TWD114184S1 - Semiconductor wafer delivery apparatus - Google Patents
Semiconductor wafer delivery apparatusInfo
- Publication number
- TWD114184S1 TWD114184S1 TW094306662F TW94306662F TWD114184S1 TW D114184 S1 TWD114184 S1 TW D114184S1 TW 094306662 F TW094306662 F TW 094306662F TW 94306662 F TW94306662 F TW 94306662F TW D114184 S1 TWD114184 S1 TW D114184S1
- Authority
- TW
- Taiwan
- Prior art keywords
- arm
- semiconductor wafer
- opening
- semiconductor
- platform
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 16
- 235000012431 wafers Nutrition 0.000 abstract 12
- 230000032258 transport Effects 0.000 abstract 6
- 238000007689 inspection Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
【物品用途】;本創作的物品是一種半導體晶圓輸送裝置，經由背面的開口部、平台臂、以及右側面的開口部，來輸送半導體晶圓的半導體晶圓輸送裝置；例如在一次一片片自動搬送半導體晶圓的自動搬送裝置(RGV)和半導體處理裝置之間，經由右側面的開口部、以及背面的開口部來輸送半導體晶圓的半導體晶圓輸送裝置。;【創作特點】;本創作例如使用狀態參考圖所示，RGV是將使用其搬送臂(RGV臂)所搬送的半導體晶圓，經由右側面的開口部而藉由平台臂輸送且保持；例如，平台臂在前端部輸送半導體晶圓，且保持半導體晶圓；作為檢查半導體晶圓的半導體處理裝置的檢查裝置，是使用其搬送臂(裝置臂)來輸送被保持在平台臂的半導體晶圓，經由背面的開口部將半導體晶圓搬送到檢查裝置內；本創作在上下方向等間隔具備複數個平台臂，可保持複數個由自動搬送裝置或半導體處理裝置被搬送的半導體晶圓；平台臂是從本創作的左正面側角隅部水平延設在對角線方向，前端部為略圓盤狀；平台臂的前述略圓盤狀前端部的略中心，是位於本創作的左正面側角隅部和右背面側角隅部的對角線上的略中心；平台臂是在上下方向等間隔的設置8個。[Purpose of the article]; The article of this creation is a semiconductor wafer conveying device that conveys semiconductor wafers through an opening on the back, a platform arm, and an opening on the right side; for example, between an automatic conveying device (RGV) that automatically conveys semiconductor wafers one by one and a semiconductor processing device, the semiconductor wafer conveying device conveys semiconductor wafers through an opening on the right side and an opening on the back. ;【Features of the creation】; As shown in the reference diagram of the usage status of this creation, for example, the RGV uses its transfer arm (RGV arm) to transport and hold the semiconductor wafer through the opening on the right side by the platform arm; for example, the platform arm transports the semiconductor wafer at the front end and holds the semiconductor wafer; the inspection device, which is a semiconductor processing device for inspecting semiconductor wafers, uses its transfer arm (device arm) to transport the semiconductor wafer held on the platform arm and transports the semiconductor wafer through the opening on the back side. Transport it into the inspection device; the present invention has a plurality of platform arms at equal intervals in the vertical direction, which can hold a plurality of semiconductor wafers transported by an automatic transport device or a semiconductor processing device; the platform arm is horizontally extended from the left front side corner of the present invention in the diagonal direction, and the front end is slightly disc-shaped; the approximate center of the aforementioned slightly disc-shaped front end of the platform arm is the approximate center on the diagonal of the left front side corner and the right back side corner of the present invention; 8 platform arms are arranged at equal intervals in the vertical direction.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005023556 | 2005-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD114184S1 true TWD114184S1 (en) | 2006-12-01 |
Family
ID=39362046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094306662F TWD114184S1 (en) | 2005-08-12 | 2005-11-03 | Semiconductor wafer delivery apparatus |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD568837S1 (en) |
| TW (1) | TWD114184S1 (en) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5636960A (en) * | 1992-07-29 | 1997-06-10 | Tokyo Electron Limited | Apparatus for detecting and aligning a substrate |
| US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
| ATE275759T1 (en) * | 1995-03-28 | 2004-09-15 | Brooks Automation Gmbh | LOADING AND UNLOADING STATION FOR SEMICONDUCTOR PROCESSING SYSTEMS |
| TW319751B (en) * | 1995-05-18 | 1997-11-11 | Toshiba Co Ltd | |
| JPH1111663A (en) * | 1997-06-27 | 1999-01-19 | Tokyo Electron Ltd | Substrate conveying device |
| JPH11300663A (en) * | 1998-04-24 | 1999-11-02 | Mecs Corp | Thin substrate conveying device |
| KR100646906B1 (en) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and substrate processing method |
| WO2000058188A1 (en) * | 1999-03-25 | 2000-10-05 | N & K Technology, Inc. | Wafer handling robot having x-y stage for wafer handling and positioning |
| US6610150B1 (en) * | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
| KR20020088419A (en) * | 2000-04-05 | 2002-11-27 | 동경 엘렉트론 주식회사 | Treating device |
| KR100395549B1 (en) * | 2001-06-22 | 2003-08-25 | 미래산업 주식회사 | Switching System for Tray Feeder |
| US7011484B2 (en) * | 2002-01-11 | 2006-03-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | End effector with tapered fingertips |
| JP4303041B2 (en) * | 2003-06-18 | 2009-07-29 | 株式会社ディスコ | Semiconductor wafer processing equipment |
| TWI293282B (en) * | 2003-12-31 | 2008-02-11 | Innolux Display Corp | Substrate transfer |
| JP4523513B2 (en) * | 2005-08-05 | 2010-08-11 | 東京エレクトロン株式会社 | Substrate delivery apparatus, substrate delivery method and storage medium |
-
2005
- 2005-11-03 TW TW094306662F patent/TWD114184S1/en unknown
- 2005-11-14 US US29/242,547 patent/USD568837S1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| USD568837S1 (en) | 2008-05-13 |
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