TWI396462B - Heat dissipation device for leds - Google Patents

Description

Light-emitting diode heat sink

The invention relates to a heat dissipating device, in particular to a light emitting diode heat dissipating device.

With the rapid development of the electronics industry, the operating speed of electronic components continues to increase, generating a large amount of heat during operation, which increases the temperature of itself and the system, which in turn affects the stability of its work. To ensure proper operation of the electronic components, a heat sink is usually mounted on it to dissipate the heat generated by it.

A conventional solution to the problem of heat dissipation of electronic components is usually to mount a heat sink on each of the heat-generating electronic components. The heat sink includes a bottom plate in close contact with the electronic components and a plurality of heat-dissipating fins disposed on the bottom plate. However, for some special heating electronic components such as a large number of light-emitting diodes, if a conventional heat dissipation solution is used, a solid bottom plate is used to contact all of the light-emitting diodes, and the heat of the light-emitting diodes is conducted. Dissipate heat into the surrounding air to dissipate heat into the surrounding air.

However, the size and area of such a base plate are relatively large, which not only increases the cost of the radiator but also causes the entire product to be too large and too heavy. More importantly, the air convection intensity around the heat sink fins in the high heat region of the solid portion is significantly lower than the heat sink fins on the periphery of the bottom plate, which greatly affects the overall heat dissipation capability of the heat sink and generates heat dissipation. Unevenness can easily cause serious damage to some heating elements.

In view of this, it is necessary to provide a light-emitting diode heat sink with better air convection.

An illuminating diode heat dissipating device includes a plurality of heat sinks, a plurality of heat dissipating units and a plurality of heat pipes, each of the heat sinks comprising a bottom plate and a plurality of heat dissipating fins extending upward from a top surface of the bottom plate, wherein the heat dissipating units are all radiated by a plurality of heat dissipating units Forming a sheet body, an air flow passage is formed between each two adjacent fin bodies, and the heat pipes connect the heat sink bottom plates and the heat dissipating unit in series, and the air flow passages communicate with the light emitting diodes above and below the heat dissipating device region.

The air flow passage between the heat sink bodies communicates with the upper and lower regions of the light emitting diode module, and the air in the air flow passage is heated to enter the upper area of the light emitting diode module, and the air from the lower area of the light emitting diode module is immediately obtained. The airflow is replenished, so that the loop of the upper and lower airflows can effectively improve the heat dissipation efficiency of the LED module.

10‧‧‧ radiator

12‧‧‧floor

120‧‧‧ Groove

14‧‧‧Heat fins

16‧‧‧transverse channel

20‧‧‧heating unit

22‧‧‧ Heat sink body

220‧‧‧Perforation

222‧‧‧Folding

224‧‧‧ 片片

30‧‧‧heat pipe

40‧‧‧Lighting diode module

42‧‧‧ boards

44‧‧‧Lighting diode

1 is a perspective view of a light-emitting diode heat sink of the present invention.

2 is an exploded perspective view of the light emitting diode heat sink of FIG. 1.

3 is an inverted view of the light emitting diode heat sink of FIG. 1.

4 is a top plan view of the light emitting diode heat sink of FIG. 1.

As shown in FIG. 1-4, the light-emitting diode heat dissipating device of the present invention is used for dissipating heat from a light-emitting diode module 40 attached to a bottom thereof, and includes three heat sinks 10 having the same structure and two groups being sandwiched between The heat dissipating unit 20 between the adjacent two heat sinks 10 and the plurality of heat pipes 30 thermally connecting the heat sink 10 and the heat dissipating unit 20 together.

As shown in FIG. 1-2, the heat sink 10 may be integrally formed of a metal material such as aluminum or copper having good thermal conductivity, and includes a rectangular bottom plate 12 and a plurality of heat dissipation fins 14 extending vertically upward from the top surface of the bottom plate 12. The heat dissipation fins 14 are equally spaced from each other and parallel to the opposite long sides of the bottom plate 12, and an air flow passage (not labeled) for airflow is formed between each of the two heat dissipation fins 14. The radiator 10 is opened The plurality of lateral channels 16 are cut into a plurality of aliquots, and the transverse channels 16 extend perpendicular to the heat dissipation fins 14 , and the bottom plate 12 corresponding to the bottom of the lateral channels 16 is provided with a semicircle for accommodating the heat pipes 30 . Groove 120.

Each of the heat dissipating units 20 includes a plurality of fins arranged in a row between two adjacent heat sinks 10, and each of the fin sets is composed of a plurality of fins 22 made of a rectangular metal foil. The fin body 22 is formed. The width of the heat sink 10 is slightly smaller than the height of the heat sink 10 so that the heat dissipating unit 20 is not protruded above and below the heat sink 10 when the heat dissipating unit 20 is sandwiched between the two heat sinks 10, that is, the top surface and the bottom surface of each heat sink body 22 are located. Between the top surface and the bottom surface of the heat sink 10. Each of the fin bodies 22 is provided with three spaced perforations 220 corresponding to the grooves 120 on the bottom plate 12 of the heat sink 10 near the lower edge thereof. The periphery of the perforations 220 extends perpendicularly with annular flanges 222, when all the fin bodies 22 are When the heat dissipating units 22 are stacked on each other, the corresponding through holes 220 and the folded edges 222 form a tubular receiving passage through which the heat pipe 30 is placed and correspondingly communicates with the groove 120 of the heat sink 10. The upper edge of the heat sink body 22 extends perpendicularly to the same side of the flange 222 to extend a plurality of spaced apart tabs 224 having an extension length equal to that of the flange 222 to space the heat sink bodies 22 equidistant from each other. Come. An air flow passage connecting the upper and lower regions of the heat sink of the light emitting diode is formed between each two adjacent heat sink bodies 22.

The number of the heat pipes 30 is nine, and is divided into three groups of three, each of which is disposed in a fin group. Each heat pipe 30 extends straight and has a circular cross section.

As shown in FIG. 3, the LED modules 40 are mounted on the bottom surface of the bottom plate 12 of each heat sink 10 at equal intervals, and include a rectangular circuit board 42 and a plurality of matrix arrays mounted on the circuit board 42. The upper LED 44 is disposed on the upper surface of the light-emitting diode 44.

Referring to FIG. 4 together, when the light-emitting diode heat dissipating device is combined, the heat pipe 30 is placed in the receiving passages of two sets of mutually spaced heat dissipating units 20, exposed in the middle of the two sets of heat dissipating units 20 and opposite to each other. The side heat pipe 30 is partially embedded in the groove 120 on the bottom plate 12 through the transverse passage 16 on the heat sink 10 and can be fixed by welding, pasting or the like. The above-mentioned LED module 40 can be locked A screw or a paste is attached to the bottom surface of the bottom plate 12 of the heat sink 10. At this time, the heat dissipating unit 20 is closely sandwiched between the opposite long sides of the bottom plate 12 of the two heat sinks 10, and the fin body 22 and the air flow passage are parallel to the heat dissipating fins 14 of the heat sink 10.

When the light-emitting diode heat sink is in use, the heat generated by the LED module 40 is absorbed by the bottom plate 12, and then a portion of the heat is conducted to the heat sink fins 14 of the heat sink 10, and the other portion is conducted to the heat sink 30. The heat dissipating unit 20 is finally radiated into the surrounding air through the fins 14 and the fin body 22 to achieve the effect of cooling the LED module 40.

The heat sink body 22 of the heat dissipating unit 20 is a relatively light and large-sized metal foil, and the heat pipe 30 is connected to the heat sink 10 without providing a base, so that the overall weight of the light-emitting diode heat sink is slightly increased. The device significantly increases the overall heat dissipation area of the light-emitting diode heat sink, and also reduces the use of the base material to reduce the material cost of the light-emitting diode heat sink manufacturing device. The airflow channel between the heat sink body 22 communicates with the upper and lower regions of the light emitting diode module 40. When the air in the airflow channel is heated into the upper area of the light emitting diode module 40, the light emitting diode module is obtained immediately. The air flow in the lower 40 area is replenished, so that the loop of the upper and lower airflows can effectively improve the heat dissipation efficiency of the LED module 40.

It can be understood that in other embodiments, the light emitting diode heat dissipating device may include two or more heat sinks 10, and a corresponding number of heat dissipating units 20 are sandwiched between each adjacent two heat sinks 10 and sufficiently passed through. The heat sink 10 and the heat pipe 30 of the heat dissipation unit 20.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator

12‧‧‧floor

14‧‧‧Heat fins

16‧‧‧transverse channel

20‧‧‧heating unit

22‧‧‧ Heat sink body

30‧‧‧heat pipe

Claims (9)

An illuminating diode heat dissipating device includes a plurality of heat sinks, a plurality of heat dissipating units and a plurality of heat pipes, wherein the heat sinks each comprise a bottom plate and a plurality of heat dissipating fins extending upward from the top surface of the bottom plate, and the improvement is: the heat dissipating units Each of the two heat sinks is formed with an air flow passage formed between each two adjacent heat sink bodies. The heat pipes are connected in series with the heat sink unit, and the heat dissipating units are sandwiched between two adjacent ones. Between the heat sinks, the heights of the heat dissipating units are smaller than the heights of the heat sinks, and the upper and lower opposite side surfaces of the heat dissipating unit are not protruded from the upper and lower sides of the heat sink when the heat dissipating unit is sandwiched between the two heat sinks The air flow passages communicate with the upper and lower regions of the light-emitting diode heat sinks. The light-emitting diode heat dissipation device of claim 1, wherein each of the heat sinks is formed with a plurality of grooves on the bottom plate, and the heat pipes are embedded in the corresponding grooves. The light-emitting diode heat dissipation device of claim 2, wherein the heat dissipation fin of each heat sink is perpendicular to the groove and forms a lateral passage corresponding to the groove. The light-emitting diode heat sink of claim 3, wherein the lateral channels divide the heat-dissipating fin into a plurality of equal parts. The light-emitting diode heat dissipation device of claim 2, wherein the bottom plate has a rectangular shape, and the heat dissipation fins and the heat dissipation fin body are parallel to the opposite long sides of the bottom plate. The illuminating diode heat sink of claim 5, wherein the heat dissipating unit is sandwiched between the long sides of the bottom plate adjacent to the two adjacent heat sinks. The light-emitting diode heat sink of claim 1, wherein the heat sink body has a rectangular shape. The light-emitting diode heat sink of claim 2, wherein the heat sink body is provided with a hole corresponding to the groove of the heat sink bottom plate near the lower edge thereof, the periphery of the hole The annular extension is vertically extended, and the plurality of perforations and the corresponding edges form a receiving passage through which the heat pipe is disposed. The light-emitting diode heat-dissipating device of claim 8, wherein the upper and lower edges of the heat-dissipating fins extend perpendicularly to the same side of the folded edge with a plurality of spaced apart tabs, the extended length and the folded edge of the tab Equal.