TWI669033B - 具備過孔銲盤的軟性印刷電路板 - Google Patents
具備過孔銲盤的軟性印刷電路板 Download PDFInfo
- Publication number
- TWI669033B TWI669033B TW106132162A TW106132162A TWI669033B TW I669033 B TWI669033 B TW I669033B TW 106132162 A TW106132162 A TW 106132162A TW 106132162 A TW106132162 A TW 106132162A TW I669033 B TWI669033 B TW I669033B
- Authority
- TW
- Taiwan
- Prior art keywords
- via pad
- printed circuit
- flexible printed
- circuit board
- distance
- Prior art date
Links
- 230000001154 acute effect Effects 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract description 5
- 239000000470 constituent Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 101000582320 Homo sapiens Neurogenic differentiation factor 6 Proteins 0.000 description 1
- 102100030589 Neurogenic differentiation factor 6 Human genes 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??10-2016-0122403 | 2016-09-23 | ||
| KR1020160122403A KR101923637B1 (ko) | 2016-09-23 | 2016-09-23 | 비아 패드를 갖는 연성 회로 기판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201815238A TW201815238A (zh) | 2018-04-16 |
| TWI669033B true TWI669033B (zh) | 2019-08-11 |
Family
ID=61690833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106132162A TWI669033B (zh) | 2016-09-23 | 2017-09-20 | 具備過孔銲盤的軟性印刷電路板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (3) | JP2019530243A (ja) |
| KR (1) | KR101923637B1 (ja) |
| CN (2) | CN116033652A (ja) |
| TW (1) | TWI669033B (ja) |
| WO (1) | WO2018056594A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101923637B1 (ko) * | 2016-09-23 | 2018-11-30 | 스템코 주식회사 | 비아 패드를 갖는 연성 회로 기판 |
| WO2024111972A1 (ko) * | 2022-11-25 | 2024-05-30 | 엘지이노텍 주식회사 | 연성 회로기판, cof 모듈 및 이를 포함하는 전자디바이스 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080085443A (ko) * | 2007-03-20 | 2008-09-24 | 삼성테크윈 주식회사 | 연성 회로 기판 및 그 제조방법 |
| CN102843857A (zh) * | 2011-06-24 | 2012-12-26 | 发那科株式会社 | 具有焊盘的印制电路布线板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521944A (ja) * | 1991-07-12 | 1993-01-29 | Canon Inc | 印刷配線板 |
| JP2845034B2 (ja) * | 1992-07-02 | 1999-01-13 | 日本電気株式会社 | 印刷配線板 |
| JP3780996B2 (ja) * | 2002-10-11 | 2006-05-31 | セイコーエプソン株式会社 | 回路基板、バンプ付き半導体素子の実装構造、バンプ付き半導体素子の実装方法、電気光学装置、並びに電子機器 |
| JP2004241512A (ja) * | 2003-02-05 | 2004-08-26 | Matsushita Electric Ind Co Ltd | プリント配線基板の導電パターン及びプリント配線基板 |
| JP4841865B2 (ja) * | 2005-06-01 | 2011-12-21 | 株式会社バッファロー | プリント回路板 |
| JP2008147328A (ja) * | 2006-12-08 | 2008-06-26 | Matsushita Electric Ind Co Ltd | フレキシブル基板及びその製造方法 |
| KR101405328B1 (ko) * | 2012-11-27 | 2014-06-10 | 스템코 주식회사 | 연성 회로 기판 |
| KR101923637B1 (ko) * | 2016-09-23 | 2018-11-30 | 스템코 주식회사 | 비아 패드를 갖는 연성 회로 기판 |
-
2016
- 2016-09-23 KR KR1020160122403A patent/KR101923637B1/ko active Active
-
2017
- 2017-08-24 WO PCT/KR2017/009252 patent/WO2018056594A1/ko active Application Filing
- 2017-08-24 CN CN202310151504.2A patent/CN116033652A/zh active Pending
- 2017-08-24 CN CN201780058602.4A patent/CN109792838A/zh active Pending
- 2017-08-24 JP JP2019516165A patent/JP2019530243A/ja active Pending
- 2017-09-20 TW TW106132162A patent/TWI669033B/zh not_active IP Right Cessation
-
2021
- 2021-03-15 JP JP2021041281A patent/JP2021100142A/ja active Pending
-
2023
- 2023-03-29 JP JP2023054009A patent/JP7607693B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080085443A (ko) * | 2007-03-20 | 2008-09-24 | 삼성테크윈 주식회사 | 연성 회로 기판 및 그 제조방법 |
| CN102843857A (zh) * | 2011-06-24 | 2012-12-26 | 发那科株式会社 | 具有焊盘的印制电路布线板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023073414A (ja) | 2023-05-25 |
| CN109792838A (zh) | 2019-05-21 |
| WO2018056594A1 (ko) | 2018-03-29 |
| KR101923637B1 (ko) | 2018-11-30 |
| JP7607693B2 (ja) | 2024-12-27 |
| JP2019530243A (ja) | 2019-10-17 |
| KR20180032995A (ko) | 2018-04-02 |
| JP2021100142A (ja) | 2021-07-01 |
| TW201815238A (zh) | 2018-04-16 |
| CN116033652A (zh) | 2023-04-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |