JP2014007307A - Apparatus and method for manufacturing coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a coil with a terminal, capable of improving quality of the coil.SOLUTION: An apparatus 1 for manufacturing a coil, includes: a winding device 20 for generating a semi-product coil 4' in which a wire 3 is wound around a bobbin 2 so that lead portions 4b and 4c are extended; a coating removing device 50 for removing a coating of the lead portions 4b and 4c of the semi-product coil 4'; a binding device 60 for binding the lead portions 4b and 4c in which the coating is removed, to terminal projections 2c of the bobbin 2; and a soldering device 70 for soldering the lead portions 4b and 4c bound to the terminal projections 2c.

Description

  The present invention relates to a coil manufacturing apparatus and a manufacturing method for manufacturing a coil by winding a wire around a bobbin.

  In the conventional coil, in addition to the lead portion that is a lead wire for energizing the coil, the lead portion extends from the coil in a free state, and the lead portion is entangled (wound) around the protrusion provided on the bobbin and soldered. In some cases, this is a terminal for energization (see, for example, Patent Document 1). In the manufacture of such a coil with a terminal, the lead part is entangled with the protrusion and then immersed in a solder bath, the insulating film of the lead part is destroyed by the heat of the molten solder, and the lead part is soldered (protrusion). Generally, a method of adhering to (see Patent Document 2) is employed.

JP-A-7-235411 JP-A-4-320016

  However, in the conventional method in which the lead part is entangled in the solder bath after the lead part is entangled with the protrusion, the insulating film is destroyed in a state where the lead part is entangled and densely packed. Occasionally, it is easy to deposit on the base end portion of the protrusion, and the occurrence of defects due to the accumulation of such debris may be a problem. In particular, when a self-bonding wire is used as the coil wire, a thicker bonding layer is provided outside the insulating layer, which increases the amount of debris generated when the insulating film is broken. There was a problem that defects caused by this were likely to occur.

  In view of such circumstances, the present invention intends to provide a coil manufacturing apparatus and a manufacturing method capable of improving the quality of a coil with a terminal.

  (1) The present invention relates to a winding device that generates a semi-finished product coil in which a wire rod is wound around a bobbin and a lead portion extends, and a coating removal device that removes a coating film on the lead portion of the semi-finished product coil A tying device for tying the lead part from which the coating has been removed to a terminal projection provided on the bobbin, and a soldering device for fixing the lead part tangled to the terminal projection by solder. A coil manufacturing apparatus comprising: a coil manufacturing apparatus;

  (2) The present invention is also characterized in that the winding device includes a start end holding member that holds a start end of the wire, a terminal end holding member that holds a terminal end of the wire, the start end, and the terminal end. A cutting device that cuts to form the lead portion, and the start end holding member and the end end holding member extend in substantially the same direction from the semi-finished coil. It is arrange | positioned so that it may become. It is a manufacturing apparatus of the coil as described in said (1) characterized by the above-mentioned.

  (3) In the present invention, the coating film removing device further includes a solder bath in which the lead portion is immersed, and the soldering device includes a heating device that melts the solder attached to the lead portion in the coating film removing device. The coil manufacturing apparatus according to (1) or (2), wherein the coil manufacturing apparatus is provided.

  (4) In the present invention, the binding device includes a pinching mechanism that slidably holds the lead portion between a pair of pinching members, and the lead portion that contacts the lead portion and the terminal protrusion. Any one of the above (1) to (3), comprising: a positioning member that determines a winding position of the winding member; and a rotation mechanism that rotates the pair of clamping members around the axis of the terminal protrusion. It is a manufacturing apparatus of the coil.

  (5) The present invention also includes a transport device that transports the semi-finished product coil from the winding device to the film removing device, the binding device, and the soldering device, and the transport device is substantially orthogonal to the transport direction. The coil manufacturing apparatus according to any one of (1) to (4), further comprising a coil holding member that holds the semi-finished product coil in a state in which the terminal protrusion is directed in a direction to be performed. .

  (6) The present invention is also the coil manufacturing apparatus according to (5), wherein the transport device includes a lead portion holding member that holds the lead portion.

  (7) In the present invention, the lead portion holding member also includes a first lead portion holding member having a first slit into which the lead portion is inserted, and a second slit into which the lead portion is inserted. A second lead portion holding member, and the first lead portion holding member and the second lead portion holding member are arranged such that the first slit and the second slit are orthogonal to each other. The coil manufacturing apparatus according to (6) above, wherein

  (8) The present invention also includes a first step of generating a semi-finished coil in which a lead is extended by winding a wire around a bobbin, and a second step of removing the coating on the lead portion of the semi-finished coil. A third step of tying the lead part from which the coating has been removed to a terminal projection provided on the bobbin, and a fourth step of fixing the lead part tangled to the terminal projection with solder. A coil manufacturing method comprising the steps of:

  (9) In the present invention, the first step extends in substantially the same direction as the step of holding the starting end and the terminal end of the wire in a state of extending in the substantially same direction from the semi-finished coil. Cutting the starting end portion and the terminal end portion to form the lead portion, wherein the coil manufacturing method according to (8) above is provided.

  (10) According to the present invention, in the second step, the lead part is immersed in a solder bath, and in the fourth step, the solder attached to the lead part in the second step is melted. The method for producing a coil according to (8) or (9) above, characterized in that

  According to the coil manufacturing apparatus and method of the present invention, it is possible to achieve an excellent effect that the quality of the coil with terminal can be improved.

It is a schematic plan view of the manufacturing apparatus of the coil which concerns on embodiment of this invention. It is the schematic which showed an example of the coil with a (a)-(c) terminal. It is the schematic which showed the procedure of (a)-(e) winding process. It is the schematic which showed the procedure of (a)-(f) winding process. (A)-(f) It is the schematic which showed the procedure of the delivery of a semi-finished product coil. It is the schematic which showed the procedure of the (a)-(c) film removal process. (A)-(e) It is the schematic which showed the procedure of the binding process. (F) And (g) It is the schematic which showed the clamping mechanism of the binding apparatus. (A)-(c) It is the schematic which showed the procedure of the soldering process.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the description is simplified for easy understanding, and the description of some components is omitted.

  FIG. 1 is a schematic plan view of a coil manufacturing apparatus 1 according to the present embodiment, and FIGS. 2A to 2C are schematic diagrams illustrating an example of a coil 4 with a terminal. 2A is a schematic plan view of the coil 4 with a terminal, FIG. 2B is a schematic front view (side view) of the coil 4 with a terminal, and FIG. 2C is a schematic plan view of the coil 4 with a terminal. It is.

  A coil manufacturing apparatus 1 (hereinafter simply referred to as manufacturing apparatus 1) of this embodiment manufactures a coil 4 with terminals (hereinafter simply referred to as a coil 4) by winding a wire 3 around the outer periphery of a cylindrical bobbin 2. To do. As shown in FIGS. 2A to 2C, the bobbin 2 is composed of a cylindrical body 2a and a flange 2b provided at one end of the body 2a in the axial direction. The flange portion 2b is provided with two terminal protrusions 2c, and two notches 2d are provided in the vicinity of the terminal protrusion 2c.

  The wire 3 is wound around the outer periphery of the body portion 2a of the bobbin 2 to form a coil portion 4a. The film coated with the wire 3 is provided with a fusion layer outside the insulating layer, and the wires 3 adjacent to each other in the coil portion 4a are bonded to each other by being heated in the winding. It has become. The two lead portions 4b and 4c of the coil portion 4a, that is, the start end portion 3a and the end end portion 3b of the wound wire rod 3 are entangled (wrapped) on the side surfaces of the two terminal projections 2c and soldered. As a result, the terminal 4d is formed. The two lead portions 4b and 4c are led from the coil portion 4a to the terminal projection 2c through the notch portion 2d.

  Thus, since the coil 4 includes the two terminals 4d soldered with the lead portions 4b and 4c being entangled, the terminal 4d is formed in addition to the winding process in the manufacture of the coil 4. The process for doing is needed. Specifically, a coating removing process for removing the coating on the lead portions 4b and 4c, a binding step for tying the lead portions 4b and 4c from which the coating has been removed to the terminal projection 2c, and a tangling to the terminal projection 2c. And a soldering step of soldering the bent lead portions 4b and 4c.

  Therefore, as shown in FIG. 1, the manufacturing apparatus 1 includes a base 10 that supports each configuration described later, and a coil portion 4 a and lead portions 4 b and 4 c by winding a wire around the outer periphery of the body portion 2 a of the bobbin 2. , A bobbin supply device 30 for supplying the bobbin 2 to the winding device 20, a transport device 40 for transporting the semi-finished coil 4 ′ after the winding, and the lead of the semi-finished coil 4 ′ A film removing device 50 for removing the film of the portions 4b and 4c, a tying device 60 for tying the lead portions 4b and 4c from which the film has been removed to the terminal projection 2c, and a lead entangled with the terminal projection 2c. A soldering device 70 for soldering the parts 4b and 4c, an inspection device 80 for inspecting the completed coil 4, an unloading device 90 for unloading the coil 4 after the inspection, and a control device 100 for controlling the entire manufacturing apparatus 1. And.

  The winding device 20 includes four spindles 21 that hold the bobbin 2 at the tip, a driving device 22 that rotationally drives the spindle 21, and a tailstock that presses and positions the bobbin 2 held by the spindle 21 in the axial direction. 23, a tail stock rotating device 24 for rotating the tail stock 23 from a position facing the spindle 21 to a position facing the conveying device 40, and a wire rod guiding device for guiding the wire 3 to the bobbin 2 held by the spindle 21. 25, a wire supply device 26 that supplies the wire 3 to the wire guide device 25, and a hot air device 27 that blows and heats the wire 3 in the winding to heat it.

  The spindle 21 includes a holding mechanism 21 a that holds the bobbin 2 at its tip, and is rotatably supported by the base 10. The spindle 21 is rotated by being driven by the driving device 22 to rotate the bobbin 2. It is configured. In the present embodiment, four spindles 21 are provided so that winding is performed on the four bobbins 2 at the same time. In the present embodiment, the spindles 21 are arranged with the axial direction being substantially horizontal, and four spindles 21 are arranged in a direction substantially orthogonal to the axial direction in a substantially horizontal plane.

  As the holding mechanism 21a of the spindle 21, a known structure can be adopted. In this embodiment, the bobbin 2 is sandwiched between a pair of clamping members 21a1 that are expanded and contracted by the expansion / contraction mechanism 21b. (Details will be described later). In addition, you may make it employ | adopt another structure as the holding mechanism 21a, such as providing the winding core which hold | maintains the bobbin 2 from an inner side.

  The drive device 22 includes, for example, a motor 22a and a known transmission mechanism 22b, and is configured to rotationally drive the four spindles 21, respectively. In the present embodiment, the drive device 22 is configured to distribute the rotational power of one motor 22a to the four spindles 21 by the transmission mechanism 22b. However, a dedicated motor 22a is provided for each spindle 21. Also good.

  The tailstock 23 is configured to be movable in the axial direction so as to be close to and away from the spindle 21, and a winding jig 23 a is provided at the tip, and the winding jig 23 a is held by the spindle 21. The bobbin 2 is positioned by being brought into contact with the bobbin 2 (details will be described later). The tail stock 23 is rotatably supported by a tail stock rotating device 24, and rotates with the spindle 21 during winding. As the moving mechanism 23b for moving the tailstock 23 in the axial direction, a known structure such as a linear actuator can be employed.

  The tail stock rotating device 24 is rotatably supported by the base 10 and has a rotating member 24a on which the tail stock 23 is disposed, a driving device 24b including a motor that rotates the rotating member 24a, and the like. It has. The rotating member 24a is disposed so as to rotate about a direction substantially parallel to the arrangement direction of the spindles 21. The rotating member 24a is provided with four tail stocks 23 corresponding to the four spindles 21 on two opposite sides, and the tail stock 23 on one side faces the spindle 21. In this case, the tail stock 23 on the other side faces the conveying device 40. Further, as will be described in detail later, the semi-finished product coil 4 ′ after winding is held by the tailstock 23.

  That is, the tail stock rotating device 24 rotates the rotating member 24a by about 180 ° after the winding of the tail stock 23 on one surface is completed, thereby transferring the tail stock 23 together with the semi-finished coil 4 ′. The semi-finished product coil 4 ′ is transferred to the transfer device 40 so as to face the device 40. Further, at this time, the tail stock 23 on the other surface faces the spindle 21, so that the next winding can be started without waiting for the completion of the delivery of the semi-finished coil 4 '. . In the present embodiment, the tact time is shortened by providing two sets of tailstocks 23 in this way.

  The wire rod guide device 25 includes four cylindrical nozzles 25a through which the wire rod 3 is inserted and a nozzle moving mechanism 25b that moves the four nozzles 25a. The wire rod 3 is moved to an appropriate position by moving the nozzle 25a. It is comprised so that it may guide. The wire rod supply device 26 includes an accommodating portion 26a that accommodates the wire rod 3 and a tension adjusting mechanism 26b that adjusts the tension of the wire rod 3. The wire rod feeder 3 is adjusted to an appropriate tension and then supplied to the wire rod guide device 25. It is configured as follows. The hot air device 27 includes a hot air generating device 27a that generates hot air, and four outlets 27b that blow the generated hot air toward the wire 3 in the winding. In addition, since the thing of a known structure can be employ | adopted for the wire guide apparatus 25, the wire supply apparatus 26, and the hot air apparatus 27, detailed description is abbreviate | omitted.

  The bobbin supply device 30 aligns and supplies the bobbin 2, the take-out device 32 that takes out the bobbin 2 from the part feeder 31, receives the bobbin 2 from the take-out device 32, conveys it to the winding device 20, and supplies it to the spindle 21. And a mounting device 33 to be mounted.

  The parts feeder 31 arranges the randomly placed bobbins 2 in one row and supplies them to the take-out device 32, and can employ various existing structures. The take-out device 32 grips and takes out the bobbins 2 that are aligned and supplied one by one, and delivers them to the mounting device 33, and can be configured by combining various existing actuators. In the present embodiment, the take-out device 32 is configured so as to deliver the bobbin 2 to the mounting device 33 in a state where the axial direction of the bobbin 2 is substantially horizontal in accordance with the arrangement of the spindle 21.

  The mounting device 33 includes a moving member 33a that moves between the take-out device 32 and the winding device 20, a moving member moving mechanism 33b that moves the moving member 33a, and a bobbin holding member that is disposed on the moving member 33a and holds the bobbin 2. A member 33c and a holding member moving mechanism 33d for moving the bobbin holding member 33c relative to the moving member 33a are provided.

  The moving member 33a is linearly reciprocated in a direction substantially parallel to the arrangement direction of the spindles 21 by the moving member moving mechanism 33b. The moving member moving mechanism 33b includes a motor, a ball screw transmission mechanism, a linear guide, and the like, and is configured to reciprocate the moving member 33a between a position facing the take-out device 32 and a position facing the spindle 21. . In addition, as a moving member moving mechanism 33b, the thing of other known structures, such as a linear motor, can be employ | adopted, for example.

  The bobbin holding member 33 c is configured to hold the bobbin 2 in a state where the axial direction of the bobbin 2 is substantially horizontal, and is disposed at four locations corresponding to the four spindles 21. That is, the mounting device 33 can transport the four bobbins 2 together and mount them on the four spindles 21 at a time. As a method for holding the bobbin 2 by the bobbin holding member 33c, a known method such as pinching, fitting, or suction can be employed.

  The holding member moving mechanism 33d is disposed on the moving member 33a, raises and lowers the four bobbin holding members 33c between a position facing the take-out device 32 and a position facing the spindle 21, and the four bobbin holding members 33c. Is moved in the axial direction of the bobbin 2 so as to be moved closer to and away from the spindle 21. The holding member moving mechanism 33d can be configured by combining various existing actuators.

  The mounting device 33 receives the bobbins 2 from the take-out device 32 one by one by moving the move member 33a by the move member moving mechanism 33b and causing the four bobbin holding members 33c to face the take-out device 32 in order. Next, the moving member moving mechanism 33b moves the moving member 33a to the winding device 20, and the holding member moving mechanism 33d brings the bobbin holding member 33c close to the spindle 21 to mount the four bobbins 2 on the spindle 21. . After the bobbin 2 is mounted on the spindle 21, the bobbin holding member 33 c is retracted from the spindle 21, the moving member 33 a is moved to the take-out device 32, and the next bobbin 2 is received.

  The conveying device 40 includes a moving member 41 that moves between the winding device 20 and the carry-out device 90, a moving mechanism 42 that moves the moving member 41, and a rotating member 43 that is rotatably disposed on the moving member 41. , A drive device 44 that rotationally drives the rotating member 43, a coil holding member 45 that is disposed on the rotating member 43 and holds the semifinished product coil 4 ′, and a semifinished product coil 4 ′ that is disposed on the rotating member 43. And a lead part holding member 46 for holding the lead parts 4b and 4c.

  The moving member 41 is arranged to reciprocate linearly in a direction substantially parallel to the arrangement direction of the spindles 21. The moving mechanism 42 includes a motor, a ball screw transmission mechanism, a linear guide, and the like, and is configured to reciprocate the moving member 41 between the winding device 20 and the carry-out device 90. As the moving mechanism 42, other known structures such as a linear motor can be employed.

  In the present embodiment, the film removal device 50, the binding device 60, the soldering device 70, and the inspection device 80 are arranged along the movement locus of the moving member 41 between the winding device 20 and the carry-out device 90. Thereby, in this embodiment, it is made to perform the film removal process after winding, a binding process, and the soldering process in the state which hold | maintained the semi-finished coil 4 'with the coil holding member 45 of the conveying apparatus 40. . Further, the coil 4 completed through the soldering process is subjected to an inspection process while being held by the coil holding member 45, and then taken out from the coil holding member 45 by the carry-out device 90. By doing in this way, since it becomes possible to omit the delivery time to each process, tact time can be shortened.

  Specifically, the moving member 41 reciprocates between the receiving position 20a that receives the semi-finished coil 4 ′ from the winding device 20 and the unloading position 90a that unloads the coil 4 completed by the unloading device 90. Yes. Between the receiving position 20a and the unloading position 90a, the coating removal position 50a for performing the coating removal process, the binding position 60a for performing the binding process, the soldering position 70a for performing the soldering process, and the inspection for performing the inspection process. A position 80a is set, and the moving member 41 is temporarily stopped at each of the positions 50a to 80a to perform each process.

  The rotating member 43 is rotatably disposed on the moving member 41 via the frame 43a, and rotates around a direction substantially parallel to the moving direction of the moving member 41. The drive device 44 is configured to rotate the rotation member 43 by a motor fixed to the frame 43a.

  The coil holding members 45 are arranged at four locations corresponding to the four tailstocks 23 on one side of the rotating member 43. That is, the conveying device 40 is configured to convey the four semi-finished coils 4 ′ at a time. Further, the coil holding member 45 holds the semi-finished coil 4 ′ or the coil 4 in a state where the axial direction of the semi-finished coil 4 ′ or the coil 4 is substantially orthogonal to the moving direction of the moving member 41 (that is, the conveying direction). It is configured as follows. Furthermore, although mentioned later for details, the coil holding member 45 hold | maintains the semi-finished product coil 4 'or the coil 4 in the state in which the protrusion 2c for terminals was orient | assigned to the outer side.

  In this embodiment, by doing in this way, access to the lead portions 4b and 4c of the semi-finished coil 4 ′ held by the coil holding member 45 or the terminal 4d of the coil 4 is facilitated, and each after winding The process can be performed quickly. Furthermore, since the semi-finished coil 4 ′ or the coil 4 can be directed in a direction suitable for each step after winding by rotating the turning member 43, each step after winding is efficiently performed. In addition, it is possible to efficiently deliver the semi-finished coil 4 ′ or the coil 4.

  Specifically, when the semi-finished product coil 4 ′ is received from the winding device 20, the conveyance device 40 directs the coil holding member 45 to the side in the conveyance direction in the binding step, the soldering step, and the inspection step. State. Further, the conveying device 40 sets the coil holding member 45 downward in the coating removal process, and turns the coil holding member 45 upward when the coil 4 is unloaded. In other words, the conveying device 40 sets the coil holding member 45 to the side in the conveying direction at the receiving position 20a, sets the coil holding member 45 to the lower side at the coating removal position 50a, and binds the position 60a. At the soldering position 70a and the inspection position 80a, the coil holding member 45 is set to the side in the transport direction, and at the unloading position 90a, the coil holding member 45 is set to the upward direction.

  As a method of holding the semi-finished coil 4 ′ or the coil 4 by the coil holding member 45, a known method such as clamping, fitting, or adsorption can be employed. Further, the semi-finished coil 4 ′ or the coil 4 may be clamped from the outside, or a rod-shaped member or the like may be inserted and held inside the bobbin 2.

  The lead portion holding member 46 determines the positions of the lead portions 4b and 4c by holding the lead portions 4b and 4c extending from the semi-finished coil 4 '. In the present embodiment, the lead portions 4b and 4c are positioned by the lead portion holding member 46, whereby the film removal step and the binding step can be efficiently performed. Details of the lead portion holding member 46 will be described later.

  The film removing apparatus 50 includes a solder bath 52 that accommodates the molten solder 51, a heat retaining device 53 that keeps the molten solder 51 in the solder bath 52 in a molten state, and an elevating device 54 that moves the solder bath 52 up and down. . That is, in the present embodiment, the lead portions 4b and 4c extending from the semi-finished coil 4 ′ are immersed in the solder bath 52 before being entangled with the terminal protrusion 2c, whereby the lead is heated by the heat of the molten solder 51. The coatings of the parts 4b and 4c are broken and removed. By doing in this way, since the solder required in a subsequent soldering process can be previously attached to the lead portions 4b and 4c in the film removal process, the soldering process is performed quickly and efficiently. It becomes possible.

  Specifically, the film removing apparatus 50 immerses the lead portions 4 b and 4 c of the semi-finished product coil 4 ′ in the solder tank 52 by raising the solder tank 52 by the lifting device 54. Since the solder tank 52, the heat retaining device 53, and the elevating device 54 can employ a known structure, detailed description thereof is omitted. The lead portions 4 b and 4 c may be immersed in the solder bath 52 by the operation of the coil holding member 45.

  The binding device 60 includes a clamping mechanism 61 that clamps the lead portions 4b and 4c, a positioning member 62 that contacts the lead portions 4b and 4c and positions the lead portions 4b and 4, and an extra lead portion 4b and 4c. A cutting mechanism 63, a clamping mechanism 61, a positioning member 62, a moving mechanism 64 that moves the cutting member 63, and a rotating mechanism 65 that rotates the clamping mechanism 61 and the positioning member 62. The binding device 60 causes the lead portions 4b and 4c to be wound around the outer periphery of the terminal protrusion 2c by rotating the holding mechanism 61 holding the lead portions 4b and 4c around the axis of the terminal protrusion 2c by the rotation mechanism 65. Wrap (wrap). Details of the binding device 60 will be described later.

  The soldering device 70 includes a soldering iron 71 that heats the lead portions 4b and 4c entangled with the terminal protrusion 2c, a soldering tray 72 that receives excess solder droplets, and a soldering iron 71 and a soldering tray 72. And a moving mechanism 73 for moving the. The lead portions 4b and 4c are fixed to the terminal protrusion 2c by the soldering device 70, and the terminal 4d is formed, whereby the coil 4 is completed. Details of the soldering apparatus 70 will be described later.

  In the present embodiment, as described above, since the terminal projection 2c of the semi-finished coil 4 ′ is directed outward while being held by the coil holding member 45 of the transfer device 40, the transfer direction It is possible to perform the tying process and the soldering process quickly and efficiently by accessing from the side. In the present embodiment, the tying device 60 is configured to perform the tying process substantially simultaneously on the four coils held by the coil holding member 45 of the transport device 40. However, the tying device 60 is performed one by one. May be. Similarly, in the present embodiment, the soldering apparatus 70 is configured to perform the soldering process on the four coils substantially simultaneously, but may be performed one by one.

  The inspection device 80 performs a continuity inspection of the coil 4 and a DCR (direct current resistance) measurement inspection by bringing a probe or the like into contact with the terminal 4 d of the completed coil 4. Since the inspection apparatus 80 can employ a known structure, detailed description thereof is omitted. In the present embodiment, as described above, since the terminal 4d of the coil 4 held by the coil holding member 45 of the transfer device 40 is directed outward, the probe or the like is connected from the side in the transfer direction. It is possible to contact 4d. That is, various inspections can be performed quickly and efficiently while the coil 4 is held by the coil holding member 45.

  In the present embodiment, the inspection device 80 is configured to inspect the four coils 4 held by the coil holding member 45 of the transfer device 40 substantially simultaneously, but the inspection may be performed one by one. Good. The inspection items by the inspection device 80 are not particularly limited, and other inspections such as an appearance inspection by an imaging device or the like may be performed.

  The carry-out device 90 is composed of a robot arm having a known structure. The carry-out device 90 takes out the coil 4 that has been inspected from the coil holding member 45 of the transport device 40, places the coil 4 that has passed the inspection on the pallet 91, and rejects the coil 4 that has failed the inspection. The product box 92 is loaded. In the present embodiment, the coils 4 are taken out one by one, but two or four coils 4 may be taken out together. Moreover, the structure of the carrying-out apparatus 90 is not specifically limited, The thing of another known structure may be sufficient.

  The control device 100 includes a CPU, a ROM, a RAM, and the like, and includes a display panel, an operation panel, and the like, and is disposed on the base 10. The control device 100 controls operations of the above-described various devices included in the manufacturing apparatus 1. Needless to say, the control device 100 may be arranged outside the base 10.

  Next, the manufacturing procedure of the coil 4 by the manufacturing apparatus 1 will be described together with the detailed configuration of each part of the manufacturing apparatus 1.

  In manufacturing the coil 4, a winding process is first performed by the winding device 20. FIGS. 3A to 3E and FIGS. 4A to 4F are schematic views showing the procedure of the winding process. 3A, 3B, and 3D are views of the periphery of the spindle 21 as viewed from the side. FIG. 3C illustrates the periphery of the tail stock 23 in FIG. FIG. 3E is a view of the periphery of the tail stock 23 in FIG. 3D viewed from the spindle 21 side in the axial direction. 4 (a), (c) and (e) are views of the periphery of the spindle 21 and the tail stock 23 from the side, and FIG. 4 (b) shows the tail stock 23 in FIG. 4 (a). FIG. 4D is a diagram of the periphery viewed from the spindle 21 side in the axial direction, and FIG. 4D is a diagram of the periphery of the tail stock 23 in FIG. FIG. 4E is a view of the periphery of the tail stock 23 in FIG. 4E viewed from the spindle 21 side in the axial direction.

  In the winding process, first, the bobbin 2 is mounted on the spindle 21 by the bobbin supply device 30. After the bobbin supply device 30 holds the bobbin 2 from the parts feeder 31 to the bobbin holding member 33c of the mounting device 33 by the take-out device 32, the bobbin holding member 33c is attached to the spindle 21 as shown in FIG. The bobbin 2 is held between the pair of clamping members 21 a 1 of the spindle 21. At this time, the tail stock 23 is at a position separated from the spindle 21 as shown in FIG. Further, the nozzle 25a of the wire rod guide device 25 is in the standby position, and the starting end portion 3a of the wire rod 3 is in a state of being entangled with the temporary holding member 25c.

  After the bobbin 2 is mounted on the spindle 21, the tail stock 23 is brought close to the spindle 21 and the winding jig 23a is pressed against the bobbin 2 as shown in FIG. Thereby, the bobbin 2 is positioned between the spindle 21 and the winding jig 23a. As shown in FIGS. 3C and 3E, the winding jig 23a is provided with groove portions 23a1 at two locations corresponding to the two terminal projections 2c and the notch portion 2d of the bobbin 2, and the bobbin The two terminal protrusions 2c are accommodated in the groove 23a1 as shown in FIGS. 3D and 3E.

  After the bobbin 2 is set, as shown in FIGS. 3D and 3E, the nozzle 25a is moved by the nozzle moving mechanism 25b and is entangled with the start end holding member 23b protruding from the tail stock 23. The Next, as shown in FIG. 4A, the nozzle 25a is moved to pass the starting end 3a of the wire 3 into the groove 23a1 of the winding jig 23a and the notch 2d of the bobbin 2, and then the nozzle 25a is arranged at the winding start position.

  At substantially the same time, as shown in FIG. 4B, the first end member 3a is cut between the temporary holding member 25c and the start end holding member 23b by the first cutting member 28. Further, the outlet 27b of the hot air device 27 is brought close to the bobbin 2 so that the wire 3 in the winding can be heated. Thereby, the preparation of the winding is completed.

  The first cutting member 28 may cut the wire 3 by shearing, or may cut the wire 3 by pushing. After the wire 3 is cut, the cut portion of the start end 3a remaining on the temporary holding member 25c is dropped from the temporary holding member 25c by an extruding member (not shown).

  Next, the wire rod 3 is wound around the outer periphery of the body portion 2 a of the bobbin 2 by reciprocating the nozzle 25 a in the axial direction of the spindle 21 by the nozzle moving mechanism 25 b while rotating the spindle 21 and the tail stock 23 by the driving device 22. turn. During winding, the wire 3 is heated by the hot air device 27 and the adjacent wires 3 are bonded to each other.

  After the winding is performed a predetermined number of times and the coil portion 4a is formed, the rotation of the spindle 21 and the tail stock 23 is stopped. Then, as shown in FIGS. 4C and 4D, the outlet 27b is retracted, the nozzle 25a is moved, and the end portion 3b of the wire 3 is separated from the start end portion 3a by a notch 2d and a groove portion. After passing through 23 a 1, the tail end 23 is entangled with a terminal holding member 23 c protruding from the tail stock 23.

  As a result, the starting end portion 3a and the terminal end portion 3b of the wire 3 are held in a state of extending in the substantially same direction along the axial direction from the semi-finished coil 4 ', as shown in FIG. 4 (e). It becomes. After the end portion 3b of the wire 3 is entangled with the end portion holding member 23C, the nozzle 25a is moved to entangle the end portion 3b with the temporary holding member 25c as shown in FIG. And while arrange | positioning the nozzle 25a in a standby position, the terminal part 3b is cut | disconnected by the 1st cutting member 28 between the terminal part holding member 23c and the temporary holding member 25c. Thereby, semi-finished product coil 4 'is cut away from wire rod 3, and a winding process is completed. Further, a new starting end 3a is generated between the nozzle 25a and the temporary holding member 25c at the standby position.

  After completing the winding process, the semi-finished coil 4 ′ is transferred to the transport device 40. FIGS. 5A to 5F are schematic views showing a procedure for delivering the semi-finished product coil 4 ′. 5A is a view of the periphery of the spindle 21 and the tail stock 23 from the side, and FIGS. 5B, 5C, and 5D are views of the tail stock 23 after being rotated by 180 °. FIG. 5E is a view of the periphery of the coil holding member 45 as viewed from the side, and FIG. 5E is a view of the periphery of the semi-finished coil 4 ′ in FIG. 5C as viewed from the tail stock 23 side. f) is a perspective view showing a state in which the lead portions 4b and 4c are held by the lead portion holding member 46. FIG.

  In the delivery of the semi-finished product coil 4 ′, as shown in FIG. 5A, the holding member 21a1 is opened by the expansion / contraction mechanism 21b, the holding of the bobbin 2 by the holding mechanism 21a is released, and then the tail stock 23 is removed from the spindle. Separate. At this time, the semi-finished coil 4 ′ moves together with the tail stock 23. That is, in this embodiment, the start end portion 3a and the end portion 3b are held by the start end holding member 23b and the end portion holding member 23c provided in the tail stock 23, so that the semi-finished coil 4 after the winding is completed. 'Is held by the tailstock 23.

  After the tail stock 23 is separated from the spindle 21, the tail stock 23 is rotated by about 180 ° by the tail stock rotating device 24, and the semi-finished coil 4 ′ is held as shown in FIG. 5B. The tail stock 23 is opposed to the coil holding member 45 of the transport device 40. Then, the tail stock 23 is brought close to the coil holding member 45, and the semi-finished coil 4 ′ is held by the coil holding member 45 as shown in FIG.

  After the semifinished product coil 4 ′ is held by the coil holding member 45, the lead end holding member 46 holds the start end portion 3 a and the end end portion 3 b as shown in FIGS. Here, among the lead portion holding members 46, first, the first end portion 3a and the end portion 3b are held in the left-right direction by the two first lead portion holding members 46a.

  As shown in FIG. 5D, the first lead portion holding member 46a is a rectangular plate-like member having a first slit 46a1 continuous in the vertical direction from the tip. The first lead portion holding member 46a is moved along the direction of the first slit 46a1 by an appropriate actuator, thereby inserting the start end portion 3a and the end portion 3b into the first slit 46a1 from the inlet 46a2. Thus, the start end portion 3a and the end end portion 3b are held (supported) in the left-right direction (horizontal direction).

  Since the start end portion 3a and the end end portion 3b are positioned by being held by the start end holding member 23b and the end end holding member 23c, the start end portion 3a and the end end portion 3b can be quickly moved only by moving the first lead portion holding member 46a. It is possible to hold the end portion 3b. Note that the width of the first slit 46a1 is gradually enlarged from the vicinity of the inlet 46a2 toward the inlet 46a2, and the first lead portion is formed even when the starting end portion 3a and the terminal end portion 3b are wrinkled. The start end portion 3a and the end end portion 3b can be easily inserted into the first slit 46a1 only by the movement of the holding member 46a.

  Further, since the start end portion 3a and the end end portion 3b are passed through the groove portion 23a1 of the winding jig 23a, the first lead portion holding member 46a enters the groove portion 23a1 to be wound. It is possible to hold the start portion 3a and the end portion 3b without interfering with the jig 23a.

  After the starting end 3a and the terminal end 3b are held by the first lead holding member 46a, the starting end 3a and the terminal end 3b are cut by the second cutting device 29 as shown in FIG. 5C. . As a result, the semi-finished product coil 4 ′ is separated from the tail stock 23, and leads 4b and 4c having a predetermined length are formed. In addition, the 2nd cutting member 29 may cut | disconnect the wire 3 by shearing, and may cut | disconnect the wire 3 by push cutting.

  After cutting the start end portion 3a and the end end portion 3b, the tailstock 23 is separated from the coil holding member 45 as shown in FIG. Thereby, delivery of the semi-finished product coil 4 ′ from the winding device 20 to the transport device 40 is completed. At this time, the terminal protrusions 2c of the semi-finished coil 4 ′ are directed outward in a state directed to the side in the conveying direction by the conveying device 40, more specifically in a direction orthogonal to the moving direction of the moving member 41. It becomes the state.

  Further, as shown in FIGS. 5E and 5F, the lead portions 4b and 4c extend from the semi-finished coil 4 ′ in a free state in substantially the same direction as the terminal protrusion 2c. However, by being held by the first lead portion holding member 46a, the position in the left-right direction is determined at least in the vicinity of the first lead portion holding member 46a. Note that the cut portions of the start end portion 3a and the end portion 3b remaining on the start end holding member 23b and the end portion holding member 23c are dropped from the start end holding member 23b and the end portion holding member 23c by a pushing member (not shown).

  The transfer device 40 that has received the semi-finished coil 4 'moves the moving member 41 from the receiving position 20a to the film removing position 50a. At the film removal position 50a, a film removal process is performed. FIGS. 6A to 6C are schematic views showing the procedure of the coating removal process, and are views of the coil holding member 45 and the periphery as viewed from the side.

  In the middle of moving the moving member 41 toward the film removal position 50a, the conveying device 40 rotates the rotating member 43 by the driving device 44, and as shown in FIG. Is in a state of facing downward. Then, the moving member 41 is stopped at the coating removal position 50 a and the semi-finished coil 4 ′ is opposed to the solder bath 52.

  After the moving member 41 is stopped, the film removing device 50 lifts the solder bath 52 by the elevating device 54 as shown in FIG. 5A, and the lead portions 4b and 4c are moved as shown in FIG. Is immersed in the molten solder 51 in the solder bath 52. Then, after the time necessary for removing the coating on the wire 3, the coating removal device 50 lowers the solder bath 52 and allows the lead portions 4 b and 4 c to escape from the molten solder 51. Thereby, the coating removal process is completed, the coating of the lead portions 4b and 4c is removed, and the solder is attached to the lead portions 4b and 4c.

  In the present embodiment, since the lead portions 4b and 4c are extended from the semi-finished coil 4 'so as to be immersed in the solder bath 52, the scraps and the like of the film removed by being broken are removed from the leads 4b, It is difficult to remain in 4c, and it is possible to effectively prevent the occurrence of defects due to such debris. Moreover, since the molten solder 51 can be coated almost uniformly on the outer peripheral surfaces of the lead portions 4b and 4c simultaneously with the removal of the coating by immersing in the molten solder 51, the subsequent soldering process can be performed quickly and with high quality. It is possible to do it.

  After completing the film removal step, the transport device 40 moves the moving member 41 from the film removal position 50a to the binding position 60a. At the binding position 60a, a binding process is performed. FIGS. 7A to 7E are schematic diagrams showing the procedure of the binding process, and FIGS. 7F and 7G are schematic diagrams showing the clamping mechanism 61 of the binding apparatus 60. FIG. . 7A, 7C, and 7E are views of the periphery of the coil holding member 45 seen from the side, and FIG. 7B is a view of the lead portions 4b and 4c in FIG. 7A. FIG. 7 (d) is an enlarged view of a part of FIG. 7 (c).

  In the middle of moving the moving member 41 toward the position 60a, the transport device 40 rotates the rotating member 43 by the driving device 44, and the semi-finished coil 4 ′ is directed again to the side in the transport direction. And Then, the moving member 41 is stopped at the binding position 60a, and the semi-finished product coil 4 ′ is made to face the binding device 60 as shown in FIG. Thereafter, the transport device 40 holds the lead portions 4 b and 4 c in the vertical direction by the two second lead portion holding members 46 b of the lead portion holding members 46.

  As shown in FIG. 7B, the second lead portion holding member 46b is a rectangular plate-like member having a second slit 46b1 continuous in the left-right direction (substantially horizontal direction) from the tip. The second lead portion holding member 46b is moved along the direction of the second slit 46b1 by an appropriate actuator, thereby inserting the lead portions 4b and 4c into the second slit 46b1 from the inlet 46b2. The lead portions 4b and 4c are held (supported) in the vertical direction.

  The lead portions 4b and 4c are previously positioned in the left-right direction by the first lead portion holding member 46a, and the width of the second slit 46b1 is gradually enlarged from the vicinity of the inlet 46b2 toward the inlet 46b2. Therefore, even when the lead portions 4b and 4c are subject to deformation or droop due to their own weight, the lead portions 4b and 4c can be easily moved into the second slit 46b1 only by moving the second lead portion holding member 46b. Can be inserted.

  Thus, by holding the lead portions 4b and 4c by the first lead portion holding member 46a and the second lead portion holding member 46b, at least the first lead portion holding member 46a and the second lead portion holding member. In the vicinity of 46b, the lead portions 4b and 4c are positioned in two directions perpendicular to each other in the vertical direction and the horizontal direction. In the present embodiment, the lead portions 4b and 4c are held (supported) from two directions orthogonal to each other in this way, whereby the lead portions 4b and 4c are positioned with high accuracy, and the lead portions 4b and 4c by the clamping mechanism 61 are positioned. The clamping can be performed quickly and easily.

  After the lead portions 4b and 4c are positioned by the first lead portion holding member 46a and the second lead portion holding member 46b, the binding device 60 is moved by the moving mechanism 64 as shown in FIG. The clamping mechanism 61 and the positioning member 62 are brought close to the semi-finished product coil 4 ′, and in the vicinity of the first lead portion holding member 46a and the second lead portion holding member 46b, between the pair of clamping members 61a provided in the clamping mechanism 61. The lead portions 4b and 4c are sandwiched.

  As shown in FIG. 7 (f), the pair of clamping members 61a of the clamping mechanism 61 is rotated about the support shaft 61b and attached to the direction in which one end side (left side in the figure) is separated from each other by the spring 61c. By being biased, the other end side (the right side in the figure) is configured to be close to each other and abut against the stopper 61d. And the clamping part 61a1 which is a mutually opposing surface is provided in the front-end | tip part of the other end side of the clamping member 61a, and the lead parts 4b and 4c are clamped between this clamping surface 61a1. Yes.

  When the lead portions 4b and 4c are clamped, first, as shown in FIG. 7G, one end side of the clamping member 61a is pressed against the urging force of the spring 61c by an appropriate actuator, and the two clamping surfaces 61a1 are pressed. Increase the interval. Then, after the clamping mechanism 61 is moved and the lead portions 4b and 4c are arranged between the two clamping surfaces 16a1, the pressing by the actuator is released, and the lead portion 4b is interposed between the two clamping surfaces 16a1 by the biasing force of the spring 61c. 4c is sandwiched.

  In the present embodiment, by providing the stopper 61d, a predetermined gap is generated between the two sandwiching surfaces 61a1 even after the pressing by the actuator is released. And by adjusting the size of the gap between the two holding surfaces 61a1 according to the wire diameter of the wire 3, the frictional force between the lead portions 4b and 4c and the holding surface 61a1 is adjusted, and the lead portions 4b and 4c are It can be held in a slidable state while adding an appropriate frictional resistance.

  As described above, in the vicinity of the first lead portion holding member 46a and the second lead portion holding member 46b, the lead portions 4b and 4c are positioned with high accuracy, so that the interval between the two holding surfaces 61a1 is widened. In this state, the holding mechanism 61 is moved to a predetermined position, and then the two holding surfaces 61a are closed, so that the lead portions 4b and 4c can be securely held.

  As shown in FIGS. 7 (a), (c) and (d), the positioning member 62 is a rod-shaped member having a tip portion formed in a taper shape. A recess 62b for accommodating the protrusion 2c is provided. The clamping member 61 is attached to the outer periphery of the positioning member 62, and the clamping mechanism 61 is also rotated around the axis of the positioning member 62 by rotating the positioning member 62 around the axis of the positioning member 62 by the rotation mechanism 65. It is designed to rotate.

  After the lead portions 4b and 4c are clamped by the clamping mechanism 61, the positioning member 62 is brought close to the terminal projection 2c, and the terminal projection 2c is placed in the recess 62b as shown in FIGS. 7 (c) and (d). To house. As a result, the axis of the positioning member 62 and the axis of the terminal projection 2c are substantially aligned. Next, the holding mechanism 61 and the positioning member 62 are rotated around the axis of the positioning member 62 by the rotation mechanism 65. Thereby, the clamping mechanism 61 rotates around the axis of the terminal protrusion 2c, and the lead portions 4b and 4c are wound around the outer periphery of the terminal protrusion 2c, that is, entangled.

  At this time, as shown in FIG. 6D, the outer peripheral portion of the tip end surface 62a of the positioning member 62 mainly contacts the lead portion 4b between the clamping member 61 and the semi-finished coil 4 ′, thereby The winding position of the lead portions 4b and 4c with respect to the protrusion 2c is determined. Further, since the lead portions 4b and 4c are supplied toward the terminal protrusion 2c while sliding between the two clamping surfaces 61a1, an appropriate tension is applied to the lead portions 4b and 4c wound around the terminal protrusion 2c. Is to be granted.

  Therefore, in the present embodiment, the lead portions 4b and 4c can be aligned and wound in a spiral shape by separating the clamping mechanism 61 and the positioning member 62 from the semi-finished coil 4 ′ while rotating. That is, the terminal 4d can be formed with high quality.

  After the lead portions 4b and 4c are wound around the terminal protrusion 2c a predetermined number of times, the holding of the lead portions 4b and 4c by the holding mechanism 61 is released, and the holding mechanism 61 and the positioning member 62 are removed from the semi-finished coil 4 ′. Evacuate. Next, as shown in FIG. 7E, the cutting member 63 is brought close to the semi-finished coil 4 ′, and the remaining lead portions 4b and 4c are cut. As a result, the binding step is completed, and the lead portions 4b and 4c, in which the terminal protrusions 2c are coated with solder, are in a state of being wound around the aligned windings.

  Instead of rotating both the clamping mechanism 61 and the positioning member 62, only the clamping mechanism 61 or the clamping member 61a may be rotated. The shape of the positioning member 62 is not particularly limited, and an appropriate shape according to the shape of the terminal protrusion 2c can be adopted. Moreover, you may make it provide the guide groove for guiding the lead parts 4b and 4c in the positioning member 62. FIG.

  After completing the binding process, the transport apparatus 40 moves the moving member 41 from the binding position 60a to the soldering position 70a. At the soldering position 70a, a soldering process is performed. FIGS. 8A to 8C are schematic views illustrating the procedure of the soldering process, and are views of the coil holding member 45 and the periphery as viewed from the side.

  The conveying device 40 stops the moving member 41 at the soldering position 70a, and makes the semi-finished product coil 4 'face the soldering device 70 as shown in FIG. The soldering apparatus 70 moves the soldering iron 71 and the solder pan 72 close to the semi-finished coil 4 ′ by the moving mechanism 73, and the soldering iron 71 is entangled with the terminal projection 2c as shown in FIG. 8B. The bent lead portions 4b and 4c are brought into contact with each other. Further, the solder tray 72 is disposed below the terminal projection 2c.

  By bringing the soldering iron 71 into contact, the solder adhered to the lead portions 4 b and 4 c is melted, and the excess solder falls onto the solder tray 72. Note that the amount of solder may be increased by attaching an appropriate amount of solder to the soldering iron 71 in advance and then bringing the soldering iron 71 into contact with the lead portions 4b and 4c.

  After a predetermined time has elapsed since the soldering iron 71 was brought into contact with the lead portions 4b and 4c, the soldering device 70, as shown in FIG. Is retracted from the semi-finished coil 4 '. As a result, the melted solder is solidified again, so that the lead portions 4b and 4c are fixed to the terminal protrusion 2c. Thereby, the terminal 4d is formed and the soldering process is completed. The coil 4 is completed by completing the soldering process.

  In this embodiment, since the solder is previously attached to the lead portions 4b and 4c in the coating removal process, it is possible to perform the soldering quickly and easily just by contacting the soldering iron 71 in the soldering process. It has become. Further, in the present embodiment, since the solder is attached to the lead portions 4b and 4c in advance, various heating methods can be employed. For example, infrared rays, hot air, laser, etc., other than the soldering iron 71 The lead portions 4b and 4c may be heated by this method.

  After completing the soldering process, the conveying device 40 moves the moving member 41 from the soldering position 70a to the inspection position 80a and stops the completed coil 4 in a state of facing the inspection device 80. Then, the inspection device 80 inspects the coil 4. After completing the inspection process, the transport device 41 moves the moving member 41 from the inspection position 80a to the carry-out position 90a while rotating the rotating member 43 by the driving device 44, and the coil 4 faces upward. Stop. The carry-out device 90 takes out the coil 4 from the coil holding member 45 and places it on the pallet 91 or puts it in the rejected product box 92. The manufacture of the coil 4 is completed by the above procedure.

  As described above, the coil manufacturing apparatus 1 according to the present embodiment winds the wire 3 around the bobbin 2 to generate the semi-finished coil 4 ′ in which the lead portions 4b and 4c extend. And a film removing device 50 for removing the film of the lead portions 4b and 4c of the semi-finished coil 4 'and a binding device for winding the lead portions 4b and 4c from which the film has been removed to the terminal protrusion 2c provided on the bobbin 2. 60 and a soldering device 70 for fixing the lead portions 4b and 4c entangled with the terminal projection 2c with solder.

  By adopting such a configuration, it is possible to tie the lead portions 4b and 4c to the terminal projection 2c and solder them after removing the coating of the lead portions 4b and 4c in advance. Can be prevented from remaining on the terminal 4d. That is, by performing the coating removal step before the binding step, it becomes possible to remove the coating more reliably, thereby preventing problems caused by coating residue etc. and improving the quality of the coil 4 with a terminal. Can be made.

  Further, the winding device 20 cuts the start end holding member 23b that holds the start end 3a of the wire 3, the end holding member 23c that holds the end 3b of the wire 3, and the start end 3a and the end 3b. And a cutting device (second cutting device 29) for forming the lead portions 4b and 4c. The starting end holding member 23b and the terminating end holding member 23c have the starting end 3a and the terminating end 3b of the semi-finished coil 4 ′. Are arranged so as to extend in substantially the same direction. By doing in this way, since the lead parts 4b and 4c will extend in the substantially the same direction, handling of the lead parts 4b and 4c is made easy, and a film removal process and a binding process are performed quickly and efficiently. It becomes possible. Thereby, productivity can be improved, improving the quality of the coil 4 with a terminal.

  The film removing device 50 includes a solder tank 52 in which the lead portions 4b and 4c are immersed, and the soldering device 70 is a heating device (solder) that melts the solder attached to the lead portions 4b and 4c in the film removing device 50. It has a iron 71). In this way, solder can be attached to the lead portions 4b and 4c in the coating removal process, so that the soldering process is simplified and the quality and productivity of the terminal-equipped coil 4 are improved. Can be made compatible. In addition, by attaching the solder to the lead portions 4b and 4c before the binding step, it becomes possible to coat the solder on the outer peripheral surface of the lead portions 4b and 4c substantially uniformly. Quality can be improved.

  In addition, the binding device 60 includes a pinching mechanism 61 that slidably holds the lead portions 4b and 4c between the pair of pinching members 61a, and a lead portion 4b that contacts the lead portions 4b and 4c and contacts the terminal protrusion 2c. 4c, and a rotation mechanism 65 that rotates the pair of clamping members 61a around the axis of the terminal projection 2c. By doing in this way, it becomes possible to perform a binding process rapidly and with high quality. Conventionally, the binding process after winding is generally performed manually when it is necessary to ensure the quality of the terminal 4d. However, the above configuration automates without reducing the quality of the binding process. Therefore, the productivity of the terminal-equipped coil 4 can be greatly improved.

  Moreover, the coil manufacturing apparatus 1 includes a transport device 40 that transports the semi-finished coil 4 ′ from the winding device 20 to the film removing device 50, the binding device 60, and the soldering device 70. Is provided with a coil holding member 45 that holds the semi-finished coil 4 ′ with the terminal protrusion 2 c oriented in a direction substantially orthogonal to the terminal. In this way, access to the terminal protrusion 2c is facilitated and each step after winding can be performed quickly and efficiently, so that the quality and productivity of the terminal-equipped coil 4 can be improved. Improvements can be achieved at the same time.

  Further, the transport device 40 includes a lead portion holding member 46 that holds the lead portions 4b and 4c. By doing so, the lead portions 4b and 4c can be positioned. Therefore, the handling of the lead portions 4b and 4c is facilitated, and both improvement in the quality of the coil 4 with terminal and improvement in productivity can be achieved. Can do.

  The lead portion holding member 46 includes a first lead portion holding member 46a having a first slit 46a1 into which the lead portions 4b and 4c are inserted, and a second slit 46b1 into which the lead portions 4b and 4c are inserted. The first lead portion holding member 46a and the second lead portion holding member 46b so that the first slit 46a1 and the second slit 46b1 are orthogonal to each other. Has been placed. By doing so, the lead portions 4b and 4c can be raised only by moving the first lead portion holding member 46a and the second lead portion holding member 46b along the first slit 46a1 and the second slit 46b1. Since it becomes possible to position accurately, handling of the lead parts 4b and 4c can be facilitated, and the improvement of the quality of the coil 4 with a terminal and the improvement of productivity can be made compatible.

  In addition, the coil manufacturing method according to the present embodiment includes a first step (winding process and winding step) in which the wire 3 is wound around the bobbin 2 to generate the semi-finished coil 4 ′ in which the lead portions 4b and 4c extend. Transfer to the transfer device 40), a second step (film removal process) for removing the coating of the lead portions 4b and 4c of the semi-finished coil 4 ', and the lead portions 4b and 4c from which the coating has been removed of the bobbin 2 A third step (entanglement process) entwined with the terminal projection 2c, and a fourth step (soldering process) for fixing the lead portions 4b, 4c entangled with the terminal projection 2c with solder, have.

  By adopting such a configuration, it is possible to more reliably remove the coating in the coating removal step prior to the binding step, so that it is possible to prevent problems caused by coating residue etc. Can improve the quality.

  The first step is substantially the same direction as the step of holding the starting end portion 3a and the terminal end portion 3b of the wire 3 in a state of extending from the semi-finished coil 4 ′ in the substantially same direction (FIG. 4 (e)). And cutting the starting end portion 3a and the terminal end portion 3b to form lead portions 4b and 4c (FIG. 5C). By doing so, the lead portions 4b and 4c extend in substantially the same direction, so that the handling of the lead portions 4b and 4c is facilitated, and the quality of the coil 4 with terminals is improved while the productivity is improved. Can be improved.

  In the second step, the lead portions 4b and 4c are immersed in the solder bath 52, and in the fourth step, the solder attached to the lead portions 4b and 4c in the second step is melted. By doing in this way, a soldering process can be simplified and the improvement of the quality of the coil 4 with a terminal and the improvement of productivity can be made compatible. In addition, since the outer peripheral surfaces of the lead portions 4b and 4c can be coated with solder substantially uniformly, the quality of soldering can be improved.

  In the present embodiment, an example in which the spindle 21 of the winding device 20 is arranged in a substantially horizontal direction is shown. However, the present invention is not limited to this, and other directions such as a substantially vertical direction, for example. The spindle 21 may be arranged on the front. Further, the binding device 60, the soldering device 70, and the inspection device 80 are not limited to those that perform each process in a state where the semi-finished coil 4 ′ or the coil 4 is directed to the side in the transport direction. You may perform each process for the semi-finished coil 4 'or the coil 4 toward other directions, such as upward and downward.

  In the present embodiment, an example in which the lead portions 4b and 4c of the semi-finished coil 4 ′ are extended in a direction substantially parallel to the axial direction of the semi-finished coil 4 ′ is shown. The invention is not limited to this, and the lead portions 4b and 4c may be extended in other directions. That is, the lead portions 4b and 4c only need to extend in a direction in which each process after winding is easy to perform. Depending on the configurations of the film removing device 50 and the binding device 60, the two lead portions 4b are somewhat different in direction. 4c may be extended. The extending direction of the lead portions 4b and 4c can be adjusted by the arrangement and shape of the start end holding member 23b and the end end portion 23c.

  Moreover, in this embodiment, although the example at the time of comprising the film removal apparatus 50 so that the lead parts 4b and 4c were immersed in the solder tank 52 was shown, this invention is not limited to this, A wire rod Depending on the wire diameter of 3 and the type of coating, the coating removal device 50 may be configured to remove the coating by other methods such as immersion in a chemical solution or mechanical peeling. In this case, the lead portions 4b and 4c may be immersed in the solder bath 52 after the coating is removed, or solder may be supplied by the soldering apparatus 70.

  Further, in the present embodiment, an example in which the moving member 33a of the bobbin mounting device 30 and the moving member 41 of the transfer device 40 are reciprocated linearly is shown, but the present invention is not limited to this. For example, the moving member 33a of the bobbin supply device 30 and the moving member 41 of the transport device 40 may be rotated by an index table or the like.

  In the present embodiment, an example in which the manufacturing apparatus 1 includes the inspection device 80 and the carry-out measure 90 has been described, but it is needless to say that the inspection device 80 or the carry-out device 90 may be omitted.

  Although the embodiments of the present invention have been described above, the coil manufacturing apparatus and the manufacturing method of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. Of course, can be added.

  The coil manufacturing apparatus and method according to the present invention can be used in the field of manufacturing various coils.

DESCRIPTION OF SYMBOLS 1 Coil manufacturing apparatus 2 Bobbin 2c Terminal protrusion 3 Wire material 3a Wire end 3b Wire end 4 Coil with terminal 4 'Semi-finished coil 4b 4c Lead 20 Winding device 23b Start end holding member 23c End end holding Member 29 Second cutting device 40 Conveying device 45 Coil holding member 46 Lead portion holding member 46a First lead portion holding member 46a1 First slit 46b Second lead portion holding member 46b1 Second slit 50 Film removing device 52 Solder tank 60 Tying device 61 Holding mechanism 61a Holding member 62 Positioning member 65 Rotating mechanism 70 Soldering device 71 Soldering iron

Claims (10)

A winding device for winding a wire around a bobbin to generate a semi-finished coil in which a lead portion is extended;
A film removing device for removing the film of the lead portion of the semi-finished coil;
A binding device for binding the lead part from which the coating has been removed to a terminal projection provided on the bobbin;
A soldering device for fixing the lead part entangled with the terminal protrusion with solder,
Coil manufacturing equipment. The winding device is
A starting end holding member for holding the starting end of the wire,
An end portion holding member for holding the end portion of the wire,
A cutting device for cutting the starting end and the terminal end to form the lead portion, and
The starting end holding member and the terminal end holding member are arranged so that the starting end portion and the terminal end portion are extended from the semi-finished product coil in substantially the same direction.
The coil manufacturing apparatus according to claim 1. The film removing apparatus includes a solder bath in which the lead portion is immersed,
The soldering device includes a heating device for melting the solder attached to the lead portion in the coating film removing device,
The coil manufacturing apparatus according to claim 1 or 2. The binding device is:
A clamping mechanism for slidably clamping the lead portion between a pair of clamping members;
A positioning member that contacts the lead portion and determines a winding position of the lead portion with respect to the terminal protrusion;
A rotation mechanism for rotating the pair of clamping members around the axis of the terminal protrusion,
The coil manufacturing apparatus according to any one of claims 1 to 3. A transport device for transporting the semi-finished coil from the winding device to the film removing device, the binding device and the soldering device;
The transport device includes a coil holding member that holds the semi-finished product coil in a state in which the terminal protrusion is directed in a direction substantially orthogonal to the transport direction.
The coil manufacturing apparatus according to any one of claims 1 to 4. The transport device includes a lead part holding member that holds the lead part,
The coil manufacturing apparatus according to claim 5. The lead portion holding member is
A first lead part holding member having a first slit into which the lead part is inserted;
A second lead part holding member having a second slit into which the lead part is inserted,
The first lead portion holding member and the second lead portion holding member are arranged such that the first slit and the second slit are orthogonal to each other,
The coil manufacturing apparatus according to claim 6. A first step of winding a wire around a bobbin to generate a semi-finished coil in which a lead portion extends;
A second step of removing the coating on the lead portion of the semi-finished coil;
A third step of binding the lead portion from which the coating has been removed to a terminal projection provided on the bobbin;
A fourth step of fixing the lead portion entangled with the terminal protrusion with solder,
Coil manufacturing method. The first step includes
Holding a starting end and a terminal end of the wire in a state of extending from the semi-finished coil in substantially the same direction;
Cutting the starting end portion and the terminal end portion in a state extending in substantially the same direction to form the lead portion,
The manufacturing method of the coil of Claim 8. In the second step, the lead portion is immersed in a solder bath,
In the fourth step, the solder attached to the lead portion in the second step is melted,
A method for manufacturing a coil according to claim 8 or 9.

Images