1357282 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種平板顯示裝置及其製造方法。 【先前技術】 近年來，作為各種電子設備的顯示部或配置在室内外如 顯示裝置，開始廣泛採用平板顯示裝置。作為該平板顯呆 裝置，已經開發出液晶顯示裝置（LCD:Liquid Crystal display)、等離子顯示裝置（PDP:Plasma Display Panel)、有機 EL(electroluminescence)顯示裝置、電場放射顯示裝置 (FED:Field Emission Display)等各種產品。 這些平板顯示裝置的顯示原理雖然不同，但均具有在支 撐基板上形成密封空間的結構。該密封空間的作用根據各 顯示裝置的顯示原理而不同，但在密封空間内形成顯示功 能部這一點上，各顯示裝置具有共同的結構。因此，這些 平板顯示裝置具有下述相同結構：在支撐基板上形成把構 成形成在密封空間内的顯示功能部的電極引出到密封空間 外併連接驅動電路的引出布線。 另一方面，這些平板顯示裝置為了實現電子設備的小 型•高性能化或提高顯示性能，正在向彩色化、高分辨率 的方向推進，相應地不得不進行顯示功能部的電極和引出 布線的細線化和高密度化。此時，作為構成顯示功能部的 電極，為了確保良好的顯示性能，不得不選擇特定的電極 材料，但作為引出布線的材料，盡可能地選擇低電阻材料 對提高顯示性能是很重要的。 95520.doc 1357282 一般，作為低電阻的布線材料使用鋁（A1)或鉻（Cr)系列材 料，但隨著布線的鈿線化的推進，要求使用電阻更低的銀 (Ag)或銀5金。但是，Ag系列材料與μ或心相比容易腐钱， 例如在專利文獻1記載的以往示例令，利用具有由Ag或Ag 合金構成的層和由Cu或Cu合金構成的層的疊層體來形成 引出布線》 . 專利文獻1特開2003·58079號公報 如上述的以往示例那樣，把引出布線形成為雙層結構， 在表層形成Cu系歹4金屬層，由此可以防止因Ag系列材料構 ^的層的腐姓造成的劣化。但是’在把Ag系列材料用於高 始、度1線的布線材料，不僅存在著劣化的問題，而且還 存在者發生遷移現象的問題。隨著該遷移現象的持續存 在’使金屬從與由絕緣材料構成的支撑基板接觸的布線的 _ P或側°卩在支撑基板上移動’造成與相鄰布線的連接， 所以僅依靠在表層形成保護層，不能防止因 成的布線不良。 用了避免因這種遷移現象造成的布線不良，可以認為矛 .、不生遷移的絕緣材料將布線整體覆蓋是有效的2 2可是，在支撑基板上具有密封空間的平板顯示裝置中 二過點接層把密封部㈣接在支樓基板上來形成密封兰 ^引Π封料的端部㈣被安裝成其—部分覆蓋從㈣ :部的引出布線上，所以在這種情以，不能對位於驾 後-面的引出布線進行充分的覆蓋，在從枯接層引i 各易在引出布線產生覆蓋不良部位⑶出布線的露出旬 95520.doc 1357282 位）。 』Γ"在度布線的由Ag系列低電阻 板顯示裝置的引出^ *电阻材#構成的斗 從形成密封空間 +的拈接狀態，在 出的狀態，且有因腐：接層引出布線後，形成布線露 成的布線不良的問題。 4生因遷移現象等造 【發明内容】 本發明將料這種_作為—個課題。即 的在於，針對平柘g 發月的目 t于+板顯不裝置的引出布線，在從 間的外緣的粘接層引出後— '工 布魄，…土 覆盍，從而形成高密度 :1劣！ g系列低電阻材料時，也不會產生因腐 遷移現象等造成的布線不良，並且，由此提 仏-種南精細且不易產生布線不良的平板顯示裝置。 為了達到上述目的’本發明的平板顯示裝置及其製造方 法至少具備以下各項發明的結構。 本發明的平板顯示裝置為，通過使㈣接層枯接支樓基 =和密封部件，在所述支縣板上形成密封空間，併在該 密封空間内形成顯示功能部’其特徵在於，具有：引出布 線，從構成所述顯示功能部的電極通過所述粘接層被引出 到所述密封空間外，在所述密封空間外面的支撐基板上形 成規定的布線圖形；.和覆蓋層，設在該引出布線的至少所 述粘接層附近，覆蓋所述引出布線，形成重疊了所述粘接 層和所述覆蓋層的疊層部分，該疊層部分的寬度大於等於 所述粘接層或所述覆蓋層的厚度，所述疊層部分的厚度至 95520.doc 1357282 少大於等於所述覆蓋層的厚度。 本發明的平板顯示裝置的製造方法，用於製造通過使用 粘接層粘接支撐基板和密封部件，在所述支撐基板上形成 密封空間，併在該密封空間内形成顯示功能部的平板顯示 裝置其*^徵在於，對於從構成所述顯示功能部的電極通 過所述枯接層被引出到所述密封空間外，併在所述密封^ 間外的支撐基板上形成規定的布線圖形的引出布線，在所 述粘接層附近形成覆蓋該引出布線的覆蓋層，形成重疊了 所述粘接層和所述覆蓋層的疊層部分，使該疊層部分的寬 度大於等於所述粘接層或所述覆蓋層的厚度，併使所述疊 層部分的厚度至少大於等於所述覆蓋層的厚度。 【實施方式】 以下’參照附圖說明本發明的實施方式。圖1是表示本發 明的一實施方式的平板顯示裝置的特徵結構部分的說明 圖。在該圖中’平板顯示裝置10通過粘.接層3粘接支撐基板 1和密封部件2，由此在支撐基板1上形成密封空間4，併在 密封空間4形成省略圖示的顯示功能部β 並且’引出布線5從構成省略圖示的顯示功能部的電極通 過粘接層3被引出到密封空間4外面，在密封空間4外面的支 撐基板1上形成規定的布線圖形，並且覆蓋引出布線5的覆 盍層6設在引出布線5的至少粘接層3的附近。另外，形成將 .钻接層3和覆蓋層6疊合而成的疊層部分a，該疊層部分a的 寬度W形成為大於等於粘接層3的厚度以或覆蓋層6的厚度 d2，疊層部分a的厚度〇形成為至少大於等於覆蓋層6的厚 95520.doc 1357282 度d2»特別在圖丨的實施方式甲，疊層部分A是通過在粘接 層3的外側部分上疊層覆蓋層6而形成的。 作為該平板顯示裝置10，可以用作移動電話、個人計算 機、數碼相機等電子設備的顯示部，也可以作為顯示裝^ 單獨配置在室内外。 . 並且，作為形成於密封空間4的顯示功能部，由液晶顯示 面板、有機EL顯示面板、PDP、FED等構成，例如，在由 液晶顯示面板構成的情況下，密封空間4成為填充液晶材料 的二間，在由另機EL顯示面板構成的情況下，密封空間4 成為把有機EL元件與外氣隔絕的空間，在由pDp構成的情 況下’密封空間4成為形成放電單元的空間。 根據具有這種特徵的平板顯示裝置1〇 ’設有將粘接層3 和覆蓋層6疊合而成的疊層部分A，所以引出布線5至少不曰會 在粘接層3附近露出，可以排除在密封部件2的外側端部^ 近容易產生的引出布線5的腐蝕或因移動造成的布線不 良。由此，_在使引出布線5的布線圖形高密度化，實現各布 線的細線化的情況下，可以使用八§等低電阻材料而不用擔 心布線不良，所以能夠良好地確保引出布線5的導通性，二 月匕 夠提高平板顯示裝置1 〇的顯示性能。 此時，疊層部分A的寬度w和粘接層3的厚度di'覆.蓋層6 的厚度d2的尺寸關係是Wgdl4Wgd2。這是因為粘接層3 和覆蓋層6—般是由不同材料形成的’疊層部分八的接合面 成為不同材料之間的接合，但難以確保足夠的粘接力。因 此，為了確保足夠的粘接力並且不產生引出布線的露出， 95520.doc -10- 1357282 需要根據上述的尺寸關係形成具有足夠寬度的疊層部分A。 並且，疊層部分A的厚度D和覆蓋層6的厚度d2的尺寸關 係是D 2 d2。該關係通過如圖所示形成疊層部分A而必然能 夠實現’因此，即使是不同材質的疊層部分，也可以在至 少枯接層3的附近把引出布線5與外氣可靠隔絕，由此能夠 充分確保相對水分等的保護功能。 圖2是說明上述實施方式的平板顯示裝置1〇的製造方法 的說明圖❶本實施方式的製造方法是用於製造通過粘接層3 枯接支撐基板1和密封部件2,由此在所述支撐基板1上形成 密封空間4，併在該密封空間4形成省略圖示的顯示功能部 的平板顯示裝置1〇的製造方法，對於從構成省略圖示的顯 示功邊部的電極通過粘接層3被引出到密封空間4外，併在 密封空間4外面的支撐基板1上形成規定的布線圖形的引出 布線5，形成在粘接層3的附近覆蓋引出布線5的覆蓋層6， 幵/成將粘接層3和覆蓋層6疊合而成的疊層部分a,疊層部分 A的寬度W形成為大於等於粘接層3或覆蓋層6的厚度以、 d2，並且疊層部分A的厚度D形成為至少大於等於覆蓋層6 的厚度d2。特別是，在圖2所示的實施方式中，疊層部分a 的形成疋在形成粘接層3之後，在粘接層3的外側部分上疊 層覆蓋層6。 ι 、以下’根據圖2進行更詳細的說明。此處，以下述形成; 法為例進行說明’即’通過支樓基板丨和密封部件 在支標基板1上形成多個密封空間，在枯接後在設定密封名 件2的部位切斷’但作為本發明的實施方式，不限於此。 95520.doc 1357282 首先，在該圖的⑷中，在支撐基板1上利用規定的布線圖 形形成引出布線5。引出布線5的形成可以在與構成顯示功 能部的電極相同的工序形成，也可以另外僅形成布線圖形 5。通過把該引出布線5從構成顯示功能部的電極直接引出 或使其與電極連接，在支撐基板1上形成圖形。 . 對此，如該圖的（b)所示，把塗覆了粘接層3的密封部件2 面對面地粘接在支撐基板1上。在密封部件2中與支撐基板i 相對的表面，形成用於形成密封空間4的密封用凹部2A，.在 其周圍塗覆粘接層3。在粘接層3的塗覆區域外側形成切斷C 用凹部2B。此處，表示在密封部件2側形成粘接層3的示例， 但也可以在支撐基板丨側的粘接區域形成粘接層3。 如該圖的（c)所示’在粘接支撐基板1和密封部件2時，按 壓支撐基板1和密封部件2，以使粘接層3滲出到外側。由 此，具有相當於上述的疊層部分八的寬度…的寬度的滲出部 3a形成在切斷用凹部2B内。切斷用凹部2B形成為，即使在 形成有該滲出部3a的情況下，也能在切斷部位c良好地切斷 而不受粘接層3的影響》 匕 在支樓基板1上形成粘接層3，在位於切斷用凹部2B的端 部的切斷部位C利用劃線法等切斷密封部件2。然後，如該 圖的（d)所示’利用覆蓋層6覆蓋钻接層3附近的引出布線$ , ‘ 以使覆盍層6的端部重疊在滲出部3&上。並且，通過在粘接· 層3的外側部分上疊層覆蓋層6，形成疊層部分a。此時，通 過按前面所述確保滲出部3a的寬度，可以形成寬度為％的 疊層部分A ’並且通過將覆蓋層6可靠地重疊在滲出部3a 95520.doc • 12- 1357282 上，而形成上述厚度D的疊層部分A。 圖3是說明本發明的其他實施方式的平板顯示裝置及其 衣la方法的δ兑明圖（對和上述實施方式相同的部分賦予相 同符號併省略部分說明）。根據該實施方式，上述的疊層 邓分Α疋在形成粘接層3的粘接區域s的覆蓋層6上疊層粘接 層3而形成的，是通過在形成覆蓋層^之後，在形成粘接層3 的钻接區域S的霜篆丨，β 復盡層6上豐層粘接層3來進行疊層部分Α的 形成。 即如該圖的⑷所*，首先，相對作為通過枯接支撐基 板#⑧封#件2而在支擇基板j上形成點接層3的钻接區域 七成覆蓋層6 ’以使端部6a進人其内側。此處形成於點接 的端B[j6a6^寬度形成為相當於上述的疊層部分a的 寬度W。 然仗’通過枯接支擇基板i和密封部件2，在覆蓋層6的端 ㈣上疊層㈣層3,形成疊層部分A。之後，在枯接層3 的外側的切斷部位C切斷密封部件2。此時，可以不受點接 層3影響，進行切斷，所以沒有必要在密封部件⑽成切斷 用凹部》 這樣形成的平板顯示裝置10如該圖的⑷所示，在钻接區1357282 IX. Description of the Invention: [Technical Field] The present invention relates to a flat panel display device and a method of fabricating the same. [Prior Art] In recent years, as a display unit of various electronic devices or as a display device indoors and outdoors, a flat panel display device has been widely used. As the flat panel display device, a liquid crystal display device (LCD: Liquid Crystal display), a plasma display device (PDP: Plasma Display Panel), an organic EL (electroluminescence) display device, and an electric field emission display device (FED: Field Emission Display) have been developed. ) and other products. Although the display principle of these flat panel display devices is different, they each have a structure in which a sealed space is formed on the supporting substrate. The function of the sealed space differs depending on the display principle of each display device, but each display device has a common structure in that a display function portion is formed in the sealed space. Therefore, these flat panel display devices have the same structure in which an electrode for guiding the display functional portion formed in the sealed space to the outside of the sealed space and connecting the drive circuit is formed on the support substrate. On the other hand, in order to realize the miniaturization, high performance, and display performance of electronic devices, these flat panel display devices are moving in the direction of colorization and high resolution, and accordingly, electrodes and lead wires of the display function portion have to be performed. Fine line and high density. At this time, as the electrode constituting the display function portion, a specific electrode material has to be selected in order to secure good display performance. However, as a material of the lead wiring, it is important to select a low-resistance material as much as possible to improve display performance. 95520.doc 1357282 Generally, aluminum (A1) or chromium (Cr) series materials are used as low-resistance wiring materials. However, as the wiring is advanced, it is required to use lower-corrosion silver (Ag) or silver. 5 gold. However, the Ag series material is more prone to money than μ or the core. For example, in the conventional example described in Patent Document 1, a laminate having a layer made of Ag or an Ag alloy and a layer made of Cu or a Cu alloy is used. In the conventional example described above, the lead-out wiring is formed into a two-layer structure, and a Cu-based 金属4 metal layer is formed on the surface layer, thereby preventing the Ag-based material from being formed. Deterioration caused by the rot of the layer of the structure. However, the use of the Ag series material for the wiring material of the high-intensity and the first-line is not only a problem of deterioration, but also a problem of migration. With the continuation of the migration phenomenon, 'moving the metal from the _P or the side of the wiring in contact with the support substrate made of the insulating material on the support substrate' causes connection with the adjacent wiring, so only relying on The surface layer forms a protective layer and cannot prevent the resulting wiring from being defective. In order to avoid the wiring failure caused by such a migration phenomenon, it can be considered that the spear, the non-migrating insulating material covers the entire wiring is effective. 2 However, in the flat panel display device having a sealed space on the support substrate The end portion of the sealing layer (4) is attached to the base plate of the support to form a seal. The end portion (4) of the seal is mounted so that it is partially covered from the (four): portion of the lead-out wiring, so in this case, The lead-out wiring located on the back-to-surface is fully covered, and the exposed wiring from the dry layer is easily exposed in the lead-out wiring (3), and the wiring is exposed 95520.doc 1357282). Γ quot quot 在 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 After the wire, there is a problem that the wiring which is exposed to the wiring is defective. (4) Causes of migration, etc. [Disclosure] The present invention is intended to be a problem. In other words, the lead-out wiring for the 板 柘 g 于 于 + + + + + + + + + + + + + + + + + + + + + + 引 引 引 引 引 引 引 引 引 引 引 引 引Density: 1 bad! In the case of the g series low-resistance material, wiring defects due to the phenomenon of corrosion migration and the like are not caused, and thus, a flat panel display device in which the south is fine and is less likely to cause wiring defects is proposed. In order to achieve the above object, the flat panel display device of the present invention and the method of manufacturing the same have at least the following configurations. In the flat panel display device of the present invention, a sealing space is formed on the branch plate by the (4) bonding layer and the sealing member, and a display function portion is formed in the sealing space, which is characterized in that : a lead wire is drawn from the electrode constituting the display function portion to the outside of the sealed space through the adhesive layer, and a predetermined wiring pattern is formed on the support substrate outside the sealed space; and a cover layer Provided in the vicinity of at least the bonding layer of the lead-out wiring, covering the lead-out wiring, forming a laminated portion in which the adhesive layer and the cover layer are overlapped, and the width of the laminated portion is greater than or equal to The thickness of the bonding layer or the covering layer, the thickness of the laminated portion to 95520.doc 1357282 is less than or equal to the thickness of the covering layer. A method of manufacturing a flat panel display device according to the present invention, for manufacturing a flat panel display device in which a support substrate and a sealing member are bonded by using an adhesive layer, a sealed space is formed on the support substrate, and a display function portion is formed in the sealed space It is characterized in that a predetermined wiring pattern is formed on the support substrate outside the seal from the electrode constituting the display function portion through the dead layer to the sealed space. Leading a wiring, forming a cover layer covering the lead-out wiring in the vicinity of the adhesive layer, forming a laminated portion overlapping the adhesive layer and the cover layer, such that the width of the laminated portion is greater than or equal to The thickness of the bonding layer or the cover layer is such that the thickness of the laminated portion is at least equal to or greater than the thickness of the cover layer. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is an explanatory view showing a characteristic structural portion of a flat panel display device according to an embodiment of the present invention. In the figure, the flat panel display device 10 bonds the support substrate 1 and the sealing member 2 via the adhesive layer 3, thereby forming a sealed space 4 on the support substrate 1, and forming a display function portion (not shown) in the sealed space 4. The lead-out wiring 5 is led out from the electrode constituting the display function portion (not shown) to the outside of the sealed space 4 through the adhesive layer 3, and a predetermined wiring pattern is formed on the support substrate 1 outside the sealed space 4, and is covered. The covering layer 6 of the lead wiring 5 is provided in the vicinity of at least the bonding layer 3 of the lead wiring 5. Further, a laminated portion a formed by laminating the drilled layer 3 and the cover layer 6 is formed, and the width W of the laminated portion a is formed to be equal to or greater than the thickness of the adhesive layer 3 or the thickness d2 of the cover layer 6, The thickness 〇 of the laminated portion a is formed to be at least equal to or greater than the thickness of the cover layer 95. 95520.doc 1357282 degrees d2» particularly in the embodiment A of the figure, the laminated portion A is laminated on the outer portion of the adhesive layer 3. Formed by covering layer 6. The flat panel display device 10 can be used as a display portion of an electronic device such as a mobile phone, a personal computer, or a digital camera, or can be separately disposed indoors and outdoors as a display device. Further, the display function portion formed in the sealed space 4 is composed of a liquid crystal display panel, an organic EL display panel, a PDP, an FED or the like. For example, when the liquid crystal display panel is configured, the sealed space 4 is filled with a liquid crystal material. In the case where the two rooms are formed of a separate EL display panel, the sealed space 4 serves as a space for isolating the organic EL element from the outside air. When the structure is composed of pDp, the sealed space 4 serves as a space for forming the discharge cells. According to the flat panel display device 1' having such a feature, the laminated portion A in which the adhesive layer 3 and the cover layer 6 are laminated is provided, so that the lead wiring 5 is exposed at least in the vicinity of the adhesive layer 3, Corrosion of the lead wiring 5 which is likely to occur at the outer end portion of the sealing member 2 or wiring failure due to movement can be excluded. Therefore, when the wiring pattern of the lead wiring 5 is made higher in density and the thinning of each wiring is realized, a low-resistance material such as 八 § can be used without worrying about wiring defects, so that the lead-out can be surely ensured. The continuity of the wiring 5 is sufficient to improve the display performance of the flat panel display device 1 in February. At this time, the dimensional relationship between the width w of the laminated portion A and the thickness di' of the adhesive layer 3 and the thickness d2 of the cap layer 6 is Wgdl4Wgd2. This is because the bonding layer 3 and the covering layer 6 are generally formed of different materials, and the bonding faces of the laminated portions 8 are joined between different materials, but it is difficult to secure a sufficient bonding force. Therefore, in order to secure sufficient adhesive force and to prevent the occurrence of the lead-out wiring, it is necessary to form the laminated portion A having a sufficient width in accordance with the above-described dimensional relationship, 95520.doc -10- 1357282. Further, the dimensional relationship between the thickness D of the laminated portion A and the thickness d2 of the cover layer 6 is D 2 d2. This relationship can be realized by forming the laminated portion A as shown in the drawing. Therefore, even in the laminated portion of different materials, the lead wiring 5 can be reliably isolated from the outside air in the vicinity of at least the dead layer 3, This can sufficiently ensure the protection function against moisture and the like. 2 is an explanatory view illustrating a method of manufacturing the flat panel display device 1 of the above embodiment. The manufacturing method of the present embodiment is for manufacturing the support substrate 1 and the sealing member 2 by the adhesive layer 3, thereby A method of manufacturing a flat panel display device 1 in which a sealing space 4 is formed on a support substrate 1 and a display function portion (not shown) is formed in the sealed space 4, and an adhesive layer is formed on an electrode from a display power edge portion (not shown) 3 is drawn out of the sealed space 4, and a lead wiring 5 having a predetermined wiring pattern is formed on the support substrate 1 outside the sealed space 4, and a cover layer 6 covering the lead wiring 5 in the vicinity of the adhesive layer 3 is formed.幵 / into the laminated portion a formed by laminating the adhesive layer 3 and the cover layer 6, the width W of the laminated portion A is formed to be equal to or greater than the thickness of the adhesive layer 3 or the cover layer 6, d2, and laminated The thickness D of the portion A is formed to be at least equal to or larger than the thickness d2 of the cover layer 6. In particular, in the embodiment shown in Fig. 2, the formation of the laminated portion a is laminated on the outer portion of the adhesive layer 3 after the formation of the adhesive layer 3. ι and below are described in more detail based on Fig. 2 . Here, the method is described as follows: The method is described as an example of a plurality of sealed spaces formed on the support substrate 1 by the branch substrate 丨 and the sealing member, and is cut at a portion where the seal member 2 is set after being spliced. However, the embodiment of the present invention is not limited thereto. 95520.doc 1357282 First, in (4) of the figure, the lead wiring 5 is formed on the support substrate 1 by a predetermined wiring pattern. The formation of the lead wiring 5 may be formed in the same process as the electrode constituting the display function portion, or only the wiring pattern 5 may be separately formed. A pattern is formed on the support substrate 1 by directly drawing the lead wires 5 from the electrodes constituting the display function portion or connecting them to the electrodes. On the other hand, as shown in (b) of the figure, the sealing member 2 coated with the adhesive layer 3 is bonded to the support substrate 1 face to face. On the surface of the sealing member 2 opposed to the support substrate i, a sealing recess 2A for forming the sealed space 4 is formed, and an adhesive layer 3 is applied around the sealing recess 2A. A recess C2 for cutting C is formed outside the coating region of the adhesive layer 3. Here, an example in which the adhesive layer 3 is formed on the sealing member 2 side is shown, but the adhesive layer 3 may be formed in the adhesive region on the side of the support substrate. As shown in (c) of the figure, when the support substrate 1 and the sealing member 2 are bonded, the substrate 1 and the sealing member 2 are pressed to press the bonding layer 3 to the outside. Thus, the bleed portion 3a having a width corresponding to the width of the laminated portion 8 described above is formed in the cutting recess 2B. The cutting recess 2B is formed so that the cut portion 3a can be cut satisfactorily without being affected by the adhesive layer 3 even when the bleed portion 3a is formed. In the joint layer 3, the sealing member 2 is cut by a scribing method or the like at the cut portion C located at the end of the cutting recess 2B. Then, as shown in (d) of the figure, the lead-out wiring $ in the vicinity of the drilled layer 3 is covered with the cover layer 6 so that the end portion of the cover layer 6 is superposed on the bleed portion 3 & Further, the laminated portion a is formed by laminating the cover layer 6 on the outer portion of the bonding layer 3. At this time, by ensuring the width of the bleed portion 3a as described above, the laminated portion A' having a width of % can be formed and formed by reliably overlapping the cover layer 6 on the bleed portion 3a 95520.doc • 12-1357282 The laminated portion A of the above thickness D. Fig. 3 is a perspective view showing a flat panel display device and a method of the same according to another embodiment of the present invention (the same portions as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted). According to this embodiment, the above-mentioned laminated Dengfen is formed by laminating the adhesive layer 3 on the cover layer 6 forming the bonding region s of the adhesive layer 3, and is formed by forming the cover layer ^ The frost layer of the drilled region S of the bonding layer 3, and the layer of the bonding layer 3 of the layer 6 are laminated to form the laminated portion. That is, as shown in (4) of the figure, first, as a cover layer 6 formed by forming the contact layer 3 on the support substrate j by the support substrate #8, the cover layer 6 is formed as a cover layer 6' to make the end portion 6a enters the inside of it. The end B (j6a6) formed here at the point is formed to have a width W corresponding to the above-mentioned laminated portion a. Then, by substituting the substrate i and the sealing member 2, the (four) layer 3 is laminated on the end (four) of the cover layer 6 to form the laminated portion A. Thereafter, the sealing member 2 is cut at the cutting portion C on the outer side of the dead layer 3. At this time, since the cutting can be performed without being affected by the contact layer 3, it is not necessary to form the flat display device 10 in the sealing member (10). The flat display device 10 is formed as shown in (4) of the figure, in the drilling area.
域S内側形成具有寬度W的疊層部分A，此時的疊層部分A 的兔度W、厚度D和枯接層的厚㈣或覆蓋層6的厚度们的 尺寸關係為wg dl或wg d2、D2 d2。 根據這種實施方式也可以取得 攻貫屹方式相同的作 用效不。即’設有將枯接層3和覆蓋層6叠合而成的叠層部 95520.doc 1357282 刀A所以引出布線5至少不會在粘接層3附近露出，也可以 排除在密封部件2的外側端部附近容易產生的引出布線5的 腐触或因遷移造成的布線不良。由此，在使引出布線5的布 線圖形高密度化，實現各布線的細線化的情況下，可以使 用Ag等低電阻材料而不用擔心布線不良，所以能夠良好地 確保引出布線5的導通性，能夠提高平板顯示裝置1〇的顯示 性能。 上述各貫鈪方式中的引出布線5的布線材料只要是低電 阻材料，即可獲得上述的作用，但優選至少含有、a卜 gA laminated portion A having a width W is formed inside the domain S, and the dimensional relationship between the rabbit degree W, the thickness D of the laminated portion A and the thickness of the dead layer (four) or the thickness of the cover layer 6 is wg dl or wg d2 , D2 d2. According to this embodiment, the same effect of the method of attack and attack can be obtained. That is, the laminated portion 95520.doc 1357282 is formed by laminating the dry layer 3 and the cover layer 6. Therefore, the lead wiring 5 is not exposed at least in the vicinity of the adhesive layer 3, and may be excluded from the sealing member 2. Corrosion of the lead wiring 5 which is likely to occur in the vicinity of the outer end portion or wiring failure due to migration. In this way, when the wiring pattern of the lead wiring 5 is increased in density and the wiring is thinned, a low-resistance material such as Ag can be used without worrying about wiring defects, so that the lead wiring can be satisfactorily secured. The conductivity of 5 can improve the display performance of the flat panel display device 1 . The wiring material of the lead wiring 5 in each of the above-described respective methods can obtain the above-described effects as long as it is a low-resistance material, but preferably contains at least
Cu、Cr或從他們的合金選擇的金屬或金屬合金中的一種以 上。不論選擇何種布線材料，均可以排除在粘接層3附近的 布線不良，所以能夠提供高可靠性的平板顯示裝置。 【貫施例】 以下’把作為顯示功能部而形成有機El顯示元件的有機 EL顯示裝置作為本發明的實施例進行說明。圖4是表示該有 機EL顯示裝置2〇的說明圖。 基本結構如上述的實施方式所述，通過粘接層3粘接支撐 G 基板1和密封部件2，由此在支撐基板1上形成密封空間4， 併在密封空間4形成由後述的有機EL元件構成的顯示功能 部。 由有機EL元件構成的顯示功能部具有：形成於支撐基板丨、 上的下部電極21 ;含有發光層併形成於下部電極21上的有 機材料層23 ;形成在該有機材料層23上的上部電極24〇在 圖示例中，利用絕緣層22劃分下部電極21，在下部電極21 95520.doc 1357282 的下面形成使用有機EL元件的單位顯示區域（肅、2〇g、 2〇B)。並且，在形成密封空間4的密封部件2的内面安裝乾 燥部件2 5。 並且，引出布線5連接顯示功能部的上部電極2 4，通㈣ 接層3被引出到密封空間4外面，在密封空間4外面的支撑基 板1上形成規定的布線圖形，覆蓋引出布線5的覆蓋層6設在 引出布線5的至少_3附近。而且，形成將點接層3和覆 盍層6疊合而成的疊層部分A’該疊層部分a的寬度w形成為 大於等於枯捿層3或覆蓋層6的厚度，疊層部分A的厚 度D形成為至少大於等於覆蓋層6的厚度。 此處，和圖i的實施方式相同’疊層部分a是通過在粘接 層3的外側部分上疊層覆蓋層6而形成的，如圖3所示的實施 方式那樣，也可以在形U接層3的純區域，在覆蓋層6 上疊層粘接層3。 作為尺寸示例可以設定如下，疊層部分A的寬度Μ 100〜1〇〇〇μΐη，粘接層3的厚度(11為1〇〜1〇〇4111,覆蓋層6的 厚度d2為ΙΟΜοοο，’疊層部分Α的厚度闕為刪㈣。 以下，列舉具體示例說明本發明的實施例涉及的有機肛 顯示裝置20的各構成要素及製造方法。 a. 支撐基板 作為支撐基板1 ’優選具有透明性的平板狀或薄片狀基 板’其材質可以使用玻璃或塑料等。 b. 密封部件 作為氣密密封有機EL元件的密封部件2，可以使用金屬 95520.doc -15- 1357282 制、玻璃制、塑料制等板狀部件或容器狀部件。可以使用 通過在玻璃制密封基板上進行衝壓成形、蝕刻、噴砂處理 寺加工來形成密封用凹部2 A(一級凹入或兩級凹入）的部 件，或者使用平板狀玻璃併利用玻璃（塑料也可以）制隔離物 在與支撑基板1之間形成密封空間4。 · C · ^接層 · 形成粘接層3的粘接劑可以使用熱固化型、化學固化型 (雙溶劑混合）、光（紫外線）固化型等粘接劑，其材料可以使 用丙婦酸樹月旨、環氧樹月旨、聚g旨 '聚婦烴等。特別優選使〇 用不需要加熱處理、即固化性高的紫外線固化型環氧樹脂 點接劑。 d.電％& 在圖4的示例中，把下部電極21作為陽極，把上部電極24 作為陰極，從下部電極21侧疊層空六輸送層23八、發光層 23B、電子輸送層23C，但在本質上可以把下部電極Μ、上 部電極24中的任一方設為陰極或陽極。作為電極材料，陽 極由功函數高於陰極的材料構成，可以使用鉻（Cr)、鉬 c (Mo)、鎳（Ni)、白金（Pt)等金屬膜或IT〇、IZ〇等氧化金屬膜 等的透明導電膜。而，陰極由功函數低於陽極的材料構成， 可以使用鋁（A1)、鎂（Mg)等的金屬膜、已摻雜㊅聚苯胺或， 已摻雜的聚苯乙炔等非晶質半導體、Cr2〇3、Ni〇、肘“…· 等氧化物。另外，在所述下部電極21、上部電極24均由透 明材料構成的情況下，在與光的射出側相反的電極側設置 反射膜。 95520.doc -16- 1357282 e.有機材料層 有機材料層23如圖4所示’一般是空穴輸送層23A、發光 層23B、電子輸送層23C的組合結構，也可以分別重疊設置 不/、一層的多層空穴輸送層23A、發光層23B、電子輸送層 23C ’還可以省略空穴輸送層23A和電子輸送層23C中的任 何層’也可以兩層均省略。另外，可以根據用途插入-八主入層、電子注入層等的有機材料層。所述空穴輸送層 23 A、發光層23B、電子輸送層23c可以適當選擇以往使用 的材料（可以是高分子材料或低分子材料）。 另外’作為形成發光層23B的發光材料，可以是呈現從單 態激子狀態返回基底狀態時發光（熒光）的材料，也可以是呈 現從三態激子狀態返回基底狀態時發光（燐光）的材料。 f·引出布線 引出布線5如前面所述，優選低電阻金屬材料，可以是令 有Ag、A卜Cu、Cr或從牠們的合金中選擇的低電阻金屬或 屬=金中的至少一種以上的材料，特別優選Apc、— Pd口金、Cr、Ai等。並且，可以利用作為金屬氧化物的加， IZO通過瘵鍍、濺射等方法在與下部電極21相同的工序中將 引出布線5薄臈化，通過利用光刻法形成圖形而形成。另 外，在與下部電極21同時形成引出布線5的情況下，可以形 ^為在m)、IZ0疊層了械Ag合金、A1、Cr等的低電阻金 的雙層結構。或者，作為Ag等的保護層，可以形成為疊 曰了 Cr、Cr、Ta等的耐氧化性高的材料的三層結構。 g·覆蓋層 95520.doc 1357282 覆蓋層6只要是耐腐㈣的絕緣材料即可。具體而言，使 用聚醜亞胺、丙稀酸酷類樹脂、石圭酮樹脂等覆蓋引出布線 5»形成覆蓋層6的工序’根據上述的實施方式，在通過點 接層3招接支撐基板！和密封部件2的密封卫序的之前或之 後進行。 . h.乾燥部件 . C: 乾燥部件25可以使用以下乾燥劑來形成：沸石、硅膠、 碳、碳納米管等物理乾燥劑；鹼金屬氧化物、金屬齒化物、 過氧化氣等化學乾燥劑；在甲笨、二甲笨、脂肪族有機溶 劑等石油類溶劑中溶解了有機金屬絡合物的乾燥劑；把這 些乾燥劑顆粒分散在具有透明性的聚乙烯、聚異戊二烯、 聚肉娃酸乙烯酯等粘合劑中的乾燥劑等。 i·製造方法（一例） t先’在玻璃制基板！上將作為陽極的Ιτ〇等的下部電極 2丄通過蒸H、㈣等方法形成為薄膜，利用光刻法等: 所期望形狀的圖案。然後，利用絕緣層22將下部電極Cu, Cr or one of the metals or metal alloys selected from their alloys. Regardless of the wiring material selected, wiring defects in the vicinity of the bonding layer 3 can be eliminated, so that a highly reliable flat panel display device can be provided. [Examples] Hereinafter, an organic EL display device in which an organic EL display element is formed as a display function portion will be described as an embodiment of the present invention. Fig. 4 is an explanatory view showing the organic EL display device 2A. Basic Structure As described in the above embodiment, the G substrate 1 and the sealing member 2 are bonded and supported by the bonding layer 3, whereby the sealing space 4 is formed on the supporting substrate 1, and an organic EL element to be described later is formed in the sealing space 4. The display function unit. The display function portion composed of the organic EL element has a lower electrode 21 formed on the support substrate ;, an organic material layer 23 including a light-emitting layer and formed on the lower electrode 21, and an upper electrode formed on the organic material layer 23. In the example of the drawing, the lower electrode 21 is partitioned by the insulating layer 22, and the unit display region (Su, 2〇g, 2〇B) using the organic EL element is formed under the lower electrode 21 95520.doc 1357282. Further, a drying member 25 is attached to the inner surface of the sealing member 2 forming the sealed space 4. Further, the lead wiring 5 is connected to the upper electrode 24 of the display function portion, and the via layer 4 is led out to the outside of the sealed space 4, and a predetermined wiring pattern is formed on the support substrate 1 outside the sealed space 4 to cover the lead wiring. The cover layer 6 of 5 is provided in the vicinity of at least _3 of the lead wiring 5. Further, a laminated portion A' in which the dotted layer 3 and the covering layer 6 are laminated is formed to have a width w of the laminated portion a formed to be equal to or greater than the thickness of the dried layer 3 or the covering layer 6, and the laminated portion A The thickness D is formed to be at least equal to or greater than the thickness of the cover layer 6. Here, as in the embodiment of Fig. i, the laminated portion a is formed by laminating the cover layer 6 on the outer portion of the adhesive layer 3, as in the embodiment shown in Fig. 3, and may be in the form U. The bonding layer 3 is laminated on the cover layer 6 in the pure region of the bonding layer 3. As an example of the size, it can be set as follows, the width of the laminated portion A is 〜100 to 1〇〇〇μΐη, the thickness of the adhesive layer 3 (11 is 1〇~1〇〇4111, and the thickness d2 of the cover layer 6 is ΙΟΜοοο, 'stack The thickness 阙 of the layer portion 阙 is (4). Hereinafter, each constituent element and manufacturing method of the organic anal display device 20 according to the embodiment of the present invention will be described as a specific example. a. The supporting substrate as the supporting substrate 1' preferably has transparency. The flat or sheet-like substrate can be made of glass, plastic, etc. b. Sealing member As the sealing member 2 for hermetically sealing the organic EL element, it can be made of metal 95520.doc -15-1357282, glass, plastic, etc. A plate-shaped member or a container-like member. A member for forming a sealing recess 2 A (first-order recess or two-stage recess) by press forming, etching, or sand blasting on a glass sealing substrate may be used, or a flat plate may be used. The glass is formed by a glass (plastic may also be used) to form a sealed space 4 with the support substrate 1. · C · ^ bonding layer · The adhesive forming the bonding layer 3 can be used For the adhesives such as thermosetting type, chemical curing type (dual solvent mixing), and light (ultraviolet) curing type, the material may be a propylene glycol, an epoxy resin, or a polyglycol. It is particularly preferable to use an ultraviolet curable epoxy resin dot-retaining agent which does not require heat treatment, that is, high curability. d. Electricity % & In the example of Fig. 4, the lower electrode 21 is used as an anode, and the upper electrode 24 is used as an upper electrode In the cathode, the empty sixth transport layer 23, the light-emitting layer 23B, and the electron transport layer 23C are laminated from the lower electrode 21 side, but essentially one of the lower electrode Μ and the upper electrode 24 may be a cathode or an anode. Material, the anode is composed of a material having a higher work function than the cathode, and a metal film such as chromium (Cr), molybdenum c (Mo), nickel (Ni), or platinum (Pt) or an oxidized metal film such as IT〇 or IZ〇 may be used. a transparent conductive film. The cathode is made of a material having a lower work function than the anode, and a metal film of aluminum (A1), magnesium (Mg) or the like, a doped hexaphenyl aniline or a doped polyphenylacetylene may be used. Oxide such as crystalline semiconductor, Cr2〇3, Ni〇, elbow “...·. Further, when both the lower electrode 21 and the upper electrode 24 are made of a transparent material, a reflective film is provided on the electrode side opposite to the light emitting side. 95520.doc -16- 1357282 e. Organic material layer organic material layer 23 is generally a combination structure of the hole transport layer 23A, the light-emitting layer 23B, and the electron transport layer 23C, and may be provided with a plurality of layers of the hole transport layer 23A, the light-emitting layer 23B, and electron transport. The layer 23C' may also omit any of the hole transport layer 23A and the electron transport layer 23C. Alternatively, both layers may be omitted. Further, an organic material layer such as an eight-master layer or an electron injection layer may be inserted depending on the application. The hole transport layer 23 A, the light-emitting layer 23B, and the electron transport layer 23c can be appropriately selected from conventional materials (may be a polymer material or a low molecular material). Further, 'the luminescent material forming the luminescent layer 23B may be a material that exhibits luminescence (fluorescence) when returning from the singlet exciton state to the basal state, or may be luminescence (luminescence) when it returns to the basal state from the tri-state exciton state. material. f. Leading wiring lead wiring 5 As described above, a low-resistance metal material is preferable, and at least one of Ag, A, Cu, Cr, or a low-resistance metal or genus=gold selected from alloys thereof may be used. The above materials are particularly preferably Apc, -Pd gold, Cr, Ai, and the like. Further, as the metal oxide, IZO can be formed by thinning the lead wiring 5 in the same step as the lower electrode 21 by a method such as ruthenium plating or sputtering, and forming a pattern by photolithography. Further, when the lead wiring 5 is formed simultaneously with the lower electrode 21, a two-layer structure in which a low-resistance gold such as an Ag alloy, A1, or Cr is laminated on m) and IZ0 can be formed. Alternatively, a protective layer of Ag or the like may be formed into a three-layer structure in which a material having high oxidation resistance such as Cr, Cr or Ta is laminated. g·covering layer 95520.doc 1357282 The covering layer 6 is only required to be a corrosion-resistant (four) insulating material. Specifically, a step of covering the lead wiring 5» to form the cover layer 6 using poly yimimide, an acrylic acid-based resin, a guar ketone resin, or the like 'according to the above-described embodiment, is supported by the joint layer 3 Substrate! And before or after the sealing of the sealing member 2. h. Drying parts. C: Drying parts 25 can be formed using the following desiccant: physical drying agents such as zeolite, silica gel, carbon, carbon nanotubes; chemical desiccants such as alkali metal oxides, metal tooth compounds, and peroxidation gases. a desiccant in which an organometallic complex is dissolved in a petroleum solvent such as a stupid, a dimethicone or an aliphatic organic solvent; the desiccant particles are dispersed in a polyethylene having transparency, polyisoprene, and poly A desiccant or the like in a binder such as vinyl acetate. i·Manufacturing method (an example) t first 'in glass substrate! The lower electrode 2丄 such as Ιτ〇 which is an anode is formed into a thin film by a method such as vapor deposition H or (d), and a pattern of a desired shape by a photolithography method or the like is used. Then, the lower electrode is made of the insulating layer 22
C 絕緣併劃分單位顯示區域2〇R、細、则，用旋轉塗覆法曰、 浸潰法等塗覆法、絲網印刷法、喷射法絲等印刷方法等的 濕式工藝、或蒸錄法、激光轉印法等的干式工藝形成有機 材料層2 3。 並且，作為與下部電極21正交的形成有多個帶狀的陰 極’形成多個金屬薄膜的上部電極24,由下部電㈣和上 :電極24形成矩陣。對於上部電極24，是利用蒸錢或_ %方法形成薄膜® 95520.doc -18- 1357282 最後，通過粘接層3粘接密封部件2和支撐基板丨併進行密 =。該工序是：在紫外線固化型環氧樹脂枯接劑中混合適 量（約〇·1〜0.5重量％)的粒徑為iyoo μιη的隔離物15八（優選 玻璃或塑料隔離物），使用配合器等將其塗覆在支撐基板工 上或在封部件2的钻接區域β然後，在氬氣等惰性氣氛下.， 枯接支撐基板i和密封部件2。之後，從支撐基板_ (或密 封部件2側）向粘接層3照射紫外線，使粘接劑固化。這樣^C Insulation and division of the unit display area 2〇R, thin, wet process such as coating method such as spin coating method, dipping method, screen printing method, jet method, etc., or steaming A dry process such as a method of laser transfer or the like forms an organic material layer 23 . Further, the upper electrode 24 in which a plurality of metal thin films are formed as a plurality of strip-shaped cathodes orthogonal to the lower electrode 21 is formed, and a matrix is formed by the lower electric (four) and the upper: electrode 24. For the upper electrode 24, the film is formed by steaming or _% method. 95520.doc -18-1357282 Finally, the sealing member 2 and the supporting substrate are bonded by the bonding layer 3 and subjected to density =. This step is: mixing an appropriate amount (about 1·1 to 0.5% by weight) of the separator 15 of the iyoo μιη (preferably glass or plastic spacer) in the ultraviolet curable epoxy resin binder, using a blender Etching or coating the supporting substrate i and the sealing member 2 on the supporting substrate or in the drilling region β of the sealing member 2, then under an inert atmosphere such as argon. Thereafter, ultraviolet rays are applied to the adhesive layer 3 from the support substrate _ (or the sealing member 2 side) to cure the adhesive. This ^
以在密封部件2和支撐基板1的密封空間4内封入了氬氣等 惰性氣體的狀態密封有機EL元件。 C 、下面更具體地說明這種製造工序中的有機材料層以的形 成工序’關於有機層23的形成’作為一個示例，通過蒸鍍 而順序豎層空穴輸送層23A、發光層23B、電子輸送層 等的各材料而形成。此時，在形成發光層23B時，使用成膜 用掩模，對各單位顯示區域撤、2〇G、細，根據多個發 光顏色進行發光層的分塗。在進行分塗時，將呈現三 顏色的發光的有機材料或多個有機材料的組合材料成膜在 属於RGB的單位顯示區域。此處，對一處單位顯示區域C 2〇R、20G、20B，使用相同材料成膜2次以上，從而可以防 止單位顯示區域2〇R、20G' 20B發生未成膜部分。 j·有機EL顯示裝置的各種方式等 作為本發明的實施方.式，在不脫離本發明宗旨的範圍内 可以進行各種設計變更。例如，作為有機£1^顯示裝置2〇的. 驅動方式，除採用帶狀的下部電極2丨和上部電極24的無源 驅動方式以外，可以採用利用TFT驅動按照每個單位顯示區 95520.doc 19 1357282 域20R、20G、20B劃分的各個下部電極21的有源驅動方式。 關於有機EL元件的發光形式，可以是從支撐基板1側發光的 下部放出方式，也可以是從與支撐基板丨的相反側發光的上 部玫出方式。 而且’本發明的貫知方式的有機EL顯示震置20可以是單 色顯示也可以是多色顯示，為了實現多色顯示，當然包括 上述的分塗方式，還可以採用以下方式：將濾色器或由榮 光材料形成的色變換層組合到白色或藍色等單色發光功能 層的方式（CF方式、CCM方式）；通過向單色發光功能層的〇 發光區域照射電磁波等實現多色發光的方式（光致褪色方 式）；將2色或多於2色的單位顯示區域縱向疊層形成一個單 位顯示區域的方式（S〇LED(transparent stacker OLED)方式） 等。 本發明的各實施方式及實施例由於具有以上的構成所 以對於平板顯示裝置的引出布線，可以在剛剛從形成密封 空間的外緣的粘接層引出後立即進行完全覆蓋，從而即使 在形成高密度布線，使用Ag系列低電阻材料時，也不會產G 生因腐蝕而劣化或因遷移現象等造成的布線不良。由此可 提供一種高精細且不易產生布線不良的平板顯示裝置。 【圖式簡單說明】 圖1是表不本發明一實施方式的平板顯示裝置的特徵結· 構部分的說明圖。 圖2a-d是說明本發明實施方式的平板顯示裝置的製造方 法的說明圖8 95520.doc --20- /282 圖3 a-c是說明本發明的其他實施方式的平板顯示裝置及 其製造方法的說明圖。 圖4是表示本發明的實施方式的有機EL元件顯不裝置的 說明圖。 . 【主要元件符號說明】 1 支撐部件 2 密封部件 〇 3 粘接層 4 密封部件 5 引出布線 6 覆蓋層 Α 疊層部分 W 疊層部分的寬度 d 1 點接層的厚度 d2 覆蓋層的厚度The organic EL element is sealed in a state in which an inert gas such as argon gas is sealed in the sealed space 2 of the sealing member 2 and the support substrate 1. C. The formation process of the organic material layer in the manufacturing process is described more specifically below as an example of the formation of the organic layer 23, and the vertical hole transport layer 23A, the light-emitting layer 23B, and the electrons are sequentially deposited by vapor deposition. It is formed by each material such as a transport layer. At this time, when the light-emitting layer 23B is formed, the film formation mask is used, and each unit display area is removed, 2 〇 G, and thin, and the light-emitting layer is divided by a plurality of light-emitting colors. At the time of the partial coating, a combination of a three-color luminescent organic material or a plurality of organic materials is formed in a unit display region belonging to RGB. Here, the unit display areas C 2 〇 R, 20G, and 20B are formed by using the same material twice or more, so that the undisplayed portions of the unit display areas 2 〇 R and 20 G ′ 20B can be prevented from occurring. Various embodiments of the organic EL display device, etc. Various design changes can be made without departing from the spirit and scope of the invention. For example, as the driving method of the organic display device 2, in addition to the passive driving method using the strip-shaped lower electrode 2A and the upper electrode 24, it is possible to use the TFT driving in accordance with each unit display area 95520.doc 19 1357282 Active driving method of each lower electrode 21 divided by domains 20R, 20G, 20B. The light-emitting form of the organic EL element may be a lower-emission mode in which light is emitted from the side of the support substrate 1, or an upper-brightness mode in which light is emitted from the side opposite to the support substrate. Moreover, the organic EL display vibrating device 20 of the present invention may be a monochrome display or a multi-color display. In order to realize multi-color display, of course, the above-described sub-coating method may be adopted, and the following method may also be adopted: a mode in which a color conversion layer formed of a luminescent material is combined to a monochromatic light-emitting functional layer such as white or blue (CF mode, CCM mode); multi-color illumination is realized by irradiating electromagnetic waves to a 〇 light-emitting region of a monochromatic light-emitting functional layer. The method (photo-fading method); a method of vertically stacking unit display areas of two or more colors to form one unit display area (S〇LED (transparent stacker OLED) method). Since the respective embodiments and examples of the present invention have the above configuration, the lead wiring of the flat panel display device can be completely covered immediately after being taken out from the adhesive layer forming the outer edge of the sealed space, so that even if it is formed high In the density wiring, when the Ag series low-resistance material is used, it does not cause deterioration of wiring due to corrosion or migration due to migration. Thereby, it is possible to provide a flat panel display device which is high in definition and which is less likely to cause wiring defects. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing a characteristic structure of a flat panel display device according to an embodiment of the present invention. 2a-d are diagrams for explaining a method of manufacturing a flat panel display device according to an embodiment of the present invention. FIG. 8 is a schematic diagram of a flat panel display device and a method of fabricating the same according to another embodiment of the present invention. Illustrating. Fig. 4 is an explanatory view showing an organic EL element display device according to an embodiment of the present invention. [Main component symbol description] 1 Support member 2 Sealing member 〇 3 Adhesive layer 4 Sealing member 5 Lead wiring 6 Cover layer 叠层 Laminated portion W Width of laminated portion d 1 Thickness of joint layer d2 Thickness of cover layer
C D 疊層部分的厚度 S 粘接區域 95520.doc • 21 -C D Thickness of laminated part S Bonding area 95520.doc • 21 -