CN108323090A - A kind of method and apparatus reducing compression stress in heat conductive pad application - Google Patents
A kind of method and apparatus reducing compression stress in heat conductive pad application Download PDFInfo
- Publication number
- CN108323090A CN108323090A CN201710026832.4A CN201710026832A CN108323090A CN 108323090 A CN108323090 A CN 108323090A CN 201710026832 A CN201710026832 A CN 201710026832A CN 108323090 A CN108323090 A CN 108323090A
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- Prior art keywords
- radiator
- conductive pad
- heat conductive
- contact surface
- heat
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- 230000006835 compression Effects 0.000 title abstract description 36
- 238000007906 compression Methods 0.000 title abstract description 36
- 238000000034 method Methods 0.000 title abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000011469 building brick Substances 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 206010037660 Pyrexia Diseases 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 150000001336 alkenes Chemical class 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides it is a kind of radiator and heat conductive pad and electronic building brick are assembled when reducing the method for heat conductive pad compression stress.The surface contacted on a heat sink with heat conductive pad has the first contact surface just faced with corresponding electronic device upper surface, and at least one with the inclined face of the first contact surface or the groove at least one central part from contact area to edge or the material for being attached with low-surface-energy.When the radiator with this feature generates compression to heat conductive pad, the transverse movement of heat conduction cushion material can be promoted and to extending outside contact area, therefore reduce the compression stress that heat conductive pad generates.
Description
Technical field
It is applied to heat conductive pad the present invention relates to a kind of device for for dissipation from electronic devices and by the radiator
When contribute to reduce heat conductive pad compression stress method.
Background technology
With the increase of power consumption, more and more electronic devices, especially big power dissipating chip, such as power tube, CPU, FPGA
Deng being distributed in the application using radiator to enhance its heat.It is commonly applied with certain between electronic device and radiator
Boundary material, to reduce thermal resistance therebetween, heat conductive pad is the boundary material that one of which is widely used.Compared to other types
Boundary material, for example thermal grease conduction or phase change material film, there is heat conductive pad compressibility, this characteristic to make heat conductive pad can
To overcome the component mutually assembled with it（Radiator and electronic device）Between spacing tolerance.In certain electronic devices and heat dissipation
Device is because cannot be guaranteed the occasion being bonded just short transverse is there are tolerance（It is multiple electronics devices for example to use a radiator
Part radiate the case where, because there are height tolerances for each electronic device, and the spreader surface contacted with electronic device there is also
Flatness tolerance so that radiator cannot be guaranteed and each electronic device exactly in contact with）, it is using heat conductive pad as boundary material
One selection well, can be public by machinery existing for the distance between the compression of heat conductive pad counteracting electronic device to radiator
Difference, to ensure to form good heat passage between electronic device to radiator.
In the selection of heat conductive pad usually will there are two aspect the considerations of, when control its thermal conduction resistance, second is that controlling it
Compression stress.In the application of heat conductive pad, the electronic device of radiator and fever can be lined with heat conduction certain compression, so heat conduction
Pad and heating device and radiator are in close contact, to which the heat that electronic device generates can be transmitted to heat dissipation via heat conductive pad
Device and dissipate, used heat conductive pad is thinner, and thermal resistance is smaller, more advantageously reduces the temperature of heating device.But from control
The angle of tolerance processed will overcome identical mechanical tolerance, and used heat conductive pad is thinner, bigger to the compression ratio of heat conductive pad,
Big compression ratio will produce big compression stress.The compression stress that heat conductive pad generates can react on electronic device and printing simultaneously
Circuit board（PCB）On, and excessive pressure can cause printed circuit board deformation excessive, the fracture of electronic device soldered ball or even electronics
, there is prodigious harm in the problems such as device fragmentation to heating device and entire electronic equipment.So this in heat conductive pad application
The considerations of two aspects, control thermal conduction resistance and control compression stress, are conflicting, it is common practice to sacrifice a side
The performance (for example thermal conduction resistance) in face come meet on the other hand（For example compression stress）Requirement.
Fig. 1 show typical radiator in the prior art and its assembly with heat conductive pad and electronic building brick.It is printed at one
Circuit board processed（PCB）There are one on 10（Can be multiple in practical applications）Electronic device 20, radiator 30 are designed to electricity
The enhancing heat dissipation of sub- device 20.Due to the presence of mechanical tolerance, it cannot be guaranteed that the following table of the upper surface 201 and radiator of electronic device
301 energy exactly in contact with of face, so can be on two surfaces in fansink designs（201,301）Between stay there are one gap d, namely
In radiator, there is mechanical tolerances with PCB assembly time gaps d.The application of heat conductive pad 40 fills the gap d, while by leading
Heat pad 40 is compressed to offset the mechanical tolerance of gap d.In the prior art, the spreader surface 301 contacted with heat conductive pad 40
A typically plane, corresponding electronic device upper surface 201 are also plane, and such heat conductive pad 40 is flat by two
When face 201,301 is compressed, stress is not readily available release, therefore will produce high compression stress.Because of electronic device 20 and PCB
10 have the maximum limitation for bearing pressure, are typically to increase the thickness of gap d, thus need to select thicker in existing application
Heat conductive pad, to control its compression ratio, to ensure the compression stress of heat conductive pad and exist to the reaction force of heating device and PCB
In one suitable range.But thick heat conductive pad brings the thermal resistance of bigger, is unfavorable for the control of electronic device temperature.
Heat conductive pad will produce compression stress when compressed and its harm brought has been subjected to widely recognizing, and
Also some methods for reducing this compression stress are produced.Fig. 2 show one kind and is subtracted by doing multiple notch on heat conductive pad
The method of small heat conductive pad compression stress.When heat conductive pad shown in figure with notch is compressed, the heat conduction mat material around notch
Expect to incision transverse direction（The direction vertical with pressure）Extension, and then discharge partial shrinkage stress.But heat conductive pad is
A kind of material of softness, on it increase notch make it be particularly easy to deform, this considerably increases heat conductive pad in production by
The difficulty of operation.Therefore this method is seldom used in practical applications.
Patent document CN 104350592A disclose a kind of region manufacture cavity contacted on a heat sink with heat conductive pad
It reduces it and includes the compression stress that is generated to heat conductive pad when the component of heat conductive pad assembles.When with the invention radiator and
Electronic unit from two side compression heat conductive pads when, heat conduction cushion material can extend into cavity, and the compression to reduce heat conductive pad is answered
Power.However the shortcomings that invention is cavity described in it is completely in the coverage area of heat conductive pad, when the heat dissipation with the invention
Easily being retained when device compresses heat conductive pad, in cavity has a certain amount of air, will produce additional thermal conduction resistance.In addition, the invention
To the reduction power limitations of heat conductive pad compression stress in cavity to the containment of neighbouring heat conduction cushion material, overall improvement ability has
Limit.
Invention content
Heat conductive pad is a kind of preforming solid material.It is usually using silicon rubber as base material, and inside filling is with high-termal conductivity
The granular materials of energy, such as alumina particle, boron nitride particle or metallic particles.Heat conductive pad material is soft, when applying with pressure,
It can be compressed.When heat conductive pad is compressed, material can be to transverse direction（Direction i.e. vertical with pressure）And it is longitudinal（I.e.
The direction parallel with pressure）Movement.The movement of material longitudinal direction makes heat conductive pad become more closely knit, is answered to generate compression
Power, and lateral movement so that material extends outward or to the small region of compressing force, to discharge partial shrinkage stress,
It is to be utilized to promote heat conduction cushion material lateral to increase notch on heat conductive pad in the prior art in the method for reducing compression stress
The principle of movement reduces compression stress.
Heat conductive pad compression is reduced when radiator is assembled with heat conductive pad and electronic building brick the present invention provides one kind to answer
The method of power, i.e., the face contacted on a heat sink with heat conductive pad manufacture some features, as the attachment of inclined-plane, groove or surface is low
The material of surface energy promotes heat conduction cushion material when compressed to lateral movement, and reduces its compression stress in turn with this.
It is proposed, according to the invention, that contacted on a heat sink with heat conductive pad region tool there are one assembly when and corresponding electronics
The first contact surface and inclined second contact surface of at least one and the first contact surface that the upper surface of device is just facing, second
Contact surface is characterized as being higher than edge close to central part in contact area.When radiator and heat conductive pad with this feature
And when electronic building brick assembly, the upper surface of the second contact surface and electronic device is at a wedge shape, and the wedge-type shape is close to interior zone
It is narrow and close to marginal zone field width, be conducive to heat conductive pad when being pressurized to extending outside contact area.
It is proposed, according to the invention, that contacted on a heat sink with heat conductive pad region tool there are one assembly when and corresponding electronics
The direction of the first contact surface and at least one groove that the upper surface of device is just facing, groove is from radiator contact area
Central part to edge, one end is located at the middle section of radiator and heat conductive pad contact zone, and the other end will extend to or
Extend the contact area edge of radiator and heat conductive pad.Groove be conducive to neighbouring heat conductive pad be pressurized when material insertion and to
Extension outside contact area.
It is proposed, according to the invention, that contacted on a heat sink with heat conductive pad region tool there are one assembly when and corresponding electronics
The first contact surface that the upper surface of device is just facing, and be attached on a heat sink compared with radiator sheet with the contact surface of heat conductive pad
The low material of body material surface energy, can be graphite, polytetrafluoroethylene (PTFE), wax etc., and the material of low-surface-energy has low friction system
Number can reduce heat conductive pad in the abducent resistance that is pressurized.
It is proposed, according to the invention, that the region contacted on a heat sink with heat conductive pad can have simultaneously assembly when and accordingly
The first contact surface that the upper surface of electronic device is just facing, it is at least one with inclined second contact surface of the first contact surface, at least
One groove or it is attached with low-surface-energy material.
Description of the drawings
Fig. 1 is the schematic diagram that radiator is assembled with heat conductive pad and electronic building brick in the prior art.
Fig. 2 is the schematic diagram that the prior art increases notch in heat conductive pad.
Fig. 3 is the radiator schematic diagram according to the first embodiment of the present invention.
Fig. 4 is the radiator and heat conductive pad and electronic building brick assembling schematic diagram according to the first embodiment of the present invention.
Fig. 5 is the radiator schematic diagram according to the contactless area's protruding parts of the first embodiment of the present invention.
Fig. 6 is the radiator schematic diagram according to second embodiment of the invention.
Fig. 7 is the radiator schematic diagram according to third embodiment of the invention.
Specific implementation mode
The radiator of the present invention has on the surface that it is contacted with heat conductive pad is conducive to heat conductive pad expansion around when compressed
The feature of exhibition, this feature can be inclined-plane, groove, the material or combination thereof for adhering to low-surface-energy.
Fig. 3 shows the schematic diagram of first embodiment according to the present invention.Surface 301,302 as shown in the figure be radiator with
The contact surface of heat conductive pad, wherein surface 301 are the first contact surface, are filled when by the radiator of the present invention and heat conductive pad and electronic device
After matching, the surface that the first contact surface 301 will just face electronic device and be contacted with heat conductive pad, the second contact surface 302 favours
The composition of one contact surface 301, the second contact surface 302 can be plane or curved surface, and the second contact surface is in the center of contact area
Position is higher than edge, and 4 the second contact surfaces being made of plane are shown in Fig. 3.
Fig. 4 shows the section schematic diagram that the radiator using the first embodiment is assembled with heat conductive pad and electronic building brick,
There are fever electronic device 20, radiator 30 to be designed as improving the heat dissipation of electronic device 20, heat conduction on the PCB 10 of one electronic building brick
Pad 40 is applied between electronic device 20 and radiator 30.301 and 302 be respectively first contacting of being contacted with heat conductive pad of radiator
Face and the second contact surface, 201 be the upper surface of electronic device, the i.e. contact surface of electronic device and heat conductive pad.It dissipates as seen from Figure 4
First contact surface 301 of hot device is just facing the contact surface 201 of electronic device and heat conductive pad, and the second contact surface of radiator
302 with 201 wedgewise of contact surface of electronic device and heat conductive pad, it is narrow close to the central part of contact area and close to edge
It is wide.When heat conductive pad is by two surfaces of both sides wedgewise（301、201）When compression, the material of heat conductive pad is easier to expand to outside
Exhibition, thereby reduces the compression stress of heat conductive pad.In addition, using the radiator of the present embodiment can be designed as with heat conductive pad and
Electronic building brick makes the first contact surface 301 closer to the upper surface 201 of electronic device when assembling, so corresponding on heat conductive pad 40
The region of the first contact surface of radiator 301 to electronic device 20 have smaller thermal resistance, and the first contact surface of radiator 301 pair
The region on the electronic device surface answered（Middle section）The typically highest region of electronic device surface temperature, namely heat transfer most have
The region of effect, therefore radiator using the present invention can also improve the heat transfer from electronic device to radiator.
It should be noted that in one embodiment of the present invention shown in Fig. 3, the contact of the first contact surface 301 and second
Face 302 is built upon on the position 305 outstanding of radiator bottom one, but 305 be not the present invention necessary condition.Fig. 5 shows
Go out using the invention first embodiment and without the realization method of protruding parts 305 shown in Fig. 3, the as seen from Figure 5 implementation
The first contact surface 301 is overlapped with the lower surface 306 of radiator in example, and the second contact surface 302 has cut radiator lower surface 306
Inside, in the realization method, the first contact surface 301 and 302 occupied area of the second contact surface are not less than the heat conduction contacted
The area of pad or top surface area not less than corresponding electronic device.
Fig. 6 shows schematic diagram according to the second embodiment of the present invention.The table contacted with heat conductive pad on radiator 30
Bread contains the first contact surface 301, and one or more groove 303, when by the radiator of the present invention and heat conductive pad and electronics device
After part assembly, the first contact surface 301 will just face the upper surface of electronic device, i.e., the table that electronic device is contacted with heat conductive pad
The direction in face, groove 303 is from the central part of radiator and heat conductive pad contact area to edge, i.e. one end is located at radiator
With the central part of heat conductive pad contact zone, and the other end will extend to or extend the contact area of radiator and heat conductive pad.Ditch
The cross sectional shape of slot can be semicircle or polygon etc., can also have rounding around the corner for the section of polygon
Angle, those of ordinary skill should be appreciated that meeting for any cross sectional shape that can be manufactured in the contact area of radiator and heat conductive pad
The groove of feature of present invention is all within the scope of the present invention.When radiator and heat conductive pad with the second embodiment feature
And electronic device, when being assembled, the heat conduction cushion material close to groove can extend into groove and reduce partial shrinkage stress, together
Shi Yin has broader section at groove, it is also conducive to lateral expansion of the heat conduction cushion material to contact area, and further subtracts
The compression stress of small heat conductive pad.It is identical as the first embodiment of the present invention, in the schematic diagram of second embodiment shown in Fig. 6,
First contact surface 301 and groove 303 are all built in a protruding parts 305, but the protruding parts 305 are not equally this implementation
The necessary condition of example, those skilled in the art are appreciated that the technology that the present embodiment is described can not have at one easily
It is realized on the radiator for having the boss position.
Fig. 7 shows schematic diagram according to the third embodiment of the invention.The table contacted with heat conductive pad on radiator 30
Face, i.e., the first contact surface 301 as shown in the figure have compared with the lower material of radiator body material surface energy, such as graphite, polytetrafluoro
Ethylene, wax etc..The material of low-surface-energy has low coefficient of friction.When heat conductive pad is compressed by radiator, part heat conductive pad
Material can transverse movement and to extending outside constricted zone, during extension, heat conductive pad surface and spreader surface can produce
Raw friction, attachment is than radiator body material on the contact surface of radiator（Usually copper, aluminium alloy）The lower material of surface energy
Material can reduce frictional force between heat conductive pad and radiator, be more advantageous to the extension of heat conductive pad, to reduce heat conductive pad by
Compression stress when being compressed to radiator.The 3rd embodiment identical, shown in Fig. 6 as the first and second embodiments of the present invention
Schematic diagram in, the low-surface-energy material of the first contact surface 301 and attachment is all built in a protruding parts 305, but this is prominent
It is not the necessary condition of the present embodiment to go out position 305 equally, and those skilled in the art is appreciated that the skill that the present embodiment is described
Art can be realized easily at one on the radiator without the protruding parts.
Three embodiments described above respectively describe by the surface manufacture inclined-plane that contact on a heat sink with heat conductive pad,
Manufacture groove and the measure for adhering to low-surface-energy material enhance the extension of heat conductive pad to the periphery when being compressed by radiator
Property, and then reduce compression stress, but embodiments described above is not the whole embodiments of the present invention, according to the present invention
Spirit and principle made by it is any modify or improve, typically on a radiator simultaneously there is three above embodiment
Two kinds in described technology or three kinds, belong to protection scope of the present invention.
Radiator is to improve a kind of device of heat dissipation to increase heat dissipation area, and the common material for manufacturing radiator is copper
Or aluminium alloy.It is only exemplary in the heat radiator structure and shape shown in the accompanying drawings with substrate and fin of the present invention,
It should not generate limitation to the design scheme of the present invention, and the radiator in practical application can have more shapes, for example one
Metal plate, or the shell of installation electronic building brick all belong to radiator model when it is applied to improve dissipation from electronic devices
Farmland.
The embodiment of the present invention illustrate only a radiator and a matched situation of electronic device, but according to this
The spirit and principle of invention, it is equally applicable to the situation of a radiator and the cooperation of multiple electronic devices.
The present invention can reduce heat conductive pad generated stress when by radiator and electronic device compression, to reduce
Electronic device and PCB are risk of damage to, or can also select thinner heat conductive pad in the application, to improve electronic device
Heat dissipation performance.
The present invention is to the cost impact very little of radiator, the technology as described in one embodiment and second embodiment
Realization can be synchronized during die casting radiator, do not increase extra cost.
Claims (10)
1. a kind of radiator for for electronic building brick heat dissipation includes the electronics device of one or more fevers on electronic building brick
Part is applied with heat conductive pad between electronic device and radiator,
It is characterized in that
The surface with heat conductive pad contact has at least one first contact surface and corresponding electronic device and heat conduction on a heat sink
The contact surface of pad just faces, and radiator in the region contacted with heat conductive pad there is at least one and the first contact surface to tilt
The second contact surface or groove at least one central part from contact area to edge, or be attached with low table
The material of face energy.
2. radiator according to claim 1, which is characterized in that second contact surface is by plane or curved surface structure
At.
3. radiator according to claim 2, which is characterized in that central part of second contact surface in contact area
It is higher by edge.
4. radiator according to claim 1, which is characterized in that described groove one end is located at the central portion of contact area
Position, the other end extend to the edge or outside of contact zone.
5. radiator according to claim 4, which is characterized in that the cross sectional shape of the groove is semicircle or polygon
Shape.
6. radiator according to claim 5, which is characterized in that the polygonal cross-section has rounding angle.
7. radiator according to claim 1, which is characterized in that the material of the low-surface-energy is graphite, polytetrafluoroethyl-ne
One kind among alkene, wax.
8. radiator according to claim 1, which is characterized in that the radiator can have simultaneously the first contact surface,
It is one or more in second contact surface, groove, the attachment several features of low-surface-energy material.
9. according to the radiator described in claim 1 to 8, which is characterized in that the radiator is the form with fin, tablet
Form or shell for electronic building brick.
10. a kind of electronic equipment, which is characterized in that have radiator according to any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710026832.4A CN108323090A (en) | 2017-01-14 | 2017-01-14 | A kind of method and apparatus reducing compression stress in heat conductive pad application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710026832.4A CN108323090A (en) | 2017-01-14 | 2017-01-14 | A kind of method and apparatus reducing compression stress in heat conductive pad application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108323090A true CN108323090A (en) | 2018-07-24 |
Family
ID=62890631
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710026832.4A Pending CN108323090A (en) | 2017-01-14 | 2017-01-14 | A kind of method and apparatus reducing compression stress in heat conductive pad application |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114946279A (en) * | 2019-12-11 | 2022-08-26 | 美光科技公司 | Temperature Control Components for Electronic Systems |
| CN116723666A (en) * | 2022-09-15 | 2023-09-08 | 荣耀终端有限公司 | A thermal pad and its production method, heat dissipation module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11163231A (en) * | 1997-11-25 | 1999-06-18 | Mitsubishi Electric Corp | Semiconductor device with heat sink |
| CN1321337A (en) * | 1999-09-10 | 2001-11-07 | 索尼电脑娱乐公司 | Heat sink including heat receiving surface with protruding portion |
| CN1748011A (en) * | 2002-12-19 | 2006-03-15 | 3M创新有限公司 | Flexible heat sink |
| CN103404248A (en) * | 2012-11-13 | 2013-11-20 | 华为技术有限公司 | Radiator and radiating system |
| CN104350592A (en) * | 2012-02-09 | 2015-02-11 | 诺基亚通信公司 | Method and apparatus for reducing the mechanical stress when mounting assemblies with thermal pads |
| WO2016170777A1 (en) * | 2015-04-24 | 2016-10-27 | 日本電気株式会社 | Heat dissipation mechanism and device provided with same |
-
2017
- 2017-01-14 CN CN201710026832.4A patent/CN108323090A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11163231A (en) * | 1997-11-25 | 1999-06-18 | Mitsubishi Electric Corp | Semiconductor device with heat sink |
| CN1321337A (en) * | 1999-09-10 | 2001-11-07 | 索尼电脑娱乐公司 | Heat sink including heat receiving surface with protruding portion |
| CN1748011A (en) * | 2002-12-19 | 2006-03-15 | 3M创新有限公司 | Flexible heat sink |
| CN104350592A (en) * | 2012-02-09 | 2015-02-11 | 诺基亚通信公司 | Method and apparatus for reducing the mechanical stress when mounting assemblies with thermal pads |
| CN103404248A (en) * | 2012-11-13 | 2013-11-20 | 华为技术有限公司 | Radiator and radiating system |
| WO2016170777A1 (en) * | 2015-04-24 | 2016-10-27 | 日本電気株式会社 | Heat dissipation mechanism and device provided with same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114946279A (en) * | 2019-12-11 | 2022-08-26 | 美光科技公司 | Temperature Control Components for Electronic Systems |
| CN116723666A (en) * | 2022-09-15 | 2023-09-08 | 荣耀终端有限公司 | A thermal pad and its production method, heat dissipation module and electronic equipment |
| CN116723666B (en) * | 2022-09-15 | 2024-04-12 | 荣耀终端有限公司 | Thermal conductive pad and manufacturing method thereof, heat dissipation module, and electronic equipment |
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