CN107658126B

CN107658126B - Coil component manufacturing apparatus

Info

Publication number: CN107658126B
Application number: CN201710595529.6A
Authority: CN
Inventors: 村上隆史; 三宅和夫; 横塚邦元
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2016-07-25
Filing date: 2017-07-20
Publication date: 2020-04-10
Anticipated expiration: 2037-07-20
Also published as: CN107658126A; TW201807721A; JP6596393B2; TWI623001B; JP2018018852A

Abstract

The invention provides a manufacturing device of a coil component capable of preventing a fault of a laser oscillator caused by dust. A coil component manufacturing apparatus includes: a core support portion that supports the core; a nozzle that feeds a wire to the iron core; a laser oscillator that irradiates a laser beam to a wire to peel off at least a part of an insulating film of the wire; a laser cover glass which is disposed between an irradiated portion irradiated with a laser beam on the wire and the laser oscillator and transmits the laser beam emitted from the laser oscillator; and a dust removing mechanism which generates an air flow on one surface of the laser protection glass on the wire side and sucks the dust on one surface of the laser protection glass to remove the dust on one surface of the laser protection glass.

Description

Coil component manufacturing apparatus

Technical Field

The present invention relates to a coil component manufacturing apparatus.

Background

Conventionally, as a manufacturing apparatus of a coil component, there is an apparatus described in japanese patent laid-open No. 2009-224599 (patent document 1). In this manufacturing apparatus, a laser beam is irradiated from a laser oscillator onto an insulating film of a wire while the wire is wound around an iron core, and the insulating film of the wire is peeled off.

Patent document 1: japanese laid-open patent publication No. 2009-224599

However, the following problems have been found in the case of using the conventional coil component manufacturing apparatus in practice.

When the insulating film of the wire is peeled by irradiating the insulating film with a laser beam, dust is generated. Then, the dust may enter the laser oscillator, and the laser oscillator may malfunction. When the laser oscillator fails, the cost for maintenance of the laser oscillator increases.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a manufacturing apparatus for a coil component capable of preventing a failure of a laser oscillator due to dust.

In order to solve the above problems, a coil component manufacturing apparatus according to the present invention is a coil component manufacturing apparatus for manufacturing a coil component including an iron core, a lead wire wound around the iron core and having a conductor covered with an insulating film, and an electrode provided on the iron core and connected to the lead wire, the coil component manufacturing apparatus including:

a core support portion that supports the core;

a nozzle that feeds the wire to the core;

a laser oscillator that irradiates the wire with a laser beam to peel off at least a part of the insulating film of the wire;

a laser cover glass which is disposed between the laser oscillator and a portion of the wire to be irradiated with the laser beam, and which transmits the laser beam emitted from the laser oscillator; and

and a dust removing mechanism that generates an air flow on one surface of the laser protective glass on the wire side and sucks dust on the one surface of the laser protective glass to remove dust on the one surface of the laser protective glass.

According to the coil component manufacturing apparatus of the present invention, the laser cover glass is disposed between the irradiated portion of the wire and the laser oscillator, and transmits the laser beam emitted from the laser oscillator. Thus, although dust is generated when the insulating film is peeled by irradiation of the laser beam, the laser cover glass prevents the dust from entering the laser oscillator. Therefore, the laser oscillator can be prevented from malfunctioning due to dust.

The dust removing mechanism generates an air current on one surface of the laser protective glass, and sucks the dust on one surface of the laser protective glass to remove the dust on one surface of the laser protective glass. This prevents dust from adhering to one surface of the laser protective glass. Therefore, the dust does not obstruct the optical path of the laser beam.

Therefore, the failure of the laser oscillator due to the dust can be prevented, and the decrease in the intensity of the laser beam due to the dust can be prevented.

In one embodiment of the apparatus for manufacturing a coil member, the laser cover glass is disposed below an irradiated portion of the lead, and the laser oscillator is disposed below the laser cover glass.

According to the above embodiment, the laser cover glass is disposed below the irradiated portion of the wire, and the laser oscillator is disposed below the laser cover glass. Thereby, the laser beam emitted from the laser oscillator passes through the laser cover glass from the lower side, and irradiates the wire from the lower side. Therefore, even if dust (particularly, dust in a solid state) falls on one surface of the laser protective glass due to the influence of gravity, the falling dust can be effectively removed by the dust removing mechanism.

In one embodiment of the apparatus for manufacturing a coil member, the laser cover glass is disposed above an irradiated portion of the lead, and the laser oscillator is disposed above the laser cover glass.

According to the above embodiment, the laser cover glass is disposed above the irradiated portion of the wire, and the laser oscillator is disposed above the laser cover glass. Thus, the laser beam emitted from the laser oscillator passes through the laser cover glass from above, and irradiates the wire from above. Therefore, even if the dust rises up to reach the laser protection glass due to the influence of the ascending air current, the rising dust can be effectively removed by the dust removing mechanism.

In one embodiment of the apparatus for manufacturing a coil component,

the laser oscillator includes a first laser oscillator and a second laser oscillator,

the first laser oscillator and the second laser oscillator are disposed at positions facing each other with respect to the irradiated portion of the wire.

Here, the opposed position means that the optical axes of the laser beams of the first laser oscillator and the second laser oscillator may or may not be coaxial. The optical axes of the laser beams may be parallel to each other and shifted by a prescribed distance. The optical axes of the laser beams may intersect each other at a non-parallel angle (an angle other than 180 ° such as 179 °).

According to the above embodiment, since the first laser oscillator and the second laser oscillator are disposed at positions facing each other with respect to the irradiated portion of the wire, the entire circumference of the insulating film of the wire can be peeled by irradiating the laser beam from the first laser oscillator and the second laser oscillator.

In one embodiment of the apparatus for manufacturing a coil member, the laser oscillator may have a laser beam emitting hole located at a position not overlapping and deviating directly below the irradiated portion of the lead.

According to the above embodiment, since the laser beam emitting hole of the laser oscillator is located at a position not overlapping and offset directly below the irradiated portion of the wire, the laser beam of the laser oscillator can be irradiated obliquely from below the irradiated portion of the wire. This prevents the dust from falling directly above the emission hole of the laser oscillator, thereby preventing the intensity of the laser beam from being reduced.

In one embodiment of the apparatus for manufacturing a coil component,

a base plate having the core support part mounted on the upper side thereof,

the laser cover glass and the laser oscillator are disposed on the lower side of the substrate,

the substrate has a through hole through which the laser beam emitted from the laser oscillator passes, and a wall portion surrounding an upper opening end of the through hole.

According to the above embodiment, the substrate has the through hole through which the laser beam emitted from the laser oscillator passes, and the wall portion surrounding the upper opening end of the through hole. Thus, even if dust is deposited on the upper surface of the substrate, the deposited dust can be prevented from falling into the through-hole of the substrate by the wall portion.

In one embodiment of the apparatus for manufacturing a coil component, an upper portion of the wall portion overlaps the through hole when viewed in a vertical direction, and an opening width of the upper portion of the wall portion is narrower than an opening width of an upper opening end of the through hole.

According to the above embodiment, the upper portion of the wall portion overlaps the through hole when viewed in the vertical direction, and the opening width of the upper portion of the wall portion is narrower than the opening width of the upper opening end of the through hole. This can prevent dust from falling into the through-hole of the substrate.

In one embodiment of the apparatus for manufacturing a coil member, the dust removing means includes a blower for blowing air to the one surface of the laser protective glass, and a vacuum cleaner for sucking dust on the one surface of the laser protective glass.

According to the above embodiment, the dust removing mechanism has the blower and the vacuum cleaner. This makes it possible to simplify the structure of the dust removing mechanism.

According to the coil component manufacturing apparatus of the present invention, since the laser cover glass is disposed between the irradiated portion of the lead wire and the laser oscillator and transmits the laser beam emitted from the laser oscillator, it is possible to prevent the malfunction of the laser oscillator caused by the dust. Further, the dust removing mechanism generates an air current on one surface of the laser protective glass, sucks the dust on the one surface of the laser protective glass, and removes the dust on the one surface of the laser protective glass, so that the intensity of the laser beam can be prevented from being reduced due to the dust.

Drawings

Fig. 1 is a schematic configuration diagram showing a first embodiment of a coil component manufacturing apparatus according to the present invention.

Fig. 2 is a schematic perspective view showing a part of an apparatus for manufacturing a coil component.

Fig. 3 is an explanatory diagram for explaining a state when a laser beam is irradiated by the first laser oscillator.

Fig. 4 is an explanatory view explaining a state when a laser beam is irradiated by the second laser oscillator.

Fig. 5 is an explanatory diagram illustrating a state in which a wire is wound around an iron core.

Fig. 6 is a schematic configuration diagram showing a second embodiment of the coil component manufacturing apparatus according to the present invention.

Fig. 7 is a schematic configuration diagram showing a third embodiment of the coil component manufacturing apparatus according to the present invention.

Fig. 8 is a schematic configuration diagram showing a fourth embodiment of the manufacturing apparatus of the coil component of the present invention.

Detailed Description

The present invention will be described in detail below with reference to the embodiments shown in the drawings.

(first embodiment)

Fig. 1 is a schematic configuration diagram showing a first embodiment of a coil component manufacturing apparatus according to the present invention. Fig. 2 is a schematic perspective view showing a part of an apparatus for manufacturing a coil component. As shown in fig. 1 and 2, the coil component manufacturing apparatus 1 includes a core support 60 that supports a core 10 of a coil component, a first nozzle 19 that feeds a first lead wire 21 to the core 10, and a second nozzle 20 that feeds a second lead wire 22 to the core 10. In fig. 1, the second nozzle 20 and the second lead 22 are not depicted.

The coil component manufacturing apparatus 1 further includes a first laser oscillator 31 for irradiating the first and second

lead wires

21 and 22 with the laser beam L to peel off the insulating films of the first and second

lead wires

21 and 22, a first laser cover glass 41 for transmitting the laser beam L emitted from the first laser oscillator 31, and a first dust removing mechanism 51 for removing dust on the first laser cover glass 41.

The coil component manufacturing apparatus 1 further includes a second laser oscillator 32 for irradiating the first and second

lead wires

21 and 22, a second laser cover glass 42 for transmitting the laser beam L emitted from the second laser oscillator 32, and a second dust removing mechanism 52 for removing dust on the second laser cover glass 42.

The coil component manufacturing apparatus 1 winds the first and second

conductive wires

21 and 22 around substantially the entire core portion 13 of the core 10 by rotating the core 10 about the axial center a of the core portion 13 of the core 10 as a rotation axis, thereby manufacturing a coil component having a two-wire structure. The coil component is, for example, a common mode choke coil.

The core 10 has a winding core portion 13, a first flange portion 11 provided at one end of the winding core portion 13, and a second flange portion 12 provided at the other end of the winding core portion 13. As the material of the core 10, for example, alumina (nonmagnetic material), Ni — Zn ferrite (magnetic material, insulator), resin, or the like is used.

The shape of the roll core 13 is, for example, a cube. The shape of the first flange portion 11 and the shape of the second flange portion 12 are, for example, rectangular flat plates. A first electrode 14 and a second electrode 15 are provided on the bottom surface of the first flange 11 and the bottom surface of the second flange 12, respectively. The material of the first and

second electrodes

14 and 15 is Ag, for example. The tip of the first wire 21 is joined to the first electrode 14 of the first flange 11 of the core 10. The tip of the second wire 22 is joined to the second electrode 15 of the first flange 11 of the core 10. The core 10 is disposed on the XY plane, and the axis a direction connecting the first flange 11 and the second flange 12 coincides with the Y direction. The Z direction coincides with the up-down direction.

The first and second

lead wires

21 and 22 are wound around the winding core 13 in a spiral shape, and are formed by covering the conductors with an insulating film. For example, the conductor is made of a copper wire, and the insulating film is made of polyamide imide (AIW) which is a heat-resistant material. The first wire 21 is wound around the core 10, thereby constituting a primary side coil. The second wire 22 is wound around the core 10, thereby constituting a secondary side coil.

The core support 60 is mounted on the upper side of the base plate 70. The substrate 70 is disposed on a horizontal plane via the support legs 75. The core support portion 60 is configured to be able to hold one of the first flange portions 11 of the core 10. The core support portion 60 is configured to rotate about the axis a of the winding core 13 of the core 10 supported by the core support portion 60. When the first and second

lead wires

21 and 22 are wound around the core portion 13 of the core 10, the core 10 is rotated while being supported by the core support portion 60, whereby the core 10 is also rotated about the axial center a of the core portion 13 as a rotation axis, and the first and second

lead wires

21 and 22 drawn out from the first and

second nozzles

19 and 20 are wound around the core portion 13.

Further, a clamp 61 is provided in the core support 60, one end of each of the first and second

lead wires

21 and 22 drawn out from the first and

second nozzles

19 and 20 is clamped by the clamp 61, and one end of each of the first and second

lead wires

21 and 22 clamped by the clamp 61 is fixed to the core support 60. Therefore, when the first and

second nozzles

19 and 20 are moved, one ends of the first and

second wires

21 and 22 are fixed, and therefore the first and

second wires

21 and 22 are pulled out from the first and

second nozzles

19 and 20, respectively, in accordance with the movement of the first and

second nozzles

19 and 20.

The first and

second laser oscillators

31, 32 irradiate the first and second

lead wires

21, 22 arranged in the vicinity of the core 10 with the laser beam L, respectively, and peel off at least a part of the insulating films of the first and second

lead wires

21, 22. In the first and second

conductive lines

21, 22, portions irradiated with the laser beam L are set as

irradiated portions

21a, 22a, respectively. The

irradiated portions

21a, 22a are shown by black dots in fig. 1 and hatched in fig. 2.

Here, the first and

second laser oscillators

31 and 32 can scan the laser beam L over a range of 300 milli-arc seconds, and can irradiate the laser beam L with the first and second

lead wires

21 and 22 arranged in the laser beam irradiation range of 300 milli-arc seconds. Further, the irradiation time for one time is about several ms, and even if a plurality of peeling operations are performed by continuous irradiation for a plurality of times, the total time taken is about 1 second or less.

The laser beam L is, for example, a second harmonic (shg) laser beam having a wavelength of approximately 532 nm. Therefore, the insulating film of each of the first and second

conductive lines

21 and 22 made of polyamide imide, which is a heat-resistant material, can be transmitted, and the insulating film can be optimally removed at the interface position between the insulating film and each of the first and second

conductive lines

21 and 22.

The first laser oscillator 31 and the second laser oscillator 32 are disposed at positions facing the irradiated portion 21a of the first wire 21 and the irradiated portion 22a of the second wire 22. Here, the opposed position means that the optical axes of the laser beams L of the first laser oscillator 31 and the second laser oscillator 32 may be coaxial or not. The optical axes of the laser beams L may be parallel to each other and shifted by a prescribed distance. The optical axes of the laser beams L may intersect each other at a non-parallel angle (an angle other than 180 ° such as 179 °).

The first laser oscillator 31 is disposed below the

irradiated portions

21a, 22a of the first and second

lead wires

21, 22, and the second laser oscillator 32 is disposed above the

irradiated portions

21a, 22a of the first and second

lead wires

21, 22. Thus, the first laser oscillator 31 and the second laser oscillator 32 are irradiated with the laser beam L to peel off the entire circumference of the insulating film of the first and second

lead wires

21 and 22. Therefore, the process operation time (production interval time) required for peeling the insulating film can be further shortened.

The first laser oscillator 31 is disposed below the substrate 70. The substrate 70 has a through hole 71 through which the laser beam L emitted from the first laser oscillator 31 passes. The through hole 71 is formed in a slit shape, for example, and the laser beam L can scan along the slit.

The first laser cover glass 41 is disposed between the

irradiated portions

21a and 22a of the first and

second wires

21 and 22 and the first laser oscillator 31, and transmits the laser beam L emitted from the first laser oscillator 31. The first laser cover glass 41 is disposed below the

irradiated portions

21a, 22a of the first and

second wires

21, 22, and the first laser oscillator 31 is disposed below the first laser cover glass 41. The first laser cover glass 41 is disposed below the substrate 70. The through hole 71 of the substrate 70 vertically overlaps the first protective laser glass 41.

The second laser cover glass 42 is disposed between the

irradiated portions

21a and 22a of the first and second

lead wires

21 and 22 and the second laser oscillator 32, and transmits the laser beam L emitted from the second laser oscillator 32. The second laser cover glass 42 is disposed above the

irradiated portions

21a, 22a of the first and

second wires

21, 22, and the second laser oscillator 32 is disposed above the second laser cover glass 42. The second laser cover glass 42 is disposed on the upper side of the substrate 70.

The first dust removing mechanism 51 causes an air flow to occur on the first laser cover glass 41 on the

lead wire

21, 22 side surface 41a (upper surface in this embodiment), sucks the dust on the first laser cover glass 41 surface 41a, and removes the dust on the first laser cover glass 41 surface 41 a. The first dust removing mechanism 51 includes a blower 55 for blowing air to the first surface 41a of the first laser cover glass 41, and a vacuum cleaner 56 for sucking dust on the first surface 41a of the first laser cover glass 41. The blower 55 and the vacuum cleaner 56 are disposed on the side of the first laser cover glass 41 on the one surface 41a, and the discharge side of the blower 55 faces the suction side of the vacuum cleaner 56. Since the first dust removing mechanism 51 is constituted by the blower 55 and the vacuum cleaner 56, the first dust removing mechanism 51 can be constituted simply.

The second dust removing mechanism 52 generates an air flow on the one surface 42a (lower surface in this embodiment) of the second laser cover glass 42 on the

lead wire

21 or 22 side, sucks the dust on the one surface 42a of the second laser cover glass 42, and removes the dust on the one surface 42a of the second laser cover glass 42. The second dust removing mechanism 52 includes a blower 55 for blowing air to the one surface 42a of the second laser cover glass 42 and a vacuum cleaner 56 for sucking dust on the one surface 42a of the second laser cover glass 42, similarly to the first dust removing mechanism 51.

Next, a method for manufacturing the coil component will be described. In the method of manufacturing the coil component, two first and

second wires

21 and 22 are wound around the core 10 at the same time and are joined to the first and

second electrodes

14 and 15, respectively. This step will be described in detail below.

As shown in fig. 2, one first flange portion 11 of the core 10 is gripped and fixed by the core support portion 60. Here, the core 10 is rotatable about the axial center a of the winding core 13 of the core 10.

Then, the first and second

lead wires

21 and 22 are drawn out from the first and

second nozzles

19 and 20, respectively, and one ends of the first and second

lead wires

21 and 22 are clamped by a clamp 61 and fixed to the core support 60.

Then, the insulating films at the bonding positions of the first and

second wires

21 and 22 bonded to the first and

second electrodes

14 and 15 of the first flange 11 are peeled off over the entire circumference. Specifically, the bonding position of the first and second

lead wires

21 and 22 is moved to the irradiation range of the laser beam L from the first and

second laser oscillators

31 and 32, and the laser beam L is irradiated from the first and

second laser oscillators

31 and 32, thereby peeling the entire circumference of the insulating film of the irradiated portions 21a and 21b of the first and second

lead wires

21 and 22.

Here, a state when the laser beam L is irradiated by the first laser oscillator 31 will be described. As shown in fig. 3, the laser beam L emitted from the first laser oscillator 31 passes through the first laser cover glass 41 from below, and irradiates the first wire 21 from below. The second conductive line 22 is also the same as the first conductive line 21, and therefore, the description thereof is omitted.

Dust F is generated when the insulating film of the irradiated portion 21a of the first wire 21 is peeled off by irradiation of the laser beam L. The dust F (particularly, dust F in a solid state) passes through the through hole 71 of the substrate 70 and falls toward the first laser oscillator 31 due to the influence of gravity. In fig. 3, the amount of dust F is depicted more for easy understanding. At this time, the first laser protection glass 41 prevents the dust F from entering the first laser oscillator 31. Therefore, the first laser oscillator 31 can be prevented from malfunctioning due to the dust F.

Then, the blower 55 of the first dust removal mechanism 51 blows air to the one surface 41a of the first laser protective glass 41, and the vacuum cleaner 56 of the first dust removal mechanism 51 sucks the dust F of the one surface 41a of the first laser protective glass 41. Thus, even if the dust F falls on the first surface 41a of the first laser cover glass 41, the first dust removing mechanism 51 can remove the falling dust F and prevent the dust F from accumulating on the first surface 41a of the first laser cover glass 41. Therefore, the dust F does not obstruct the optical path of the laser beam L.

In this way, since coil component manufacturing apparatus 1 includes first protective laser glass 41 and first dust removal mechanism 51, it is possible to prevent failure of first laser oscillator 31 due to dust F and to prevent a decrease in the intensity of laser beam L due to dust F.

Next, a state when the laser beam L is irradiated by the second laser oscillator 32 will be described. As shown in fig. 4, the laser beam L emitted from the second laser oscillator 32 passes through the second laser cover glass 42 from above, and irradiates the first wire 21 from above. The second conductive line 22 is also the same as the first conductive line 21, and therefore, the description thereof is omitted.

Dust F is generated when the insulating film of the irradiated portion 21a of the first wire 21 is peeled off by irradiation of the laser beam L. The dust F rises until reaching the second laser cover glass 42 due to the influence of the ascending air current. In fig. 4, the amount of the dust F is plotted in a large scale for ease of explanation. At this time, the second laser protection glass 42 prevents the dust F from entering the second laser oscillator 32. Therefore, the second laser oscillator 32 can be prevented from malfunctioning due to the dust F.

Then, the blower 55 of the second dust removal mechanism 52 blows air to the one surface 42a of the second laser protective glass 42, and the vacuum cleaner 56 of the second dust removal mechanism 52 sucks the dust F of the one surface 42a of the second laser protective glass 42. Thus, even if the dust F reaches the one surface 42a of the second laser protective glass 42, the second dust removal mechanism 52 can remove the ascending dust F and prevent the dust F from adhering to the one surface 42a of the second laser protective glass 42. Therefore, the dust F does not obstruct the optical path of the laser beam L.

In this way, since coil component manufacturing apparatus 1 includes second protective laser glass 42 and second dust removal mechanism 52, it is possible to prevent second laser oscillator 32 from malfunctioning due to dust F and to prevent laser beam L from being reduced in intensity due to dust F.

Thereafter, the first and second

lead wires

21 and 22 are wound around the core portion 13 of the core 10. As shown in fig. 5, the core 10 and the core support portion 60 are rotated about the axial center a of the core portion 13 of the core 10 supported by the core support portion 60 as a rotation axis, and the first and

second nozzles

19 and 20 are moved in the axial direction of the core portion 13 of the core 10, whereby the first and second

lead wires

21 and 22 are wound around the entire core portion 13. Then, the rotation operation of the core support 60 is stopped at the time when the winding operation of the previous turn of the last turn is completed, and the winding operation is stopped.

Then, the insulating films at the connection positions of the first and

second wires

21 and 22 connected to the first and

second electrodes

14 and 15 of the second flange 12 are peeled off over the entire circumference. Specifically, the connection position of the first and second

lead wires

second laser oscillators

31 and 32, and the laser beam L is irradiated from the first and

second laser oscillators

lead wires

21 and 22. Here, the state when the laser beam L is irradiated by the first and

second laser oscillators

31 and 32 is as described above with reference to fig. 3 and 4.

Thereafter, the winding operation of the last turn is performed. That is, the first and second

lead wires

21 and 22 are wound around the core 13 of the core 10 by one turn. This completes all the winding operations of the first and second

lead wires

21 and 22 to the winding core 13.

Then, the peeling position (connection position) at which the winding of the first and second

lead wires

21 and 22 is started is connected to the first and

second electrodes

14 and 15 of the first flange portion 11 by hot pressing or laser welding, and the peeling position (connection position) at which the winding of the first and second

lead wires

21 and 22 is completed is connected to the first and

second electrodes

14 and 15 of the second flange portion 12 by hot pressing or laser welding.

Finally, a not-shown cutter is sequentially moved to positions near the first and

second flanges

11 and 12 of the core 10, and one end (starting end) portion and the other end (terminating end) portion of each of the first and second

lead wires

21 and 22 are cut. Thereby, a coil component is manufactured.

According to the coil component manufacturing apparatus 1, since the first and second

laser cover glasses

41 and 42 are provided, dust is prevented from entering the first and

second laser oscillators

31 and 32. Therefore, the first and

second laser oscillators

31, 32 can be prevented from malfunctioning due to dust.

Further, since the first and second

dust removing mechanisms

51 and 52 are provided, dust is prevented from adhering to the first and

second surfaces

41a and 42a of the first and second

laser cover glasses

41 and 42. Therefore, the dust does not obstruct the optical path of the laser beam L.

Therefore, the failure of the first and

second laser oscillators

31, 32 due to the dust can be prevented, and the intensity of the laser beam L can be prevented from being reduced due to the dust.

(second embodiment)

Fig. 6 is a schematic configuration diagram showing a second embodiment of the coil component manufacturing apparatus according to the present invention. The second embodiment is different from the first embodiment in the position of the first laser oscillator. The different structure will be described below. In the second embodiment, the same reference numerals as those in the first embodiment denote the same configurations as those in the first embodiment, and therefore, the description thereof will be omitted.

As shown in fig. 6, the emission hole 31a of the laser beam L of the first laser oscillator 31 is located at a position not overlapping and shifted directly below (in the direction of arrow Z) the irradiated portion 21a of the first wire 21. In other words, the optical axis of the laser beam L does not intersect in line with the direction (arrow Z direction) directly below the irradiated portion 21 a. Similarly, although not shown, the emission hole 31a of the first laser oscillator 31 is located at a position not overlapping and offset directly below the irradiated portion 22a of the second wire 22.

Thereby, the laser beam L of the first laser oscillator 31 can be irradiated obliquely downward from the

irradiated portions

21a, 22a of the first and

second wires

21, 22. Therefore, the dust does not fall directly above the emission hole 31a of the first laser oscillator 31, and the intensity of the laser beam L can be prevented from being reduced.

(third embodiment)

Fig. 7 is a schematic configuration diagram showing a third embodiment of the coil component manufacturing apparatus according to the present invention. The third embodiment is different from the first embodiment in the structure of the substrate. The different structure will be described below. In the third embodiment, the same reference numerals as those in the first embodiment denote the same configurations as those in the first embodiment, and therefore, the description thereof will be omitted.

As shown in fig. 7, the substrate 70A has a wall portion 72 surrounding an upper opening end 71a of the through hole 71. Wall portion 72 is configured to cover the periphery of open end 71 a. The wall portion 72 is preferably formed continuously along the periphery of the open end 71a, but may be formed intermittently along the periphery of the open end 71 a.

Thus, even if the dust F is deposited on the upper surface of the substrate 70A, the deposited dust F can be prevented from falling to the through-hole 71 of the substrate 70A by the wall portion 72.

(fourth embodiment)

Fig. 8 is a schematic configuration diagram showing a fourth embodiment of the manufacturing apparatus of the coil component of the present invention. The fourth embodiment is different from the third embodiment in the structure of the wall portion of the substrate. The different structure will be described below. In the fourth embodiment, the same reference numerals as those in the third embodiment denote the same configurations as those in the third embodiment, and therefore, the description thereof will be omitted.

As shown in fig. 8, the upper portion of the wall portion 72B of the substrate 70B overlaps the through hole 71 when viewed in the vertical direction. In other words, the upper portion of wall portion 72B is inclined toward through hole 71. The opening width H1 of the upper portion of the wall portion 72B is narrower than the opening width H2 of the upper opening end 71a of the through hole 71.

Thus, even if the dust falls toward the through-hole 71 due to the influence of gravity, the dust can be reduced from falling to the through-hole 71 by the narrow wall portion 72B having the opening width H1. Even if dust accumulates on the upper surface of the substrate 70B, the wall portion 72B prevents the dust from falling into the through-hole 71. Therefore, the wall portion 72B can further prevent dust from falling into the through-hole 71.

The present invention is not limited to the above-described embodiments, and design changes can be made without departing from the scope of the present invention. For example, various combinations of the respective feature points of the first to fourth embodiments are also possible.

In the above embodiment, two upper and lower laser oscillators are used, but either the first laser oscillator on the lower side or the second laser oscillator on the upper side may be used. In this case, it is preferable that after laser irradiation is performed toward a part of the first and second wires to peel off approximately half of the first and second wires in the circumferential direction by one laser oscillator, the side from which the insulating film is peeled is reversed to face the side from which the insulating film remains to the laser oscillator, and laser irradiation is performed again to peel off the remaining insulating film to peel off the entire circumference.

In the above embodiment, two laser oscillators are arranged in the vertical direction, but two laser oscillators may be arranged in the horizontal direction. In this case, the two laser oscillators are preferably disposed so as to face the irradiated portions of the first and second wires.

In the above embodiment, the first and second lead wires are wound around the winding core portion by rotating the core about the axial center of the winding core portion of the core as a rotation axis, but the first and second lead wires may be wound around the winding core portion of the core by revolving the nozzle around the core.

In the above embodiment, two wires are wound around the core, but one or three or more wires may be wound around the core.

Description of the reference numerals

1 … coil component manufacturing apparatus, 10 … iron core, 11 … first flange part, 12 … second flange part, 13 … winding core part, 14 … first electrode, 15 … second electrode, 19 … first nozzle, 20 … second nozzle, 21 … first wire, 21a … irradiated part, 22 … second wire, 22a … irradiated part, 31 … first laser oscillator, 31a … emitting hole, 32 … second laser oscillator, 32a … emitting hole, 41 … first laser protection glass, 41a … face, 42 … second laser protection glass, 42a … face, 51 … first dust removing means, 52 … second dust removing means, 55 …, 56 … vacuum cleaner, 60 … iron core supporting part, 61 … clamp, 70A, 70B substrate, 3671 through hole, … a …, … B opening end, … B wall part, … L dust wall part, … L dust suction cleaner, h1 … (opening width of wall), H2 … (opening width of through hole).

Claims

1. An apparatus for manufacturing a coil component having an iron core, a lead wire wound around the iron core and having a conductor covered with an insulating film, and an electrode provided on the iron core and connected to the lead wire, the apparatus comprising:

a core support portion that supports the core;

a nozzle that feeds the wire to the core;

a dust removing mechanism for generating an air flow on one surface of the laser protective glass on the wire side and sucking dust on the one surface of the laser protective glass to remove dust on the one surface of the laser protective glass,

the laser cover glass is disposed below the irradiated portion of the lead, the laser oscillator is disposed below the laser cover glass,

the laser beam emitting hole of the laser oscillator is located at a position not overlapping and deviating with a position right below the irradiated portion of the lead.

2. The coil component manufacturing apparatus according to claim 1, wherein,

3. The coil component manufacturing apparatus according to claim 1, wherein,

a base plate having the core support part mounted on the upper side thereof,

4. The coil component manufacturing apparatus according to claim 3, wherein,

an upper portion of the wall portion overlaps the through hole when viewed in a vertical direction, and an opening width of the upper portion of the wall portion is narrower than an opening width of an upper opening end of the through hole.

5. The coil component manufacturing apparatus according to claim 1, wherein,

the dust removing means includes a blower for blowing air to the one surface of the laser protective glass, and a vacuum cleaner for sucking dust on the one surface of the laser protective glass.