CN102577603A - Organic el panel and manufacturing method therefor - Google Patents

Abstract

The organic EL panel and its manufacturing method can fully ensure the bonding strength between the substrate and the sealing substrate and maintain good sealing performance of the organic EL element when reducing the edge area of the organic EL panel. The sealing substrate (20) for hollowly sealing the light-emitting part (11) on the substrate (10) has a recess (22) for accommodating the light-emitting part (11), and is formed along the outer periphery of the recess (22) and has a The rib (23) of the opposite bonding surface (23A), on the cross-section in the adhesive layer forming part of the rib (23), the steepest part tangent to the side (23B) of the rib (23) The angle (θa) formed by the tangent (L1) and the line (L2) along the bonding surface (23A) is 65°～85°, from the bonding surface (23A) to the side (23B) of the rib (23) An adhesive layer (1) is formed.

Description

Organic EL panel and manufacturing method thereof

technical field

The invention relates to an organic EL panel and a method for manufacturing the organic EL panel.

Background technique

An organic EL panel is a self-luminous panel equipped with an organic EL element as a light-emitting element. Various display devices such as lighting panels; various light sources for scanners and printers; lighting devices for general lighting or backlights for liquid crystal display devices; and optical communication equipment using photoelectric conversion functions, which can be used For various purposes and models.

Organic EL elements have the property of deteriorating light emitting characteristics when they come into contact with moisture contained in the atmosphere, so in order to operate the organic EL panel stably for a long time, a sealing structure for isolating the organic EL elements from the atmosphere is essential. As an example of the sealing structure of the organic EL panel, there is known a hollow sealing structure (for example, Refer to the following patent document 1).

FIG. 1 is a schematic view showing a structural example of an organic EL panel having a conventional hollow sealing structure (the drawing (a) is a cross-sectional view, and the drawing (b) is a plan view). One or more organic EL elements J3 forming the light emitting portion J2 are formed on the substrate J1, and the sealing substrate J5 is bonded to the substrate J1 through an adhesive layer J6 to form a sealed space J4 covering the light emitting portion J2. The inner surface of the sealing substrate J5 is provided with a desiccant J7, and the desiccant absorbs moisture in the sealed space J4, thereby prolonging the life of the organic EL element.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2002-231439

Contents of the invention

The problem to be solved by the invention

In the organic EL panel having the above-mentioned hollow sealing structure, the region in which the light emitting portion J2 is formed in the surface of the substrate J1 becomes the light emitting region J20, but since it is necessary to ensure the bonding of the substrate J1 and the sealing substrate J5 through the adhesive layer J6, For example, it is necessary to form a region (edge region) with a predetermined width JW outside the light-emitting region J20 (adhesion region), and the entire substrate J1 cannot be used as the light-emitting region J20.

However, when the organic EL panel is assembled in various devices or installed independently, it is desirable to reduce the edge area outside the light emitting area J20 as much as possible in order to avoid compression of the surrounding space. In addition, when forming a plurality of light-emitting parts J2 on a large substrate and bonding the large substrate and a large sealing substrate to form a plurality of panels in one bonding process, the panel that can be taken out from one large substrate becomes larger if the edge area becomes larger If the number is reduced, there is a problem that the manufacturing yield is poor and the productivity improvement effect cannot be sufficiently obtained.

In addition, when a large-area panel (tile panel) is formed by arranging a plurality of organic EL panels, the edge area of each panel is located in the entire light-emitting area of the large-area panel to form a non-light-emitting area. Therefore, it is considered to improve the performance of the entire light-emitting area. , is required to reduce the marginal area as much as possible.

In order to reduce the edge region, the width of the bonding region has to be reduced (refer to JW1 in FIG. 1 ). If the width of the bonding region is simply reduced, the bonding strength between the substrate J1 and the sealing substrate J5 cannot be sufficiently ensured, resulting in failure to maintain the organic substrate. A problem of good sealing performance of the EL element J3.

In addition, simply reducing the bonding area reduces the width of the rib J10 formed on the sealing substrate J5 to form the sealing space J4. As a result, the strength of the rib J10 decreases, and the strength of the rib J10 cannot withstand the load acting on the sealing substrate J6, causing a problem that the rib J10 is damaged. When the rib J10 is damaged, the organic EL element J3 is exposed to the outside air, causing a disadvantage that the organic EL element J3 deteriorates remarkably. In addition, if the strength of the ribs J10 decreases, there is a possibility that the ribs J10 may be damaged during the manufacturing process of the organic EL panel, resulting in a decrease in yield.

This invention takes solving such a problem as an example of a subject. That is, the object of the present invention is to improve the performance of the organic EL panel by increasing the occupancy ratio of the light-emitting region in the organic EL panel; Maintain the good sealing performance of the organic EL element; ensure the strength of the ribs of the sealing substrate to prevent defects caused by damage to the ribs, etc.

means to solve the problem

In order to achieve such an object, the organic EL panel and its manufacturing method according to the present invention have at least the following structures.

An organic EL panel, characterized in that the organic EL panel includes a substrate, a light-emitting portion formed on the substrate and having at least one organic EL element stacked with an anode, an organic layer, and a cathode, and for the light-emitting portion to perform A sealing substrate that is hollow-sealed and bonded to the substrate through an adhesive layer, the sealing substrate includes a recess for accommodating the light-emitting part, and an adhesive surface formed along the outer periphery of the recess and facing the substrate. The rib, in cross-section in the adhesive layer forming part of the rib, the angle formed by the steepest tangent to the side of the rib and the line along the bonding surface is 65 °˜85°, and the adhesive layer is formed from the adhesive surface to the side of the rib.

A method for manufacturing an organic EL panel, characterized in that the method comprises: a light-emitting portion forming step of forming a light-emitting portion having at least one organic EL element on a substrate; The concave portion of the concave portion and the rib portion along the outer periphery of the concave portion and having an adhesive surface opposite to the substrate; and a sealing step of bonding the substrate and the sealing substrate through an adhesive layer and sealing the light emitting portion. In the hollow sealing, in the sealing substrate processing step, the sealing substrate is processed in such a manner that, on the cross section in the adhesive layer forming portion of the rib, The angle formed by the steepest tangent and the line along the bonding surface is 65° to 85°, and in the sealing process, the adhesive is formed from the bonding surface to the side of the rib layer.

Description of drawings

FIG. 1 is a schematic view showing a structural example of an organic EL panel having a conventional hollow sealing structure (the drawing (a) is a cross-sectional view, and the drawing (b) is a plan view).

2 is a schematic diagram showing a basic structure of an organic EL panel according to an embodiment of the present invention (the figure (a) shows the overall cross section, and the figure (b) shows a partially enlarged cross section.).

FIG. 3 is an explanatory view showing a formation example of the organic EL panel according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram showing another formation example of the organic EL panel according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram showing another formation example of the organic EL panel according to the embodiment of the present invention.

6 is an explanatory diagram showing an example of the formation of an organic EL element formed by a light-emitting portion forming process (the figure (a) shows an example of an active drive element provided with an independent pixel electrode, and the figure (b) shows an An example of a passively driven element where the intersection of the shaped electrodes is formed.).

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 2 is a schematic view showing a basic structure of an organic EL panel according to an embodiment of the present invention (the figure (a) shows an overall cross section, and the figure (b) shows an enlarged cross section of a portion where an adhesive layer is formed.).

As shown in FIG. 2( a ), the organic EL panel 1 includes a substrate 10 , a light emitting unit 11 formed on the substrate made of a translucent material, and a sealing substrate 20 . The light emitting unit 11 includes a single or a plurality of organic EL elements 11A in which an anode, an organic layer, and a cathode are laminated. For example, the organic EL elements 11A constituting pixels are arranged in a dot matrix to form an image display surface. As in this example, the organic EL element 11A formed on a substrate made of a light-transmitting material is an element capable of emitting light to the outside through the substrate 10 (bottom emission type). In contrast, the organic EL panel 1 according to the embodiment of the present invention can emit light to the outside from the side of the sealing substrate 20 described later (top emission type), and can also emit light from both sides of the substrate 10 and the sealing substrate 20 to the outside. Emit light (double light type).

In order to hollow-seal the light emitting unit 11 in the sealed space C, the sealing substrate 20 is bonded to the substrate 10 via the adhesive layer 21 . The sealing substrate 20 includes a recess 22 for accommodating the light emitting unit 11 and a rib 23 formed along the outer periphery of the recess 22 and having an adhesive surface 23A facing the substrate 10 . The desiccant 24 is provided on the bottom surface 22A of the concave portion 22 of the sealing substrate 20 as needed.

In addition, as shown in FIG. 2( b ), on the cross section in the adhesive layer forming portion of the rib 23 , the steepest tangent L1 tangent to the side surface 23B of the rib 23 and the line along the adhesive surface 23A are the same. The angle θa formed by the lines L2 is 65° to 85°, and the adhesive layer 21 is formed from the adhesive surface 23A to the side surface 23B of the rib 23 .

In the organic EL panel 1 according to the embodiment of the present invention having such a panel structure, the edge area FA (the distance from the outer periphery of the light emitting part 11 to the outer periphery of the substrate 10 ) is reduced by further expanding the light emitting area EA of the light emitting part 11. area), the bonding strength between the substrate 10 and the sealing substrate 20 can be ensured, and the structural strength of the sealing space of the sealing substrate 20 can be ensured.

That is, in the organic EL panel 1 according to the embodiment of the present invention, even when the width of the edge area FA is reduced by reducing the width of the bonding surface 23A of the rib 23 , since the rib 23 is formed gradually wider from the top toward the bottom, Therefore, the structural strength of the rib 23 can also be ensured. In addition, the adhesive applied to the adhesive surface 23A spreads into the sealed space C when the substrate 10 and the sealing substrate 20 are bonded together, but the adhesive layer 21 passes through the angle θa formed on the side surface of the rib 23 . The inclined surface is formed to gradually widen from the top of the side surface 23B of the rib 23 toward the substrate 10 . Accordingly, even when the adhesive surface 23A is narrowed, the adhesive force of the adhesive layer 21 can be ensured, and the adhesive strength between the substrate 10 and the sealing substrate 20 can be maintained at a sufficient strength.

The range of the angle θa is preferably in the range of 65° to 85°. If the angle θa is greater than 85°, the overall slope of the rib 23 becomes steep, so the overall width of the rib 23 is narrowed by narrowing the bonding surface 23A of the rib 23, and the structural strength of the rib 23 cannot be obtained. With such a rib 23 structure, the rib 23 is damaged and the organic EL element 11A is exposed to the outside air, which may cause a disadvantage that the organic EL element 11A is significantly deteriorated.

On the other hand, if the angle θa is less than 65°, the side surfaces of the ribs 23 are too inclined, so that a sufficient sealing space cannot be ensured at the inner part of the adhesive surface 23A, and the adhesive cannot be used when bonding the substrate 10 and the sealing substrate 20 together. Extending to the organic EL element 11A will cause damage to the organic EL element 11A, so it is necessary to ensure a correspondingly large amount of the edge area FA. In addition, if the side surface of the rib 23 is too inclined, the skirt of the bottom of the rib 23 becomes longer and the width of the flat portion of the recess 22 becomes shorter. As a result, the space for disposing the desiccant disposed in the flat portion in the concave portion 22 becomes narrow, and the effect of the desiccant cannot be sufficiently obtained.

The organic EL panel 1 according to the embodiment of the present invention can increase the effective display area ratio of the panel by enlarging the light-emitting area EA (reducing the area of the edge area FA), thereby improving the display performance. In this case, the sealing performance of the organic EL element 11A can be maintained satisfactorily, and the above-described improvement in display performance can be effectively achieved while suppressing deterioration of light emission characteristics.

FIG. 3 is an explanatory view showing a formation example of the organic EL panel 1 according to the embodiment of the present invention (the same reference numerals are attached to the parts that overlap with the above-mentioned description, and the description of parts is omitted). Here, an example in which a plurality of sealed spaces are formed by bonding the substrate 10 and the sealing substrate 20 is shown. As shown in the figure, when the sealed spaces C1 and C2 are formed across both sides of the rib 23 , in the organic EL panel 1 according to the embodiment of the present invention, from the bonding surface 23A of the rib 23 to both sides, A side 23B is formed with an adhesive layer 21 .

At this time, the volumes of the sealed spaces C1 and C2 on both sides adjacent to the rib 23 may be different. There is a difference between P1 and P2, and the internal pressure P2 of the sealed space C2 with a smaller volume is greater than the internal pressure P2 of the sealed space C1 with a larger volume (P1<P2). In this case, a phenomenon in which the adhesive is drawn to the side with the lower internal pressure (adhesive pulling) occurs due to the difference in internal pressure, whereby the adhesive moves easily along the adhesive surface 23A. If such pulling of the adhesive occurs, the adhesive layer 21 is formed off to one side of the rib 23 , and good adhesive strength cannot be obtained. In addition, the amount of the adhesive in the adhesive surface 23A may decrease or fall off due to the pulling of the adhesive layer 21 . In this case, the sealing performance may decrease or the organic EL element 11A may deteriorate significantly. By setting the angle θa at 65° or more, the difference between the internal pressures P1 and P2 generated in the sealed spaces C1 and C2 becomes small, so that such adhesive pulling is less likely to occur, and the top of the rib 23 can be formed toward the top of the rib 23. The adhesive layer 21 spread uniformly on the left and right sides can ensure good bonding strength and sealing performance between the substrate 10 and the sealing substrate 20 .

FIG. 4 is an explanatory view showing another formation example of the organic EL panel 1 according to the embodiment of the present invention (the same reference numerals are attached to the parts that overlap with the above-mentioned description, and the description of parts is omitted). Among them, the corners of the bonding surface 23A and the side surface 23B are chamfered at the top of the rib 23 . As shown in the figure, by forming the chamfer R, the diffusion of the adhesive layer 21 in the vicinity of the adhesive surface 23A can be ensured more sufficiently. Accordingly, even when the width of the adhesive surface 23A is reduced, the adhesive strength of the adhesive layer 21 can be further increased.

FIG. 5 is an explanatory diagram showing another example of formation of the organic EL panel 1 according to the embodiment of the present invention (the same reference numerals are attached to the parts that overlap with the above-mentioned description, and the description of parts is omitted). Wherein, the concave portion 22 of the sealing substrate 20 is made into a segmented groove shape. That is, a recessed portion 22B is further formed on the bottom surface 22A of the recessed portion 22 . By forming the recess 22 in a multi-stage groove shape in this way, the capacity of the sealed space can be ensured regardless of the predetermined range of the angle θa, and a space for the desiccant 24 to be placed in the sealed space can be secured. When the concave portion required for mounting the desiccant 24 is processed into one segment, the processing depth is deep, and it may be difficult to form the angle θa at a predetermined value. In order to solve this phenomenon, the restriction on forming the angle θa is eliminated by making the concave portion 22 a multi-stage groove shape as described above.

Hereinafter, a method of manufacturing the organic EL panel 1 according to the embodiment of the present invention will be described. The method of manufacturing the organic EL panel 1 according to the embodiment of the present invention includes a light-emitting portion forming step as a step on the substrate 10 side, a sealing substrate processing step as a step on the sealing substrate 20 side, and bonding of the substrate 10 and the sealing substrate 20 . Sealing process.

The light emitting portion forming step is a step of forming the light emitting portion 11 including at least one organic EL element 11A on the substrate 10 . The organic EL element 11A has a structure in which an anode, an organic layer, and a cathode are stacked. An electrode pattern of either the anode or the cathode is formed directly on the substrate 10 or through another layer, and an electrode pattern including a light-emitting layer is stacked on the electrode pattern divided by insulation. An organic layer, and an electrode pattern of the other of the anode or the cathode is formed on the organic layer.

When passive matrix driving is performed on a plurality of organic EL elements 11A, for example, stripe-shaped transparent electrodes (anodes) are patterned on the substrate 10, an insulating film is patterned to divide the independent organic EL elements 11A, and an insulating film is formed on the insulating film. Stripe-shaped partition walls were formed on the film in a direction intersecting the aforementioned transparent electrodes. Then, an organic layer including a light-emitting layer is formed on the insulatingly partitioned transparent electrode, and a metal electrode (cathode) patterned through the partition walls is formed on the organic layer.

When active-matrix driving is performed on a plurality of organic EL elements 11A, for example, on the substrate 10 on which driving elements such as TFTs are formed, a pixel electrode (anode) composed of a transparent electrode is formed through a planarization film. An organic layer including a light-emitting layer is formed on the electrode, and a metal electrode (cathode) is further formed on the organic layer.

The sealing substrate processing step is a step of forming, on the sealing substrate 20 , the recess 22 for accommodating the light emitting unit 11 and the rib 23 along the outer periphery of the recess 22 and having the bonding surface 23A. The recesses 22 and the ribs 23 can be simultaneously formed by performing scooping on the surface of the flat sealing substrate 22 except for the bonding surface 23A. As the scooping process, treatment methods such as wet etching, dry etching, and sand blasting can be employed. When wet etching is used, a resist pattern corresponding to the bonding surface 23A is formed on the sealing substrate 22, and the exposed surface of the sealing substrate 22 is immersed in an etching solution. In order to form the concave portion 22 into a segmented groove shape, first, a resist film having an opening pattern along the outer edge of the concave portion 22 is formed on the surface of the sealing substrate 20, and the pattern is subjected to a first etching process, and then the concave portion 22 is etched. A resist film having an opening pattern is formed inside, and the pattern is subjected to a second etching process. In the sealing substrate processing step, the setting range of the aforementioned angle θa is realized by appropriately setting the processing conditions at the time of the digging processing for forming the concave portion 22 .

The sealing step is a step of bonding the substrate 10 and the sealing substrate 20 together with the adhesive layer 21 to hollow-seal the light emitting unit 11 . An appropriate amount of adhesive is applied to the adhesive surface 23A of the sealing substrate 20 . At this time, the amount of the adhesive to be applied is set so that the adhesive layer 21 is formed from the adhesive surface 23A to the side surface 23B of the rib 23 after bonding. The adhesive layer 21 is formed in a gradually widened shape from the side top of the rib 23 toward the substrate 10 by laminating the substrate 10 and the sealing substrate 20 together and applying a predetermined pressure. As the binder, ultraviolet curable or thermosetting resin or the like can be used.

FIG. 6 is an explanatory view showing a formation example of the organic EL element formed by the light emitting portion forming step. The figure (a) shows an example of an active drive element including independent pixel electrodes, and the figure (b) shows an example of a passive drive element in which elements are formed at intersections of intersecting stripe-shaped electrodes.

In the example in (a) of the figure, a flattening film 31 is formed on the substrate 10 on which the driving element (TFT, etc.) 30 is formed so as to cover the driving element 30, and the lower part of the pixel electrode is formed on the flattening film 31. electrode 32. The lower electrode 32 can be formed by patterning in a photolithography process after depositing an electrode material as a film on the planarizing film 31 . Before the lower electrode 32 is formed, the connection line 30A connecting the lower electrode 32 and the driving element 30 is formed, and the insulating film 33 is formed on the peripheral portion thereof. The organic layer 34 including the light emitting layer 34A is formed to cover the opening pattern of the insulating film 33 on the lower electrode 32 . The organic layer 34 can be obtained by mask vapor deposition combining the mask opening and the opening of the insulating film 33 . Thereafter, the upper electrode 34 is formed so as to cover the entire organic layer 34 .

In the example in (b) of this figure, the lower electrodes 40 are formed in stripes on the substrate 10 , and the insulating film 41 is formed thereon to form a stripe pattern so as to cross the lower electrodes 40 . Furthermore, stripe-shaped partition walls 42 are formed on the insulating film 41 as needed. More preferably, the partition wall 42 is a partition wall in which the side wall is tapered downwardly. Then, the organic layer 43 including the light emitting layer 43A is formed along the stripe-shaped openings of the insulating film 41 and the partition wall 42 , and the stripe-shaped upper electrode 44 is formed thereon. The partition wall 42 becomes a mask pattern when forming the upper electrode 44 . When forming the organic layer 43 and the upper electrode 44 , the organic material accumulation layer 43R and the upper electrode material accumulation layer 44R are deposited on the upper surface of the partition wall 42 .

Formation examples of the organic layers 34 and 43 when the lower electrodes 32 and 40 are used as anodes and the upper electrodes 35 and 44 are used as cathodes are shown below. The lower electrodes 32 and 40 can be formed by transparent electrodes such as ITO, and a hole injection layer such as copper phthalocyanine (CuPc) is formed on the lower electrodes 32 and 40, and a film of NPB (N, N-di(naphtalence)- N, N-dipheneyl-benzodene) as a hole-transporting layer. The hole transport layer has a function of transporting holes injected from the lower electrodes 32 and 40 to the light emitting layers 34A and 43A. The hole transport layer may be a transport layer laminated with only one layer, or may be a transport layer laminated with two or more layers. In addition, the hole transport layer is not formed by a single material, and a single layer may be formed from a plurality of materials, or a host material with a high charge transport capability may be doped with a guest material with a high charge supply (accommodation) property.

Next, light emitting layers 34A and 43A are formed on the hole transport layer. As an example, the red (R), green (G), and blue (B) light emitting layers 34A and 43A are formed in the respective film formation regions by a resistance heating vapor deposition method using a mask for separate coating. As red (R), styrene dyes such as DCM1 (4-(dicyanomethylene)-2-methyl-6-(4'-dimethylaminostyryl)-4H-pyran) etc. are used An organic material that emits red light. As the green color (G), an organic material emitting green light such as quinoline aluminum complex (Alq ₃ ) is used. As the blue color (B), an organic material emitting blue light, such as a stilbene derivative or a triazole derivative, is used. Of course, other materials can be used, such as a host-guest layer structure, and a fluorescent light-emitting material or a phosphorescent light-emitting material can be used for the light-emitting form.

The electron transport layers formed on the light-emitting layers 34A and 43A are formed by various film-forming methods such as resistance heating vapor deposition and using various materials such as quinoline aluminum complex (Alq ₃ ). The electron transport layer has a function of transporting electrons injected from the upper electrodes 35 and 44 to the light emitting layers 34A and 43A. The electron transport layer may be a transport layer in which only one layer is laminated, or may have a multilayer structure in which two or more layers are laminated. In addition, the electron transport layer is not formed by forming a film of a single material, but may be formed by forming a single layer from a plurality of materials, or may be formed by doping a host material with a high charge transport ability with a guest material with a high charge supply (accommodation) property.

The insulating films 33 and 41 or the partition walls 42 are made of polyimide or a resist material. When the upper electrodes 35 and 44 function as cathodes, a material having a work function lower than that of the anode is used so as to have an electron injection function. For example, when using ITO as an anode, it is preferable to use aluminum (Al) or a magnesium alloy (Mg—Ag). Among them, since Al has low electron injection ability, it is preferable to provide an electron injection layer such as LiF between Al and the electron transport layer.

According to such an embodiment of the present invention, even when the width of the edge area FA (the width from the outer periphery of the light emitting portion 11 to the outer periphery of the substrate 10 ) is set to 0.5 mm or less, it is possible to obtain a good quality of the organic EL element 11A. sealing performance. Therefore, when the organic EL panel according to the embodiment of the present invention is assembled in electronic equipment or the like as a display device, the installation space required for assembly can be reduced relative to the desired display area, so that it is possible to obtain an electronic equipment that is easy to miniaturize. Effect. When placed indoors or in a car as an independent display device, desired display performance can be obtained without oppressing the surrounding space. In addition, when a plurality of panels are simultaneously formed on a large substrate, the number of panels can be increased by narrowing the area of the edge area FA, and the product yield can be improved to improve productivity.

In addition, when a large panel (tile panel) is formed by arranging a plurality of organic EL panels 1, the area of the non-light emitting region existing in the entire light emitting region of the large panel can be reduced, and the display performance of the large panel can be improved.

As mentioned above, although embodiment of this invention was described in detail with reference to drawings, the specific structure is not limited to these embodiment, Even if there is a design change in the range which does not deviate from the gist of this invention, it is also included in this invention. In addition, as long as there is no particular contradiction or problem in the above-mentioned respective embodiments, their purposes, structures, etc., each other's technology can be shared and combined.

Symbol Description

1: Organic EL panel,

10: substrate, 11: light emitting part, 11A: organic EL element,

20: sealing substrate, 21: adhesive layer, 22: -recess,

23: rib, 23A: bonding surface, 23B: side,

24: desiccant,

EA: luminous area, FA: edge area, C: sealed space,

θa: The angle formed by the tangent line L1 and the line L2.

Claims (9)

1. an organic EL panel is characterized in that,

This organic EL panel possesses substrate, be formed on this substrate and possess the illuminating part of at least 1 range upon range of organic EL that anode, organic layer, negative electrode arranged and fitted in the hermetic sealing substrate of said substrate through adhesive layer for this illuminating part is carried out hollow sealing

Said hermetic sealing substrate possesses the recess that holds said illuminating part and forms and have the flank of the adhesive surface relative with said substrate along the periphery of this recess,

Adhesive layer at said flank forms on the cross section in the part; Be 65 °～85 ° with tangent the most precipitous tangent line in the side of said flank and line angulation, and be formed said adhesive layer from the side that said adhesive surface spreads all over said flank along said adhesive surface.

2. organic EL panel as claimed in claim 1 is characterized in that,

Chamfered edge is carried out to the bight of said adhesive surface and said side in top at said flank.

3. according to claim 1 or claim 2 organic EL panel is characterized in that,

The recess of said hermetic sealing substrate is made as the segmentation flute profile.

4. like each described organic EL panel in the claim 1 to 3, it is characterized in that,

Said adhesive layer is formed from the side top of said flank towards said substrate wide cut shape gradually.

5. like each described organic EL panel in the claim 1 to 4, it is characterized in that,

The bottom surface of the said recess on said hermetic sealing substrate is equipped with drier.

6. the manufacturing approach of an organic EL panel is characterized in that, this method has:

Illuminating part forms operation, on substrate, forms the illuminating part that possesses at least 1 organic EL;

The hermetic sealing substrate manufacturing procedure forms the recess hold said illuminating part and along the periphery of this recess and have the flank of the adhesive surface relative with said substrate on hermetic sealing substrate; And

Sealing process, through adhesive layer fit said substrate and said hermetic sealing substrate and said illuminating part carried out hollow sealing,

In said hermetic sealing substrate manufacturing procedure; Process said hermetic sealing substrate as follows; Promptly form on the cross section in the part, be 65 °～85 ° with tangent the most precipitous tangent line in the side of said flank and line angulation along said adhesive surface at the adhesive layer of said flank

In said sealing process, the side that spreads all over said flank from said adhesive surface forms said adhesive layer.

7. the manufacturing approach of organic EL panel as claimed in claim 6 is characterized in that,

In said hermetic sealing substrate manufacturing procedure, chamfered edge processing is carried out in the bight of said adhesive surface and said side at the top of said flank.

8. like the manufacturing approach of claim 6 or 7 described organic EL panels, it is characterized in that,

In said hermetic sealing substrate manufacturing procedure, form said recess through etch processes.

9. like the manufacturing approach of each described organic EL panel in the claim 6 to 8, it is characterized in that,

In said sealing process, on said adhesive surface, be coated with binding agent, fitting is applied the said hermetic sealing substrate and the said substrate of binding agent.

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