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TWD230199S - 半導體製造裝置用基板支承具 - Google Patents

半導體製造裝置用基板支承具 Download PDF

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Publication number
TWD230199S
TWD230199S TW111300807F TW111300807F TWD230199S TW D230199 S TWD230199 S TW D230199S TW 111300807 F TW111300807 F TW 111300807F TW 111300807 F TW111300807 F TW 111300807F TW D230199 S TWD230199 S TW D230199S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
substrate support
manufacturing equipment
substrate
design
Prior art date
Application number
TW111300807F
Other languages
English (en)
Inventor
岡嶋優作
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD230199S publication Critical patent/TWD230199S/zh

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置用基板支承具，是在用以處理複數個晶圓之基板處理裝置中，在處理室內以包圍晶圓基板的方式設置有複數個本物品，並將各晶圓基板載置於插銷上。;【設計說明】;(無)

Description

半導體製造裝置用基板支承具
本設計的物品是半導體製造裝置用基板支承具，是在用以處理複數個晶圓之基板處理裝置中，在處理室內以包圍晶圓基板的方式設置有複數個本物品，並將各晶圓基板載置於插銷上。
(無)
TW111300807F 2021-08-27 2022-02-18 半導體製造裝置用基板支承具 TWD230199S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-018468 2021-02-08
JP2021018468F JP1706322S (zh) 2021-08-27 2021-08-27

Publications (1)

Publication Number Publication Date
TWD230199S true TWD230199S (zh) 2024-03-01

Family

ID=80218929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111300807F TWD230199S (zh) 2021-08-27 2022-02-18 半導體製造裝置用基板支承具

Country Status (3)

Country Link
US (1) USD1022933S1 (zh)
JP (1) JP1706322S (zh)
TW (1) TWD230199S (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD213399S (zh) 2019-08-19 2021-08-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基座軸

Family Cites Families (22)

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US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
USD291413S (en) * 1984-07-30 1987-08-18 Tokyo Denshi Kagaku Co., Ltd. Wafer holding frame
US4993559A (en) * 1989-07-31 1991-02-19 Motorola, Inc. Wafer carrier
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
JP3487497B2 (ja) * 1998-06-24 2004-01-19 岩手東芝エレクトロニクス株式会社 被処理体収容治具及びこれを用いた熱処理装置
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
KR100410982B1 (ko) * 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
TWD119910S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD119911S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD130137S1 (zh) * 2006-10-25 2009-08-01 東京威力科創股份有限公司 晶舟
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
JP1537629S (zh) * 2014-11-20 2015-11-09
JP1597807S (zh) * 2017-08-21 2018-02-19
JP1651258S (zh) * 2019-07-29 2020-01-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD213399S (zh) 2019-08-19 2021-08-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基座軸

Also Published As

Publication number Publication date
USD1022933S1 (en) 2024-04-16
JP1706322S (zh) 2022-01-31

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