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TWI730137B - 樹脂成形方法 - Google Patents

樹脂成形方法 Download PDF

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Publication number
TWI730137B
TWI730137B TW106122175A TW106122175A TWI730137B TW I730137 B TWI730137 B TW I730137B TW 106122175 A TW106122175 A TW 106122175A TW 106122175 A TW106122175 A TW 106122175A TW I730137 B TWI730137 B TW I730137B
Authority
TW
Taiwan
Prior art keywords
release film
mold
film
resin
molding
Prior art date
Application number
TW106122175A
Other languages
English (en)
Chinese (zh)
Other versions
TW201813798A (zh
Inventor
中澤英明
藤澤雅彥
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW201813798A publication Critical patent/TW201813798A/zh
Application granted granted Critical
Publication of TWI730137B publication Critical patent/TWI730137B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW106122175A 2016-09-27 2017-07-03 樹脂成形方法 TWI730137B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-188667 2016-09-27
JP2016188667A JP6423399B2 (ja) 2016-09-27 2016-09-27 樹脂成形方法、フィルム搬送装置および樹脂成形装置

Publications (2)

Publication Number Publication Date
TW201813798A TW201813798A (zh) 2018-04-16
TWI730137B true TWI730137B (zh) 2021-06-11

Family

ID=61759388

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109143181A TWI747649B (zh) 2016-09-27 2017-07-03 樹脂成形方法
TW106122175A TWI730137B (zh) 2016-09-27 2017-07-03 樹脂成形方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109143181A TWI747649B (zh) 2016-09-27 2017-07-03 樹脂成形方法

Country Status (5)

Country Link
JP (1) JP6423399B2 (ja)
KR (2) KR102254069B1 (ja)
CN (2) CN108698266B (ja)
TW (2) TWI747649B (ja)
WO (1) WO2018061316A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
JP7417429B2 (ja) * 2020-01-17 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形品の製造方法
KR102348941B1 (ko) * 2020-10-05 2022-01-13 덕양산업 주식회사 내장재 성형 금형
JP7432925B2 (ja) * 2020-12-04 2024-02-19 アピックヤマダ株式会社 圧力監視装置、樹脂封止装置、及び圧力監視方法
KR20220125058A (ko) * 2021-03-04 2022-09-14 삼성전자주식회사 반도체 칩 몰딩 금형 장치
JP7644494B2 (ja) * 2021-09-28 2025-03-12 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7230160B1 (ja) * 2021-12-01 2023-02-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
KR20230169711A (ko) 2022-06-09 2023-12-18 제주파나텍 (주) 아르기닌 흡수 증대를 위한 비타민 c 함유 장어즙 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108159A (ja) * 1998-10-08 2000-04-18 Apic Yamada Corp 樹脂封止装置
JP2005219210A (ja) * 2004-02-03 2005-08-18 Towa Corp 離型シート及び樹脂成形方法
JP2008302550A (ja) * 2007-06-06 2008-12-18 Sumitomo Heavy Ind Ltd フィルム供給機構
TW201532774A (zh) * 2014-01-14 2015-09-01 Apic Yamada Corp 樹脂成型金屬模及樹脂成型方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241553B2 (ja) 1994-11-21 2001-12-25 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP2006027081A (ja) * 2004-07-16 2006-02-02 Towa Corp 樹脂封止方法及びシート状部材
JP4405429B2 (ja) * 2005-05-11 2010-01-27 住友重機械工業株式会社 樹脂モールド金型及び樹脂モールド方法
KR101395520B1 (ko) * 2006-08-18 2014-05-14 아사히 가라스 가부시키가이샤 반도체 수지 몰드용 이형 필름
JP2009099850A (ja) * 2007-10-18 2009-05-07 Sony Chemical & Information Device Corp 半導体モジュールの製造方法及び製造装置、半導体モジュール
JP2012142364A (ja) * 2010-12-28 2012-07-26 Nitto Denko Corp 封止部材、封止方法、および、光半導体装置の製造方法
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
KR102019656B1 (ko) * 2012-01-30 2019-09-09 에이지씨 가부시키가이샤 이형 필름 및 이것을 사용한 반도체 디바이스의 제조 방법
JP5906453B2 (ja) * 2013-01-11 2016-04-20 パナソニックＩｐマネジメント株式会社 射出成形方法および射出成形装置
JP5934156B2 (ja) 2013-08-20 2016-06-15 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108159A (ja) * 1998-10-08 2000-04-18 Apic Yamada Corp 樹脂封止装置
JP2005219210A (ja) * 2004-02-03 2005-08-18 Towa Corp 離型シート及び樹脂成形方法
JP2008302550A (ja) * 2007-06-06 2008-12-18 Sumitomo Heavy Ind Ltd フィルム供給機構
TW201532774A (zh) * 2014-01-14 2015-09-01 Apic Yamada Corp 樹脂成型金屬模及樹脂成型方法

Also Published As

Publication number Publication date
KR20190060953A (ko) 2019-06-04
KR102282905B1 (ko) 2021-07-28
TW202112520A (zh) 2021-04-01
CN112372916A (zh) 2021-02-19
CN112372916B (zh) 2022-06-10
KR102254069B1 (ko) 2021-05-20
TW201813798A (zh) 2018-04-16
JP2018051841A (ja) 2018-04-05
CN108698266A (zh) 2018-10-23
CN108698266B (zh) 2021-04-20
TWI747649B (zh) 2021-11-21
WO2018061316A1 (ja) 2018-04-05
KR20200138432A (ko) 2020-12-09
JP6423399B2 (ja) 2018-11-14

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