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GB0412614D0 - Heat dissipating device with fins inclinedly connected to base - Google Patents

Heat dissipating device with fins inclinedly connected to base

Info

Publication number
GB0412614D0
GB0412614D0 GB0412614A GB0412614A GB0412614D0 GB 0412614 D0 GB0412614 D0 GB 0412614D0 GB 0412614 A GB0412614 A GB 0412614A GB 0412614 A GB0412614 A GB 0412614A GB 0412614 D0 GB0412614 D0 GB 0412614D0
Authority
GB
United Kingdom
Prior art keywords
base
fins
heat dissipating
dissipating device
inclinedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0412614A
Other versions
GB2412499A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUO YUNG PIN
Original Assignee
KUO YUNG PIN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUO YUNG PIN filed Critical KUO YUNG PIN
Publication of GB0412614D0 publication Critical patent/GB0412614D0/en
Publication of GB2412499A publication Critical patent/GB2412499A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink comprises a base 20, e.g. of copper, with inclined sides on which are mounted a heat-dissipating section 10, e.g. of aluminium, with fins 11 formed by skiving. The heat sink may be used in conjunction with a fan 30. In an alternative embodiment (Fig 7A) the base may be omitted.
GB0412614A 2004-03-26 2004-06-07 Heat sink Withdrawn GB2412499A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93204650U TWM254653U (en) 2004-03-26 2004-03-26 Novel tilted heat sink structure of composite type

Publications (2)

Publication Number Publication Date
GB0412614D0 true GB0412614D0 (en) 2004-07-07
GB2412499A GB2412499A (en) 2005-09-28

Family

ID=32986295

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0412614A Withdrawn GB2412499A (en) 2004-03-26 2004-06-07 Heat sink

Country Status (3)

Country Link
DE (1) DE202004009233U1 (en)
GB (1) GB2412499A (en)
TW (1) TWM254653U (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2384108T3 (en) * 2010-04-27 2014-06-30 Giga Byte Tech Co Ltd Dust-disposal heat-dissipation device with double cooling fans
CN102236397B (en) * 2010-04-30 2015-04-01 技嘉科技股份有限公司 Dual-fan cooling device with dust removal function, its control circuit and fin assembly
TWI635385B (en) * 2012-11-09 2018-09-11 技嘉科技股份有限公司 Heat sink and method of manufacturing thereof
TWI578671B (en) * 2014-01-10 2017-04-11 技嘉科技股份有限公司 Heat sink with heat pipe and manufacturing method thereof
TWI556088B (en) * 2014-12-31 2016-11-01 Giga Byte Tech Co Ltd Radiator structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2362353A1 (en) * 1973-12-14 1975-06-26 Siemens Ag Heat sink for semiconductor component - has massive core column with component receiving surface and lateral cooling fins
JP3431004B2 (en) * 2000-01-14 2003-07-28 松下電器産業株式会社 Heat sink and cooling device using the same
JP2000353889A (en) * 1999-06-09 2000-12-19 Nec Ibaraki Ltd Cooler
JP2001148450A (en) * 1999-11-19 2001-05-29 Hiromi Kataoka Forced-air cooling heat sink and method of manufacturing the same
US6550531B1 (en) * 2000-05-16 2003-04-22 Intel Corporation Vapor chamber active heat sink
JP2003078081A (en) * 2001-09-05 2003-03-14 Nakamura Mfg Co Ltd Forming method of heatsink
TW530993U (en) * 2002-01-14 2003-05-01 Chia Cherne Industry Co Ltd Dual tilted-side heat sink base structure to reduce the fan pressure reduction
US6816373B2 (en) * 2002-10-04 2004-11-09 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device

Also Published As

Publication number Publication date
DE202004009233U1 (en) 2004-09-09
TWM254653U (en) 2005-01-01
GB2412499A (en) 2005-09-28

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)