CN2877035Y - An elevated suspended cooling component - Google Patents
An elevated suspended cooling component Download PDFInfo
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- CN2877035Y CN2877035Y CN 200520143163 CN200520143163U CN2877035Y CN 2877035 Y CN2877035 Y CN 2877035Y CN 200520143163 CN200520143163 CN 200520143163 CN 200520143163 U CN200520143163 U CN 200520143163U CN 2877035 Y CN2877035 Y CN 2877035Y
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- 238000001816 cooling Methods 0.000 title description 12
- 238000009423 ventilation Methods 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 27
- 239000000725 suspension Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
技术领域:Technical field:
本实用新型涉及散热设备技术领域,特指一种应用于电脑中央处理器等热源上的高架悬空式的散热构件。The utility model relates to the technical field of heat dissipation equipment, in particular to an overhead suspended heat dissipation component applied to heat sources such as computer central processing units.
技术背景:technical background:
目前应用于电脑中央处理器等热源上的散热构件,如图1所示;含有接热基座71、若干导热管72、散热片组73以及风扇74等元件;其中,各导热管72的一端固定于接热基座71上,而另一端从接热基座71一侧向上弯伸,并使各导热管72的末段弯曲成与接热基座71呈一水平状,以嵌接于散热片组73中;并使该风扇74装置于散热片组73的顶面上。Currently applied to heat dissipation components such as computer central processing units and other heat sources, as shown in FIG. It is fixed on the heat-connecting base 71, and the other end is bent upward from one side of the heat-connecting base 71, and the end section of each heat pipe 72 is bent to be horizontal with the heat-connecting base 71, so as to be embedded in the heat-connecting base 71. and make the fan 74 installed on the top surface of the heat sink set 73 .
上述现有的散热构件,其散热片组73由多片散热片组成,且使投影于接热基座71的散热片底部731跨置于接热基座71上;如此便可使接热基座71所搭接的热源75的热能,从导热管72及与接热基座71所接触的散热片,传递至整个散热片组73上而向外散热。In the above-mentioned existing heat dissipation member, its heat sink group 73 is composed of multiple heat sinks, and the bottom 731 of the heat sink projected on the heat base 71 is placed across the heat base 71; The thermal energy of the heat source 75 overlapped by the base 71 is transferred from the heat pipe 72 and the heat sink in contact with the heat base 71 to the entire heat sink group 73 to dissipate heat outward.
前述现有的散热构件其散热片组73是由若干呈密集列状的散热片所组成;由于两相邻散热片之间槽道极小,外界自然风并不易流入;因此,通常会通过由风扇所产生的气流吹向散热片组73,而将散热片间的热能向外带出;然而,由于该现有的散热片组73的底部是若干跨置结构接于接热基座71上,外界的冷空气无法流入散热片组73的中央部分;因此,当风扇74所产生的气流吹向散热片组73的各散热片后,便将散热片所散出的高温空气又循着两相邻散热片间的槽道直接吹向接热基座71;因此,造成现有散热构件的散热效果大打折扣。The heat sink group 73 of the aforementioned existing heat dissipation components is composed of a number of heat sinks in a dense row; because the channels between two adjacent heat sinks are extremely small, the natural wind from the outside is not easy to flow in; The airflow produced by the fan is blown to the cooling fin group 73, and the heat energy between the cooling fins is taken out; yet, because the bottom of the existing cooling fin group 73 is a number of straddling structures connected to the heat base 71 Therefore, when the airflow produced by the fan 74 is blown to each cooling fin of the cooling fin group 73, the high-temperature air emitted by the cooling fins will follow the two sides again. The channels between the adjacent heat sinks are directly blown to the heat base 71; therefore, the heat dissipation effect of the existing heat dissipation components is greatly reduced.
实用新型内容:Utility model content:
本实用新型解决的技术问题在于提供一种可以使外界的冷空气可以自由流通于散热片组与接热基座间的中空区域,从而将接热基座上的热能快速向外散热的高架悬空式散热构件。The technical problem to be solved by the utility model is to provide a kind of overhead suspension that can make the cold air from the outside freely circulate in the hollow area between the heat sink group and the heat-connected base, so that the thermal energy on the heat-connected base can be quickly dissipated outward. heat dissipation components.
本实用新型的技术问题是通过如下技术方案实现的:主要包括有接热基座,搭接于热源上;导热管,含有搭接段,搭接与接热基座上;自由段,该自由段从接热基座的侧缘向上突伸;若干散热片组成的散热片组,连接导热管;以及,风扇;跨置于散热片组上,其出风方向吹向散热片组两相邻散热片间的通风走道;散热片组位于接热基座上方,散热片组各相邻两散热片间构成的通风走道指向接热基座;该散热片组底部与接热基座间相隔有间距而呈架高悬空状,构成中空区域。The technical problem of the utility model is achieved through the following technical solutions: mainly including a heat-connecting base, which is lapped on the heat source; The section protrudes upwards from the side edge of the heat-connecting base; the heat sink group composed of several heat sinks is connected to the heat pipe; The ventilation passage between the heat sinks; the heat sink group is located above the heat-connecting base, and the ventilation passage formed between two adjacent heat-radiating fins of each heat-radiating fin group points to the heat-connecting base; the bottom of the heat sink group is separated from the heat-connecting base by The spacing is elevated and suspended, forming a hollow area.
还包括有一风扇固定框架,锁固于散热片组的顶端;在该风扇固定框架顶端面上设有一通风口;并于该顶端面上穿设有若干固定孔,以锁接风扇;使风扇可以稳固地锁接于风扇固定框架上,并置于散热片组的上方。It also includes a fan fixing frame, which is locked on the top of the heat sink group; a vent is provided on the top surface of the fan fixing frame; and a number of fixing holes are pierced on the top surface to lock the fan; the fan can It is firmly locked on the fan fixing frame and placed above the heat sink group.
在接热基座上锁接有若干导热管的搭接段;各导热管呈ㄈ形状,从接热基座的两侧向外伸置;该各导热管的自由段的末段呈水平状态,投影地伸置于接热基座的上方,并分别嵌置于若干组散热片组中,而将各散热片组呈悬空状地架高于接热基座的上方。There are overlapping sections of several heat-conducting pipes locked on the heat-connecting base; each heat-conducting pipe is in the shape of ㄈ, extending outward from both sides of the heat-connecting base; the end section of the free section of each heat-conducting pipe is in a horizontal state projectively placed above the heat-connecting base, and respectively embedded in several groups of heat sinks, and each heat-radiating fin group is suspended above the heat-connecting base.
本实用新型利用导热管将散热片组架高、悬空于接热基座上方,形成中空区域;使本实用新型的散热构件可因外界的冷空气可以不受阻碍的流通于散热片组的各散热片之间及散热片组与接热基座间所构成的中空区域;而产生强劲的对流,使热源所产生的热能可以迅速被带离至外界,获得较佳的散热效果。The utility model utilizes the heat conduction tube to raise the heat sink group and suspend it above the heat receiving base to form a hollow area; the heat dissipation component of the utility model can be circulated unhindered by the external cold air in each part of the heat sink group. The hollow area formed between the heat sinks and between the heat sink group and the heating base generates strong convection, so that the heat energy generated by the heat source can be quickly taken away to the outside world, and a better heat dissipation effect is obtained.
附图说明:Description of drawings:
下面结合附图对本实用新型进一步说明:Below in conjunction with accompanying drawing, the utility model is further described:
附图1是现有散热构件侧视示意图;Accompanying
附图2是本实用新型散热构件局部分解图;Accompanying drawing 2 is a partial exploded view of the heat dissipation component of the present utility model;
附图3是本实用新型散热构件立体图;Accompanying drawing 3 is the three-dimensional view of heat dissipation member of the present utility model;
附图4是本实用新型散热构件侧视图。Accompanying drawing 4 is a side view of the heat dissipation component of the present invention.
附图图号说明Description of drawings and numbers
接热基座 10 座体 11
导热管承载部 111 固定压板 12Heat
扣具槽 121 导热管 20Buckle
搭接段 21 自由段 22
末段 221 散热片组 30
散热片 31 风扇固定框架 32Heat sink 31
通风口 321 固定孔 322
风扇 40 热源 50
具体实施方式:Detailed ways:
见附图2、3、4所示,本实用新型主要包括有接热基座10、导热管20、散热片组30及风扇40;其中散热片组30被导热管20所架高,并悬空地投影位于接热基座10上,使外界的冷空可以流通于散热片组30底部及接热基座10间所形成的中空区域,而将接热基座10上的热能迅速带离,以增强散热效率。接热基座10含有一座体11,可紧固地搭接于热源50上,如主机板的中央处理器等;在该座体11上形成有一导热管承载部111,以承接导热管20的搭接段21跨置于其上;接热基座10还含有一固定压板12,其底部跨置于导热管20的搭接段21上,并锁固于座体11上,以与该座体11紧夹、固定导热管20的搭接段21。As shown in accompanying drawings 2, 3 and 4, the utility model mainly includes a heat receiving
上述本实用新型的接热基座10,在固定压板12的顶端形成有一扣具槽121,以供稳定地跨置扣具(图中未示出),并通过该扣具将接热基座10的座体11紧贴于热源50上;使热源的热能可以经由热导作用传递至接热基座10上,并从导热管20传递至散热片组30上。扣具结构及接热基座10与热源50的搭接固定方式,并不限于本前述描述。The above-mentioned
本实用新型的导热管20,如图2、3所示,其含有一紧固于接热基座10上的搭接段21,并使导热管20的自由端段22从接热基座10的侧缘向上突伸,且使该自由段22的末段221弯曲成水平状,并投影于接热基座10的上方。The
本实用新型的散热片组30是由若干散热片31组成的,其与导热管20的自由段22的呈水平状的末段221连接,并投影地位于接热基座10的上方;且使各相邻两散热片31间的通风走道指向接热基座10;如此,当启动风扇40后,除了可使产生的空气流穿散热片31间的通风走道后再吹向接热基座之外,还能够通过散热片组30与接热基座10之间所呈现的架高悬空状而构成中空区域,使外界的冷空气可以自由流通于此中空区域;从而将接热基座10上的热能更快速地向外散热,以大幅度增进散热效率。The
本实用新型的散热构件还可包括有一风扇固定框架32,锁固于散热片组30的顶端;在该风扇固定框架32顶端面上设有一通风口321;并于该顶端面上穿设有若干固定孔322,以锁接风扇40;使风扇40可以稳固地锁接于风扇固定框架32上,并置于散热片组30的上方。The heat dissipation component of the present utility model can also include a
本实用新型的散热构件,如图2、3所示,在接热基座10上锁接有若干导热管20的搭接段21,并使各导热管20呈ㄈ形状,从接热基座10的两侧向外伸置;其各导热管20的自由段22的末段221呈水平状态,投影地伸置于接热基座10的上方,并分别嵌置于若干组散热片组30中,而将各散热片组30呈悬空状地架高于接热基座10的上方,也使各散热片组30的底部与接热基座10间相隔一距离,并使各散热片组30的两相邻散热片31间所构成的通风走道指向接热基座10;前述描述并不限制导热管20及散热片组30的数量。The heat dissipation member of the present utility model, as shown in Figures 2 and 3, is locked with overlapping
本实用新型的各散热片组30被若干导热管20向上架高,并使各散热片组30的底部与接热基座10间呈一中空区域;也即使各散热片组30呈悬空状,投影地位于接热基座10的上方;如此,当热源50的热能向上传递至接热基座10时,该接热基座10上的热能可以马上与介于散热片组30与接热基座10间所构成的中空区域的外界冷空气产生散热;而经导热管20传递至散热片组30的热能除了可辐射散热外,也可通过散热片组30上方的风扇40启动,使所产生的气流施予散热;如图4箭头所标示的气流流动方向;使本实用新型的散热构件可因外界的冷空气可以不受阻碍的流通于散热片组30的各散热片31之间及散热片组30与接热基座10间所构成的中空区域;而产生强劲的对流,使热源50所产生的热能可以迅速被带离至外界,获得较佳的散热效果。Each
前述描述并不是对本实用新型结构、元件的限制,凡依前述描述所做之均等变化,皆应属于本实用新型之保护范围。The foregoing description is not a limitation to the structure and components of the present utility model, and all equivalent changes made according to the foregoing description shall fall within the scope of protection of the present utility model.
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CN 200520143163 CN2877035Y (en) | 2005-11-15 | 2005-11-15 | An elevated suspended cooling component |
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CN 200520143163 CN2877035Y (en) | 2005-11-15 | 2005-11-15 | An elevated suspended cooling component |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101452897B (en) * | 2007-12-05 | 2011-03-30 | 富准精密工业(深圳)有限公司 | Heat radiating device for LED |
CN101409996B (en) * | 2007-10-11 | 2012-05-23 | 曜越科技股份有限公司 | A method of manufacturing a cooling module |
TWI396462B (en) * | 2007-12-21 | 2013-05-11 | Foxconn Tech Co Ltd | Heat dissipation device for leds |
-
2005
- 2005-11-15 CN CN 200520143163 patent/CN2877035Y/en not_active Ceased
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101409996B (en) * | 2007-10-11 | 2012-05-23 | 曜越科技股份有限公司 | A method of manufacturing a cooling module |
CN101452897B (en) * | 2007-12-05 | 2011-03-30 | 富准精密工业(深圳)有限公司 | Heat radiating device for LED |
TWI396462B (en) * | 2007-12-21 | 2013-05-11 | Foxconn Tech Co Ltd | Heat dissipation device for leds |
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