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TW200942145A - Heat-dissipating device with multiple heat sources - Google Patents

Heat-dissipating device with multiple heat sources Download PDF

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Publication number
TW200942145A
TW200942145A TW097109858A TW97109858A TW200942145A TW 200942145 A TW200942145 A TW 200942145A TW 097109858 A TW097109858 A TW 097109858A TW 97109858 A TW97109858 A TW 97109858A TW 200942145 A TW200942145 A TW 200942145A
Authority
TW
Taiwan
Prior art keywords
heat
heat source
dissipating
source
conducting elements
Prior art date
Application number
TW097109858A
Other languages
Chinese (zh)
Inventor
Jun-Guang Luo
Original Assignee
Jun-Guang Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jun-Guang Luo filed Critical Jun-Guang Luo
Priority to TW097109858A priority Critical patent/TW200942145A/en
Priority to US12/136,255 priority patent/US20090236078A1/en
Publication of TW200942145A publication Critical patent/TW200942145A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat-dissipating device with multiple heat sources, comprising: a plurality of heat conducting elements and at least a heat-dissipating element. The heat-conducting elements are arranged in an interlaced way and respectively contact with a heat source for heat exchanging. The heat-dissipating elements are connected with the heat-dissipating elements and provided to make heat exchange with cold outside air. In this way, thermal energy generated by each heat source, in a short time, follow the conduction path under the same conditions, can be distributed quickly and evenly to enhance the heat-dissipating efficiency of multiple heat sources.

Description

200942145 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置，特別是指一種可以針 對多熱源進行散熱的多熱源的散熱裝置。 【先前技術】200942145 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device capable of dissipating heat from multiple heat sources. [Prior Art]

參閱圖1，以中華民國公告第M326999號案的散熱裝 置1為例，主要是與一 LED發光模組2結合。該散熱裴置 1匕3有基座11、平行排列在該基座11上的多數散熱_ 片12,及串接該等散熱韓片12的多數熱管13。該等熱管 疋概呈u型，並分別具有鄰近熱源的一受熱段Hi，及 遠離熱源的-冷凝段132。豸LED發光模組2具有設置在 該基座11的數個LED單元21a〜21d。 #參閱圖2 ’當該等LED單元2U〜2id發光發熱時，該 熱官13内的液態工作流體會藉由熱傳導吸收該等LE〇單元 21a〜21d產生的熱能，使液態工作流體氣化成高溫的氣態工 作流體’並膨脹㈣而沿該熱管13朝該冷凝段132擴散， 同時’該氣態工作流體會透過該等散熱鰭片12與外界冷空 乳進订熱乂換’藉此’高溫的氣態卫作流體遇冷開始降溫 並凝結為水滴形成液態工作流體，再依循箭頭方向迴流至 該受熱段131内，達到散熱的效果。 _由於該散熱裝置i的設計概念是源自於電腦(圖未 T)單-熱源的散熱模式，而以單一基座u同時與該等LED 單元21a〜21d形成的多點熱源接觸，而此-錯誤概念，會 在液態工作流體迴流時，先與LED單元2ia進行熱交換， 200942145 再依序與LED單元md進行熱交換，使餘最後的 LED單元21d，往往會因為液態工作流體溫度愈來愈高，有 無法即時散熱，及散熱效果不均勻等缺失，容易導致光衰 的情形。 【發明内容】 因此，本發明之目的，即在提供—種能提昇散熱效率 的多熱源的散熱裝置。 Ο Ο 於是，本發明的多熱源的散熱裝置，包含數個導熱元 至少一散熱元件。該等導熱元件是間隔排列，且分 別與-熱源接觸進行熱交換。該散熱元件是連接該等導執 几件，且與外界冷空氣進行熱交換。 本發明的功效是藉由多數個導熱元件分別與熱源接觸 门使母-熱源產生的熱能’都能在短時間内，依循條件相 Γ傳導路徑，快速且均勾的散熱，達到提昇散熱效率的 目的。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 :下配合參考圖式之一較佳實施例的詳細 楚的呈現。 參閱圖3、圖4及圏5 ’本發明的多熱源的散熱裝置的 :第一較佳實施例是與—LED發光模組3結合。㉟哪發 =模組3具有數個LED單元31。該散熱農置包含：數個導 熱元件4，及數散熱元件5。 該導熱元件4在本較佳實施例分別為—熱管，是間隔排 6 200942145 列而不互相接觸，並分別具有封閉的一腔室40、與單一 led 單元31接觸的一受熱端41 ’及反向於該受熱端41的一冷凝 端42。該腔室40為真空狀態，並充填有工作流體。該工作 流體可以是在常溫下為液態的冷媒、溫度超傳導液體其中一 種。 忒等散熱70件5在本較佳實施例分別為一散熱鰭片，是 依序平行排列且連接該等導熱元件4。Referring to Fig. 1, the heat dissipating device 1 of the Republic of China Announcement No. M326999 is taken as an example, and is mainly combined with an LED lighting module 2. The heat dissipating device 1匕3 has a susceptor 11, a plurality of heat dissipating sheets 12 arranged in parallel on the susceptor 11, and a plurality of heat pipes 13 connected in series to the heat dissipating Korean sheets 12. The heat pipes are generally u-shaped and have a heated section Hi adjacent to the heat source and a condensation section 132 remote from the heat source. The 豸LED lighting module 2 has a plurality of LED units 21a to 21d provided on the susceptor 11. #Refer to Figure 2 'When the LED units 2U~2id emit heat, the liquid working fluid in the heat register 13 absorbs the heat generated by the LE units 21a-21d by heat conduction, and vaporizes the liquid working fluid into a high temperature. The gaseous working fluid 'expands (4) and diffuses along the heat pipe 13 toward the condensation section 132, and at the same time 'the gaseous working fluid passes through the heat-dissipating fins 12 to exchange heat with the outside world for 'heating' The gaseous working fluid begins to cool down in the cold and condenses into water droplets to form a liquid working fluid, and then returns to the heated section 131 in the direction of the arrow to achieve the heat dissipation effect. _ Since the design concept of the heat sink i is derived from the heat dissipation mode of the single-heat source of the computer (not shown), the single pedestal u is simultaneously in contact with the multi-point heat source formed by the LED units 21a 21d, and this - The concept of error, when the liquid working fluid is recirculated, first exchanges heat with the LED unit 2ia, and 200942145 heat exchanges with the LED unit md in sequence, so that the last LED unit 21d tends to be warmer due to the temperature of the liquid working fluid. The higher the temperature, the lack of instant heat dissipation, and the uneven heat dissipation effect, which may easily lead to light decay. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat sink for a multi-heat source capable of improving heat dissipation efficiency. Ο Ο Thus, the heat sink of the multi-heat source of the present invention comprises a plurality of heat conducting elements and at least one heat dissipating component. The thermally conductive elements are spaced apart and are in heat exchange with the heat source. The heat dissipating component is connected to the guiding members and exchanges heat with the outside cold air. The utility model has the advantages that the heat energy generated by the mother-heat source can be contacted by a plurality of heat-conducting elements respectively with the heat source to follow the conditional conduction path, and the heat is quickly and uniformly cooled, thereby improving the heat dissipation efficiency. purpose. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention are set forth in the following detailed description of the preferred embodiments of the invention. Referring to Figures 3, 4 and 5', the heat dissipation device of the multi-heat source of the present invention is: The first preferred embodiment is combined with the LED lighting module 3. 35 Whichever = Module 3 has several LED units 31. The heat sink includes a plurality of heat conducting elements 4 and a plurality of heat dissipating elements 5. In the preferred embodiment, the heat conducting elements 4 are respectively heat pipes, which are spaced apart from each other, and are not in contact with each other, and each has a closed chamber 40, a heated end 41' in contact with the single led unit 31, and a reverse Towards a condensing end 42 of the heated end 41. The chamber 40 is in a vacuum state and is filled with a working fluid. The working fluid may be one of a refrigerant that is liquid at normal temperature and a temperature superconducting liquid. In the preferred embodiment, the heat sink 70 is a heat dissipating fin, which is arranged in parallel and connected to the heat conducting elements 4.

❹ 當該等LED單元31發光發熱時，每一導熱元件4内的 液態工作流體會透過該受熱端41吸收每一 LED單元31產 生的熱能，使液態工作流體氣化成高溫的氣態工作流體， 並膨脹增壓而沿該導熱元件4朝該冷凝端42擴散，同時， 該氣態卫作流體會透過”散熱元件5與外界冷空氣進行 熱交換，並開始降溫而凝結為水滴形成液態工作流體，再 、机至j丈熱端41内，藉此’使每一 LED單元31在沒有 先後順序的情形下，都能依循條件相同的傳導路徑，達到 散熱的目的。 參閱圖6，是本發明_货 . 赞月第一較佳實施例，其與該第一較 佳實施例大致相同，X n忐士 不同處在於：該散熱裝置更包含一風 該風扇6是設置在該等散熱元件5 一 ，私· /U汁 J 一 Ί只_J ， 彳曰对钱寻 月欠熱元件5產生循環氣讳 ^ ^ 藉此’可避免熱能滯留在該等 政熱元件5間，提昇锋望| ^ L田 导散熱元件5與外界氣流的熱交換 效果’使每一 LED單 工问樣能依循條件相同的傳導路徑 ，達到散熱的目的。 7 200942145 參閱圖7，是本發明一第三較佳實施例，其與該第一較 佳實施例大致相同，不同處在於： 該等導熱το件4在本較佳實施例分別為一空心管並 分別具有沿長度方向延伸且連通外界的數溝槽43。 藉此，該等導熱元件4可以在受熱時，利用煙自效應 ，使匯集的熱能迅速料向上，且料與該散熱元件$及 外界冷^氣進行熱交換，使每―咖單^同樣能依循條 件相同的傳導路徑，達到散熱的目的。 〇 ❹ 參閱圖8’是本發明—第四較佳實施例，其與該第三較 佳實施例大致相同，不同處在於： 該等導熱7L件4在本較佳實施例分別為_ u形板，並 分別具有反向且與該等散熱元件5結合的―第—側面44與 一第二側面45。 、 藉此，該等導熱元件4同樣可以在受熱時，利用煙函 效應，使匯集的熱能迅速排導向上， 1 及外界冷空氣進行熱交換 條件相同的傳導路徑，達到散熱的目的。 ， 參閱圖9,是本發明一第五較佳實施例，其與該 佳實施例大致相同，不同處在於·· ^ "亥等導熱7L件4在本較佳實施例分別為—實心桂。 藉此’該導熱元件4可將熱能傳導至 後’與外界冷线進行熱㈣，絲-LED單=件5 =Γ:間内’依循條件相同的傳導路徑，快逮且:： 的散熱，提昇多熱源時的散熱效率。 均勾 200942145 據上所述可知，本發明之多熱源的散熱裝置具有下列 優點及功效： 本發明是藉由多數個直接與熱源接觸的導熱元件4,使 每一熱源產生的熱能，都能在短時間内，依循條件相同的 傳導路控，快速且均勻的散熱，而能大幅提昇多熱源時的 散熱效率，且該等導熱元件4可以依使用需求為真空管、 二〜笞實柱、或u形板，提昇使用上的方便性與實用 性。 、 〇 以上所述只是本發明之較佳實施例而已，當不能以此 限定本發明實施之範圍，即大凡依本發明申請專利範圍及 發明說明内容所作之簡單的等效變化與修飾，皆仍屬本發 明專利涵蓋之範圍内。 200942145 圖 式簡單說明】 圖1是一立體圖，說明中華 ； Α σ 第 M326999 號案 圖2是前述公告案的一剖視圖，· 圖3是一立體分解圖，說明本 — 置的-較佳實施例； 月-多熱源的散熱裝 圖4疋該較佳實施例的一組合立體圖· Ο 圖5是該較佳實施例的一剖視圖； 圖6是一剖視圖，說明本發明一多熱源的散熱楚置的 弟一較佳實施例； 圖7是-剖視圖，說明本發明一多熱源的散熱裝置的 第二較佳實施例； 一圖8是一剖視圖，說明本發明一多熱源的散熱裝置的 ―第四較佳實施例；及 〇 圖9是一剖視圖，說明本發明一多熱源的散熱裝置的 〜第五較佳實施例。 10 200942145 【主要元件符號說明】 3 ..........LED發光模組 31.........LED單元 4 ..........導熱元件 40 .........腔室 41 .........受熱端 42 .........冷凝端 43 .........溝槽 44 ..........第一側面 45 .........第二側面 5 ..........散熱元件 6 ..........風扇❹ When the LED units 31 emit light, the liquid working fluid in each of the heat conducting elements 4 absorbs the heat energy generated by each of the LED units 31 through the heat receiving end 41, and vaporizes the liquid working fluid into a high temperature gaseous working fluid, and Expanding and supercharging and diffusing along the heat conducting element 4 toward the condensation end 42. At the same time, the gaseous medium fluid exchanges heat with the outside cold air through the heat dissipating component 5, and begins to cool down and condenses into water droplets to form a liquid working fluid. In the hot end 41 of the machine, the LED unit 31 can follow the same conduction path in the absence of a sequence to achieve the purpose of heat dissipation. Referring to Figure 6, the invention is a cargo. The first preferred embodiment of the month is substantially the same as the first preferred embodiment, and the X n gentleman is different in that the heat sink further includes a wind, and the fan 6 is disposed on the heat dissipating components 5 Private · / U juice J Ί _J only, 彳曰 钱 钱 钱 钱 钱 欠 欠 欠 产生 产生 产生 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Field conduction heat dissipation element 5 and outside The heat exchange effect of the airflow enables each LED simplex to follow the same conduction path to achieve the purpose of heat dissipation. 7 200942145 Referring to FIG. 7, a third preferred embodiment of the present invention is compared with the first The preferred embodiment is substantially the same except that the heat conducting members 4 are respectively hollow tubes in the preferred embodiment and each has a plurality of grooves 43 extending in the length direction and communicating with the outside. Thereby, the heat conducting members are 4 When the heat is taken, the self-effect of the smoke is utilized, so that the collected heat energy is quickly turned upward, and the heat exchange between the heat dissipating component and the external heat is performed, so that each of the coffee beans can follow the same conduction path. The purpose of achieving heat dissipation is as follows: 图 Referring to FIG. 8 ′ is a fourth preferred embodiment of the present invention, which is substantially the same as the third preferred embodiment, except that: the thermally conductive 7L member 4 is in the preferred embodiment. They are respectively _ u-shaped plates, and respectively have a first side surface 44 and a second side surface 45 which are combined with the heat dissipating elements 5 . Thereby, the heat conducting elements 4 can also utilize the smoke when heated. Letter effect, The collected heat energy is quickly directed, 1 and the outside cold air is subjected to the same heat conduction path to achieve the purpose of heat dissipation. Referring to FIG. 9, a fifth preferred embodiment of the present invention is substantially the same as the preferred embodiment. The same is true, the difference is that the heat-conducting 7L member 4 in the preferred embodiment is solid-solid. Thus, the heat-conducting element 4 can conduct heat to the rear to heat with the external cold line (4). Wire-LED single=piece 5=Γ: In-between's follow the same conduction path, fast catch:: heat dissipation, improve heat dissipation efficiency when multiple heat sources. 均勾200942145 According to the above description, the multiple heat source of the present invention The heat dissipating device has the following advantages and effects: The present invention uses a plurality of heat conducting elements 4 directly in contact with a heat source, so that the heat energy generated by each heat source can follow the same conduction path in a short time, and is fast and Uniform heat dissipation can greatly improve the heat dissipation efficiency of multiple heat sources, and the heat conducting elements 4 can be vacuum tubes, two tamping columns, or u-shaped plates according to the needs of use, thereby improving convenience and practicability in use. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are still It is within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a Chinese; Α σ No. M326999 FIG. 2 is a cross-sectional view of the foregoing publication, and FIG. 3 is an exploded perspective view showing a preferred embodiment of the present invention. Fig. 5 is a cross-sectional view of the preferred embodiment of the preferred embodiment. Fig. 6 is a cross-sectional view showing the heat dissipation of a plurality of heat sources of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a cross-sectional view showing a second preferred embodiment of a heat sink for a plurality of heat sources according to the present invention; and FIG. 8 is a cross-sectional view showing the heat sink of a heat source of the present invention. Fourth Preferred Embodiment; and FIG. 9 is a cross-sectional view showing a fifth preferred embodiment of a heat sink of a plurality of heat sources according to the present invention. 10 200942145 [Description of main component symbols] 3 .......... LED lighting module 31 .... LED unit 4 ..... ........ chamber 41 .... heat receiving end 42 ... condensing end 43 ... ... groove 44 ... .......the first side 45 .........the second side 5 ..........the heat dissipating component 6 ..........fan

1111

Claims (1)

200942145 十、申請專利範圍： 1· 一種多熱源的散熱裝置，包含： 且刀別與一熱源接觸 數個導轨元株，县3日 “、、几仟疋間隔排列 進行熱交換；及 散熱元件，是連接該等導熱元 冷空氣進行熱交換。 且與外界 2_依據申請專利範圍第 項所述之夕熱源的散埶裝署甘 中，該等導熱元件㈣[實心'卜 t、裝置，其200942145 X. Patent application scope: 1. A multi-heat source heat dissipating device, comprising: and the knife is in contact with a heat source to contact several guide rail element plants, and the county is arranged at intervals of “, and several times for heat exchange; and the heat dissipating component Is to connect the heat-conducting elements to the cold air for heat exchange. And with the outside world 2_ according to the application of the scope of the application of the heat source of the heat source, the heat-conducting components (four) [solid 'b, device, its 3. 依據申請專利範圍第1 項所述之夕熱源的散熱裝置，A 中，邊4導熱元件分別為_ U形板。 /、 4. 依據5請專利範圍第1項所述之多熱源的散熱裳置，其 中，該等導熱元件分別為一空心管。 、 5.依料請專利範圍第4項所述之多熱源的散熱裝置，其 中’該等導熱元件分別是一熱管’並分別具有封閉的一 、與該熱源接觸的-受熱端，及反向於該受熱端的一冷 凝端。 6. 依據申請專利範圍第5項所述之多熱源的散熱裝置，其 中，该熱管的腔室為真空狀態，益充填有工作流體。 7. 依據申請專利範圍第6項所述之多熱源的散熱裝置，其 中，該工作流體可以是在常溫下為液態的冷媒、溫度超 傳導液體其中一種。 8.依據申請專利範圍第丨項所述之多熱源的散熱裝置，其 中’該散熱元件為一散熱鰭片。 9_依據申請專利範圍第丨項所述之多熱源的散熱裝置，盆 12 200942145 中，該散熱元件丑古 1 Λ A⑼* /、有數片’是依序平行排列。 ’更 ，可 •依據申請專利範園笛。 圍第9項所述之多熱源的散熱裝望 風扇’該風扇是設置在該等散 相對該等散熱元件產生循環氣流。…、韓片1 〇 133. According to the heat sink of the heat source as described in the first paragraph of the patent application, in A, the heat conducting elements of the side 4 are respectively _ U-shaped plates. /, 4. According to the heat dissipation device of the multi-heat source described in Item 1 of the patent scope, the heat-conducting elements are respectively a hollow tube. 5. According to the multi-heat source heat dissipating device described in claim 4, wherein the heat-conducting elements are respectively a heat pipe and respectively have a closed one, a heat receiving end in contact with the heat source, and a reverse At a condensation end of the heated end. 6. The heat sink of a multi-heat source according to claim 5, wherein the chamber of the heat pipe is in a vacuum state and is filled with a working fluid. 7. The heat sink of a multi-heat source according to claim 6, wherein the working fluid may be one of a refrigerant that is liquid at normal temperature and a temperature superconducting liquid. 8. The heat sink of a multi-heat source according to the scope of the patent application, wherein the heat dissipating component is a heat sink fin. 9_ According to the heat-dissipating device of the multi-heat source described in the scope of the patent application, in the basin 12 200942145, the heat-dissipating element is 1 Λ A(9)* /, and several pieces are sequentially arranged in parallel. ‘More, yes • According to the patent application Fan Yuan flute. The heat-dissipating fan of the multi-heat source described in item 9 is disposed in the fan to generate a circulating airflow with respect to the heat dissipating components. ..., Korean 1 〇 13
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