber via, for example, an exhaust duct connected to an exhaust port provided in the processing apparatus.

  However, the exhaust duct is usually provided at a specific location in the factory where the processing equipment is installed. Therefore, when installing the processing equipment, carefully check the layout of the factory, the length and shape of the exhaust duct, and accurately adjust the position and dimensions of the exhaust port of the processing equipment to which the exhaust duct is connected. Required, and it takes time to install the processing equipment. In addition, if the factory is not provided with exhaust equipment, it becomes difficult to install the processing apparatus itself.

  Therefore, instead of exhausting the atmosphere in the processing chamber by an exhaust duct, a method of connecting a device for removing mist from the atmosphere in the processing chamber to a processing apparatus has been proposed. For example, Patent Literature 1 discloses a mist collection device that captures a mist-like liquid remaining in a processing chamber and opens the atmosphere of the processing chamber from which the liquid has been removed into a clean room. By installing this mist collecting device, for example, adjacent to the processing device, it is possible to remove the mist-like liquid without connecting the processing device to an exhaust duct provided in a factory.

JP 2016-47563 A

  The above-mentioned mist collecting device is constituted by a complicated mechanism provided with a large number of dedicated components such as two types of demisters having different shapes and cooling means arranged between these demisters and controlling the temperature of air. Therefore, many processes are required for manufacturing the mist collecting device, which takes time.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a processing apparatus capable of removing a mist-like liquid remaining in a processing chamber by a simple mechanism.

  According to one embodiment of the present invention, a chuck table for holding an object to be processed, a processing unit for processing or cleaning the object to be processed while supplying liquid to the object to be processed held by the chuck table, A processing chamber accommodating the chuck table and the processing unit, a processing chamber drain for discharging the liquid used in the processing chamber, and a gas-liquid separation by discharging gas and mist-like liquid from the processing chamber A gas-liquid separation unit, wherein the gas-liquid separation unit sucks and discharges the gas and the mist-like liquid from the processing chamber, and the liquid supplied from the processing chamber drain. And a duct connection for connecting the suction duct to the liquid tank such that the gas and the mist-like liquid are ejected toward the liquid surface of the liquid stored in the liquid tank. Department and An exhaust opening provided in a liquid tank, wherein the mist-like liquid ejected from the suction duct is captured by the liquid stored in the liquid tank, and the gas separated from the liquid is exhausted; And a drain unit for discharging the liquid from the liquid tank.

  Preferably, the processing apparatus further includes a reuse path for supplying the liquid discharged from the liquid tank to the processing unit, wherein the reuse path is used for processing or cleaning by the processing unit. A filter unit for removing foreign substances contained in the liquid;

  Further, preferably, the processing unit is a processing unit that processes the workpiece with a tool mounted on a spindle rotatably housed in a housing, and the processing device is supplied to the housing and controls the spindle. The apparatus further includes a coolant supply path for supplying the cooled coolant to the liquid tank.

  The processing apparatus according to the present invention includes a gas-liquid separation unit that discharges a gas and a mist-like liquid from a processing chamber in which an object to be processed is processed, and separates them into gas and liquid. This gas-liquid separation unit performs gas-liquid separation by a very simple method of injecting the gas discharged from the processing chamber and the mist-like liquid toward the liquid surface of the liquid stored in the liquid tank. Therefore, the mist-like liquid can be easily removed without using a mist collection device or the like constituted by a complicated mechanism.

It is a perspective view which shows a processing apparatus typically. FIG. 3 is a partial cross-sectional side view schematically illustrating a gas-liquid separation unit connected to a processing chamber. FIG. 3 is a schematic view of a processing apparatus provided with a path for reusing a liquid stored in a liquid tank.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view schematically illustrating a processing apparatus 2 that performs processing and cleaning of an object to be processed.

  The processing device 2 includes a base 4 that supports each component of the processing device 2. An opening 4 a is formed in a front corner of the base 4, and a cassette support 6 that is moved up and down by an elevating mechanism (not shown) is provided in the opening 4 a. On an upper surface of the cassette support 6, a cassette 8 that accommodates a plurality of workpieces 11 is mounted. FIG. 1 shows only the outline of the cassette 8 for convenience of explanation.

  The processing target 2 is subjected to various processing such as processing and cleaning by the processing apparatus 2. When processing (cutting, grinding, polishing, or the like) is performed on the processing target 11 by the processing apparatus 2, the processing target 11 becomes the processing target.

  As the object to be processed 11, for example, a disk-shaped semiconductor wafer made of a semiconductor material such as silicon is used. For example, the processing target 11 is divided into a plurality of regions by a plurality of streets (planned division lines) arranged in a grid pattern so as to intersect with each other. Devices such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), etc., are formed.

  A circular adhesive tape 13 having a larger diameter than the object 11 is attached to the back side of the object 11. By attaching the annular frame 15 along the outer periphery of the adhesive tape 13 and attaching the back side of the object 11 to the center of the adhesive tape 13, the object 11, the adhesive tape 13, and the annular frame 15 are formed. The frame unit 17 is configured.

  The object 11 is accommodated in the cassette 8 while being supported by the annular frame 15 via the adhesive tape 13 as described above. Then, a plurality of device chips each including a device are obtained by, for example, cutting and dividing the workpiece 11 along the dividing line by the processing apparatus 2.

  Note that there is no limitation on the type, material, shape, structure, size, and the like of the workpiece 11. For example, a wafer made of a material other than silicon (such as GaAs, InP, GaN, or SiC), glass, sapphire, ceramics, resin, or metal can be used as the processing target 11. Further, the processing target 11 may be a package substrate in which a plurality of device chips are sealed with a resin.

  A rectangular opening 4b in a plan view is provided in a region of the upper surface of the base 4 located on the side of the cassette support 6. The opening 4b is formed such that the longitudinal direction is along the X-axis direction (front-back direction, processing feed direction). In the opening 4b, a ball screw type X-axis moving mechanism 10, a table cover 12, and a bellows-shaped dustproof and dripproof cover 14 are provided.

  The table cover 12 and the dust-proof drip-proof cover 14 are arranged so as to cover the upper part of the X-axis moving mechanism 10. The X-axis moving mechanism 10 includes an X-axis moving table (not shown) covered by a table cover 12, and moves the X-axis moving table along the X-axis direction.

  On the upper surface of the X-axis moving table, a chuck table 16 for holding the workpiece 11 is provided so as to be exposed from the table cover 12. The chuck table 16 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). The X-axis moving mechanism 10 moves the chuck table 16 along with the X-axis moving table and the table cover 12 along the X-axis direction.

  The upper surface of the chuck table 16 forms a holding surface 16a for holding the workpiece 11 by suction. The holding surface 16 a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is provided with a suction source (not shown) such as an ejector via a suction path (not shown) provided inside the chuck table 16. )It is connected to the.

  Four clamps 18 are provided around the chuck table 16 for fixing the annular frame 15 supporting the workpiece 11 from all sides. A transport unit (not shown) that transports the workpiece 11 to the chuck table 16 or the like is disposed near the opening 4b.

  Above the chuck table 16, two sets of processing units (processing units) 20a and 20b for processing the workpiece 11 are provided. Each of the processing units 20a and 20b is provided with a tool (processing tool) for processing the workpiece 11.

  Hereinafter, as an example, an example in which an annular cutting blade for cutting the workpiece 11 is mounted on the processing units 20a and 20b will be described. In this case, the processing units 20a and 20b each function as a cutting unit that cuts the workpiece 11.

  On the upper surface of the base 4, a portal-shaped support structure 22 for supporting the processing units 20a and 20b is disposed so as to straddle the opening 4b. A moving unit (moving mechanism) 24a for moving the processing unit 20a in the Y-axis direction and the Z-axis direction and a moving unit (moving) for moving the processing unit 20b in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 22. (Mechanism) 24b.

  The moving unit 24a includes a Y-axis moving plate 28a, and the moving unit 24b includes a Y-axis moving plate 28b. Each of the Y-axis moving plate 28a and the Y-axis moving plate 28b is slidably mounted on a pair of Y-axis guide rails 26 arranged on the front surface of the support structure 22 along the Y-axis direction.

  A nut portion (not shown) is provided on the back surface (rear surface side) of the Y-axis moving plate 28a. The nut portion has a Y-axis ball screw disposed substantially parallel to the pair of Y-axis guide rails 26. 30a is screwed. A nut (not shown) is provided on the back surface (rear surface side) of the Y-axis moving plate 28b, and the nut portion has a Y portion arranged substantially parallel to the pair of Y-axis guide rails 26. The shaft ball screw 30b is screwed.

  A Y-axis pulse motor 32 is connected to one end of each of the Y-axis ball screws 30a and 30b. By rotating the Y-axis ball screw 30a by the Y-axis pulse motor 32 connected to the Y-axis ball screw 30a, the Y-axis moving plate 28a moves in the Y-axis direction along the Y-axis guide rail 26. When the Y-axis ball screw 30b is rotated by the Y-axis pulse motor 32 connected to the Y-axis ball screw 30b, the Y-axis moving plate 28b moves in the Y-axis direction along the Y-axis guide rail 26.

  A pair of Z-axis guide rails 34a are provided on the front (front) side of the Y-axis moving plate 28a along the Z-axis direction. On the front (front) side of the Y-axis moving plate 28b, the Z-axis Are provided along the pair of Z-axis guide rails 34b. A Z-axis moving plate 36a is slidably mounted on the pair of Z-axis guide rails 34a, and a Z-axis moving plate 36b is slidably mounted on the pair of Z-axis guide rails 34b.

  A nut (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36a, and a Z-axis ball screw 38a arranged substantially parallel to the Z-axis guide rail 34a is provided on the nut. It is screwed. A Z-axis pulse motor 40 is connected to one end of the Z-axis ball screw 38a. By rotating the Z-axis ball screw 38a by the Z-axis pulse motor 40, the Z-axis moving plate 36a moves along the Z-axis guide rail 34a. To move in the Z-axis direction.

  A nut (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36b, and a Z-axis ball screw 38b arranged substantially parallel to the Z-axis guide rail 34b is provided on the nut. It is screwed. A Z-axis pulse motor 40 is connected to one end of the Z-axis ball screw 38b. When the Z-axis ball screw 38b is rotated by the Z-axis pulse motor 40, the Z-axis moving plate 36b moves along the Z-axis guide rail 34b. To move in the Z-axis direction.

  The processing unit 20a is provided below the Z-axis moving plate 36a. The processing unit 20a includes a cylindrical housing 42a supported by the moving unit 24a. A processing unit 20b is provided below the Z-axis moving plate 36b. The processing unit 20b includes a cylindrical housing 42b supported by the moving unit 24b.

  At a position adjacent to the processing unit 20a, an imaging unit (camera) 44 for imaging the workpiece 11 and the like sucked and held by the chuck table 16 is provided. The image acquired by the imaging unit 44 is used for, for example, positioning the workpiece 11 held by the chuck table 16 with the processing units 20a and 20b.

  A circular opening 4c in a plan view is provided in a region of the upper surface of the base 4 opposite to the opening 4a with respect to the opening 4b. A chuck table (cleaning table) 46 that holds and rotates the object 11 and a cleaning unit (processing unit) 48 that cleans the object 11 held by the chuck table 46 are arranged in the opening 4c. ing. The workpiece 11 processed by the processing units 20a and 20b is cleaned by the cleaning unit 48.

  Around the chuck table 46, a clamp (not shown) for fixing the annular frame 15 supporting the workpiece 11 is provided. The upper surface of the chuck table 46 constitutes a holding surface 46a for holding the workpiece 11 by suction.

  The holding surface 46a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is provided with a suction source (not shown) such as an ejector via a suction path (not shown) provided inside the chuck table 46. )It is connected to the. The chuck table 46 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction).

  The cleaning unit 48 includes an injection nozzle 50 supported by an L-shaped cleaning arm and having an injection port arranged to face the chuck table 46. The injection nozzle 50 supplies a liquid (cleaning liquid) such as pure water toward the holding surface 46a of the chuck table 46.

  When the processing target 11 is held by the chuck table 46 and the chuck table 46 is rotated while spraying the cleaning liquid from the injection nozzle 50 toward the surface of the processing target 11, foreign matter such as processing debris adhered to the processing target 11 is obtained. Is washed away. The cleaning unit 48 may further include an air nozzle (not shown) for injecting air for drying the processed object 11 after cleaning.

  The chuck table 16 and the processing units 20a and 20b are accommodated in a processing chamber (processing chamber) 70 (see FIG. 2) provided so as to cover the chuck table 16 and the processing units 20a and 20b. The processing of the workpiece 11 is performed in the processing chamber 70.

  When the workpiece 11 is processed by the processing units 20a and 20b, a liquid such as pure water (processing) is directed toward the processing object 11 and a processing tool (cutting blade 56) mounted on the processing units 20a and 20b. Liquid) is supplied. The liquid cools the workpiece 11 and the processing tool, and at the same time, removes chips (work chips) generated by the processing.

  The liquid supplied at the time of processing comes into contact with the processing tool and scatters, forming a mist. Therefore, when the workpiece 11 is processed, a large amount of mist-like liquid is generated in the processing chamber 70. If the mist-like liquid adheres to the components of the processing apparatus 2, there is a possibility that rust of the processing apparatus 2 or failure of electronic equipment included in the processing apparatus 2 may occur. Therefore, the mist-like liquid generated in the processing chamber 70 is preferably removed.

  The processing apparatus 2 according to the present embodiment includes a gas-liquid separation unit 52 that discharges gas (atmosphere of the processing chamber 70) and mist-like liquid from the processing chamber 70 and separates them into gas and liquid. The mist-like liquid generated in the processing chamber 70 is removed by the gas-liquid separation unit 52. Thereby, it is possible to prevent the occurrence of rust due to the mist-like liquid adhering to the components of the processing apparatus 2 and the failure of the electronic device.

  The gas-liquid separation unit 52 is housed inside the base 4, for example, as shown in FIG. Therefore, the mist-like liquid generated in the processing chamber 70 can be removed without performing an operation of connecting the processing chamber 70 with an exhaust duct provided in a factory where the processing apparatus 2 is installed. Thereby, the work when installing the processing apparatus 2 in the factory can be simplified. Further, even when the factory is not provided with an exhaust facility such as an exhaust duct, mist-like liquid can be removed.

  FIG. 2 is a partial cross-sectional side view schematically illustrating the gas-liquid separation unit 52 connected to the processing chamber (processing chamber) 70. The processing chamber 70 is formed in a substantially rectangular parallelepiped shape so as to cover the chuck table 16, the processing unit 20a, and the processing unit 20b (not shown in FIG. 2). Is a processing space 72 in which the processing is performed. That is, the chuck table 16, the processing unit 20a, and the processing unit 20b are accommodated in the processing space 72 inside the processing chamber 70.

  The processing chamber 70 includes a substantially rectangular upper wall 70a in plan view, and a side wall 70b connected to the upper wall 70a and arranged along the Z-axis direction. The upper wall 70a is formed with an opening 70c large enough to insert the Z-axis moving plates 36a and 36b and the imaging unit 44.

  The processing unit 20a includes a spindle 54 (see FIG. 3) rotatably housed in the housing 42a (see FIG. 1) and taking an axis in a direction substantially parallel to the holding surface 16a of the chuck table 16. The tip of the spindle 54 is exposed to the outside of the housing 42a, and an annular cutting blade 56 as a processing tool for cutting the workpiece 11 is mounted on the tip of the spindle 54. The spindle 54 is connected to a rotary drive source such as a motor, and the cutting blade 56 mounted on the spindle 54 is rotated by a force transmitted from the rotary drive source.

  The cutting blade 56 is formed by fixing abrasive grains made of, for example, diamond with a bonding material. As the bonding material, for example, a metal bond, a resin bond, a vitrified bond, or the like is used.

  The processing unit 20a includes a blade cover 58 that covers the cutting blade 56. The blade cover 58 includes a nozzle block 60a that supplies a liquid (cutting liquid) such as pure water to the cutting blade 56. The nozzle block 60a includes a pair of nozzles 64a connected to a tube 62a to which the cutting fluid is supplied.

  The pair of nozzles 64a are arranged so as to sandwich the cutting blade 56 from the front side and the back side (both sides). Further, each of the pair of nozzles 64a is provided with an opening (not shown) for jetting a cutting fluid toward the cutting blade 56 at a position facing the cutting blade 56. The cutting fluid supplied from the tube 62a to the pair of nozzles 64a is sprayed from the opening toward the front side and the back side of the cutting blade 56.

  The blade cover 58 includes a nozzle block 60b that supplies a liquid (cutting liquid) such as pure water to the cutting blade 56 and the workpiece 11 held on the chuck table 16. The nozzle block 60b includes a nozzle 64b connected to a tube 62b to which the cutting fluid is supplied.

  The tip of the nozzle 64b opens toward the outer periphery of the cutting blade 56. The cutting fluid supplied from the tube 62b to the nozzle 64b is sprayed from the tip of the nozzle 64b toward the outer periphery of the cutting blade 56. Then, the cutting fluid is supplied to the contact area between the cutting blade 56 and the workpiece 11 by the rotation of the cutting blade 56.

  When the workpiece 11 is cut, the cutting blade 56 is cut into the workpiece 11 while supplying a cutting fluid to the cutting blade 56 and the workpiece 11 from the nozzles 64a and 64b. By the supply of the cutting fluid, a region where the cutting blade 56 and the workpiece 11 are in contact is cooled, and chips (cut chips) generated by cutting are washed away.

  Although the configuration example of the processing unit 20a has been particularly described above, the processing unit 20b (see FIG. 1) can be similarly configured.

  A protective cover 74 is provided near the opening 70c and at a position overlapping the opening 70c. The protective cover 74 prevents the liquid used in the processing by the processing unit 20a from scattering to the outside of the processing chamber 70 via the opening 70c.

  Further, a partition member 76 that partitions the processing space 72 into a processing area 72a and a transport area 72b is provided on the front side (the right side in FIG. 2) of the processing unit 20a. The processing of the workpiece 11 is performed in the processing area 72a, and the transport of the workpiece 11 onto the chuck table 16 and the unloading of the workpiece 11 from the chuck table 16 are performed in the transport area 72b. Further, the partition member 76 prevents the liquid used in the processing by the processing unit 20a from scattering to the transport area 72b.

  Note that an opening 76 a is provided at the lower end of the partition member 76. The chuck table 16 moves along the X-axis direction between the processing area 72a and the transport area 72b via the opening 76a.

  When the workpiece 11 is processed in the processing area 72a by the processing unit 20a, the liquid 78 used for the processing is scattered to the rear side (the left side in FIG. 2) by the rotation of the cutting blade 56. A part of the scattered liquid 78 is discharged by the processing chamber drain 80 provided on the rear side of the dust-proof and drip-proof cover 14.

  The processing chamber drain 80 is a discharge mechanism that discharges the liquid 78 used in the processing chamber 70 out of the processing chamber 70. The processing chamber drain 80 includes a storage part 80a for temporarily storing the liquid in the processing space 72, and a pipe 80b having one end connected to the bottom of the storage part 80a and the other end connected to the liquid tank 82. A part of the liquid 78 scattered in the processing space 72 is temporarily stored in the storage unit 80a, and then supplied to the liquid tank 82 via the pipe 80b, and stored in the liquid tank 82.

  In addition, a part of the liquid 78 scattered by the rotation of the cutting blade 56 becomes a mist and floats inside the processing chamber 70. Thereby, the processing chamber 70 is filled with the gas corresponding to the atmosphere of the processing chamber 70 and the mist-like liquid 78. The gas and the mist-like liquid 78 are discharged by the gas-liquid separation unit 52 connected to the processing chamber 70.

  Specifically, an opening 70d is formed in the side wall 70b on the rear side of the processing chamber 70, and the processing chamber 70 is connected to the gas-liquid separation unit 52 through the opening 70d. The gas-liquid separation unit 52 discharges the gas (atmosphere of the processing chamber 70) and the mist-like liquid 78 from the processing space 72 of the processing chamber 70, and separates them into a gas and a liquid (gas-liquid separation). As described above, by discharging the atmosphere in the processing chamber 70 and the mist-like liquid 78 generated by the processing, it is possible to prevent the mist-like liquid 78 from adhering to the components of the processing apparatus 2.

  The gas-liquid separation unit 52 includes a suction duct 84 that suctions and discharges the atmosphere in the processing chamber 70 and the mist-like liquid 78 from the processing chamber 70. One end of the suction duct 84 is connected to an opening 70 d provided in a side wall 70 b of the processing chamber 70, and the other end is connected to a liquid tank 82 via a duct connection 86.

  The suction duct 84 has a connection portion 84a connected to the opening 70d. The connection portion 84a is provided with a fan 84b for generating an air flow 88 from the processing space 72 to the liquid tank 82 via the suction duct 84. ing. By rotating the fan 84b, an airflow 88 is generated, and the atmosphere in the processing chamber 70 and the mist-like liquid 78 are sucked and exhausted.

  In the liquid tank 82, the liquid 90 used in the processing apparatus 2 is stored at a water level within a predetermined range. The liquid 90 is, for example, a processing liquid (cutting liquid or the like) used for processing the object 11 by the processing units 20a and 20b, a cleaning liquid used for cleaning the object 11 by the cleaning unit 48 (see FIG. 1), It corresponds to a cooling liquid or the like used for cooling the processing units 20a and 20b.

  The duct connection portion 86 connects the end of the suction duct 84 to the liquid tank so that the atmosphere in the processing chamber 70 and the mist-like liquid 78 are jetted toward the liquid surface 90 a of the liquid 90 stored in the liquid tank 82. Connect to. Specifically, the suction duct 84 is positioned by the duct connection portion 86 so that its end is opened toward the liquid surface 90a.

  The atmosphere in the processing chamber 70 and the mist-like liquid 78 discharged by the suction duct 84 are sprayed on the liquid surface 90 a of the liquid 90. As a result, the mist-like liquid 78 is captured by the liquid 90 stored in the liquid tank 82. As a result, the atmosphere in the processing chamber 70 and the mist-like liquid are separated into gas and liquid (gas-liquid separation). The gas-liquid separated atmosphere in the processing chamber 70 is discharged to the outside of the liquid tank 82 through an exhaust opening 92 provided in the liquid tank 82.

  When the above-described gas-liquid separation is performed, the mist-like liquid 78 is not discharged from the exhaust opening 92. Therefore, even if the atmosphere of the processing chamber 70 exhausted from the exhaust opening 92 is opened inside the processing apparatus 2, the mist-like liquid does not adhere to the components of the processing apparatus 2.

  The exhaust opening 92 may be provided with a filter for further removing liquid from the atmosphere in the processing chamber 70 after gas-liquid separation. As the filter, for example, a wire net formed in a mesh shape, a louver made of metal or the like can be used. By providing a filter in the exhaust opening 92, the mist-like liquid 78 discharged from the processing chamber 70 can be reliably removed.

  Further, a drain portion 94 for discharging the liquid 90 stored in the liquid tank 82 is connected to the liquid tank 82. One end of the drain portion 94 is connected to the liquid tank 82, and the other end is exposed outside the base 4. When the water level of the liquid 90 stored in the liquid tank 82 reaches a predetermined value, the liquid 90 is discharged from the liquid tank 82 to the outside of the processing apparatus 2 by the drain unit 94.

  As described above, the gas-liquid separation unit 52 according to the present embodiment injects the gas discharged from the processing chamber 70 and the mist-like liquid 78 toward the liquid surface 90 a of the liquid 90 stored in the liquid tank 82. The gas-liquid separation is performed by a very simple method. Therefore, the mist-like liquid can be easily removed without using a mist collection device or the like constituted by a complicated mechanism.

  The liquid 90 that has captured the mist-like liquid 78 can be reused as a processing liquid, a cleaning liquid, a cooling liquid, or the like for the processing apparatus 2. FIG. 3 is a schematic diagram of the processing apparatus 2 provided with a path for reusing the liquid 90 stored in the liquid tank 82. In FIG. 3, a part of the configuration of the processing device 2 is represented by blocks.

  The processing apparatus 2 shown in FIG. 3 includes a filter unit 100 connected to a liquid tank 82 via a flow path 102a and connected to a processing unit 20a or a processing unit 20b (not shown in FIG. 3) via a flow path 102b. Is provided. The filter unit 100 removes foreign matter (such as processing waste) contained in the liquid 90 supplied from the liquid tank 82 via the flow path 102a.

  The liquid 90 from which foreign matter has been removed and purified by the filter unit 100 is supplied to the processing units 20a and 20b via the flow path 102b and reused. As described above, the filter unit 100 and the flow paths 102a and 102b constitute a reuse path 104 for supplying the liquid 90 discharged from the liquid tank 82 to the processing units 20a and 20b.

  Further, a liquid supply unit 106 that supplies liquid to the filter unit 100 is connected to the filter unit 100. The liquid supply unit 106 includes a valve 108 and a liquid supply source 110 connected to the filter unit 100 via the valve 108.

  When the liquid 90 is not stored in the liquid tank 82 or when the storage amount of the liquid 90 is insufficient, a liquid such as water is supplied from the liquid supply source 110 to the filter unit 100 via the valve 108. Then, after this liquid is purified by the filter unit 100, it is supplied to the processing units 20a and 20b.

  The liquid supplied to the processing units 20a and 20b via the reuse path 104 is used, for example, as a cooling liquid for cooling the processing units 20a and 20b. However, the liquid purified by the filter unit 100 can be used as a processing liquid (cutting liquid or the like) supplied to the cutting blade 56 at the time of processing, a cleaning liquid for cleaning the workpiece 11, or the like.

  When the liquid supplied via the reuse path 104 is used as the cooling liquid, the cooling liquid is supplied to, for example, the housing 42a provided in the processing unit 20a or the housing 42b (not shown in FIG. 3) provided in the processing unit 20b. Is done. In this case, the reuse path 104 is connected to the housings 42a and 42b as shown in FIG. Then, the cooling liquid supplied to the housings 42a and 42b is supplied to the spindle 54 to cool the spindle 54.

  The cooling liquid used for cooling the spindle 54 is supplied to the liquid tank 82 through a cooling liquid supply path 112 connected to the liquid tank 82, and is stored as a part of the liquid 90. In this way, the reuse path 104 and the coolant supply path 112 constitute the coolant circulation path 114 for circulating the coolant.

  As described above, the processing apparatus 2 according to the present embodiment causes the mist-like liquid 78 discharged from the processing chamber 70 to be captured by the liquid 90 stored in the liquid tank 82 and uses the liquid 90 as a cooling liquid or the like. Can be reused.

  When the liquid 90 stored in the liquid tank 82 is reused, the temperature of the liquid 90 is adjusted according to the application. Here, the coolant used to cool the spindle 54 is heated by the heat generated in the spindle 54, and when the heated coolant is supplied from the coolant supply path 112 to the liquid tank 82, the liquid tank 82 The temperature of the liquid 90 stored in the tank increases. As a result, the energy required for cooling the liquid 90 increases.

  When the gas-liquid separation unit 52 according to the present embodiment is used, the atmosphere of the processing chamber 70 supplied from the suction duct 84 is sprayed on the liquid 90 stored in the liquid tank 82, and the liquid 90 is cooled. Therefore, the energy required for cooling the liquid 90 is reduced.

  Further, in the present embodiment, an example in which the gas-liquid separation unit 52 is connected to the processing chamber 70 in which the processing of the workpiece 11 is performed has been described, but the gas-liquid separation unit 52 is connected to another processing chamber from which the liquid is discharged. Can also be connected. For example, the chuck table 46 and the cleaning unit (processing unit) 48 shown in FIG. 1 are housed in a processing chamber (cleaning chamber) for cleaning the processing target 11. By connecting the gas-liquid separation unit 52 to this processing chamber, mist-like liquid generated by cleaning the processing object 11 can be removed.

  The liquid (cleaning liquid) used for cleaning the object 11 is stored in the liquid tank 82 (see FIG. 3). Then, the liquid 90 stored in the liquid tank 82 is supplied to the cleaning unit 48 after the foreign matter is removed by the filter unit 100 and is used again as the cleaning liquid.

  In the present embodiment, the case where the processing unit 20a is a cutting unit to which the cutting blade 56 for cutting the processing target 11 is attached has been described. There is no limitation on the configuration of 20a and 20b.

  For example, the processing units 20a and 20b may be grinding units that grind the workpiece 11 or polishing units that grind the workpiece 11. When the processing units 20a and 20b are grinding units, a grinding wheel or the like including a grinding wheel for grinding the workpiece 11 is mounted on a spindle as a processing tool. When the processing units 20a and 20b are polishing units, a polishing pad or the like having a polishing member for polishing the workpiece 11 is mounted on a spindle as a processing tool.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 11 Processed object 13 Adhesive tape 15 Annular frame 17 Frame unit 2 Processing device 4 Base 4a Opening 4b Opening 4c Opening 6 Cassette support 8 Cassette 10 X-axis moving mechanism 12 Table cover 14 Dust-proof drip-proof cover 16 Chuck table 16a Holding surface 18 Clamp 20a, 20b Processing unit (processing unit)
22 Support structure 24a, 24b Moving unit (moving mechanism)
26 Y-axis guide rails 28a, 28b Y-axis moving plate 30a, 30b Y-axis ball screw 32 Y-axis pulse motor 34a, 34b Z-axis guide rail 36a, 36b Z-axis moving plate 38a, 38b Z-axis ball screw 40 Z-axis pulse motor 42a, 42b Housing 44 Imaging unit (camera)
46 Chuck table (washing table)
46a Holding surface 48 Cleaning unit (processing unit)
Reference Signs List 50 injection nozzle 52 gas-liquid separation unit 54 spindle 56 cutting blade 58 blade cover 60a, 60b nozzle block 62a, 62b tube 64a, 64b nozzle 70 processing chamber (processing chamber)
70a Upper wall 70b Side wall 70c Opening 70d Opening 72 Processing space 72a Processing area 72b Transport area 74 Protective cover 76 Partition member 76a Opening 78 Liquid 80 Processing chamber drain 80a Storage section 80b Pipe 82 Liquid tank 84 Suction duct 84a Connection section 84b Fan 86 duct Connection 88 Airflow 90 Liquid 90a Liquid surface 92 Exhaust opening 94 Drain 100 Filter unit 102a, 102b Flow path 104 Reuse path 106 Liquid supply unit 108 Valve 110 Liquid supply source 112 Coolant supply path 114 Coolant circulation path

Claims (3)

A chuck table for holding the workpiece,
A processing unit for processing or cleaning the workpiece while supplying liquid to the workpiece held by the chuck table;
A processing chamber containing the chuck table and the processing unit,
A processing chamber drain for discharging the liquid used in the processing chamber;
A gas-liquid separation unit that discharges gas and the mist-like liquid from the processing chamber to perform gas-liquid separation,
The gas-liquid separation unit,
A suction duct for suctioning and discharging the gas and the mist-like liquid from the processing chamber;
A liquid tank for storing the liquid supplied from the processing chamber drain,
A duct connection unit that connects the suction duct to the liquid tank so that the gas and the mist-like liquid are ejected toward the liquid surface of the liquid stored in the liquid tank;
An exhaust opening provided in the liquid tank, wherein the mist-like liquid ejected from the suction duct is trapped by the liquid stored in the liquid tank and the gas separated from the gas is exhausted;
A drain unit for discharging the liquid from the liquid tank. The apparatus further includes a recycling path for supplying the liquid discharged from the liquid tank to the processing unit,
The processing apparatus according to claim 1, wherein the reuse path includes a filter unit that removes a foreign substance contained in the liquid used for processing or cleaning by the processing unit. The processing unit is a processing unit that processes the workpiece with a tool mounted on a spindle rotatably housed in a housing,
3. The processing apparatus according to claim 1, further comprising a cooling liquid supply passage that supplies a cooling liquid supplied to the housing and cooling the spindle to the liquid tank.