JP2000353889A - Cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cooler in which cooling effect of an electronic part is enhanced without increasing the load on a motor fan by supplying air flow smoothly from the motor fan thereby eliminating a conventional drawback that dust is deposited in the vicinity of the fringe part or end part of a fin supporting plane. SOLUTION: The cooler comprises a heat sink 12 having a plurality of fins 12a and a plane 11 a for supporting the plurality of fins 12a integrally and disposed proximately to a CPU 15, and a motor fan 13 for blowing air toward the heat sink 12. The cooler has a fin supporting plane 11a formed as an inclining plane for introducing the air flow 14 generated from the motor fan 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a cooling device,
More specifically, the present invention relates to a cooling device for forcibly cooling electronic components mounted on a circuit board in a computer device.

[0002]

2. Description of the Related Art In recent years, in a computer device, the operation of a central processing unit (CPU) has been further accelerated, and accordingly, the amount of heat generated by the CPU has increased, and the temperature in the device has risen more remarkably than before. Has become. Since this rise in temperature causes unstable operations such as data transfer, a cooling device is arranged near the CPU to forcibly cool the CPU. This cooling device includes a heat sink having a plurality of rectangular plate-shaped fins extending in parallel with each other, and an electric fan that blows air toward the heat sink.

[0003]

In the above-mentioned conventional cooling device, the fin supporting surface for supporting a plurality of fins is flat,
Since the air flow from the electric fan does not flow smoothly along the fin support surface, there is a problem that the air flow does not affect the area other than immediately below and in the vicinity of the electric fan. For this reason, the air flow becomes weak near the edge or end of the fin support surface, causing concentration of dust. During long-term use, dust accumulates and the cooling effect is impaired. There have been problems such as an excessive load and an increase in power consumption.

[0004] In view of the above, the present invention solves the conventional disadvantage that dust accumulates near the edge or end of the fin support surface by smoothly flowing the air flow from the electric fan. An object of the present invention is to provide a cooling device that can improve a cooling effect on electronic components and does not increase the load on an electric fan.

[0005]

In order to achieve the above object, a cooling device according to the present invention has a plurality of fins and a fin support surface for integrally supporting the plurality of fins, and is arranged close to an electronic component. In a cooling device including a heat sink and an electric fan that blows air toward the heat sink, the fin support surface is formed as an inclined surface that guides an air flow by the electric fan.

In the cooling device of the present invention, since the air flow from the electric fan can flow smoothly along the inclined surface, the accumulation of dust at the edge or near the edge of the fin support surface is prevented, and The cooling effect on the parts can be improved. In addition, since accumulation of dust can be avoided, there is no increase in load on the electric fan.

Here, in the preferred cooling device of the present invention,
Preferably, the plurality of fins are formed as plate-like members extending in parallel with each other, and the inclined surface is inclined toward an extending direction of the plate-like member. In this case, an inclined surface shape that functions well is obtained.

It is also a preferred embodiment of the present invention that the inclined surface is gradually inclined from a position facing the electric fan toward a direction in which the plate member extends in a direction away from the electric fan. This makes it possible to obtain a well-functioning inclined surface shape.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail based on embodiments of the present invention with reference to the drawings. FIG.
FIG. 1 is a perspective view showing a cooling device according to a first embodiment of the present invention. The cooling device is provided on a CPU 15 (FIG. 2) mounted on a circuit board 10 in the computer device, and a heat sink 12 for dissipating heat generated by the CPU 15 and blowing an airflow toward the heat sink 12. And an electric fan 13.

The heat sink 12 has a plurality of fins 12 a having a substantially rectangular plate shape extending in parallel with each other, and a support portion 11. The support portion 11 is formed in a rectangular shape when viewed from above,
A flat bottom surface is brought into contact with the surface of the CPU 15 mounted on the circuit board 10, made of a metal material having an insulating material applied to the surface. The support 11 has a plurality of fins 12
a is formed as a fin support surface (inclined surface) 11a that integrally supports a. An electric fan 13 is provided at a central portion on the plurality of fins 12a.

The fin support surface 11a has a top facing the electric fan 13, and the fin support surface 1a extends from the top.
1a toward the both edges (left and right in FIG. 1) of the electric fan 13
Gradually tilt away from The support 11
Can be configured as a solid part or as a hollow part.

The cooling device of this embodiment operates as follows. FIG. 2 is a side view showing an operation state of the present cooling device. When the electric fan 13 starts rotating by the supply of power, the air flow 14 blown out of the electric fan 13
Fin support surface 1 from the top facing electric fan 13
It flows toward both edges of the fin support surface 11a along the inclination of 1a. Thereby, directly from the CPU 15,
Alternatively, the heat transmitted by radiation is forcibly dissipated,
The CPU 15 is cooled.

In the present cooling device, the airflow 14 from the electric fan 13 flows along the fin support surface 11a along the fin support surface 1a.
1a flows smoothly toward both edges, so that dust accumulation near both edges of the fin support surface 11 is prevented,
The cooling effect on the CPU 15 can be improved. In addition, since accumulation of dust is avoided, an increase in the load on the electric fan 13 is avoided.

FIG. 3 is a side sectional view showing a cooling device according to a second embodiment of the present invention. In the present embodiment,
Although the arrangement of the electric fan 13 and the shape of the fin support surface 11a are different from those of the first embodiment, other configurations are the same.

In this cooling device, the electric fan 13 is arranged on one side of the plurality of fins 12a, and the fin support surface 11a is moved from a position facing the electric fan 13 to one of the fin support surfaces 11a. It gradually inclines in a direction away from the electric fan 13 toward the edge.

According to this embodiment as well, the air flow 14 from the electric fan 13 smoothly flows toward one edge of the fin support surface 11a, and the same effect as in the first embodiment is obtained. be able to.

As described above, the present invention has been described based on the preferred embodiment. However, the cooling device of the present invention is not limited to the configuration of the above-described embodiment, and is not limited to the configuration of the above-described embodiment. Cooling system with various modifications and changes,
It is included in the scope of the present invention.

[0018]

As described above, according to the cooling device of the present invention, the air flow from the electric fan smoothly flows, so that the dust accumulates on the edge or near the edge of the fin support surface. The disadvantages can be solved and the cooling effect on the electronic components such as the CPU can be improved, and the load on the electric fan does not increase.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a cooling device according to a first embodiment of the present invention.

FIG. 2 is a side view showing an operation state of the cooling device of the embodiment.

FIG. 3 is a side view showing an operation state of a cooling device according to a second embodiment of the present invention.

[Explanation of symbols]

 10: Circuit board 11: Support portion 11a: Fin support surface 12: Heat sink 12a: Fin 13: Electric fan 14: Air flow 15: CPU

Claims (3)

[Claims] 1. A heat sink having a plurality of fins and a fin support surface for integrally supporting the plurality of fins, the heat sink being disposed in proximity to an electronic component, and an electric fan for blowing air toward the heat sink. In the cooling device, the fin support surface is formed as an inclined surface that guides the airflow by the electric fan. 2. The cooling device according to claim 1, wherein the plurality of fins are formed as plate members extending in parallel with each other, and the inclined surface is inclined toward an extending direction of the plate member. 3. The cooling device according to claim 2, wherein the inclined surface is gradually inclined in a direction away from the electric fan in a direction in which the plate-shaped member extends from a position facing the electric fan.