TWI623001B - Device for manufacturing coil parts - Google Patents

Abstract

The invention provides a manufacturing device for a coil part which can prevent the failure of a laser oscillator caused by dust.

The coil component manufacturing device of the present invention includes a core supporting portion that supports the core, a nozzle that successively sends out a wire to the core, and a laser oscillator that irradiates the wire with laser light to peel off at least a part of the insulating film of the wire; A laser protective glass, which is arranged between the irradiated portion of the irradiated laser light in the wire and the laser oscillator, and transmits the laser light emitted from the laser oscillator; and a dust removing mechanism, which is in the laser protective glass One side of the lead wire generates airflow and sucks dust on one side of the laser protective glass, and removes dust on one side of the laser protective glass.

Description

Device for manufacturing coil parts

The invention relates to a manufacturing device for a coil part.

Conventionally, as a manufacturing apparatus of a coil component, there exists what is described in Unexamined-Japanese-Patent No. 2009-224599 (patent document 1). This manufacturing device is based on winding a lead wire around a core, radiating laser light from the laser oscillator to the insulating film of the lead wire, and peeling off the insulating film of the lead wire.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-224599

However, when the conventional coil component manufacturing apparatus was actually used, the following problems were found.

When the insulating film of a lead is irradiated with laser light and the insulating film is peeled off, dust is generated. In addition, the dust may enter the laser oscillator and the laser oscillator may fail. In the event of a laser oscillator failure, the cost of laser oscillator maintenance increases.

Therefore, an object of the present invention is to provide a manufacturing device for a coil part which can prevent a failure of a laser oscillator caused by dust.

In order to solve the above-mentioned problems, the coil component manufacturing apparatus of the present invention is a coil component manufacturer. The coil component has a core, a wire wound around the core, and a conductor covered with an insulating film; and an electrode, which is provided. The core is connected to the wire, and the manufacturing device of the coil component includes a core supporting part that supports the core, a nozzle that successively sends the wire to the core, and a laser oscillator that irradiates the wire with laser light. At least a part of the insulating film of the wire is peeled off; a laser protective glass is arranged between the irradiated portion of the wire where the laser light is irradiated and the laser oscillator, and is emitted from the laser oscillator Laser light transmission; and a dust removing mechanism that generates airflow on one side of the lead wire side in the laser protective glass, and sucks dust on the one side of the laser protective glass, and the laser protective glass Removal of dust on the above side.

According to the coil component manufacturing device of the present invention, the laser protective glass is disposed between the irradiated portion of the wire and the laser oscillator, and transmits laser light emitted from the laser oscillator. Thereby, although dust is generated when the insulating film is peeled off by irradiation with laser light, the laser protection glass prevents dust from entering the laser oscillator. Therefore, failure of the laser oscillator due to dust can be prevented.

In addition, the dust removing mechanism is attached to one side of the laser protective glass to generate airflow, and The dust on one side of the laser protective glass is sucked, and the dust on one side of the laser protective glass is removed. This prevents dust from adhering to one side of the laser protective glass. Therefore, the dust does not block the light path of the laser light.

Therefore, failure of the laser oscillator caused by dust can be prevented, and further, the intensity of laser light caused by dust can be prevented from being lowered.

Furthermore, in one embodiment of the manufacturing apparatus for the coil component, the laser protection glass is disposed below the irradiated portion of the lead wire, and the laser oscillator is disposed below the laser protection glass.

According to the above embodiment, the laser protection glass is disposed on the lower side of the irradiated portion of the wire, and the laser oscillator is disposed on the lower side of the laser protection glass. Thereby, the laser light emitted from the laser oscillator passes through the laser protective glass from the lower side, and the lead is irradiated from the lower side. Therefore, even if the dust (especially solid dust) is dropped on one side of the laser protective glass due to the influence of gravity, the dropped dust can be effectively removed by the dust removing mechanism.

Moreover, in one embodiment of the manufacturing apparatus of the coil component, the laser protection glass is disposed on an upper side of the irradiated portion of the lead wire, and the laser oscillator is disposed on an upper side of the laser protection glass.

According to the above embodiment, the laser protection glass is disposed on the upper side of the irradiated portion of the lead wire, and the laser oscillator is disposed on the upper side of the laser protection glass. Thereby, the laser light emitted from the laser oscillator passes through the laser protection glass from the upper side, and the lead is irradiated from the upper side. Therefore, even if the dust rises due to the influence of the updraft until it reaches the laser protective glass, the ascended dust can be effectively removed by the dust removal mechanism.

Furthermore, in one embodiment of a manufacturing apparatus for a coil part, The laser oscillator includes a first laser oscillator and a second laser oscillator, and the first laser oscillator and the second laser oscillator are disposed to face each other with respect to an irradiated portion of the lead wire. position.

Here, the opposite position means that the optical axes of the laser light of the first laser oscillator and the second laser oscillator may be located on the same axis or not. It is also possible that the optical axes of the laser light are parallel to each other and staggered by a predetermined distance. It is also possible that the optical axes of the laser light intersect each other at a non-parallel angle (an angle other than 180 ° such as 179 °).

According to the above embodiment, the first laser oscillator and the second laser oscillator are disposed at positions facing each other with respect to the irradiated portion of the wire, so that the first laser oscillator and the second laser oscillator can be Irradiate the laser light to peel off the entire circumference of the insulating film of the wire.

Moreover, in one embodiment of the manufacturing apparatus of the coil component, the laser light exit hole of the laser oscillator is located at a position that does not overlap with and is offset from directly below the irradiated portion of the wire.

According to the above embodiment, the laser light exit hole of the laser oscillator is located at a position which does not overlap and stagger directly below the irradiated portion of the wire, so the laser oscillator can be irradiated from the obliquely below of the irradiated portion of the wire. Shoot light. Thereby, the dust will not fall directly above the exit hole of the laser oscillator, and the intensity of the laser light can be prevented from decreasing.

Furthermore, in one embodiment of the manufacturing device for the coil component, a bottom plate on which the core support portion is mounted is provided, the laser protection glass and the laser oscillator are arranged below the bottom plate, and the bottom plate has: A hole through which laser light emitted from the laser oscillator passes; and a wall portion surrounding the open end on the upper side of the through hole.

According to the above embodiment, the bottom plate includes a through hole through which laser light emitted from the laser oscillator passes, and a wall portion surrounding the open end on the upper side of the through hole. Thereby, even if dust is accumulated on the bottom plate, it is possible to prevent the accumulated dust from falling to the through hole of the bottom plate by the wall portion.

In one embodiment of the coil component manufacturing device, the upper portion of the wall portion overlaps the through hole when viewed from above and below, and an opening width of the upper portion of the wall portion is narrower than an opening end of the upper side of the through hole. Opening width.

According to the above embodiment, the upper portion of the wall portion overlaps the through hole when viewed from the up and down direction, and the opening width of the upper portion of the wall portion is narrower than the opening width of the open end on the upper side of the through hole. Thereby, the wall portion can further prevent dust from falling into the through hole of the bottom plate.

Furthermore, in one embodiment of the manufacturing apparatus of the coil part, the dust removing mechanism includes: a blower that blows air to the one side of the laser protective glass; and a vacuum cleaner that applies one of the The dust is sucked.

According to the above embodiment, the dust removing mechanism includes a blower and a vacuum cleaner. Thereby, the dust removal mechanism can be made simple.

According to the coil component manufacturing device of the present invention, the laser protective glass is arranged between the irradiated part of the wire and the laser oscillator, and transmits the laser light emitted from the laser oscillator, so that it can be prevented from being caused by dust. Failure of laser oscillator. In addition, the dust removing mechanism generates air flow on one side of the laser protective glass, and sucks the dust on one side of the laser protective glass to remove the dust on one side of the laser protective glass, so it can prevent the dust caused by the dust. The intensity of the laser light is reduced.

1‧‧‧ Coil part manufacturing device

10‧‧‧ core

11‧‧‧ the first flange

12‧‧‧ 2nd flange

13‧‧‧ core core

14‧‧‧The first electrode

15‧‧‧Second electrode

19‧‧‧The first nozzle

20‧‧‧ 2nd nozzle

21‧‧‧The first wire

21a‧‧‧Irradiated part

22‧‧‧ 2nd wire

22a‧‧‧Irradiated part

31‧‧‧1st laser oscillator

31a‧‧‧shot hole

32‧‧‧ 2nd laser oscillator

32a‧‧‧ shooting hole

41‧‧‧The first laser protection glass

41a‧‧‧ side

42‧‧‧The second laser protection glass

42a‧‧‧ side

51‧‧‧The first dust removal mechanism

52‧‧‧The second dust removal mechanism

55‧‧‧blower

56‧‧‧Vacuum cleaner

60‧‧‧ core support department

61‧‧‧Fixture

70, 70A, 70B‧‧‧ floor

71‧‧‧through hole

71a‧‧‧ open end

72, 72B‧‧‧Wall

F‧‧‧ dust

L‧‧‧ laser light

H1‧‧‧ (of the wall) opening width

H2‧‧‧ (through hole) opening width

FIG. 1 is a schematic configuration diagram showing a first embodiment of a manufacturing apparatus for a coil part according to the present invention.

Fig. 2 is a schematic perspective view showing a part of a manufacturing apparatus for a coil part.

FIG. 3 is an explanatory diagram illustrating a state when laser light is irradiated by the first laser oscillator.

FIG. 4 is an explanatory diagram illustrating a state when laser light is irradiated by a second laser oscillator.

FIG. 5 is an explanatory diagram illustrating a state in which a wire is wound around a core.

Fig. 6 is a schematic configuration diagram showing a second embodiment of the manufacturing apparatus for a coil part according to the present invention.

Fig. 7 is a schematic configuration diagram showing a third embodiment of the coil component manufacturing apparatus of the present invention.

FIG. 8 is a schematic configuration diagram showing a fourth embodiment of a manufacturing apparatus for a coil part according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

(First Embodiment)

FIG. 1 is a schematic configuration diagram showing a first embodiment of a manufacturing apparatus for a coil part according to the present invention. Fig. 2 is a schematic perspective view showing a part of a manufacturing apparatus for a coil part. As shown in FIGS. 1 and 2, the coil component manufacturing device 1 includes a core support portion 60 that supports the core 10 of the coil component, a first nozzle 19 that successively sends a first lead 21 to the core 10, and a second nozzle 20 for its core 10 The second wire 22 is successively sent out. Note that in FIG. 1, the second nozzle 20 and the second lead 22 are omitted for drawing.

The coil component manufacturing device 1 further includes a first laser oscillator 31 that irradiates the first and second wires 21 and 22 with laser light L to peel off the insulating films of the first and second wires 21 and 22; The laser protective glass 41 transmits the laser light L emitted from the first laser oscillator 31, and the first dust removing mechanism 51 removes the dust on the first laser protective glass 41.

The coil component manufacturing device 1 further includes a second laser oscillator 32 that irradiates the first and second wires 21 and 22 with laser light L to peel off the insulating films of the first and second wires 21 and 22; the second The laser protective glass 42 transmits the laser light L emitted from the second laser oscillator 32; and the second dust removing mechanism 52 removes the dust on the second laser protective glass 42.

The coil component manufacturing device 1 is configured to rotate the core 10 around the entire core portion 13 of the core 10 by rotating the core 10 around the core A of the core portion 13 of the core 10 as a rotation axis. , 22, and manufacture coil parts with bifilar structure. The coil component is, for example, a common mode choke coil.

The core 10 includes a core winding portion 13, a first flange portion 11 provided at one end of the core winding portion 13, and a second flange portion 12 provided at the other end of the core winding portion 13. As the material of the core 10, for example, materials such as alumina (non-magnet), Ni-Zn-based ferrite (magnet, insulator), or resin are used.

The core portion 13 has a rectangular parallelepiped shape, for example. The shape of the first flange portion 11 and the shape of the second flange portion 12 are, for example, rectangular flat plates. A first electrode 14 and a second electrode 15 are provided on the bottom surface of the first flange portion 11 and the bottom surface of the second flange portion 12, respectively. The material of the first and second electrodes 14 and 15 is, for example, Ag. The front end of the first lead 21 is joined to the first flange portion 11 of the core 10. First electrode 14. The front end of the second lead 22 is bonded to the second electrode 15 of the first flange portion 11 of the core 10. The core 10 is provided on the XY plane so that the axial center A direction and the Y direction connecting the first flange portion 11 and the second flange portion 12 coincide with each other. The Z direction is the same as the up and down direction.

The first and second lead wires 21 and 22 are wound around the core portion 13 in a coil shape, and the conductor is covered with an insulating film. For example, the conductor is made of copper wire, and the insulating film is made of polyamide-imide (AIW), which is a heat-resistant material. The first lead wire 21 is wound around the core 10 to form a primary-side coil. The second lead 22 is wound around the core 10 to form a secondary-side coil.

The core support portion 60 is mounted on the upper side of the bottom plate 70. The bottom plate 70 is provided on a horizontal plane through the support legs 75. The core support portion 60 is configured to hold the first flange portion 11 of one of the cores 10. The core support portion 60 is configured to rotate around the axis A of the core portion 13 of the core 10 supported by the core support portion 60 as a rotation axis. When the first and second wires 21 and 22 are wound around the core portion 13 of the core 10, the core 10 is rotated while the core 10 is supported by the core support portion 60, and the core 10 is also wound on the axis of the core portion 13. A is a rotating shaft that rotates, and the first and second wires 21 and 22 drawn from the first and second nozzles 19 and 20 are wound around the core portion 13.

A clamp 61 is provided on the core supporting portion 60. The clamp 61 clamps one end of the first and second wires 21 and 22 respectively drawn from the nozzle 18, and clamps the first and second wires 21 and 21 of the clamp 61. One end of 22 is fixed to the core support portion 60. Therefore, when the nozzle 18 is moved, one end of the first and second lead wires 21 and 22 is fixed. Therefore, the first and second lead wires 21 and 22 are moved from the first and second wires along with the movement of the first and second nozzles 19 and 20. 1. The second nozzles 19 and 20 are pulled out, respectively.

The first and second laser oscillators 31 and 32 irradiate the laser light L to the first and second wires 21 and 22 arranged near the core 10, respectively, and the first and second wires 21 and 22 respectively At least a part of the insulating film is peeled. The portions to be irradiated with the laser light L among the first and second lead wires 21 and 22 are irradiated portions 21a and 22a, respectively. The irradiated portions 21a and 22a are indicated by black dots in FIG. 1 and hatched in FIG. 2.

Here, each of the first and second laser oscillators 31 and 32 can scan the laser light L while irradiating a range of 300 mm square, and the first and second wires 21 and 22 can be arranged in the 300 mm square light. The laser beam L is irradiated into the irradiation range. In addition, the irradiation time for one time is about several ms, and even if the continuous irradiation is performed multiple times and the peeling is performed multiple times, the overall time taken is within about one second.

The laser light L is, for example, laser light of a second harmonic generation (SHG), and the wavelength of the laser is about 532 nm. Therefore, it is possible to pass through the insulating film of each of the first and second wires 21 and 22 made of polyimide and imine, which is a heat-resistant material. The interface position optimally removes the insulating film.

The first laser oscillator 31 and the second laser oscillator 32 are disposed at positions where the irradiated portion 21a of the first lead 21 and the irradiated portion 22a of the second lead 22 face each other. Here, the opposite position means that the optical axes of the laser light L of the first laser oscillator 31 and the second laser oscillator 32 may be located on the same axis or not. The optical axes of the laser light L may be parallel to each other and staggered by a predetermined distance. The optical axes of the laser light L may intersect at a non-parallel angle (an angle other than 180 °, such as 179 °).

The first laser oscillator 31 is arranged below the irradiated portions 21a and 22a of the first and second wires 21 and 22, and the second laser oscillator 32 is arranged under the irradiated portions of the first and second wires 21 and 22. Parts 21a, 22a are on the upper side. Thereby, the laser light L can be irradiated from the 1st laser oscillator 31 and the 2nd laser oscillator 32, and the whole periphery of the insulating film of the 1st, 2nd lead 21, 22 can be peeled. Therefore, it is possible to further shorten the time required for the steps (the distance between steps) required for peeling the insulating film.

The first laser oscillator 31 is disposed below the bottom plate 70. The bottom plate 70 has a through hole 71 through which the laser light L emitted from the first laser oscillator 31 passes. The through hole 71 is formed in a slit shape, for example, so that the laser light L can be scanned along the slit.

The first laser protective glass 41 is disposed between the irradiated portions 21a and 22a of the first and second lead wires 21 and 22 and the first laser oscillator 31, and allows laser light emitted from the first laser oscillator 31 to be emitted. L through. The first laser protection glass 41 is disposed below the irradiated portions 21a and 22a of the first and second wires 21 and 22, and the first laser oscillator 31 is disposed below the first laser protection glass 41. The first laser protection glass 41 is disposed below the bottom plate 70. The through hole 71 of the bottom plate 70 overlaps the first laser protection glass 41 in the vertical direction.

The second laser protection glass 42 is disposed between the irradiated portions 21a and 22a of the first and second lead wires 21 and 22 and the second laser oscillator 32, and allows laser light emitted from the second laser oscillator 32 to be emitted. L through. The second laser protection glass 42 is disposed on the upper side of the irradiated portions 21 a and 22 a of the first and second leads 21 and 22, and the second laser oscillator 32 is disposed on the upper side of the second laser protection glass 42. The second laser protection glass 42 is disposed on the upper side of the bottom plate 70.

The first dust removing mechanism 51 is formed on one surface 41a (the upper surface in the present embodiment) of one side of the leads 21 and 22 of the first laser protective glass 41, and generates airflow to one of the surfaces 41a of the first laser protective glass 41. The dust is sucked, and the dust on one surface 41a of the first laser protective glass 41 is removed. The first dust removing mechanism 51 includes a blower 55 that blows air on one surface 41 a of the first laser protective glass 41, and a vacuum cleaner 56 that sucks dust on one surface 41 a of the first laser protective glass 41. The blower 55 and the vacuum cleaner 56 are arranged on the first laser protective glass 41 so that the blow-out side of the blower 55 and the suction side of the vacuum cleaner 56 face each other. One surface 41a side. As described above, the first dust removing mechanism 51 is constituted by the blower 55 and the vacuum cleaner 56. Therefore, the first dust removing mechanism 51 can be made simple.

The second dust removing mechanism 52 is a surface 42a (lower surface in the present embodiment) on one surface 42a (the lower surface in this embodiment) of the second laser protective glass 42 on the one side of the lead wires 21 and 22, and generates a current on the one surface 42a of the second laser protective glass 42. The dust is sucked, and the dust on one surface 42a of the second laser protection glass 42 is removed. The second dust removing mechanism 52 includes, similarly to the first dust removing mechanism 51, a blower 55 that blows air to one surface 42a of the second laser protective glass 42 and a vacuum cleaner 56 that applies air to the second laser protective glass 42. The dust on one side 42a is sucked.

Next, the manufacturing method of a coil component is demonstrated. In the manufacturing method of the coil component, two first and second lead wires 21 and 22 are wound around the core 10 at the same time and are respectively bonded to the first and second electrodes 14 and 15. This step will be described in detail below.

As shown in FIG. 2, the first flange portion 11 of one of the cores 10 is grasped and fixed by the core support portion 60. Here, the core 10 can be rotated by using the axis A of the wound core portion 13 of the core 10 as a rotation axis.

Then, the first and second lead wires 21 and 22 are respectively pulled out from the first and second nozzles 19 and 20, and one end of each of the first and second lead wires 21 and 22 is clamped by the clamp 61 to be opposed to the core. The support part 60 is fixed.

Then, the insulating film which is bonded to the joint portions of the first and second electrodes 14 and 15 of the first flange portion 11 and the first and second lead wires 21 and 22 is peeled off all around. Specifically, the joints of the first and second lead wires 21 and 22 are moved to the irradiation range of the laser light L of the first and second laser oscillators 31 and 32, and from the first and second laser oscillators. 31 and 32 irradiate the laser light L, and the insulation films of the irradiated portions 21a and 21b of the first and second lead wires 21 and 22 are peeled off all around.

Here, a state when the laser light L is irradiated by the first laser oscillator 31 will be described. As shown in FIG. 3, the laser light L emitted from the first laser oscillator 31 passes through the first laser protective glass 41 from the lower side, and irradiates the first lead 21 from the lower side. The second lead wire 22 is also the same as the first lead wire 21, and a description thereof will be omitted.

When the insulating film of the irradiated portion 21a of the first lead 21 is peeled by irradiating the laser light L, dust F is generated. Dust F (especially, dust F in a solid state) passes through the through hole 71 of the bottom plate 70 due to the influence of gravity, and falls toward the first laser oscillator 31 side. In FIG. 3, for ease of understanding, the amount of dust F is depicted in large amounts. At this time, the first laser protective glass 41 prevents dust F from entering the first laser oscillator 31. Therefore, failure of the first laser oscillator 31 due to the dust F can be prevented.

Furthermore, the blower 55 of the first dust removal mechanism 51 blows air to one surface 41a of the first laser protection glass 41, and the vacuum cleaner 56 of the first dust removal mechanism 51 performs dust F to the one surface 41a of the first laser protection glass 41 Suction. Thereby, even if the dust F falls on one surface 41a of the first laser protective glass 41, the dropped dust F can be removed by the first dust removing mechanism 51, thereby preventing the dust F from accumulating on the first laser protection. One surface 41a of the glass 41. Therefore, the dust F does not block the optical path of the laser light L.

In this way, the coil component manufacturing device 1 includes the first laser protective glass 41 and the first dust removing mechanism 51, so that the failure of the first laser oscillator 31 caused by the dust F can be prevented, and furthermore, the dust F can be prevented. The resulting intensity of the laser light L decreases.

Next, a state when the laser light L is irradiated by the second laser oscillator 32 will be described. As shown in FIG. 4, the laser light L emitted from the second laser oscillator 32 passes through the second laser protective glass 42 from the upper side, and irradiates the first lead 21 from the upper side. Furthermore, regarding the second guide Since the line 22 is also the same as the first lead 21, its description is omitted.

When the insulating film of the irradiated portion 21a of the first lead 21 is peeled by irradiating the laser light L, dust F is generated. The dust F rises under the influence of the updraft until it reaches the second laser protective glass 42. In FIG. 4, in order to facilitate understanding, the amount of dust F is depicted more. At this time, the second laser protective glass 42 prevents dust F from entering the second laser oscillator 32. Therefore, it is possible to prevent the second laser oscillator 32 from malfunctioning due to the dust F.

Furthermore, the blower 55 of the second dust removal mechanism 52 blows air to one surface 42a of the second laser protection glass 42, and the vacuum cleaner 56 of the second dust removal mechanism 52 performs dust F to the one surface 42a of the second laser protection glass 42 Suction. Thereby, even if the dust F reaches the first surface 42 a of the second laser protective glass 42, the raised dust F can be removed by the second dust removing mechanism 52, thereby preventing the dust F from adhering to the second laser protective glass. 42 一个 面 42a。 42 one surface 42a. Therefore, the dust F does not block the optical path of the laser light L.

In this way, the coil component manufacturing device 1 includes the second laser protection glass 42 and the second dust removing mechanism 52, so that the failure of the second laser oscillator 32 caused by the dust F can be prevented, and furthermore, the dust F can be prevented. The resulting intensity of the laser light L decreases.

Thereafter, the first and second lead wires 21 and 22 are wound around the wound core portion 13 of the core 10. As shown in FIG. 5, while rotating the core 10 and the core support portion 60 around the axis A of the core portion 13 of the core 10 supported by the core support portion 60 as a rotation axis, the first and second nozzles 19, 20 moves in the axial direction of the core portion 13 of the core 10, and the first and second wires 21 and 22 are wound around the entire core portion 13 as a whole. Then, at the time point when the winding operation is completed 1 turn before the final lap, the rotation operation by the core support portion 60 is stopped, and the winding operation is stopped.

Then, the first and second electrodes 14 connected to the second flange portion 12 and The insulation films at the connection portions of the first and second lead wires 21 and 22 of 15 are peeled off all around. Specifically, the connection portions of the first and second lead wires 21 and 22 are moved to the irradiation range of the laser light L of the first and second laser oscillators 31 and 32, and from the first and second laser oscillators. 31 and 32 irradiate the laser light L, and the insulation films of the irradiated portions 21a and 21b of the first and second lead wires 21 and 22 are peeled off all around. Here, the state when the laser light L is irradiated by the first and second laser oscillators 31 and 32 is as described using FIG. 3 and FIG. 4 described above.

Thereafter, the winding operation of the final loop is performed. That is, the first and second lead wires 21 and 22 are wound around the core portion 13 of the core 10 only once. Thereby, all winding operations of the first and second lead wires 21 and 22 to the winding core portion 13 are completed.

Then, the peeling portion (connection portion) at which winding of the first and second lead wires 21 and 22 is started and the first and second electrodes 14 and 15 of the first flange portion 11 are performed by thermocompression bonding or laser welding. The connection is performed, and further, the peeling portion (connecting portion) where winding of the first and second lead wires 21 and 22 is completed and the first and second electrodes 14 of the second flange portion 12 by thermocompression bonding or laser welding. , 15 connections.

Finally, the cutter (not shown) is sequentially moved to a position near the first and second flange portions 11 and 12 of the core 10, and one end (starting end) of each of the first and second lead wires 21 and 22 and another One end (terminal) is cut off. Thereby, a coil part is manufactured.

According to the above-mentioned coil component manufacturing apparatus 1, since the first and second laser protective glasses 41 and 42 are provided, dust is prevented from entering the first and second laser oscillators 31 and 32. Therefore, failure of the first and second laser oscillators 31 and 32 due to dust can be prevented.

In addition, since the first and second dust removing mechanisms 51 and 52 are provided, dust is prevented from adhering to one of the surfaces 41 a and 42 a of the first and second laser protective glasses 41 and 42. Therefore, dust does not Will block the light path of the laser light L.

Therefore, failures of the first and second laser oscillators 31 and 32 caused by dust can be prevented, and further, the intensity of the laser light L caused by dust can be prevented from being lowered.

(Second Embodiment)

Fig. 6 is a schematic configuration diagram showing a second embodiment of the manufacturing apparatus for a coil part according to the present invention. In the second embodiment, the position of the first laser oscillator is different from that of the first embodiment. The different configurations will be described below. In addition, in the second embodiment, the same symbols as those in the first embodiment have the same configuration as those in the first embodiment, and therefore descriptions thereof are omitted.

As shown in FIG. 6, the exit hole 31 a of the laser light L of the first laser oscillator 31 is located at a position that does not overlap with and directly offset from the irradiated portion 21 a of the first lead 21 (in the direction of the arrow Z). That is, the optical axis of the laser light L does not coincide with the direction (arrow Z direction) immediately below the irradiated portion 21a. Similarly, the exit hole 31a of the first laser oscillator 31 is located at a position that does not overlap with the portion directly below the irradiated portion 22a of the second lead 22, but is not shown.

Thereby, the laser light L of the first laser oscillator 31 can be irradiated obliquely below the irradiated portions 21a, 22a of the first and second lead wires 21, 22. Therefore, the dust does not fall directly above the exit hole 31a of the first laser oscillator 31, and the intensity of the laser light L can be prevented from decreasing.

(Third Embodiment)

Fig. 7 is a schematic configuration diagram showing a third embodiment of the coil component manufacturing apparatus of the present invention. In the third embodiment, the configuration of the bottom plate is different from that of the first embodiment. The different configurations will be described below. In the third embodiment, the same symbols as those in the first embodiment have the same configuration as those in the first embodiment, and therefore descriptions thereof are omitted.

As shown in FIG. 7, the bottom plate 70A has an open end 71 a that extends above the through hole 71. Surrounded wall portion 72. The wall portion 72 is configured to cover the periphery of the open end 71a. The wall portion 72 is preferably formed continuously along the periphery of the open end 71a, but may be formed intermittently along the periphery of the open end 71a.

Accordingly, even if the dust F is deposited on the bottom plate 70A, the accumulated dust F can be prevented from falling to the through hole 71 of the bottom plate 70A by the wall portion 72.

(Fourth Embodiment)

FIG. 8 is a schematic configuration diagram showing a fourth embodiment of a manufacturing apparatus for a coil part according to the present invention. In the fourth embodiment, the configuration of the wall portion of the bottom plate is different from that in the third embodiment. The different configurations will be described below. In addition, in the fourth embodiment, the same symbols as those in the third embodiment are the same as those in the third embodiment, and therefore descriptions thereof are omitted.

As shown in FIG. 8, the upper portion of the wall portion 72B of the bottom plate 70B overlaps the through hole 71 when viewed from the up-down direction. That is, the upper portion of the wall portion 72B is inclined toward the through-hole 71 side. The opening width H1 of the upper portion of the wall portion 72B is narrower than the opening width H2 of the opening end 71 a on the upper side of the through hole 71.

Thereby, even if the dust falls toward the through-hole 71 side due to the influence of gravity, it is possible to reduce the dust falling to the through-hole 71 by the wall portion 72B having the narrow opening width H1. Moreover, even if dust is deposited on the upper surface of the bottom plate 70B, it is possible to prevent the dust from falling into the through hole 71 by the wall portion 72B. Therefore, the wall portion 72B can further prevent dust from falling into the through hole 71.

In addition, the present invention is not limited to the above-mentioned embodiments, and design changes can be made without departing from the gist of the present invention. For example, various characteristic points of the first to fourth embodiments may be combined in various ways.

In the above embodiment, two laser oscillators are used, but it is also possible to use Either use the first laser oscillator on the lower side or the second laser oscillator on the upper side. At this time, it is preferable to irradiate a part of the first and second wires with a laser by a laser oscillator to peel off approximately half of the first and second wires in the circumferential direction, and then reverse the side where the insulation film has been peeled off. Then, the remaining side of the insulating film faces the laser oscillator, and the laser is irradiated again to peel off the remaining insulating film, thereby peeling off the entire periphery.

In the above embodiment, the two laser oscillators are arranged up and down, but the two laser oscillators may be arranged in a horizontal direction. At this time, it is preferable to arrange two laser oscillators so as to face the irradiated portions of the first and second lead wires.

In the above embodiment, the first and second wires are wound around the core portion by rotating the core around the core of the core portion of the core as the rotation axis, but it is also possible to orbit the nozzle around the core. The first and second wires are wound around the core portion of the core.

In the above embodiment, two wires are wound around the core, but one or three or more wires may be wound around the core.

Claims (8)

A coil component manufacturing device is a coil component manufacturing device. The coil component includes: a core; a wire wound around the core and a conductor covered with an insulating film; and an electrode provided on the core, and Connected to the wire; the coil component manufacturing device includes: a core supporting part that supports the core; a nozzle that successively sends out the wire to the core; a laser oscillator that irradiates the wire with laser light to convert the wire At least a part of the insulating film is peeled off; a laser protective glass is disposed between the irradiated portion of the above-mentioned wire and the laser oscillator, and transmits the laser light emitted from the laser oscillator; And a dust removing mechanism that generates airflow on one side of the wire side in the laser protective glass, sucks dust on the one side of the laser protective glass, and dusts the one side of the laser protective glass. Remove. For example, the manufacturing apparatus of a coil part according to the scope of the patent application, wherein the laser protection glass is disposed below the irradiated portion of the wire, and the laser oscillator is disposed below the laser protection glass. For example, the apparatus for manufacturing a coil part according to the scope of the patent application, wherein the laser protection glass is disposed on an upper side of the irradiated portion of the wire, and the laser oscillator is disposed on an upper side of the laser protection glass. For example, the manufacturing apparatus of a coil part according to the scope of the patent application, wherein the laser oscillator has a first laser oscillator and a second laser oscillator, and the first laser oscillator and the second laser oscillation The device is disposed at a position facing each other with respect to the irradiated portion of the wire. For example, the coil part manufacturing device according to the scope of the patent application, wherein the laser light exit hole of the laser oscillator is located at a position that does not overlap with and is offset from directly below the irradiated portion of the wire. For example, the coil part manufacturing device of the scope of the patent application has a base plate on which the core support portion is installed on the upper side, the laser protective glass and the laser oscillator are arranged below the base plate, and the base plate has: A through-hole for passing laser light emitted from the laser oscillator; and a wall part surrounding the open end on the upper side of the through-hole. For example, in a coil component manufacturing device according to item 6, the upper part of the wall portion overlaps the through hole when viewed from above and below, and the opening width of the upper part of the wall portion is narrower than the open end on the upper side of the through hole. Opening width. For example, the manufacturing apparatus of coil parts according to item 1 of the patent scope, wherein the dust removing mechanism has: a blower that blows air to the above side of the laser protection glass; and a vacuum cleaner that does the same to the above side of the laser protection glass The dust is sucked.