[go: up one dir, main page]

WO2017045358A1 - 柔性基板和显示装置 - Google Patents

柔性基板和显示装置 Download PDF

Info

Publication number
WO2017045358A1
WO2017045358A1 PCT/CN2016/074017 CN2016074017W WO2017045358A1 WO 2017045358 A1 WO2017045358 A1 WO 2017045358A1 CN 2016074017 W CN2016074017 W CN 2016074017W WO 2017045358 A1 WO2017045358 A1 WO 2017045358A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
flexible substrate
functional
bendable region
adjacent
Prior art date
Application number
PCT/CN2016/074017
Other languages
English (en)
French (fr)
Inventor
张博
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/325,416 priority Critical patent/US10314172B2/en
Publication of WO2017045358A1 publication Critical patent/WO2017045358A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits

Definitions

  • the present invention relates to the field of flat panel display technologies, and in particular, to a flexible substrate and a display device.
  • Chip On Flex or Chip On Film (COF) technology is to fix an integrated circuit (IC) on a flexible substrate, and use a soft additional circuit board as a carrier for packaging the integrated circuit chip, thereby A technique in which a chip is bonded to a circuit on a flexible substrate.
  • the flip chip technology can solve the problem of space occupation to a certain extent.
  • the existing COF technology only mounts the integrated circuit chip on the flexible substrate by using the anisotropic conductive adhesive.
  • the flexible substrate can be changed in shape according to an external force, it is limited by the hardness of the packaged integrated circuit chip, and the shape of the flexible substrate is changed to a small extent, so that space occupation cannot be more effectively reduced.
  • the flexible substrate in the COF technology is connected to the rigid circuit board on which the peripheral circuit components are mounted to form a rigid flexible integrated board. Since the hard circuit board portion has a large volume and weight and is not flexible, it is necessary to occupy a large space in the display module. This does not apply to the trend of thin and light display module packaging.
  • the present invention can solve the problem that the flexible substrate is limited by the hardness of the packaged integrated circuit chip, and the shape change is small, and the problem of space occupation cannot be more effectively reduced.
  • the present invention can also solve the problem that the rigid circuit board occupies a large space after the flexible substrate and the rigid circuit board are connected to form a rigid flexible integrated board.
  • An embodiment of the present invention provides a flexible substrate, the flexible substrate includes at least two chip regions, and the chip region is provided with a functional chip;
  • a bendable region is disposed between each two adjacent chip regions, the flexible substrate is bent at the bendable region, and two of the chip regions adjacent to the bendable region overlapping.
  • the flexible substrate includes the bendable region, and the flexible substrate can be bent in the bendable region to overlap the chip regions on both sides of the bendable region, thereby The space occupied by the flexible substrate is reduced.
  • the chip area is also provided with a plurality of electrodes for electrical connection with an external substrate.
  • the flexible substrate includes wires disposed in the bendable region, and the functional chips are connected to each other by the guiding.
  • the cross-sectional pattern of the flexible substrate in a bent state is a wave shape, a square wave shape or a rectangular spiral shape.
  • the flexible substrate can be bent into various shapes according to actual assembly needs.
  • each of the chip regions has the same shape and is equal in size.
  • the flexible substrate is provided with the functional chip only on one side of the chip region, and the functional chip is disposed on different faces of two adjacent chip regions.
  • the package surface of the functional chip can be designed in combination with the bending requirements of the flexible substrate.
  • the width of the bendable region is at least one time and more than the thickness of the functional chip having the largest thickness among two adjacent chip regions.
  • the width of the bendable area that is one or more times the thickness of the maximum function chip can ensure that “the functional chips are disposed on different faces of two adjacent chip regions”. After the flexible substrate of the structure is bent, two adjacent chip regions can overlap, and the functional chip in the chip region is not affected.
  • the flexible substrate is provided with the functional chip on both sides of the chip area.
  • the package surface of the functional chip can be designed in combination with the bending requirements of the flexible substrate.
  • the width of the bendable region is at least twice or more the thickness of the functional chip having the largest thickness among the adjacent two chip regions.
  • the width of the bendable area that is twice or more the thickness of the maximum function chip can ensure that the same side or both sides of the two adjacent chip areas are provided with the Functional chip "After bending, the flexible substrate of such a structure can overlap two adjacent chip regions without affecting the functional chip in the chip region.
  • the functional chip includes a single chip, a stacked chip, and a silicon penetrating structure.
  • Through Silicon Via integrates any one or more of the chips in the chip.
  • the function chip may be a single chip, such as a capacitor, a resistor, a diode, an inductor, etc.; or an integrated circuit chip, such as a gate driving chip, a data driving chip, a single chip microcomputer, or the like; or a TSV chip.
  • the flexible substrate includes the bendable region, and the flexible substrate can be bent in the bendable region to make the chip region on both sides of the bendable region Overlap, thereby reducing the space occupied by the flexible substrate.
  • the embodiment of the invention further provides a display device, wherein the peripheral circuit of the display device is packaged in the flexible substrate provided in the above embodiment.
  • the flexible substrate includes the bendable region, and the flexible substrate can be bent in the bendable region to make the chip region on both sides of the bendable region Overlap, thereby reducing the space occupied by the flexible substrate.
  • the peripheral circuit is packaged in the flexible substrate, and a hard circuit board is no longer needed, which can effectively save space.
  • FIG. 1 is a top plan view of a flexible substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic view showing a first shape of a flexible substrate after being bent according to an embodiment of the present invention
  • FIG. 3 is a schematic view showing a second shape of a flexible substrate after being bent according to an embodiment of the present invention
  • FIG. 4 is a partial cross-sectional view showing a first flexible substrate according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing the first flexible substrate shown in FIG. 4 after being bent;
  • FIG. 6 is a partial cross-sectional view showing a second flexible substrate according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view showing the second substrate shown in FIG. 6 after being bent;
  • FIG. 8 is a partial cross-sectional view showing a third flexible substrate according to an embodiment of the present invention.
  • Figure 9 is a cross-sectional view showing the third flexible substrate shown in Figure 8 after being bent;
  • FIG. 10 is a schematic diagram showing a connection relationship between a display module and a flexible substrate in a display device according to an embodiment of the invention.
  • an embodiment of the present invention provides a flexible substrate 100 .
  • the flexible substrate 100 includes at least two chip regions 1 provided with a functional chip 11 and a plurality of electrodes for electrical connection with an external substrate.
  • a bendable region 2 is disposed between each two adjacent chip regions 1, and the functional chips 11 are connected to each other by wires 21 disposed in the bendable region 2.
  • the flexible substrate 100 is bent in the bendable region 2. In the bent state, the two chip regions 1 adjacent to the bendable region 2 overlap.
  • the flexible substrate 100 includes a bendable region 2.
  • the flexible substrate 100 can be bent in the bendable region 2 such that the chip regions 1 on both sides of the bendable region 2 overlap, thereby reducing the space occupied by the flexible substrate 100.
  • the cross-sectional shape of the bent flexible substrate 100 may be a wave shape, a square wave shape or a rectangular spiral shape.
  • the cross section of the folded flexible substrate 100 has a square waveform.
  • the folded flexible substrate 100 has a rectangular spiral cross section.
  • the flexible substrate 100 can be bent into various shapes according to actual assembly needs.
  • each chip region 1 is the same and the size is equal, and the shape of the flexible substrate 100 after bending can be made uniform, which is advantageous for reducing the occupied space.
  • function chip 11 can be flexibly selected to be disposed on any one or both of the two faces of the chip area 1, as described in detail below.
  • the flexible substrate 100 is provided with the functional chip 11 only on one side of the chip area 1, and the functional chip 11 is disposed on different faces of the adjacent two chip areas 1.
  • the shape of the flexible substrate 100 shown in FIG. 4 after being bent in the bendable region 2 is as shown in FIG. 5.
  • the bending mode shown in FIG. 5 is for illustrative purposes only, and the present invention is not limited thereto.
  • the function chip 11 in 1 can be designed to have the width of the bendable region 2 as follows. In the extending direction of the flexible substrate 100 (for example, the lateral direction in FIG. 4), the width of the bendable region 2 is at least one time or more of the thickness of the maximum thickness functional chip 11 in the adjacent two chip regions 1.
  • the flexible substrate 100 is provided only on one side of the chip area 1.
  • the functional chip 11 is disposed on the same side of the adjacent two chip areas 1, that is, all the functional chips 11 are disposed on the same side of the flexible substrate 100.
  • the shape of the flexible substrate 100 shown in FIG. 6 after being bent in the bendable region 2 is as shown in FIG. 7.
  • the bending mode shown in FIG. 7 is for illustrative purposes only, and the present invention is not limited thereto.
  • the adjacent two chip regions 1 can overlap and the chip region is not affected.
  • the function chip 11 in 1 can be designed to have the width of the bendable region 2 as follows. In the extending direction of the flexible substrate 100 (for example, the lateral direction in FIG. 6), the width of the bendable region 2 is at least twice or more the thickness of the maximum thickness functional chip 11 in the adjacent two chip regions 1.
  • the flexible substrate 100 is provided with functional chips 11 on both sides of the chip area 1.
  • the shape of the flexible substrate 100 shown in FIG. 8 after being bent in the bendable region 2 is as shown in FIG.
  • the bendable region 2 can be designed as follows. In the extending direction of the flexible substrate 100, the width of the bendable region 2 is at least twice or more the thickness of the maximum thickness functional chip 11 of the adjacent two chip regions 1.
  • the functional chip 11 includes a chip of any one or more of a single chip, a stacked chip, and a Through Silicon Via (TSV) integrated chip.
  • the functional chip 11 can be a single chip, such as a capacitor, a resistor, a diode, an inductor, or the like.
  • the functional chip 11 can also be an integrated circuit chip, such as a gate driving chip, a data driving chip, a single chip microcomputer, etc.
  • the function chip 11 can also be a TSV chip.
  • the function chip 11 when the function chip 11 is a chip with a pin count such as a gate driving chip, a data driving chip, or a single chip microcomputer, the function chip 11 may be packaged in a micro bump manner so as to be directly connected to the flexible substrate 100. Electrically and mechanically connected and underfilled for protection.
  • a Ball Grid Array (BGA) package may be used, and the function chip and the flexibility are made by using a solder ball.
  • the substrate 100 is electrically and mechanically connected.
  • a surface mount technology (SMT) can be used to mount the functional chip on the flexible substrate 100 to achieve electrical and mechanical connection.
  • the flexible substrate 100 can also have some commonly used interfaces, such as a power supply. Interface, data line interface, etc. These interfaces can be placed on the edge of the flexible substrate 100 to facilitate connection with external wiring after packaging to save space.
  • the flexible substrate includes a bendable region
  • the flexible substrate can be bent in the bendable region to overlap the chip regions on both sides of the bendable region, thereby reducing the space occupied by the flexible substrate.
  • an embodiment of the present invention further provides a display device.
  • the peripheral circuit of the display device is packaged in the flexible substrate 100 provided in the above embodiment.
  • the peripheral circuit on the hard circuit board of the prior art can be packaged in the flexible substrate 100 provided in the above embodiment.
  • the peripheral circuit may be a driving circuit including a plurality of integrated circuit chips, a control circuit, a power supply circuit, and the like, and details are not described herein.
  • the flexible substrate 100 and the display panel of the display device may be connected in such a manner that one end of the flexible substrate 100 is electrically and mechanically connected to the display module 3 of the display panel by using Tape Automated Bonding (TAB) technology, and The underfill is protected; the flexible substrate 100 is bent along the edge of the display module 3 and applied to the side edge of the display module 3.
  • TAB Tape Automated Bonding
  • the display module 3 may be a combination of a glass substrate and a backlight module of the liquid crystal display panel, or may be a glass substrate of the organic electroluminescence display panel, and details are not described herein again.
  • the flexible substrate includes a bendable region, and the flexible substrate can be bent in the bendable region to overlap the chip regions on both sides of the bendable region, thereby reducing the space occupied by the flexible substrate;
  • the peripheral circuit is packaged in the flexible substrate, and the hard circuit board is no longer needed, which can effectively save space.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

提供一种柔性基板和显示装置。该柔性基板（100）包含至少两个芯片区（1），该芯片区（1）设置有功能芯片（11）和用于与外部基板电连接的多个电极；每两个相邻的芯片区（1）之间设有可弯折区（2），功能芯片（11）通过布设于可弯折区（2）的导线（21）连接；柔性基板（100）于可弯折区（2）弯折，并且与可弯折区（2）相邻的两个所述芯片区（1）重叠。该显示装置的外围电路封装于该柔性基板（100）中。该柔性基板（100）能够在可弯折区（2）进行弯折，使可弯折区（2）两侧的芯片区（1）重叠，从而减小柔性基板（100）占用的空间。

Description

柔性基板和显示装置 技术领域
本发明涉及平板显示技术领域，尤其涉及一种柔性基板和显示装置。
背景技术
近年来，随着微电子技术的发展，小型化、轻薄化、易携带的产品己成为电子产品的发展趋势。覆晶薄膜(Chip On Flex或Chip On Film，COF)技术是将集成电路芯片(Integrated Circuit，IC)固定于柔性基板上，运用软质附加电路板作为封装集成电路芯片的载体，从而将集成电路芯片与柔性基板上的电路接合的技术。覆晶薄膜技术能够在一定程度上解决空间占用的问题。
发明内容
现有的COF技术只将集成电路芯片采用各项异性导电胶贴装在柔性基板上。虽然柔性基板可以根据外力改变形状，但受限于封装的集成电路芯片的硬度，柔性基板形状的改变幅度较小，无法更有效地减少空间占用。而且，COF技术中的柔性基板会与安装外围电路组件的硬质电路板进行连接组成刚挠一体板。由于硬质电路板部分的体积和重量较大，也不具有柔性，因此必须要在显示器模组中占用较大的空间。这样不适用于显示器模组封装轻薄短小的发展趋势。
为此，本发明的目的是提供一种柔性基板和显示装置，以解决或减轻上文所述的一个或多个问题。例如，本发明可以解决柔性基板受限于所封装的集成电路芯片的硬度，形状的改变幅度较小，无法更有效地减少空间占用的问题。又例如，本发明还可以解决柔性基板与硬质电路板连接组成刚挠一体板后，硬质电路板占用较大的空间的问题。
本发明的目的是通过以下技术方案实现的。
本发明实施例提供一种柔性基板，所述柔性基板包含至少两个芯片区，所述芯片区设置有功能芯片；
每两个相邻的所述芯片区之间设有可弯折区，所述柔性基板于所述可弯折区弯折，并且与所述可弯折区相邻的两个所述芯片区重叠。
本实施例中，所述柔性基板包含所述可弯折区，所述柔性基板能够在所述可弯折区进行弯折，使所述可弯折区两侧的所述芯片区重叠，从而减小所述柔性基板占用的空间。
例如，所述芯片区还设置有用于与外部基板电连接的多个电极。
例如，所述柔性基板包含布设于所述可弯折区的导线，所述功能芯片通过所述导向相互连接。
例如，所述柔性基板在弯折状态的剖面图形呈波浪形、方波形或矩形螺旋形。本实施例中，可以根据实际组装需要，将所述柔性基板弯折成多种形状。
例如，各所述芯片区的形状相同，大小相等。
例如，所述柔性基板仅在所述芯片区的一面设置有所述功能芯片，并且所述功能芯片设置于相邻的两个所述芯片区的不同面。本实施例中，可以结合所述柔性基板的弯折需求，设计所述功能芯片的封装面。
例如，沿所述柔性基板延伸方向上，所述可弯折区的宽度至少为相邻的两个所述芯片区中厚度最大的所述功能芯片的厚度的一倍及以上。本实施例中，最大所述功能芯片的厚度的一倍及以上的所述可弯折区的宽度，可以保证“相邻的两个所述芯片区的不同面设置有所述功能芯片”这种结构的所述柔性基板在弯折后，相邻两个所述芯片区能够重叠，不会影响所述芯片区内的所述功能芯片。
例如，所述柔性基板仅在所述芯片区的一面设置有所述功能芯片，并且所述功能芯片设置于相邻的两个所述芯片区的同一面。本实施例中，可以结合所述柔性基板的弯折需求，设计所述功能芯片的封装面。
例如，所述柔性基板在所述芯片区的两面均设置有所述功能芯片。本实施例中，可以结合所述柔性基板的弯折需求，设计所述功能芯片的封装面。
例如，沿所述柔性基板延伸方向上，所述可弯折区的宽度至少为相邻的两个所述芯片区中厚度最大的所述功能芯片的厚度的两倍及以上。本实施例中，最大所述功能芯片的厚度的两倍及以上的所述可弯折区的宽度，可以保证“相邻的两个所述芯片区的同一面或两个面设置有所述功能芯片”这种结构的所述柔性基板在弯折后，相邻两个所述芯片区能够重叠，不会影响所述芯片区内的所述功能芯片。
例如，所述功能芯片包括结构为单一芯片、叠层的芯片和穿透硅 通孔技术(Through Silicon Via，TSV)集成芯片中任意一种或多种的芯片。本实施例中，所述功能芯片可以为单一芯片，例如电容、电阻、二极管和电感等；也可以为集成电路芯片，例如栅极驱动芯片、数据驱动芯片和单片机等；也可以为TSV芯片。
本发明实施例有益效果如下：所述柔性基板包含所述可弯折区，所述柔性基板能够在所述可弯折区进行弯折，使所述可弯折区两侧的所述芯片区重叠，从而减小所述柔性基板占用的空间。
本发明实施例还提供一种显示装置，所述显示装置的外围电路封装于如上实施例提供的所述柔性基板中。
本发明实施例有益效果如下：所述柔性基板包含所述可弯折区，所述柔性基板能够在所述可弯折区进行弯折，使所述可弯折区两侧的所述芯片区重叠，从而减小所述柔性基板占用的空间。同时，将外围电路封装于所述柔性基板中，不再需要硬质电路板，可以有效地节省空间。
附图说明
图1为本发明一实施例提供的柔性基板的俯视示意图；
图2为本发明一实施例提供的柔性基板弯折后的第一种形状示意图；
图3为本发明一实施例提供的柔性基板弯折后的第二种形状示意图；
图4为本发明一实施例提供的第一种柔性基板的局部剖面示意图；
图5为图4所示的第一种柔性基板弯折后的剖面示意图；
图6为本发明一实施例提供的第二种柔性基板的局部剖面示意图；
图7为图6所示的第二种性基板弯折后的剖面示意图；
图8为本发明一实施例提供的第三种柔性基板的局部剖面示意图；
图9为图8所示的第三种柔性基板弯折后的剖面示意图；以及
图10为本发明一实施例提供的显示装置中，显示模组和柔性基板连接关系的示意图。
具体实施方式
下面结合说明书附图对本发明实施例的实现过程进行详细说明。 需要注意的是，自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
参见图1，本发明实施例提供一种柔性基板100。柔性基板100包含至少两个芯片区1，芯片区1设置有功能芯片11和用于与外部基板电连接的多个电极。每两个相邻的芯片区1之间设有可弯折区2，功能芯片11通过布设于可弯折区2的导线21相互连接。柔性基板100于可弯折区2弯折。在弯折状态下，与该可弯折区2相邻的两个芯片区1重叠。
本实施例中，柔性基板100包含可弯折区2。柔性基板100能够在可弯折区2进行弯折，使得可弯折区2两侧的芯片区1重叠，从而减小柔性基板100占用的空间。
柔性基板100在可弯折区2弯折后，弯折后的柔性基板100的剖面图形可以呈波浪形、方波形或矩形螺旋形。例如，如图2所示，弯折后的柔性基板100的剖面呈方波形。又例如，如图3所示，弯折后的柔性基板100的剖面呈矩形螺旋形。本实施例中，可以根据实际组装需要，将柔性基板100弯折成多种形状。
例如，各芯片区1的形状相同且大小相等，能够使柔性基板100弯折后的形状规则，有利于减小所占用空间。
需要说明的是，可以灵活选择在芯片区1两个面中的任意一个面或全部两个面设置功能芯片11，详细说明如下。
例如，如图4所示，柔性基板100仅在芯片区1的一面设置有功能芯片11，并且功能芯片11设置于相邻的两个芯片区1的不同面。图4所示的柔性基板100在可弯折区2弯折后的形状如图5所示。当然图5所示的弯折方式仅是为了进行说明，本发明并不以此为限。为了保证“功能芯片11设置于相邻的两个芯片区1的不同面”，使得这种结构的柔性基板100在弯折后，相邻两个芯片区1能够重叠，并且不会影响芯片区1内的功能芯片11，可以如下设计可弯折区2的宽度。沿柔性基板100延伸方向(例如图4中的横向方向)上，可弯折区2的宽度至少为相邻的两个芯片区1中厚度最大功能芯片11的厚度的一倍及以上。
又例如，如图6所示，柔性基板100仅在芯片区1的一面设置有 功能芯片11，并且功能芯片11设置于相邻的两个芯片区1的同一面，即所有功能芯片11设置于柔性基板100的同一面。图6所示的柔性基板100在可弯折区2弯折后的形状如图7所示，当然图7所示的弯折方式仅是为了进行说明，本发明并不以此为限。为了保证“功能芯片11设置于相邻的两个芯片区1的同一面”，使得这种结构的柔性基板100在弯折后，相邻两个芯片区1能够重叠，并且不会影响芯片区1内的功能芯片11，可以如下设计可弯折区2的宽度。沿柔性基板100延伸方向(例如图6中的横向方向)上，可弯折区2的宽度至少为相邻的两个芯片区1中厚度最大功能芯片11的厚度的两倍及以上。
又例如，如图8所示，柔性基板100在芯片区1的两面均设置有功能芯片11。图8所示的柔性基板100在可弯折区2弯折后的形状如图9所示。为了保证“功能芯片11设置于相邻的两个芯片区1的两面”，使得这种结构的柔性基板100在弯折后，相邻两个芯片区1能够重叠，并且不会影响芯片区1内的功能芯片11，可以如下设计可弯折区2。沿柔性基板100延伸方向上，可弯折区2的宽度至少为相邻的两个芯片区1中厚度最大功能芯片11的厚度的两倍及以上。
例如，功能芯片11包括结构为单一芯片、叠层的芯片和穿透硅通孔技术(Through Silicon Via，TSV)集成芯片中任意一种或多种的芯片。本实施例中，功能芯片11可以为单一芯片，例如电容、电阻、二极管和电感等。功能芯片11也可以为集成电路芯片，例如栅极驱动芯片、数据驱动芯片和单片机等.功能芯片11也可以为TSV芯片。
对于不同类型的功能芯片11可以采用不同的封装方式。例如，当功能芯片11为栅极驱动芯片、数据驱动芯片或单片机等引脚数密集的芯片时，可以对功能芯片11采用微凸块(Micro Bump)封装方式，使之直接与柔性基板100进行电气和机械连接，并且进行底部填充(underfill)进行保护。又例如，当功能芯片11为引脚数不是特别多的芯片或元器件时，可采用球栅阵列结构(Ball Grid Array，BGA)的封装方式，利用锡球(solder ball)使功能芯片与柔性基板100进行电气和机械连接。又例如，当功能芯片11为电容、电阻或接口器件等元器件时，可以采用表面贴装技术(Surface Mount Technology，SMT)，将功能芯片贴装于柔性基板100上实现电气和机械连接。
需要说明的是，柔性基板100上还可以一些常用的接口，如电源 接口、数据线接口等。这些接口可以设放置于柔性基板100边缘，方便封装后与外部接线连接以节省空间。
本发明实施例有益效果如下：柔性基板包含可弯折区，柔性基板能够在可弯折区进行弯折，使可弯折区两侧的芯片区重叠，从而减小柔性基板占用的空间。
参见图10，本发明实施例还提供一种显示装置，显示装置的外围电路封装于如上实施例提供的柔性基板100中。
可以将现有技术中的硬质电路板上的外围电路封装于上述实施例提供的柔性基板100中。该外围电路可以是包括若干集成电路芯片的驱动电路、控制电路、电源电路等等，在此不再赘述。柔性基板100与显示装置的显示面板可以采用如下方式连接：将柔性基板100的一端利用自动载带键合(Tape Automated Bonding，TAB)技术与显示面板的显示模组3进行电气和机械连接，并底部填充进行保护；柔性基板100沿显示模组3的边沿进行弯折贴敷于显示模组3的侧边缘即可。
需要说明的是，该显示模组3可以是液晶显示面板的玻璃基板和背光模组的组合，也可以是有机电致发光显示面板的玻璃基板，在此不再赘述。
本发明实施例有益效果如下：柔性基板包含可弯折区，柔性基板能够在可弯折区进行弯折，使可弯折区两侧的芯片区重叠，从而减小柔性基板占用的空间；同时，将外围电路封装于柔性基板中，不再需要硬质电路板，可以有效地节省空间。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (12)

  1. 一种柔性基板，其特征在于，所述柔性基板包含至少两个芯片区，所述芯片区设置有功能芯片；
    每两个相邻的所述芯片区之间设有可弯折区，所述柔性基板于所述可弯折区弯折，并且与所述可弯折区相邻的两个所述芯片区重叠。
  2. 如权利要求1所述的柔性基板，其特征在于，所述芯片区还设置有用于与外部基板电连接的多个电极。
  3. 如权利要求1所述的柔性基板，其特征在于，所述柔性基板包含布设于所述可弯折区的导线，所述功能芯片通过所述导向相互连接。
  4. 如权利要求1所述的柔性基板，其特征在于，所述柔性基板在弯折状态的剖面图形呈波浪形、方波形或矩形螺旋形。
  5. 如权利要求1所述的柔性基板，其特征在于，各所述芯片区的形状相同，大小相等。
  6. 如权利要求1所述的柔性基板，其特征在于，所述柔性基板仅在所述芯片区的一面设置有所述功能芯片，并且所述功能芯片设置于相邻的两个所述芯片区的不同面。
  7. 如权利要求6所述的柔性基板，其特征在于，沿所述柔性基板延伸方向上，所述可弯折区的宽度至少为相邻的两个所述芯片区中厚度最大的所述功能芯片的厚度的一倍及以上。
  8. 如权利要求1所述的柔性基板，其特征在于，所述柔性基板仅在所述芯片区的一面设置有所述功能芯片，并且所述功能芯片设置于相邻的两个所述芯片区的同一面。
  9. 如权利要求1所述的柔性基板，其特征在于，所述柔性基板在所述芯片区的两面均设置有所述功能芯片。
  10. 如权利要求8或9所述的柔性基板，其特征在于，沿所述柔性基板延伸方向上，所述可弯折区的宽度至少为相邻的两个所述芯片区中厚度最大的所述功能芯片的厚度的两倍及以上。
  11. 如权利要求1所述的柔性基板，其特征在于，所述功能芯片包括结构为单一芯片、叠层的芯片和穿透硅通孔技术集成芯片中任意一种或多种的芯片。
  12. 一种显示装置，其特征在于，所述显示装置的外围电路封装于如权利要求1至11任一项所述的柔性基板中。
PCT/CN2016/074017 2015-09-18 2016-02-18 柔性基板和显示装置 WO2017045358A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/325,416 US10314172B2 (en) 2015-09-18 2016-02-18 Flexible substrate and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520730033.1 2015-09-18
CN201520730033.1U CN204948505U (zh) 2015-09-18 2015-09-18 一种柔性基板和显示装置

Publications (1)

Publication Number Publication Date
WO2017045358A1 true WO2017045358A1 (zh) 2017-03-23

Family

ID=55015888

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/074017 WO2017045358A1 (zh) 2015-09-18 2016-02-18 柔性基板和显示装置

Country Status (3)

Country Link
US (1) US10314172B2 (zh)
CN (1) CN204948505U (zh)
WO (1) WO2017045358A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102391249B1 (ko) * 2015-05-28 2022-04-28 삼성디스플레이 주식회사 표시 장치
CN204948505U (zh) * 2015-09-18 2016-01-06 京东方科技集团股份有限公司 一种柔性基板和显示装置
CN108493212A (zh) * 2018-03-13 2018-09-04 武汉华星光电半导体显示技术有限公司 柔性显示结构及电子设备
WO2020133444A1 (zh) * 2018-12-29 2020-07-02 深圳市柔宇科技有限公司 显示装置
CN111256057A (zh) * 2020-01-21 2020-06-09 重庆慧库科技有限公司 一种灯带
CN112713164A (zh) * 2021-01-05 2021-04-27 电子科技大学 一种三维集成电路及其制造方法
CN112863359B (zh) * 2021-01-28 2022-04-08 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN117612577B (zh) * 2024-01-24 2024-04-16 深圳宏芯宇电子股份有限公司 一种抗辐射的固态硬盘

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1669140A (zh) * 2002-07-17 2005-09-14 英特尔公司 堆叠微电子封装
US20070205479A1 (en) * 2005-08-31 2007-09-06 International Business Machines Corporation Method for attaching a flexible structure to a device and a device having a flexible structure
CN102867786A (zh) * 2011-07-04 2013-01-09 三星电子株式会社 芯片层叠的半导体封装件
CN103400809A (zh) * 2013-08-02 2013-11-20 华进半导体封装先导技术研发中心有限公司 一种柔性基板封装结构及其封灌工艺
CN204948505U (zh) * 2015-09-18 2016-01-06 京东方科技集团股份有限公司 一种柔性基板和显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7454499B2 (en) * 2002-11-07 2008-11-18 Tippingpoint Technologies, Inc. Active network defense system and method
US7154175B2 (en) * 2004-06-21 2006-12-26 Intel Corporation Ground plane for integrated circuit package
US7393226B2 (en) * 2006-03-08 2008-07-01 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
GB201421421D0 (en) * 2014-12-02 2015-01-14 Ge Oil & Gas Uk Ltd Angular displacement of flexible pipe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1669140A (zh) * 2002-07-17 2005-09-14 英特尔公司 堆叠微电子封装
US20070205479A1 (en) * 2005-08-31 2007-09-06 International Business Machines Corporation Method for attaching a flexible structure to a device and a device having a flexible structure
CN102867786A (zh) * 2011-07-04 2013-01-09 三星电子株式会社 芯片层叠的半导体封装件
CN103400809A (zh) * 2013-08-02 2013-11-20 华进半导体封装先导技术研发中心有限公司 一种柔性基板封装结构及其封灌工艺
CN204948505U (zh) * 2015-09-18 2016-01-06 京东方科技集团股份有限公司 一种柔性基板和显示装置

Also Published As

Publication number Publication date
CN204948505U (zh) 2016-01-06
US10314172B2 (en) 2019-06-04
US20170295649A1 (en) 2017-10-12

Similar Documents

Publication Publication Date Title
WO2017045358A1 (zh) 柔性基板和显示装置
US7329597B2 (en) Semiconductor chip and tab package having the same
KR100765478B1 (ko) 구멍이 형성된 테이프 배선기판과, 그를 이용한 테이프패키지 및 평판 표시 장치
KR100652519B1 (ko) 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
US9113545B2 (en) Tape wiring substrate and chip-on-film package including the same
JP5539346B2 (ja) 半導体チップおよびその実装構造
KR102258746B1 (ko) 벤딩부를 갖는 칩 온 필름 패키지
CN106158817B (zh) 薄膜覆晶封装结构及封装模块
US7589421B2 (en) Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
TW201936029A (zh) 軟性電路板及包括其的電子裝置
KR101166069B1 (ko) 씨오에프형 반도체 패키지 및 이를 위한 테이프 배선 기판
CN210692527U (zh) 薄膜覆晶封装结构及其软性电路板
WO2024120485A1 (zh) 可挠性线路板、薄膜覆晶封装结构及显示装置
WO2017035881A1 (zh) 驱动器芯片结构及液晶显示装置
TWM457965U (zh) 軟性電路板及覆晶薄膜
CN107833524A (zh) 一种芯片、柔性显示面板及显示装置
US11189597B2 (en) Chip on film package
JPH07254760A (ja) 基板とｉｃユニットとの接続構造
JP2665275B2 (ja) 半導体装置
US20250096085A1 (en) Chip on film package and display apparatus including the same
US11013120B2 (en) Tape wiring board and semiconductor device
TW594315B (en) Manufacturing method of electronic device
KR20080061602A (ko) 탭 패키지용 반도체 칩
KR20040062197A (ko) 테이프캐리어패키지 커버구조
TW200807668A (en) Pluggable tape type IC package

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 15325416

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16845474

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16845474

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 22/08/2018)

122 Ep: pct application non-entry in european phase

Ref document number: 16845474

Country of ref document: EP

Kind code of ref document: A1