TWI686130B - Cooling module - Google Patents

Abstract

A cooling module is provided to overcome the low cooling efficiency of the conventional cooling efficiency resulting from exposing a bend to the air. The cooling module includes at least one heat pipe having a bend located between a vaporization portion and a condensed portion, at least one heat transferring board connected to the bend of the at least one heat pipe, and a cooling fin unit located on the condensed portion of the at least one heat pipe.

Description

Cooling module

The invention relates to a heat dissipation module, in particular to a heat dissipation module which dissipates heat through heat transfer of a heat pipe.

Existing central processing units and other electronic components generate a lot of heat energy during operation, which causes their own temperature to rise. Therefore, a heat dissipation module is added to the electronic component. The conventional heat dissipation module uses a heat sink The end is used to absorb the heat generated by the electronic component, and the absorbed heat is introduced into a heat dissipation fin group through a heat pipe to dissipate the heat, thereby allowing the heat dissipation module to dissipate the electronic component.

However, the heat pipe of the conventional heat dissipation module transfers heat through the heat dissipation fin set. When the heat pipe has a bent structure to meet the requirements of installation or design, the bent structure will not be able to It must pass through the heat dissipation fin set and must be exposed, resulting in poor heat dissipation efficiency of the heat dissipation module at the bending structure.

In view of this, the conventional heat dissipation modules still need to be improved.

In order to solve the above problems, an object of the present invention is to provide a heat dissipation module capable of improving the heat dissipation efficiency of the bent portion of the heat pipe, so as to further increase the overall heat dissipation efficiency.

The second object of the present invention is to provide a heat dissipation module capable of increasing the heat of the heat pipe The scope of delivery.

The directivity or its approximate terms in the entire text of the present invention, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "Side", etc., mainly refer to the directions of the attached drawings, and each directivity or its approximate terms are only used to help explain and understand the embodiments of the present invention, not to limit the present invention.

The use of the quantifier "a" or "one" in the elements and components described throughout the present invention is for convenience and provides the usual meaning of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and single The concept of also includes the plural case unless it clearly means something else.

The approximate terms "combination", "combination", or "assembly" described throughout the present invention mainly include the types that can be separated without damaging the components after connection, or the components cannot be detached after connection, which is common knowledge in the art. It can be selected according to the material or assembly requirements of the components to be connected.

The heat dissipation module of the present invention includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having a first A surface and a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel, wherein the number of the heat conducting plates is two, the two heat conduction The grooves of the plate jointly cover the outer peripheral surface of the bent portion; and a heat dissipation fin set located at the condensation portion of the heat pipe.

The heat dissipation module of the present invention includes: a heat dissipation module including: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conduction plate connected to the bent portion of the heat pipe, the The heat conducting plate has a first surface and a second surface opposite to each other, the first surface is concavely provided with a channel, the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel; and a heat dissipation fin set, Located in the condensation part of the heat pipe, the heat dissipation fin group is connected to the second surface of the heat conduction plate.

The heat dissipation module of the present invention includes: a heat dissipation module including: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conduction plate connected to the bent portion of the heat pipe, the The heat-conducting plate has a first surface and a second surface opposite to each other, the first surface is concavely provided with a channel, and the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel. The two surfaces have several convex ribs; and a radiating fin set is located in the condensation part of the heat pipe.

According to this, the heat dissipation module of the present invention can absorb the heat of the bent portion of the heat pipe through the heat conduction plate, so that the bent portion is not exposed and can fully perform heat transfer, ensuring the heat of the working liquid in the bent portion The function of being able to be transferred to the heat conduction plate can increase the heat transfer range of the heat pipe, and can increase the heat radiation efficiency of the heat radiation module without increasing the overall longitudinal height of the heat radiation module; in addition, the heat conduction plate After absorbing the heat of the bent portion of the heat pipe, the heat can be dissipated by transferring the heat to the heat dissipation fin group through the second surface, which has the effect of further improving the heat dissipation efficiency of the bent portion. The heat dissipation module of the present invention can indeed expand the heat dissipation area of the heat dissipation module and improve its heat dissipation efficiency, so as to achieve the effect of improving the heat dissipation effect of the heat dissipation module.

Wherein, the outer peripheral surface of the bent portion may have more than 25% of the area located in the channel. In this way, it has the function of ensuring that the heat of the working liquid in the bent portion can be transferred to the heat conducting plate.

Wherein, the grooves of the two heat conduction plates can completely cover the outer peripheral surface of the bending portion, and the first surfaces of the two heat conduction plates are connected. In this way, the outer peripheral surface of the bent portion can be completely covered by the two heat conductive plates, which has the effect of further improving the heat dissipation efficiency.

Wherein, the bent part of the heat pipe to the end of the condensation part may be connected to the heat conducting plate. In this way, the bent portion of the heat pipe extends to the outer peripheral surface of the condensing portion, and the heat transfer can be performed by the heat conducting plate. The heat conducting plate can cover the bent portion of the heat pipe and the condensing portion to produce more Perfect heat dissipation.

There is a straight section between the bent part and the evaporation part of the heat pipe, the heat conduction The plate can connect the bent portion and the straight section. In this way, it has the effect of increasing the heat transfer range of the heat pipe.

Wherein, the cross section of the bent portion of the heat pipe may have a circular shape or a shape with a ratio of longitudinal height to lateral width ≧0.75. In this way, it is convenient to shape to simplify the manufacturing steps, and can maintain the integrity of the capillary structure of the inner wall of the heat pipe, and avoid affecting the convection circulation of the working liquid.

Wherein, the cross section of the bent portion of the heat pipe may be in the shape of a flat tube with a ratio of longitudinal height to lateral width ≦0.5. In this way, the area connected to the heat conduction plate can be increased, which has the effect of improving the heat conduction efficiency.

Wherein, the bent portion of the heat pipe may have two opposite planes, and the heat conducting plate has a first surface attached to one of the aforementioned planes. In this way, the area connected to the heat conduction plate can be increased, which has the effect of improving the heat conduction efficiency.

1‧‧‧heat pipe

11‧‧‧Evaporation Department

12‧‧‧Condensation

13‧‧‧Bending Department

131‧‧‧plane

14‧‧‧Linear section

2‧‧‧Heat conduction board

21‧‧‧First surface

22‧‧‧Second surface

23‧‧‧Slot

24‧‧‧rib

3‧‧‧Cooling Fin Set

31‧‧‧ Fin

32‧‧‧Fixed hole

[Figure 1] An exploded perspective view of the first embodiment of the present invention.

[Figure 2] A combined plan view of the first embodiment of the present invention.

[Figure 3] A cross-sectional view of a heat pipe partially covered with a heat pipe according to the first embodiment of the present invention.

[Figure 4] A cross-sectional view of the heat pipe completely covering the heat pipe according to the first embodiment of the present invention.

[Figure 5] A cross-sectional view of the heat pipe of the first embodiment of the present invention attached to the outer peripheral surface of the heat pipe.

[Figure 6] A top view of the heat conducting plate of the first embodiment of the present invention covering a straight section.

[Figure 7] An exploded perspective view of a second embodiment of the present invention.

[Figure 8] A cross-sectional view of a heat dissipation fin assembly connected to a thermally conductive plate according to a second embodiment of the present invention.

[Figure 9] A cross-sectional view of a part of the heat dissipation fin assembly connected to the heat conducting plate of the second embodiment of the present invention.

[Figure 10] The second type of cross-sectional view of the heat dissipation fin assembly partially connected to the heat conducting plate.

[Figure 11] A partially exploded perspective view of a third embodiment of the present invention.

[Figure 12] A combination diagram of a third embodiment of the present invention.

In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, which are described in detail as follows: This is the first embodiment of the heat dissipation module of the present invention, which includes at least one heat pipe 1, at least one heat conducting plate 2 is connected between the two ends of the heat pipe 1, and one of the two ends of the heat pipe 1 has A heat dissipation fin group 3 enables the heat absorbed by the heat pipe 1 to be transferred to the heat conducting plate 2 and the heat dissipation fin group 3 for heat dissipation.

The heat pipe 1 may be made of a material with high thermal conductivity, such as copper or aluminum. The heat pipe 1 may be filled with a working liquid. The working liquid may be water, alcohol, or other low-boiling liquids, so that the working liquid can be changed from the liquid state. Absorb heat and evaporate into gas. The inner wall of the heat pipe 1 may have a capillary structure such as a wire mesh, a micro-groove, etc., to help the working liquid to return, as those skilled in the art can understand, and the present invention will not repeat them here. In detail, one end of the heat pipe 1 may have an evaporation portion 11 for absorbing the heat energy of a heat source, such as a central processing unit, or a chip on a circuit board that generates heat due to operation, etc. Electronic components, so that the working liquid in the heat pipe 1 can absorb heat in the evaporation part 11 and evaporate from the liquid state into a gas state. The end of the heat pipe 1 away from the evaporation part 11 may have a condensing part 12, whereby the working liquid will carry The heat moves toward the relatively low-temperature condensing part 12 to release the heat and return to the liquid state, so as to return to the evaporation part 11 to absorb the heat and form a convection cycle. In this embodiment, the number of the heat pipes 1 can be several, so that the heat elements 1 can simultaneously transfer heat to the electronic component; each of the heat pipes 1 can have at least one between the evaporation portion 11 and the condensation portion 12 The bent portion 13 allows the heat pipes 1 to be respectively The bent portion 13 extends in different directions to meet the design requirements, and each of the condensing portions 12 has sufficient heat dissipation space to improve the heat dissipation efficiency of the electronic component.

Please refer to FIGS. 3, 4, and 5, the cross-section of the bent portion 13 of the heat pipe 1 may have any geometric shape, and the present invention is not limited thereto. In this embodiment, the bent portion 13 may have a longitudinal height and a transverse width (in the direction of the drawing) passing through the center of the cross section, and the ratio of the longitudinal height to the transverse width is ≧0.75, so that the bent portion The cross-section of 13 may be slightly rounded (as shown in Figures 3 and 4). The cross-section may preferably be a perfect circle to facilitate forming to simplify the manufacturing process and maintain the integrity of the capillary structure of the inner wall of the heat pipe. Avoid affecting the convection circulation of the working liquid; or the ratio of the longitudinal height to the lateral width is ≦0.5, so that the cross section of the bent portion 13 can be in the shape of a flat tube (as shown in FIG. 5), so that the bent portion 13 There may be two opposite planes 131, that is, the two planes 131 are longitudinally opposed to the outer peripheral surface of the bent portion 13 in the direction of the drawing, and the two planes 131 can increase the area connected to the heat conducting plate 2, This has the effect of improving the thermal conductivity.

Please continue to refer to FIG. 1, the heat-conducting plate 2 can connect the bent portion 13 of the heat pipe 1 with heat conduction, so as to dissipate heat from the bent portion 13. In detail, each of the heat conductive plates 2 may have a first surface 21 and a second surface 22 opposite to each other. The first surface 21 is used to be attached to the outer peripheral surface of the bending portion 13 to directly absorb the bending The heat of the working liquid in the folded portion 13 dissipates the heat through the second surface 22. In this embodiment, the first surface 21 may have at least one channel 23 corresponding to the bent portion 13, and the channel 23 may be formed by recessing the first surface 21 so that the first surface 21 can be formed by The wall surface of the channel 23 is correspondingly connected to the outer peripheral surface of the bent portion 13.

Please refer to FIG. 3 and FIG. 4 again. For example, when the cross-section of the bending portion 13 is slightly round, the cross-section of the wall surface of the channel 23 can form an arc surface, and the arc surface corresponds to the For the portion of the outer peripheral surface of the bent portion 13, when there is only one thermally conductive plate 2, the outer peripheral surface of the bent portion 13 can have an area of more than 25% located in the channel 23, thereby ensuring the bent portion The heat of the working liquid in 13 can be transferred to the function of the heat conducting plate 2.

It is worth noting that the number of the heat conducting plates 2 can be two, so that the bending portions 13 of the heat pipe 1 are sandwiched by the two heat conducting plates 2; that is, the first surfaces 21 of the two heat conducting plates 2 can be respectively With the groove 23, the bending portion 13 can be sandwiched between the grooves 23 of the two heat-conducting plates 2, so that the grooves 23 of the two heat-conducting plates 2 collectively cover the outer peripheral surface of the bending portion 13, In this way, the outer peripheral surface of the bending portion 13 can have an area of more than 50% in the groove 23 (as shown in FIG. 3) opposite to the two heat-conducting plates 2, and preferably the two grooves 23 The outer peripheral surface of the bent portion 13 (as shown in FIG. 4) can be completely covered to connect the first surfaces 21 of the two heat-conducting plates 2, whereby the outer peripheral surface of the bent portion 13 can be completely The two heat-conducting plates 2 are coated to further improve the heat dissipation efficiency. In addition, the first surface 21 of the heat conducting plate 2 and the bent portion 13 can be soldered by applying solder paste, whereby the outer peripheral surface of the bent portion 13 and the first surface 21 of the heat conducting plate 2 need not be Especially matched to each other, or the first surface 21 may not have the channel 23, or the gap between the first surface 21 and the bent portion 13 may be filled by the high coverage and moldability of the solder paste The gap increases the heat transfer area of the first surface 21 and the bent portion 13 to achieve a good heat transfer effect.

In addition, referring to FIG. 6, a straight section 14 may be provided between the bent portion 13 and the evaporation portion 11 of the heat pipe 1, and the heat conducting plate 2 may also extend from the bent portion 13 to be connected to the straight section 14, so as to increase the heat absorption range of the heat pipe 1 by the heat conduction plate 2, the heat conduction plate 2 is preferably separated from the evaporation portion 11 on the linear section 14 to avoid the heat conduction plate 2 being too close to the The evaporation part 11 affects the phase change of the working liquid in the heat pipe 1 and reduces the overall heat dissipation efficiency.

Please continue to refer to Figures 1 and 2, the heat dissipation fin group 3 is located in the condensation part 12 of the heat pipe 1, so that the gaseous state of the working liquid can dissipate heat in the condensation part 12 to return to a liquid state; The arrangement form of the heat sink fin group 3 is not limited, it can receive the heat carried by the working fluid of the heat pipe 1 and dissipate it, or it can be blown by a cooling fan to improve the heat dissipation . In this embodiment, the condensation sections 12 of the heat pipes 1 can be bent by each The portion 13 extends in two opposite directions to have opposite heat dissipation fin groups 3. In detail, the heat dissipation fin group 3 may have a plurality of heat dissipation fins 31, and the heat dissipation fins 31 may be stacked on top of each other so as to have a gap or are arranged at intervals, etc. The heat dissipation fins 31 can be arranged in parallel, and each of the heat dissipation fins 31 can have a fixing hole 32 for the condensation part 12 of the heat pipe 1 to pass through. In addition, the condensation part 12 of the heat pipe 1 can also be Solder paste is fixed in the fixing hole 32.

Please refer to FIGS. 7 to 10, which is the second embodiment of the heat dissipation module of the present invention. The heat dissipation fin group 3 can be extended to be connected to the second surface 22 of the heat conducting plate 2, whereby the heat conducting plate 2 After absorbing the heat of the bent portion 13 of the heat pipe 1, the second surface 22 can transfer the heat to the heat dissipation fin group 3 for dissipation, which has the effect of further improving the heat dissipation efficiency of the bent portion 13, and When the number of the thermally conductive plates 2 is two and is clamped to the bent portion 13, the heat dissipation fin group 3 can be selectively connected to the second surfaces 22 of the two thermally conductive plates 2 (as shown in FIG. 8) In order to achieve the effect of further improving the heat dissipation efficiency, or only connected to the second surface 22 of one of the heat conducting plates 2 (as shown in FIG. 9), so as to reduce the overall longitudinal height of the heat dissipation module to achieve miniaturization Role. In addition, the second surface 22 of the thermally conductive plate 2 can choose not to connect to the heat dissipation fin group 3, but has a plurality of ribs 24, which can increase the surface area of the second surface 22 to increase The heat dissipation efficiency of the heat conducting plate 2 (as shown in Fig. 10). For example, the ribs 24 may be straight ribs or wavy ribs arranged parallel to each other, and extend from one edge to the other edge of the second surface 22, or the ribs 24 may be staggered. In order to connect with each other, the plurality of convex ribs 24 may also be short ribs arranged in sequence in a truncated shape, or needle ribs in a near-cylindrical shape, the invention is not limited herein, and according to this, the heat dissipation Under the premise of the overall longitudinal height of the module, it further improves the efficiency of heat dissipation.

Please refer to Figs. 11 and 12, which is the third embodiment of the heat dissipation module of the present invention. The bent portion 13 of the heat pipe 1 to the end of the condensing portion 12 are connected to the heat conducting plate 2, that is, the heat conduction The plate 2 extends from the bent portion 13 to the condensing portion 12, whereby the outer surface of the bent portion 13 of the heat pipe 1 extends all the way to the outer peripheral surface of the condensing portion 12 For heat transfer, at this time, the heat dissipation fin group 3 can be connected to the second surface 22 of the heat conducting plate 2 to dissipate heat to produce a more perfect heat dissipation effect. The heat dissipation fins of the heat dissipation fin group 3 The sheet 31 does not need to provide fixing holes 32 for the condensing part 12 to pass through, which has the effect of improving manufacturing convenience.

In summary, the heat dissipation module of the present invention can absorb the heat of the bent portion of the heat pipe through the heat conduction plate, so that the bent portion is not exposed and can fully perform heat transfer. In addition, the heat transfer plate can also cover the bent portion, the condensation portion, and the linear section between the bent portion and the evaporation portion of the heat pipe to increase the heat transfer range of the heat pipe to improve the heat dissipation mold Group cooling efficiency. It is also known from the experimental results that after the conventional heat dissipation module dissipates the electronic component, the measurable temperature of the electronic component is 74.2~77°C, and the heat dissipation module of the present invention absorbs the bending of the heat pipe through the heat conduction plate The heat of the folded part is dissipated, and the temperature of the electronic component is measured to be about 67.3°C, which is 6.9~9.7°C lower than that of the conventional heat dissipation module. The heat dissipation module of the present invention can indeed expand the heat dissipation The heat dissipation area of the module and increase its heat dissipation efficiency to achieve the effect of improving the heat dissipation effect of the heat dissipation module.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with this art without departing from the spirit and scope of the present invention still makes various changes and modifications to the above-mentioned embodiments. The technical scope of the invention is protected, so the scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

1‧‧‧heat pipe

13‧‧‧Bending Department

14‧‧‧Linear section

2‧‧‧Heat conduction board

21‧‧‧First surface

22‧‧‧Second surface

23‧‧‧Slot

3‧‧‧Cooling Fin Set

31‧‧‧ Fin

32‧‧‧Fixed hole

Claims (10)

A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel, wherein the number of the heat conducting plates is two, and the number of the two heat conducting plates The grooves collectively cover the outer peripheral surface of the bent portion; and a heat dissipation fin set is located in the condensation portion of the heat pipe. The heat dissipation module as described in item 1 of the patent application scope, wherein the outer peripheral surface of the bent portion has more than 25% of the area located in the channel. The heat dissipation module as described in item 1 of the patent application scope, wherein the grooves of the two heat conducting plates completely cover the outer peripheral surface of the bent portion, and the first surfaces of the two heat conducting plates are connected. A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel; and a heat dissipation fin set is located in the condensation portion of the heat pipe, the heat dissipation The fin set is connected to the second surface of the heat conducting plate. A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, and the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel, wherein the second surface of the thermally conductive plate has a plurality of ribs; and A heat dissipation fin set is located in the condensation part of the heat pipe. The heat dissipation module as described in any one of the items 1 to 5 of the patent application range, wherein the bending part of the heat pipe to the end of the condensation part are connected to the heat conducting plate. The heat dissipation module as described in any one of claims 1 to 5, wherein the heat pipe has a straight section between the bent portion and the evaporation portion, and the heat conducting plate connects the bent portion and the linear area segment. The heat dissipation module according to any one of claims 1 to 5, wherein the cross section of the bent portion of the heat pipe has a circular shape, or a shape with a ratio of longitudinal height to lateral width ≧0.75. The heat dissipation module as described in item 1 of the patent application scope, wherein the cross section of the bent portion of the heat pipe is in the shape of a flat tube with a ratio of longitudinal height to lateral width ≦0.5. The heat dissipation module as described in item 9 of the patent application range, wherein the bent portion of the heat pipe has two opposite planes, and the heat conducting plate has a first surface attached to one of the aforementioned planes.

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