201250196 六 '發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關一種照明裝置，尤指一種散熱器及具該散 熱器的LED照明裝置。 [先前技術] [0002] 近年來因發光二極體（LED)技術的蓬勃發展及曰趨成熟， 且其具有低耗能、使用壽命長、體積小、反應快等特點 ，已逐步的取代傳統的照明裝置；然而影響LED壽命的最 關鍵因素莫過於熱量的堆積問題，是以目前的相關業者 都已竭盡全力的在開發可供LED使用的散熱器等產品。 [0003] 習知的LED照明裝置’主要包括一鋁擠散熱器及一led發 光模組’此紹擠散熱器包含一座板及自座板的一端向上 延伸出的多數散熱鰭片，各散熱鰭片大致呈一長條狀， 並在任二相鄰散熱鰭片之間形成有一散熱通道；LED發光 模組則固定在座板並相互熱接觸傳導。 [0004]然而’習知的LED照明裝置，在實際使用上仍存在下述的 問題點，由於其各散熱鰭片呈一長條狀，能與周圍氣體 作熱交換的散熱表面積受到限制，更易因為風向的關係 而造成死角的問題。另其座板為一封閉板體，不僅板體 上、下兩侧的氣體無法進行有效的熱交換，且用在室外 的空間時易在板體的上表面堆積或沾黏灰塵、污物；如 此，皆將嚴重的影響到其散熱效能。 【發明内容】 [0005] 本發明之一目的，在於提供一種散熱器及具該散熱器的 LED照明裝置’其係藉由各散熱柱的獨立佈設，能夠大幅 100119621 表單編號A0101 第3頁/共23頁 1002033191-0 201250196 度的增加與氣體的熱交換表面積，進而提高散熱器的散 熱效能。 [0006] 為了達成上述之目的，本發明提供一種散熱器，包括一 導熱基板及多數散熱柱，該導熱基板開設有多數貫穿孔 :各該散熱柱分別設置在該導熱基板的一表面上，各該 散熱柱為分離配置。 [0007] 為了達成上述之目的’本發明提供一種具散熱器的LED照 明裝置，包括一散熱器及一LED發光模組，該散熱器包括 一導熱基板及多數散熱柱，該導熱基板開設有多數貫穿 孔，各該散熱柱分別設置在該導熱基板的一表面上且分 離配置；該LED發光模組固定在該導熱基板上，且其包括 一電路板及佈設在該電路板的多數LED。 [0008] 本發明還具有以下功效’其係藉助各貫穿孔的開設，不 僅可擴增散熱基板與周圍冷空氣的熱交換作用，並可大 幅度的減輕整體的重量。利用各圓柱狀散熱柱的均勻分 佈，可減少散熱死角的產生，而充分的發揮散熱效能。 各貫穿孔除了可作為散熱通道外，此LED照明裝置若配置 在室外的空間中時，此等貫穿孔亦可被用來作為水洗的 流道，因此能夠有效的避免粉塵、污物等的堆積影響。 藉由在各散熱柱開設剖槽或形成中空柱，不但可減輕整 體總重量，更食b擴大與周圍氣體的熱交換表面積。 【實施方式】 [0009] 有關本發明之詳細說明及技術内容，配合圖式說明如下 ，然而所附圖式僅提供參考與說明用，並非用來對本發 明加以限制者。 100119621 表單編號A0101 第4頁/共23頁 1002033191-0 201250196 [0010] [0011] ο [0012]201250196 VI 'Invention>: TECHNICAL FIELD OF THE INVENTION [0001] The present invention relates to a lighting device, and more particularly to a heat sink and an LED lighting device having the same. [Prior Art] [0002] In recent years, due to the vigorous development and maturity of light-emitting diode (LED) technology, and its characteristics of low energy consumption, long service life, small size, fast response, etc., it has gradually replaced the traditional The lighting device; however, the most critical factor affecting the life of the LED is the accumulation of heat, so that the current relevant industry has made every effort to develop products such as radiators for LED use. [0003] A conventional LED lighting device mainly includes an aluminum extruded radiator and a led lighting module. The extruded radiator includes a plate and a plurality of heat radiating fins extending upward from one end of the seat plate. The sheet is substantially in the shape of a strip, and a heat dissipation channel is formed between any two adjacent heat sink fins; the LED light emitting module is fixed on the seat plate and is in thermal contact with each other. [0004] However, the conventional LED illumination device still has the following problems in practical use. Since each of the heat dissipation fins has a long strip shape, the heat dissipation surface area capable of heat exchange with the surrounding gas is limited, and is easier. Because of the relationship between the wind direction, the problem of dead ends. In addition, the seat plate is a closed plate body, not only the gas on the upper and lower sides of the plate body can not be effectively exchanged heat, and it is easy to accumulate or stick dust or dirt on the upper surface of the plate body when used in an outdoor space; In this way, it will seriously affect its heat dissipation performance. SUMMARY OF THE INVENTION [0005] One object of the present invention is to provide a heat sink and an LED lighting device having the same, which can be independently arranged by each heat dissipating column, and can be substantially 100119621 Form No. A0101 Page 3 / Total 23 pages 1002033191-0 201250196 degrees increase the heat exchange surface area of the gas, thereby improving the heat dissipation performance of the heat sink. [0006] In order to achieve the above object, the present invention provides a heat sink comprising a heat conducting substrate and a plurality of heat dissipating columns, wherein the heat conducting substrate is provided with a plurality of through holes: each of the heat dissipating columns is respectively disposed on a surface of the heat conducting substrate, The heat sink column is in a separate configuration. [0007] In order to achieve the above object, the present invention provides an LED lighting device with a heat sink, comprising a heat sink and an LED lighting module, the heat sink comprising a heat conducting substrate and a plurality of heat dissipating columns, the heat conducting substrate having a majority Each of the heat dissipation columns is disposed on a surface of the heat conductive substrate and disposed separately; the LED light emitting module is fixed on the heat conductive substrate, and includes a circuit board and a plurality of LEDs disposed on the circuit board. The present invention also has the effect of opening the through holes, which not only amplifies the heat exchange between the heat dissipating substrate and the surrounding cold air, but also greatly reduces the overall weight. By using the uniform distribution of the cylindrical heat dissipating columns, the generation of heat dissipation dead angle can be reduced, and the heat dissipation performance can be fully exerted. In addition to being used as a heat dissipation channel, the through holes can be used as a water-washing flow path when the LED lighting device is disposed in an outdoor space, thereby effectively preventing the accumulation of dust, dirt, and the like. influences. By forming a slit or forming a hollow column in each of the heat dissipating columns, not only the overall weight of the whole body can be alleviated, but also the heat exchange surface area with the surrounding gas can be enlarged. The detailed description and technical contents of the present invention are set forth below with reference to the accompanying drawings. 100119621 Form No. A0101 Page 4 of 23 1002033191-0 201250196 [0011] [0012]
[0013] 請參閱第一至七圖所示，本發明係提供一種散熱器及具 散熱器的LED照明裝置，此LED照明裝置主要包括一散熱 器1及一LED發光模組5。 散熱器1包括一導熱基板10及多數散熱柱20，本實施例的 導熱基板10由一上板11和一下板12所組合而成，上、下 板11、12大致呈一矩形狀，且皆以銅、鋁或其合金等導 散熱性良好材料所製成；在上、下板11、12分別開設有 相互對應的多數貫穿孔111、121，各貫穿孔111、121大 致呈橫向排列；另在上、下板11、12相互疊接的表面開 設有多數條槽道112、122，此等槽道112、122是形成在 前述各排貫穿孔111、121之間。 各散熱柱20是形成在上、下板11、12的上、下表面上， 此等散熱枉20可與上、下板11、12—體成型製出，或以 組合方式連接在上、下板11、12上，各散熱柱20可為一 實心圓柱（如第六圖所示），其沿著前述槽道112、122兩 側間隔排列佈設，且相鄰排的散熱柱20又恰位在前述貫 穿孔111、121外周圍區域（參閱第五圖所示）。另在下板 12的下表面中間區域的各散熱柱20之間形成有一容置區 123(參閱第四圖所示），此容置區123是供前述的LED發 光模組5安裝固定，且前述各槽道122的一端恰位在容置 區123的正上方位置。 此外，本發明的散熱器1更包括多數的熱管30(Heat Pipe)，各熱管30的内部具有毛細組織和工作流體，利用 工作流體的汽液相變化和毛細組織所提供的液體回流機 制，來產生連續循環的熱量傳遞；每一熱管30具有一蒸 100119621 表單編號A0101 第5頁/共23頁 1002033191-0 201250196 發段31和自蒸發段31延伸出的一冷凝段32，此等熱管3〇 是安置在前述的槽道112、122内，且被上、下板11、12 所夾掣固定（參閱第六圖所示），其中各蒸發段31被安置 在容置區123正上方的各槽道112、122内（參閱第三圖所 示）。進一步，在上、下板11、12組合後的一側邊形成有 一套接孔13(參閱第二圖所示）。 [0014] [0015] LED發光模組5主要包括一電路板51、多數LED52及一均 溫板53(Vapor Chamber)，此電路板51係為一金屬基印 刷電路板（Metal Core PCB’MCPCB)，各LED52是以矩 陣排列方式佈設在電路板51的一表面上，均溫板53的内 部亦具有毛細組織、卫作流體和支撐體，利用工作流體 的汽液相變化和毛細組織所提供的㈣㈣機制，來產 生連續循環的熱量傳遞；此均溫板53的_端面是斑下板 和各熱管30的蒸發段31熱傳導，另—端面則供電路板 51固定並與各LED52熱傳導。 此透光 上；如此 此外，本發明的LED照明裝置更包括 罩6是罩蓋在LED發光模組5外部且固定在下板u ，以組合成一具散熱器的LED照明裝置。 [0016] 便用旰谷發光並產生高熱量’其 溫板53 ’均溫板53在接受此等熱量後，將令其内 1導給， 作流體產生蒸發而成為一氣體，此氣體將帶著大^工 往均溫板53的冷端快速移走，並將此熱量傳導 板10和各熱管30，各熱管3〇則將此等敎量：.、、、基 到導熱基板1〇的大部分區域，藉助導熱基板 穿孔111、121來與外部的冷空氣進行熱 各1 100119621 表單編號臟 第6頁/共23s R時利月 1002033191-0 201250196 各散熱柱20的大散熱表面積來與外部的冷空氣進行大量 的熱交換，而得一高效能的散熱效果。 [0017] 請參閱第八圖所示，為本發明第二實施例的LED照明裝置 ，此LED照明裝置與第一實施例LED照明裝置的主要區別 在於：各散熱柱20a分別自上板11或下板12的一端面延伸 成型，且各散熱柱20a為一中空圓柱體，如此可大幅度的 減輕上、下板11、12和各散熱柱20a的重量，且能夠有效 的擴增散熱表面積。 [0018] 請參閱第九圖所示，為本發明第三實施例的LED照明裝置 ，此LED照明裝置與前述各實施例LED照明裝置的主要區 別在於：各散熱柱20b係自上板11或下板12的一端面延伸 成型，在各散熱柱20b的中心位置開設有一字狀剖槽21b ，但不以此種形狀為限，其亦可為其它各種不同幾何造 型的剖槽，如此亦具有減輕重量和擴增散熱表面積的等 同效果。 [0019] 請參閱第十圖所示，為本發明第四實施例的LED照明裝置 ，此LED照明裝置與前述各實施例LED照明裝置的主要區 別在於：導熱基板10c由單一板體所構成，在導熱基板10c 的單一端面延伸有多數散熱柱20，並在導熱基板10c對應 LED發光模組5的位置開設有多數條凹槽100c，以供各熱 管30來埋設，LED發光模组5則是固定在容置區123c内。 [0020] 請參閱第十一圖所示，為本發明第五實施例的LED照明裝 置，此LED照明裝置與前述各實施例LED照明裝置的主要 區別在於·.導熱基板10d亦由單一板體所構成，在導熱基 100119621 表單編號A0101 第7頁/共23頁 1002033191-0 201250196 板10d的上下兩端面分別延伸有多數根散熱柱20，發光模 組5的均溫板53直接固定在導熱基板10d的下端面。 [0021] 綜上所述，本發明之散熱器及具該散熱器的LED照明裝置 ，確可達到預期之使用目的，而解決習知之缺失，又因 極具新穎性及進步性，完全符合發明專利申請要件，爰 依專利法提出申請，敬請詳查並賜准本案專利，以保障 發明人之權利。 【圖式簡單說明】 [0022] 第一圖係本發明第一實施例立體分解圖。 〇 [0023] 第二圖係本發明第一實施例組合外觀圖。 [0024] 第三圖係本發明第一實施例組合俯視圖。 [0025] 第四圖係第三圖之4_4剖視圖。 [0026] 第五圖係第三圖之5-5剖視圖。 [0027] 第六圖係第三圖之6-6剖視圖。[0013] Referring to the first to seventh embodiments, the present invention provides a heat sink and an LED lighting device with a heat sink. The LED lighting device mainly includes a heat sink 1 and an LED lighting module 5. The heat sink 1 includes a heat-conducting substrate 10 and a plurality of heat-dissipating columns 20. The heat-conductive substrate 10 of the present embodiment is composed of an upper plate 11 and a lower plate 12, and the upper and lower plates 11 and 12 are substantially rectangular. A conductive material having good heat dissipation properties such as copper, aluminum or an alloy thereof is formed; and a plurality of through holes 111 and 121 corresponding to each other are respectively formed in the upper and lower plates 11 and 12, and the through holes 111 and 121 are arranged substantially in a lateral direction; A plurality of grooves 112 and 122 are formed on the surfaces of the upper and lower plates 11 and 12 which are overlapped with each other. These grooves 112 and 122 are formed between the rows of through holes 111 and 121. Each of the heat dissipating columns 20 is formed on the upper and lower surfaces of the upper and lower plates 11, 12, and the heat dissipating fins 20 can be integrally formed with the upper and lower plates 11, 12, or connected in combination in the upper and lower portions. On the boards 11, 12, each of the heat dissipation columns 20 can be a solid cylinder (as shown in the sixth figure), which is arranged along the two sides of the grooves 112 and 122, and the heat dissipation columns 20 of the adjacent rows are in place. In the outer peripheral area of the aforementioned through holes 111, 121 (refer to the fifth figure). An accommodating area 123 (shown in the fourth figure) is formed between the heat dissipating columns 20 in the middle portion of the lower surface of the lower plate 12, and the accommodating area 123 is mounted and fixed by the LED lighting module 5, and the foregoing One end of each channel 122 is located just above the accommodating area 123. In addition, the heat sink 1 of the present invention further includes a plurality of heat pipes 30, and the inside of each heat pipe 30 has a capillary structure and a working fluid, and utilizes a vapor-liquid phase change of the working fluid and a liquid reflux mechanism provided by the capillary structure. A continuous cycle of heat transfer is generated; each heat pipe 30 has a steaming 100119621 Form No. A0101 Page 5 / Total 23 pages 1002033191-0 201250196 The sending section 31 and a condensation section 32 extending from the evaporation section 31, these heat pipes 3〇 It is disposed in the aforementioned channels 112, 122, and is fixed by the upper and lower plates 11, 12 (refer to the sixth figure), wherein each evaporation section 31 is disposed directly above the accommodating area 123. Inside the channels 112, 122 (see the third figure). Further, a set of through holes 13 is formed on one side of the combination of the upper and lower plates 11, 12 (see Fig. 2). [0015] The LED lighting module 5 mainly includes a circuit board 51, a plurality of LEDs 52, and a Vapor Chamber. The circuit board 51 is a metal-based printed circuit board (Metal Core PCB'MCPCB). Each of the LEDs 52 is arranged on a surface of the circuit board 51 in a matrix arrangement. The interior of the temperature equalizing plate 53 also has a capillary structure, a working fluid and a support body, which are provided by the vapor-liquid phase change of the working fluid and the capillary structure. (4) (4) Mechanism for generating heat transfer in a continuous cycle; the end face of the temperature equalizing plate 53 is heat conduction of the lower plate and the evaporation section 31 of each heat pipe 30, and the other end face is fixed to the circuit board 51 and thermally conducted with each LED 52. In addition, the LED lighting device of the present invention further includes a cover 6 which is an LED lighting device which is disposed outside the LED lighting module 5 and is fixed to the lower plate u to be combined into a heat sink. [0016] The light is used to illuminate the valley and generate high heat. The warming plate 53 of the warming plate 53 receives the heat, and then causes the liquid to evaporate and become a gas. The gas will carry The large-scale work is quickly removed from the cold end of the temperature equalizing plate 53, and the heat-conducting plate 10 and the heat pipes 30, and the heat pipes 3 〇 are the same amount: ., , and the base to the heat-conducting substrate Part of the area, by means of the heat-conducting substrate perforations 111, 121 to heat with the outside cold air 1 100119621 Form number dirty page 6 / total 23s R when the month 1002033191-0 201250196 The heat dissipation surface of each heat sink 20 comes with the external The cold air exchanges a lot of heat, and a high-efficiency heat dissipation effect is obtained. [0017] Please refer to the eighth embodiment, which is an LED lighting device according to a second embodiment of the present invention. The main difference between the LED lighting device and the LED lighting device of the first embodiment is that the heat dissipating columns 20a are respectively from the upper plate 11 or One end surface of the lower plate 12 is extended and formed, and each of the heat dissipation columns 20a is a hollow cylinder, so that the weight of the upper and lower plates 11, 12 and the heat dissipation columns 20a can be greatly reduced, and the heat dissipation surface area can be effectively expanded. [0018] Please refer to the ninth embodiment of the LED lighting device of the third embodiment of the present invention. The main difference between the LED lighting device and the LED lighting device of the foregoing embodiments is that the heat dissipating columns 20b are from the upper plate 11 or One end surface of the lower plate 12 is extended and formed, and a shape-shaped slit 21b is formed at a central position of each of the heat-dissipating columns 20b. However, it is not limited to such a shape, and it can also be a groove of other various geometric shapes. Equivalent effect of reducing weight and amplifying heat dissipation surface area. [0019] Referring to FIG. 10, an LED lighting device according to a fourth embodiment of the present invention, the main difference between the LED lighting device and the LED lighting device of the foregoing embodiments is that the heat conducting substrate 10c is composed of a single plate body. A plurality of heat dissipating columns 20 extend on a single end surface of the heat conducting substrate 10c, and a plurality of grooves 100c are formed in the position of the heat conducting substrate 10c corresponding to the LED lighting module 5 for the heat pipes 30 to be buried, and the LED lighting module 5 is It is fixed in the accommodating area 123c. [0020] Referring to FIG. 11 , an LED lighting device according to a fifth embodiment of the present invention, the main difference between the LED lighting device and the LED lighting device of the foregoing embodiments is that the heat conducting substrate 10d is also composed of a single plate. The heat-radiating substrate 100119621 Form No. A0101 Page 7/23 pages 1002033191-0 201250196 The upper and lower end faces of the plate 10d respectively have a plurality of heat-dissipating columns 20, and the temperature-averaging plate 53 of the light-emitting module 5 is directly fixed on the heat-conducting substrate. 10d lower end face. [0021] In summary, the heat sink of the present invention and the LED lighting device having the same can achieve the intended purpose of use, and solve the lack of the prior art, and are completely in line with the invention because of the novelty and the progressiveness. The patent application requirements are filed in accordance with the Patent Law. Please check and grant the patent in this case to protect the rights of the inventor. BRIEF DESCRIPTION OF THE DRAWINGS [0022] The first drawing is an exploded perspective view of a first embodiment of the present invention. [0023] The second drawing is a combined appearance view of the first embodiment of the present invention. [0024] The third drawing is a combined top view of the first embodiment of the present invention. [0025] The fourth figure is a cross-sectional view taken along line 4_4 of the third figure. The fifth figure is a cross-sectional view taken along line 5-5 of the third figure. [0027] Figure 6 is a cross-sectional view taken along line 6-6 of the third figure.
[0028] 第七圖係第三圖之7-7剖視圖。 CJ[0028] The seventh drawing is a cross-sectional view taken along line 7-7 of the third figure. CJ
[0029] 第八圖係本發明第二實施例組合剖視圖。 [0030] 第九圖係本發明第三實施例組合剖視圖。 [0031] 第十圖係本發明第四實施例組合剖視圖。 [0032] 第十一圖係本發明第五實施例組合剖視圖。 【主要元件符號說明】 [0033] 1…散熱器 100119621 表單編號A0101 第8頁/共23頁 1002033191-0 201250196 [0034] 10、10c、lOd…導熱基板 [0035] 1 00c…凹槽 [0036] 11…上板 [0037] 1 2…下板 [0038] 111、121…貫穿孔 [0039] 112、122…槽道 [0040] 123、123c…容置區 [0041] 13…套接孔 [0042] 20、20a、20b…散熱柱 [0043] 21b…剖槽 [0044] 30…熱管 [0045] 31…蒸發段 o _] 3 2…冷凝段 [0047] 5…L E D發光模組 [0048] 51…電路板 [0049] 52 …LED [0050] 53…均溫板 [0051] 6…透光罩 100119621 表單編號A0101 第9頁/共23頁 1002033191-08 is a cross-sectional view showing a combination of a second embodiment of the present invention. [0030] A ninth drawing is a sectional view of a combination of a third embodiment of the present invention. [0010] FIG. 10 is a cross-sectional view showing a combination of a fourth embodiment of the present invention. 11 is a sectional view showing a combination of a fifth embodiment of the present invention. [Description of main component symbols] [0033] 1... Heatsink 100119621 Form No. A0101 Page 8 of 23 1002033191-0 201250196 [0034] 10, 10c, lOd... Thermally conductive substrate [0035] 1 00c... Groove [0036] 11...Upper plate [0037] 1 2... Lower plate [0038] 111, 121... Through hole [0039] 112, 122... Channel [0040] 123, 123c... accommodating area [0041] 13... Socket hole [0042 20, 20a, 20b... Heatsink [0043] 21b... Groove [0044] 30... Heat pipe [0045] 31... Evaporation section o _] 3 2... Condensation section [0047] 5... LED lighting module [0048] 51 ...circuit board [0049] 52 ...LED [0050] 53...mean temperature plate [0051] 6...transparent cover 100119621 form number A0101 page 9/total 23 page 1002033191-0