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TWD112955S1 - Stage arm for semiconductor wafer delivery apparatus - Google Patents

Stage arm for semiconductor wafer delivery apparatus

Info

Publication number
TWD112955S1
TWD112955S1 TW094306664F TW94306664F TWD112955S1 TW D112955 S1 TWD112955 S1 TW D112955S1 TW 094306664 F TW094306664 F TW 094306664F TW 94306664 F TW94306664 F TW 94306664F TW D112955 S1 TWD112955 S1 TW D112955S1
Authority
TW
Taiwan
Prior art keywords
arm
semiconductor wafer
opening
semiconductor
platform
Prior art date
Application number
TW094306664F
Other languages
Chinese (zh)
Inventor
保廣樹
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD112955S1 publication Critical patent/TWD112955S1/en

Links

Abstract

【物品用途】;本創作的物品是一種半導體晶圓輸送裝置之平台臂,經由背面的開口部、平台臂、以及右側面的開口部,來輸送半導體晶圓的平台臂;例如在一次一片片自動搬送半導體晶圓的自動搬送裝置(RGV)和半導體處理裝置之間,經由右側面的開口部、以及背面的開口部來輸送半導體晶圓的半導體晶圓輸送裝置之平台臂。;【創作特點】;本創作例如使用狀態參考圖所示,RGV是將使用其搬送臂(RGV臂)所搬送的半導體晶圓,經由右側面的開口部而藉由平台臂輸送且保持;例如,平台臂在前端部輸送半導體晶圓,且保持半導體晶圓;作為檢查半導體晶圓的半導體處理裝置的檢查裝置,是使用其搬送臂(裝置臂)來輸送被保持在平台臂的半導體晶圓,經由背面的開口部將半導體晶圓搬送到檢查裝置內;該平台臂係以上下方向等間隔的複數配置在裝置內,可保持複數個由自動搬送裝置或半導體處理裝置被搬送的半導體晶圓;平台臂是從裝置的左正面側角隅部水平延設在對角線方向,前端部為略圓盤狀;平台臂的前述略圓盤狀前端部的略中心,是位於本創作的左正面側角隅部和右背面側角隅部的對角線上的略中心;平台臂是在上下方向等間隔的設置8個。[Purpose of the Article]; The article of this creation is a platform arm of a semiconductor wafer transport device, which transports semiconductor wafers through an opening on the back, the platform arm, and an opening on the right side; for example, between an automatic transport device (RGV) that automatically transports semiconductor wafers one by one and a semiconductor processing device, the platform arm of a semiconductor wafer transport device transports semiconductor wafers through an opening on the right side and an opening on the back. ;【Features of the creation】; As shown in the reference diagram of the usage status of this creation, for example, the RGV uses its transfer arm (RGV arm) to transport and hold the semiconductor wafer through the opening on the right side by the platform arm; for example, the platform arm transports the semiconductor wafer at the front end and holds the semiconductor wafer; the inspection device, which is a semiconductor processing device for inspecting semiconductor wafers, uses its transfer arm (device arm) to transport the semiconductor wafer held on the platform arm and moves the semiconductor wafer to the inspection device through the opening on the back side. sent to the inspection device; the platform arm is arranged in multiple numbers at equal intervals in the vertical direction in the device, and can hold multiple semiconductor wafers transported by an automatic transport device or a semiconductor processing device; the platform arm is horizontally extended from the left front side corner of the device in the diagonal direction, and the front end is slightly disc-shaped; the approximate center of the aforementioned slightly disc-shaped front end of the platform arm is the approximate center on the diagonal of the left front side corner and the right back side corner of the present invention; 8 platform arms are arranged at equal intervals in the vertical direction.

TW094306664F 2005-08-12 2005-11-03 Stage arm for semiconductor wafer delivery apparatus TWD112955S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005023558 2005-08-12

Publications (1)

Publication Number Publication Date
TWD112955S1 true TWD112955S1 (en) 2006-09-11

Family

ID=38921419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094306664F TWD112955S1 (en) 2005-08-12 2005-11-03 Stage arm for semiconductor wafer delivery apparatus

Country Status (2)

Country Link
US (1) USD559805S1 (en)
TW (1) TWD112955S1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD126123S1 (en) * 2007-06-06 2008-11-21 東京威力科創股份有限公司 Wafer holding member
TWD126122S1 (en) * 2007-06-06 2008-11-21 東京威力科創股份有限公司 Wafer holding member
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636960A (en) * 1992-07-29 1997-06-10 Tokyo Electron Limited Apparatus for detecting and aligning a substrate
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
ATE275759T1 (en) * 1995-03-28 2004-09-15 Brooks Automation Gmbh LOADING AND UNLOADING STATION FOR SEMICONDUCTOR PROCESSING SYSTEMS
TW319751B (en) * 1995-05-18 1997-11-11 Toshiba Co Ltd
JPH1111663A (en) * 1997-06-27 1999-01-19 Tokyo Electron Ltd Substrate conveying device
JPH11300663A (en) * 1998-04-24 1999-11-02 Mecs Corp Thin substrate conveying device
KR100646906B1 (en) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 Substrate processing apparatus and substrate processing method
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
KR20020088419A (en) * 2000-04-05 2002-11-27 동경 엘렉트론 주식회사 Treating device
KR100395549B1 (en) * 2001-06-22 2003-08-25 미래산업 주식회사 Switching System for Tray Feeder
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US7033126B2 (en) * 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
JP4303041B2 (en) * 2003-06-18 2009-07-29 株式会社ディスコ Semiconductor wafer processing equipment
TWI293282B (en) * 2003-12-31 2008-02-11 Innolux Display Corp Substrate transfer
JP4523513B2 (en) * 2005-08-05 2010-08-11 東京エレクトロン株式会社 Substrate delivery apparatus, substrate delivery method and storage medium

Also Published As

Publication number Publication date
USD559805S1 (en) 2008-01-15

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