[go: up one dir, main page]

TW573947U - Heat sink including heat receiving surface with protruding portion - Google Patents

Heat sink including heat receiving surface with protruding portion

Info

Publication number
TW573947U
TW573947U TW92215955U TW92215955U TW573947U TW 573947 U TW573947 U TW 573947U TW 92215955 U TW92215955 U TW 92215955U TW 92215955 U TW92215955 U TW 92215955U TW 573947 U TW573947 U TW 573947U
Authority
TW
Taiwan
Prior art keywords
protruding portion
receiving surface
sink including
heat sink
heat receiving
Prior art date
Application number
TW92215955U
Other languages
Chinese (zh)
Inventor
Yasuhiro Ootori
Chiyoshi Sasaki
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of TW573947U publication Critical patent/TW573947U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW92215955U 1999-09-10 2000-09-07 Heat sink including heat receiving surface with protruding portion TW573947U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25693399A JP2001085877A (en) 1999-09-10 1999-09-10 Heat sink with heat receiving surface provided with protrusions

Publications (1)

Publication Number Publication Date
TW573947U true TW573947U (en) 2004-01-21

Family

ID=17299395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92215955U TW573947U (en) 1999-09-10 2000-09-07 Heat sink including heat receiving surface with protruding portion

Country Status (10)

Country Link
EP (1) EP1142015A1 (en)
JP (1) JP2001085877A (en)
KR (1) KR20010104257A (en)
CN (1) CN1321337A (en)
AU (1) AU6872700A (en)
BR (1) BR0007213A (en)
CA (1) CA2349833A1 (en)
HK (1) HK1039830A1 (en)
TW (1) TW573947U (en)
WO (1) WO2001020675A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100667932B1 (en) 2004-11-15 2007-01-11 삼성에스디아이 주식회사 Plasma display device
KR100684751B1 (en) 2004-11-17 2007-02-20 삼성에스디아이 주식회사 Plasma display device
KR100740119B1 (en) 2004-11-17 2007-07-16 삼성에스디아이 주식회사 Plasma display device
KR100659071B1 (en) * 2004-11-19 2006-12-21 삼성에스디아이 주식회사 Plasma display device
KR100696516B1 (en) * 2005-04-28 2007-03-19 삼성에스디아이 주식회사 Circuit element heat dissipation structure and plasma display module having same
KR100766922B1 (en) 2006-04-26 2007-10-17 삼성에스디아이 주식회사 Plasma display device
CN103477430A (en) * 2012-02-08 2013-12-25 华为技术有限公司 Casing for electronic equipment with an integrated heat sink
KR101407194B1 (en) * 2013-05-10 2014-06-12 현대오트론 주식회사 Electronic control apparatus for vehicle
US9253871B2 (en) 2013-10-31 2016-02-02 General Electric Company Circuit card assembly and method of fabricating the same
CN104882421A (en) * 2014-02-28 2015-09-02 西安永电电气有限责任公司 IGBT device heat dissipation structure
JP6398815B2 (en) * 2015-03-17 2018-10-03 株式会社デンソー Reducer motor
DE102015118245B4 (en) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Electronic component with a thermal interface material, manufacturing method for an electronic component, heat dissipation body with a thermal interface material and thermal interface material
CN108323090A (en) * 2017-01-14 2018-07-24 郭瑜 A kind of method and apparatus reducing compression stress in heat conductive pad application
CN108550559B (en) * 2018-05-28 2024-07-30 北京比特大陆科技有限公司 Heat sinks, chip components and circuit boards
CN211404486U (en) * 2019-08-09 2020-09-01 哈曼国际工业有限公司 Radiator for IC component and IC radiating assembly
CN112490202A (en) * 2019-09-12 2021-03-12 朋程科技股份有限公司 Power device package structure
DE102019131159A1 (en) * 2019-11-19 2021-05-20 Connaught Electronics Ltd. Heat sink for holding thermal paste and reducing heat for use in an electronic control unit (ECU)
CN111129195A (en) * 2019-12-09 2020-05-08 珠海格力电器股份有限公司 A photovoltaic module heat dissipation structure, back glass and photovoltaic module
CN111276455B (en) * 2020-02-17 2021-11-30 北京华电能源互联网研究院有限公司 Power module and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145647A (en) * 1984-01-10 1985-08-01 Fujitsu Ltd Heat dissipation installation method for heating element module
DE68925403T2 (en) * 1988-09-20 1996-05-30 Nippon Electric Co Cooling structure for electronic components
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US5729052A (en) * 1996-06-20 1998-03-17 International Business Machines Corporation Integrated ULSI heatsink

Also Published As

Publication number Publication date
EP1142015A1 (en) 2001-10-10
KR20010104257A (en) 2001-11-24
HK1039830A1 (en) 2002-05-10
CA2349833A1 (en) 2001-03-22
AU6872700A (en) 2001-04-17
CN1321337A (en) 2001-11-07
WO2001020675A1 (en) 2001-03-22
JP2001085877A (en) 2001-03-30
BR0007213A (en) 2001-07-31

Similar Documents

Publication Publication Date Title
TW498993U (en) Heat sink assembly
GB2325781B (en) Heat sink
TW573947U (en) Heat sink including heat receiving surface with protruding portion
SG91866A1 (en) Heat transfer surface
TW491376U (en) Heat sink
TW516800U (en) Heat sink assembly
GB2356288B (en) Heat spreader
GB2323434B (en) Heat sink
TW484794U (en) Heat sink
GB9900165D0 (en) Heat sink
TW450431U (en) Heat sink assembly including improved heat exchanger
TW490042U (en) Improved heat sink structure
TW534583U (en) Improved heat sink structure
TW447735U (en) Heat sink with compound structure
PL332346A1 (en) Heat sink
TW433443U (en) Improved heat sink structure
TW428745U (en) Side-blowing heat sink structure
TW510522U (en) Heat sink assembly
TW506568U (en) Heat sink assembly
SG75929A1 (en) Heat sink assembly
TW474558U (en) Heat sink structure
GB9804184D0 (en) Heat sink
CA96562S (en) Heat sink
AU137532S (en) Sink
AU138592S (en) Sink

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model