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TWI411383B - - Google Patents

Info

Publication number
TWI411383B
TWI411383B TW096147379A TW96147379A TWI411383B TW I411383 B TWI411383 B TW I411383B TW 096147379 A TW096147379 A TW 096147379A TW 96147379 A TW96147379 A TW 96147379A TW I411383 B TWI411383 B TW I411383B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
base panel
dissipation columns
heat
columns
Prior art date
Application number
TW096147379A
Other languages
Chinese (zh)
Other versions
TW200926945A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096147379A priority Critical patent/TW200926945A/en
Priority to JP2008000251U priority patent/JP3140605U/en
Priority to US12/018,187 priority patent/US20090151900A1/en
Priority to DE202008002041U priority patent/DE202008002041U1/en
Publication of TW200926945A publication Critical patent/TW200926945A/en
Application granted granted Critical
Publication of TWI411383B publication Critical patent/TWI411383B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall, and radiation fins mounted on the heat dissipation columns at different elevations, each radiation fin having a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns. The base panel may be provided with a fan and/or heat pipes to enhance heat dissipation efficiency.
TW096147379A 2007-12-12 2007-12-12 Cylindrical heat dissipater equipped with cooling fins TW200926945A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW096147379A TW200926945A (en) 2007-12-12 2007-12-12 Cylindrical heat dissipater equipped with cooling fins
JP2008000251U JP3140605U (en) 2007-12-12 2008-01-21 Column-shaped radiator with radiating fins
US12/018,187 US20090151900A1 (en) 2007-12-12 2008-01-22 Heat sink
DE202008002041U DE202008002041U1 (en) 2007-12-12 2008-02-14 heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096147379A TW200926945A (en) 2007-12-12 2007-12-12 Cylindrical heat dissipater equipped with cooling fins

Publications (2)

Publication Number Publication Date
TW200926945A TW200926945A (en) 2009-06-16
TWI411383B true TWI411383B (en) 2013-10-01

Family

ID=39326888

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096147379A TW200926945A (en) 2007-12-12 2007-12-12 Cylindrical heat dissipater equipped with cooling fins

Country Status (4)

Country Link
US (1) US20090151900A1 (en)
JP (1) JP3140605U (en)
DE (1) DE202008002041U1 (en)
TW (1) TW200926945A (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200919160A (en) * 2007-10-26 2009-05-01 Delta Electronics Inc Heat dissipation module and base and manufacturing method thereof
TW200942145A (en) * 2008-03-20 2009-10-01 Jun-Guang Luo Heat-dissipating device with multiple heat sources
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
CN101852564A (en) * 2009-03-30 2010-10-06 富准精密工业(深圳)有限公司 Cooling device
CN101909415A (en) * 2009-06-02 2010-12-08 鸿富锦精密工业（深圳）有限公司 Heat dissipation device and fixing frame thereof
JP2011038702A (en) * 2009-08-11 2011-02-24 崇賢 ▲黄▼ Heat exhauster increasing heat exhaust efficiency
CN201518567U (en) * 2009-08-26 2010-06-30 富准精密工业(深圳)有限公司 Radiating die set
US20110085304A1 (en) * 2009-10-14 2011-04-14 Irvine Sensors Corporation Thermal management device comprising thermally conductive heat spreader with electrically isolated through-hole vias
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
JP2014045136A (en) * 2012-08-28 2014-03-13 Mitsubishi Electric Corp Junction material between heating element and heat radiator
JPWO2014049805A1 (en) * 2012-09-28 2016-08-22 株式会社日立製作所 COOLING SYSTEM AND ELECTRIC DEVICE USING THE SAME
US9627599B2 (en) 2013-07-08 2017-04-18 Lg Electronics Inc. LED lighting apparatus and heat dissipation module
KR20150009039A (en) 2013-07-10 2015-01-26 엘지전자 주식회사 LED Lighting and Manufacturing method of the same
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
US9913411B2 (en) * 2016-04-27 2018-03-06 General Electric Company Thermal capacitance system
US10809017B2 (en) * 2016-05-10 2020-10-20 Mitsubishi Electric Corporation Heat sink with projection and recess shaped fins
US9831153B1 (en) 2016-12-09 2017-11-28 Metal Industries Research & Development Centre Heat dissipating device
JP7022426B2 (en) * 2018-04-25 2022-02-18 かがつう株式会社 How to manufacture heat sinks, electronic component packages and heat sinks
CN108925102B (en) * 2018-06-22 2024-05-10 江苏英杰铝业有限公司 High-performance aluminum plate radiator
CN108717938B (en) * 2018-07-16 2024-08-02 上海克拉索富电子有限公司 Radiating structure of fan speed regulation module
US20200236806A1 (en) * 2019-01-18 2020-07-23 United Arab Emirates University Heat sink with internal chamber for phase change material
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
CN112332588B (en) * 2020-10-26 2022-12-27 中车大连机车研究所有限公司 Motor end cover radiator
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle
JP7574734B2 (en) 2021-05-10 2024-10-29 日本軽金属株式会社 Heat sink and method for manufacturing the same
US20240237277A9 (en) * 2022-10-24 2024-07-11 Strategic Thermal Labs, Llc Stacked-fin cold plate with a 3d vapor chamber

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM259945U (en) * 2004-07-23 2005-03-21 Inventec Corp Heat sink with fluid medium
TWM319519U (en) * 2007-04-25 2007-09-21 Acpa Energy Conversion Devices Heat sink for multi-layer thermal-conducting plate of light-emitting diode
TW200743945A (en) * 2006-05-19 2007-12-01 Foxconn Tech Co Ltd Heat dissipation apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243441A (en) * 1992-03-03 1993-09-21 Ito Gijutsu Kenkiyuushitsu:Kk Heat dissipating device
US5784255A (en) * 1995-12-04 1998-07-21 Integrated Device Technology, Inc. Device and method for convective cooling of an electronic component
EP0889524A3 (en) * 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US5926370A (en) * 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
TW539393U (en) * 2000-03-15 2003-06-21 Tw 089204149
US6550529B1 (en) * 2002-04-17 2003-04-22 Sunonwealth Electric Machine Industry Co., Ltd. Heatsink device
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
TW587902U (en) * 2002-07-26 2004-05-11 Hon Hai Prec Ind Co Ltd Heat sink
JP2004125381A (en) * 2002-08-02 2004-04-22 Mitsubishi Alum Co Ltd Heat pipe unit and heat pipe cooler
TW553371U (en) * 2002-12-02 2003-09-11 Tai Sol Electronics Co Ltd Liquid/vapor phase heat dissipation apparatus
TW557350B (en) * 2003-01-06 2003-10-11 Jiun-Guang Luo One-way airstream hollow cavity energy transferring device
US7106589B2 (en) * 2003-12-23 2006-09-12 Aall Power Heatsinks, Inc. Heat sink, assembly, and method of making
US6945318B2 (en) * 2004-01-26 2005-09-20 Giga-Byte Technology Co., Ltd. Heat-dissipating device
US7227752B2 (en) * 2005-05-23 2007-06-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7694718B2 (en) * 2006-10-02 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM259945U (en) * 2004-07-23 2005-03-21 Inventec Corp Heat sink with fluid medium
TW200743945A (en) * 2006-05-19 2007-12-01 Foxconn Tech Co Ltd Heat dissipation apparatus
TWM319519U (en) * 2007-04-25 2007-09-21 Acpa Energy Conversion Devices Heat sink for multi-layer thermal-conducting plate of light-emitting diode

Also Published As

Publication number Publication date
DE202008002041U1 (en) 2008-04-24
US20090151900A1 (en) 2009-06-18
TW200926945A (en) 2009-06-16
JP3140605U (en) 2008-04-03

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