JPH11163231A - Semiconductor device with heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow tight contact to a curved surface of a heat reception surface with no air reservoir occurrence, by forming a heat sink of a heat sink-attached semiconductor device allocated on a thermal conductive material on a heat spreader into such shape as convex at a central part on the side of thermal conductive material. SOLUTION: A heat reception surface 7 of a heat sink 3 is formed into such shape as generally convex with a large-radius arc on the side of a thermal conductive material 5. Related to the order of contact between the thermal conductive material 5 coated on a flat surface 6 or a heat spreader 4 and the heat reception surface 7 of the heat sink 3, firstly the central part of the heat reception surface 7 where the arc is higher contacts, and the thermal conductive material 5 deforms along the curved surface or the heat reception surface 7 of the heat sink 3 with no gap to, thereafter, contact the outside surface of the heat reception surface 7 where the arc is lower. Here, the thermal conductive material 5 is tightly contacted to the curved surface of the heat reception surface 7 of the heat sink 3 without causing air reservoir. An excessive thermal conductive material 5 is pushed outside to be held on a package 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device with a heat sink, and more particularly to an improvement in a semiconductor device with a heat sink for cooling a semiconductor chip such as a microprocessor housed in a package constituting electronic equipment.

[0002]

2. Description of the Related Art In recent years, microprocessors constituting electronic equipment have been remarkably developed, and their speed and performance have been increasing. As the speed and performance of the microprocessor increase, the size of the microprocessor increases and the amount of heat generated increases. However, since a microprocessor has a junction (junction), it is susceptible to heat, and if the junction temperature exceeds a predetermined value, it causes malfunction or failure. For this reason, a heat sink for heat dissipation is conventionally attached to the microprocessor, and the microprocessor is cooled by natural air cooling or forced air cooling by a cooling fan.

FIG. 10 is a perspective view showing a conventional semiconductor device with a heat sink, and FIG. 11 is a diagram showing a junction between a heat spreader and a heat sink when the heat sink is curved in the conventional semiconductor device with a heat sink shown in FIG. FIG. 10 and 11, 31
Is a package for accommodating a semiconductor chip such as a microprocessor, 32 is a number of lead pins attached to the package 31, 33 is a heat sink attached to the package 31, and 34 is a heat sink for the package 31 heated by heat generated in the semiconductor chip. Is a heat conductive material applied between the heat spreader 34 and the heat sink 33, and 36 is an air pocket (hollow) generated between the heat conductive material 35 and the heat sink 33.

Next, the operation will be described with reference to FIGS. 10 and 11. The package 31 houses a semiconductor chip such as a microprocessor inside, and is mounted on a printed circuit board or the like together with other components via lead pins 32, and performs a predetermined operation. Most of the heat generated by the operation of the semiconductor chip is transmitted from the package 31 to the heat spreader 32 on the package 31, then to the heat sink 33 via the heat conductive material 35 on the heat spreader 32, and finally to the fins of the heat sink 33. The air is cooled by natural air cooling or forced air cooling using a fan by conduction, convection and radiation. Further, a part of the heat generated from the semiconductor chip is transmitted to a printed circuit board or the like via the lead pins 32 provided on the package 31 and is cooled.

[0005]

In general, the mounting surfaces of the heat spreader 34 and the heat sink 33 are slightly uneven and warped. If the size of the irregularities and warpage exceeds a certain limit, an air pool 36 is generated between the heat spreader 34 and the heat sink 33, and heat conduction performance is immediately reduced. Since the conventional semiconductor device having a heat sink is relatively small, the flatness and the warpage are not large. For this reason, if the thermal conductive material 35 is, for example, silicone rubber, it is absorbed by its elasticity, and if it is silicone grease, it is absorbed by the applied thickness, and there is no problem.

However, in recent years, in particular, the package 31 containing a microprocessor has been increasing in size to accommodate a plurality of microprocessors, and the amount of heat generated has increased by the number of processors accommodated. Therefore, a large heat sink 33 can be attached. It became so. The heat sink 33 is generally made by cutting an aluminum alloy extruded shape into a predetermined length. However, when manufacturing the extruded shape, slight warpage occurs. It is finished with including. The occurrence of warpage is a general feature when extruding an aluminum alloy, and the warpage usually occurs in both the extrusion direction (longitudinal direction) and the extrusion cross-sectional direction.

The heat spreader 24 made of W (tungsten), W alloy or the like on the package 31 tends to be twisted or tilted as the size increases, and the flatness deteriorates. Even though the flatness per unit area and the warpage are the same, the absolute value of the unevenness and the warpage of the plane increases due to the overall increase. Therefore, as shown in FIG. 11, the heat conductive material 35 attached to the heat spreader 34 arranged corresponding to the microprocessor position is used.
When the heat sink 33 is attached with the heat conducting material 35
An air pool 36 is generated between the heat sink 33 and
There is a problem that the heat conduction efficiency of conducting heat from the package 31 to the heat sink 33 from the heat conducting material 35 is reduced.

A semiconductor chip such as a microprocessor, which is a heating element, is mounted in the package 31 so as to correspond to the central portion of the heat spreader 34. Therefore, the heat conduction performance was easily deteriorated. Therefore,
In order to improve the flatness of the mounting surface of the heat spreader 34 and the heat sink 33 and reduce the warpage, a method of finishing by machining with a milling machine or the like can be considered, but the processing cost increases and the cost increases accordingly. There was a problem.

FIG. 12 shows, for example, Japanese Patent Application Laid-Open No. 1-3072.
No. 53, a side view of a semiconductor device with a heat sink, FIG. 13 is an enlarged view of a portion A in FIG. 12, FIG. 14 and FIG.
FIG. 13 is a plan view showing a surface to which the heat sink shown in FIG. 12 is attached. 12 to 15, the same reference numerals as those in FIGS. 10 and 11 denote the same or corresponding parts, 37 denotes a groove provided on the heat sink 33 and has a depth of about 5 to 50 microns, and 37a and 37b denote the heat sink 33. The grooves 37c formed in a lattice pattern are formed on the heat sink 33.
The grooves 37d are concentrically arranged grooves, and the grooves 37d are crosswise grooves formed on the heat sink 33.

In the conventional semiconductor device with a heat sink, when the flatness and warpage of the heat sink 33 and the like are small, when a heat conductive material such as a heat conductive adhesive or silicone grease is applied as the heat conductive material 35, the heat sink 33 is generated therein. Groove bubbles 3
It acts so as to be removed by breaking at the protrusions 7a to 37d. However, it is considered that a sufficient effect cannot be obtained when the bubble is large and does not break due to straddling the grooves 37a to 37d, or when the flatness is poor or when the warpage is large.

Therefore, the present invention has been made to solve the above-mentioned problem, and is intended to be used when a heat sink is mounted on a package containing a microprocessor or the like.
An object of the present invention is to provide a semiconductor device with a heat sink that can be easily and inexpensively realized without lowering the heat conduction efficiency.

[0012]

Means for Solving the Problems The invention described in claim 1 is:
In a semiconductor device with a heat sink having a package for accommodating a semiconductor chip, a heat spreader disposed on the package, a heat conductive material disposed on the heat spreader, and a heat sink disposed on the heat conductive material, the heat sink has a heat sink. It is characterized in that it is formed in a convex shape at the center on the conductive material side.

According to a second aspect of the present invention, in the semiconductor device with the heat sink according to the first aspect, the convex shape of the heat sink is an arc shape.

According to a third aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to second aspects, the heat sink is provided with projections at both ends thereof in contact with the package.

According to a fourth aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to third aspects, the surface of the heat spreader in contact with the heat conductive material corresponds to the surface of the heat sink in contact with the heat conductive material. It is characterized by being formed in a concave shape as described above.

According to a fifth aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to fourth aspects, the heat sink has a plurality of through holes formed on a heat conductive material. .

According to a sixth aspect of the present invention, there is provided a package containing a semiconductor chip, a heat spreader disposed on the package, a heat conductive material disposed on the heat spreader, and a heat sink disposed on the heat conductive material. In a semiconductor device with a heat sink, the heat sink has a plurality of through holes formed on a heat conductive material.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIG. FIG. 1 is an overall perspective view of a semiconductor device with a heat sink according to a first embodiment of the present invention, and FIG. 2 is a partial sectional view showing a side surface of the semiconductor device with a heat sink shown in FIG. 1 and 2, reference numeral 1 denotes a package for accommodating a semiconductor chip such as a microprocessor, 2 denotes a lead pin attached to a plurality of packages 1, and 3 denotes a package 1.
Heat sink made of aluminum alloy, etc. attached to
Reference numeral 4 denotes a heat spreader made of tungsten, a tungsten alloy, or the like disposed on the package 1 for radiating the package 1 heated by the heat generated by the semiconductor chip. Reference numeral 5 denotes silver, zinc, or the like applied between the heat spreader 4 and the heat sink 3. A heat conductive material made of a metal-containing adhesive, a silicone-based adhesive, or the like;
Reference numeral 7 denotes a heat receiving surface of the heat sink 1 facing the heat spreader 4, and 8 denotes a projection provided on both ends of the heat sink 1 and in contact with the package 1.

In FIG. 2, the heat spreader 4 arranged on the package 1 so as to correspond to the position of the semiconductor chip housed in the package 1 has a flat surface 6 in contact with the heat conductive material 5 and a general flatness. Finished with precision. The heat conductive material 5 is a grease-like sheet or a gel-like sheet at the beginning of application of an adhesive or grease having good heat conductivity. The heat conductive material 5 is applied on the flat surface 6 of the heat spreader 4 with a predetermined thickness by a silk screen technique or the like, and the heat sink 3 is positioned such that the heat receiving surface 7 is opposed to the heat conductive material 5. It is placed on the heat conductive material 5, pressurized and fixed to the heat spreader 4 by the heat conductive material 5.

The heat receiving surface 7 of the heat sink 3 is
Assuming that a portion facing the heat spreader 4 is an arc on a semi-cylindrical curved surface having an arc of a large radius that is entirely convex on the side, the height of this arc is about 1% of the length of the arc.
When the height of the arc is increased, it is preferable that the distance between the heat sink 3 and the heat spreader 4 and the thickness of the heat conductive material 5 greatly vary between the central portion and the peripheral portion of the heat sink 3 so that heat is uniformly transmitted. Absent. Therefore, the height of the arc is preferably reduced in consideration of conducting heat uniformly. Even if the height of the arc is small, since it is convex on the heat conductive material 5 side, no air pool is generated. The heat conductive material 5 is applied to a thickness that is slightly smaller than the arc height of the heat receiving surface 7. If the thickness of the heat conductive material 5 is too large, the edges become thicker and the thermal conductivity deteriorates. Therefore, in consideration of the uniformity of the thermal conductivity, the thermal conductivity at the edges is particularly large. Is set appropriately so as not to deteriorate.

Therefore, the order of contact between the heat conductive material 5 applied on the flat surface 6 of the heat spreader 4 and the heat receiving surface 7 of the heat sink 3 is as follows. First heat sink 3
The central portion of the heat receiving surface 7 where the height of the arc of the circular arc is high contacts the heat conductive material 5, and then the heat conductive material 5 is brought into contact with the heat receiving surface 7 of the heat sink 3 by the weight of the heat sink 3 and external pressure. While being deformed along the curved surface of the heat receiving surface without any gap, the heat receiving surface 7 comes into contact sequentially with the outer portion having a lower arc height. At this time, the heat conductive material 5 adheres tightly to the curved surface of the heat receiving surface 7 of the heat sink 3 so as not to cause air pockets,
Move so as to be pushed out, reach the package 1 where the heat spreader 4 is not arranged, and accumulate on the package 1.

Finally, the heat conductive material 5 is crushed until the protrusions 8 provided on both ends of the heat sink 3 contact the upper surface of the package 1, and the heat receiving surface 7 of the heat sink 3 contacts the heat spreader 4 or slightly. Is fixed via the heat conductive material 5 having a thickness of The height of the protrusion 8 is determined by whether the heat receiving surface 7 of the heat sink 3 is in contact with the heat spreader 4 or not.
Alternatively, the interval is set to be the minimum, and the heat sink 3 is set so as not to be attached to the package 1 at an angle.

As described above, in the present embodiment, since the heat sink 3 is formed in an arc shape on the heat conductive material 5 side, the heat receiving surface 7 comes into contact with the center of the heat conductive material 5 on the heat spreader 4, and the heat receiving surface 7 is sequentially formed on the outside. The heat sink 3 can be fixed to the heat spreader 4 via the heat conductive material 5 because air can be prevented from being generated between the heat sink 3 and the heat conductive material 5. For this reason, the heat generated from the semiconductor chip can be transmitted from the package 1 to the heat sink 3 with good thermal conductivity, and the semiconductor chip can be efficiently moved, as compared with the conventional case where an air pocket occurs between the heat sink 3 and the heat conductive material 5. Can be cooled.

In the present embodiment, the heat sink 3
Since the projections 8 are provided at both ends of the heat sink 3, the distance between the heat sink 3 and the heat spreader 4 and the inclination of the heat sink 3 with respect to the package 1 can be adjusted by the projections 8. For this reason, it is possible to suppress the variation in the heat conduction between the heat sink 3 and the heat spreader 4, and to make the heat conductivity uniform.

Further, in the present embodiment, the heat sink 3 having the projection 8 and the arc shape is used. However, since the heat sink 3 can be formed by extrusion molding with a normal aluminum alloy or the like, the processing cost increases. It is not necessary to perform special machining, and an easy and inexpensive semiconductor device with a heat sink can be realized.

In the above embodiment, the case where the heat sink 3 is formed in an arc shape on the heat conductive material 5 side has been described. However, the heat sink 3 is basically formed in a convex shape at the central portion on the heat conductive material 5 side. For example, as shown in FIG. 3, the heat sink 3 may be configured in a trapezoidal shape on the heat conductive material 5 side. According to the heat sink 3, since the heat sink 3 has a trapezoidal shape, heat can be efficiently conducted in the central portion where the amount of heat conduction is larger than in the case of a triangular shape.

Embodiment 2 FIG. 4 is an overall perspective view of a semiconductor device with a heat sink according to a second embodiment of the present invention, and FIG. 5 is a partial cross-sectional view showing a side surface of the semiconductor device with a heat sink shown in FIG. It is. 4 and 5, FIG. 1 and FIG.
The same reference numerals denote the same or corresponding parts, and a description thereof will not be repeated. 9 is a concave curved surface corresponding to the convex curved surface of the heat receiving surface 7 of the heat sink 3 provided on the heat spreader 4 arranged on the package 1.

Next, the operation will be described with reference to FIG. In FIG. 5, as in the first embodiment, the heat conductive material 5
Is applied flat on the concave curved surface 9 of the heat spreader 4 arranged on the package 1, and the heat sink 3 is placed on the heat conductive material 5 so that the heat receiving surface 7 of the heat sink 3 is opposed to the heat conductive material 5. Pressurized and fixed to the heat spreader 4 by the heat conductive material 5. At this time, the heat conductive material 5 applied on the heat spreader 4 and the heat receiving surface 7 of the heat sink 3 come into contact in the same order as in the first embodiment.
The excess heat conductive material 5 moves so as to be pushed out so as not to cause air pockets between the heat conductive material 5 and the heat receiving surface 7 of the heat sink 3, and the package 1 in which the heat spreader 4 is not disposed is provided. Package 1 up to the top
Collect on top.

Finally, the center of the heat receiving surface 7 of the heat sink 3 having the convex arcuate curved surface coincides with the center of the concave curved surface 9 of the heat spreader 4 corresponding to the convex curved surface of the heat receiving surface 7. The convex curved surface of the heat sink 3 and the concave curved surface of the heat spreader 4 are contacted and fixed. Considering the contact between the convex curved surface of the heat sink 3 and the concave curved surface of the heat spreader 4, the radius of each curved surface should be equal or the heat sink 3
The radius of the convex curved surface may be slightly smaller than the radius of the concave curved surface of the heat spreader 4.

As described above, in the present embodiment, as in the first embodiment, since the heat sink 3 is formed in an arc shape on the heat conductive material 5 side, air pockets are generated between the heat sink 3 and the heat conductive material 5. Without doing this, the heat sink 3 can be fixed to the heat spreader 4 via the heat conductive material 5. For this reason, the heat generated from the semiconductor chip can be transmitted from the package 1 to the heat sink 3 with good thermal conductivity, and the semiconductor chip can be efficiently moved, as compared with the conventional case where an air pocket occurs between the heat sink 3 and the heat conductive material 5. Can be cooled.

Also, in the present embodiment, the heat spreader 4 is formed in a concave shape so that the surface in contact with the heat conductive material 5 corresponds to the surface of the heat sink 3 in contact with the heat conductive material 5. In addition, the heat sink 3 and the heat spreader 4 can be fixed with better adhesion than in the case of the first embodiment of the heat spreader 4 in which the surface in contact with the heat conductive material 5 is flat. Therefore, the heat conductivity between the heat sink 3 and the heat spreader 4 can be improved as compared with the case of the first embodiment.

Embodiment 3 FIG. FIG. 6 is a plan view of a semiconductor device with a heat sink according to a third embodiment of the present invention, and FIG. 7 is a partial cross-sectional view showing a side surface of the semiconductor device with a heat sink shown in FIG. 6 and 7, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts, and a description thereof will not be repeated. Reference numeral 10 denotes a plurality of through holes provided on the heat receiving surface 7 which is in contact with the heat conductive material 5 of the heat sink 3. Here, as in the first embodiment, the surface of the heat spreader 4 that is in contact with the heat conductive material 5 is the flat surface 6.

In FIG. 7, as in the first embodiment, the heat conductive material 5 is applied evenly on the flat surface 6 of the heat spreader 4 arranged on the package 1, and the heat sink 3 The surface 7 is positioned on the heat conductive material 5 so as to be opposed to the heat conductive material 5, and is pressurized and fixed to the heat spreader 4 by the heat conductive material 5. At this time, the heat conductive material 5 applied on the heat spreader 4
Is a through hole 10 provided in the heat receiving surface 7 of the heat sink 3.
Press and fix until slightly extruded from. When the heat conductive material 5 is extruded from the through-hole 10, the heat spreader 4 and the heat receiving surface 7 of the heat sink 3 come into contact with each other via the heat conductive material 5 without generating air pockets between the heat sink 3 and the heat conductive material 5. .

If the heat receiving surface 7 of the heat sink 3 is concavely warped, the periphery of the heat receiving surface 7 comes into contact first, and when the heat receiving material 7 is further pressed, the heat conductive material 5 accumulates in the non-contact portion at the center. The central portion of the heat sink 3 comes into contact with the air while extruding the air from the through hole 10 formed in the heat receiving surface 7 to fill the concave warp portion of the heat sink 3 so that no air is trapped. The through holes 10 formed in the heat receiving surface 7 of the heat sink 3 are arranged at predetermined intervals in a range where the heat conductive material 5 is applied, so that even if the heat sink 3 has a local warp or a dent, heat conduction is performed. Filled with material 5. The diameter of the through-holes 10 is made small and the number thereof is appropriately set in consideration of the heat conduction performance so as not to greatly affect the heat conduction performance of the heat sink 3.

As described above, in the present embodiment, the through hole 10 provided in the entire heat receiving surface 7 of the heat sink 3 causes the heat receiving surface 7 to be generated at the beginning of contact even if it comes into contact with any part of the heat conductive material 5. The trapped air can be discharged to the outside of the heat sink 3. Therefore, similarly to the first and second embodiments, it is possible to prevent the formation of air pockets between the heat sink 3 and the heat conductive material 5, and to fix the heat sink 3 to the heat spreader 4 via the heat conductive material 5. Therefore, the heat generated from the semiconductor chip can be transmitted from the package 1 to the heat sink 3 with good thermal conductivity, and the semiconductor chip can be cooled efficiently, as compared with the case where air pools occur between the conventional heat sink 3 and the heat conductive material 5. can do.

In the third embodiment, the case where the through hole 10 is provided in a state where the surfaces of the heat sink 3 and the heat spreader 4 that are in contact with the heat conductive material 5 are flat is described, for example, as shown in FIG. In the first embodiment, a through hole 10 is provided in a portion of the heat sink 3 on the heat conductive material 5 in a state where a surface of the heat sink 3 in contact with the heat conductive material 5 is formed in a convex arc shape. In this case, an air pool can be less likely to be generated between the heat sink 3 and the heat conductive material 5 than in the first embodiment. For example, as shown in FIG. 9, in Embodiment 2, the surface of heat sink 3 in contact with heat conductive material 5 is formed into a convex arc shape, and heat conductive material 5 of heat spreader 4 is correspondingly formed. In a state where the surface in contact with the heat sink 3 has a concave shape,
In this case, it is possible to make it harder for air to accumulate between the heat sink 3 and the heat conductive material 5 than in the case of the second embodiment.

[0037]

According to the first aspect of the present invention, by forming the heat sink in a convex shape at the central portion on the heat conductive material side, the heat receiving surface of the heat sink contacts the central portion of the heat conductive material on the heat spreader, Since the heat sink can be sequentially brought into contact with the outside, it is possible to prevent the formation of air pockets between the heat sink and the heat conductive material, and the heat sink can be fixed to the heat spreader via the heat conductive material. For this reason, the heat generated from the semiconductor chip can be transmitted from the package to the heat sink with better heat conductivity, and the semiconductor chip can be cooled more efficiently than in a case where air puddle occurs between the conventional heat sink and the heat conductive material. There is an effect that can be.

According to the first aspect of the present invention, by using a heat sink formed in a convex shape at the center on the heat conductive material side, the heat sink is formed by extrusion molding with a normal aluminum alloy or the like. Therefore, it is possible to eliminate the need for special machining that increases the processing cost, and it is possible to realize an easily and inexpensive semiconductor device with a heat sink.

According to the second aspect of the present invention, in the semiconductor device with the heat sink according to the first aspect, the heat sink is formed in an arc shape on the heat conductive material side, so that the heat receiving surface of the heat sink is formed on the heat spreader. Since the contact can be made from the central portion of the material and sequentially in contact with the outside efficiently, air pools can be prevented from being generated between the heat sink and the heat conductive material, and the heat sink can be fixed to the heat spreader via the heat conductive material. . For this reason, the heat generated from the semiconductor chip can be transmitted from the package to the heat sink with better heat conductivity, and the semiconductor chip can be cooled more efficiently than in a case where air puddle occurs between the conventional heat sink and the heat conductive material. There is an effect that can be.

According to the third aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to second aspects, the distance between the heat sink and the heat spreader and the package of the heat sink are provided by providing protrusions at both ends of the heat sink. Can be adjusted, the variation in the heat conduction between the heat sink and the heat spreader can be further suppressed, and the heat conductivity can be made more uniform.

According to a fourth aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to third aspects, the heat spreader may be configured such that a surface of the heat sink in contact with the heat conductive material is in contact with a surface of the heat sink in contact with the heat conductive material. By forming a concave shape so as to correspond, the heat sink and the heat spreader can be fixed with better adhesion than a heat spreader having a flat surface in contact with the heat conductive material. This has the effect that the thermal conductivity of the metal can be further improved.

According to the fifth aspect of the present invention, in the semiconductor device with a heat sink according to any one of the first to fourth aspects, the heat sink is formed by forming a plurality of through holes on a heat conductive material. Since the air between the heat conducting materials can be discharged to the outside through the through holes, there is an effect that the air pool generated between the heat sink and the heat conducting material can be efficiently suppressed.

According to the sixth aspect of the present invention, by forming the heat sink by forming a plurality of through holes on the heat conductive material, the air pool generated between the heat sink and the heat conductive material is discharged to the outside of the heat sink. Because you can
Air pools can be prevented from being generated between the heat sink and the heat conductive material as compared with the case where there is no conventional through hole, and the heat sink can be fixed to the heat spreader via the heat conductive material. Therefore, heat generated from the semiconductor chip can be transmitted from the package to the heat sink with good thermal conductivity, and the semiconductor chip can be cooled efficiently.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing a semiconductor device with a heat sink according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing a structure of the semiconductor device with a heat sink shown in FIG.

FIG. 3 is a partial cross-sectional view showing a structure of a semiconductor device with a heat sink applicable to the present invention.

FIG. 4 is an overall perspective view showing a semiconductor device with a heat sink according to a second embodiment of the present invention.

5 is a partial cross-sectional view showing the structure of the semiconductor device with a heat sink shown in FIG.

FIG. 6 is a plan view showing a semiconductor device with a heat sink according to a third embodiment of the present invention.

7 is a partial cross-sectional view showing the structure of the semiconductor device with a heat sink shown in FIG.

FIG. 8 is a partial cross-sectional view showing a structure of a semiconductor device with a heat sink applicable to the present invention.

FIG. 9 is a partial cross-sectional view showing a structure of a semiconductor device with a heat sink applicable to the present invention.

FIG. 10 is an overall perspective view showing a conventional semiconductor device with a heat sink.

11 is a partial cross-sectional view showing the structure of the semiconductor device with a heat sink shown in FIG.

FIG. 12 is a side view showing a conventional semiconductor device with a heat sink.

FIG. 13 is an enlarged view showing a structure of a portion A shown in FIG.

FIG. 14 is a plan view showing the shape of grooves provided in a grid on the contact surface of the heat sink shown in FIG. 12 with a heat conductive material.

FIG. 15 is a plan view showing a shape of a groove provided concentrically on a contact surface of the heat sink shown in FIG. 12 with a heat conductive material.

[Explanation of symbols]

1 package, 2 lead pins, 3 heat sinks,
4 heat spreader, 5 heat conductive material, 6 plane, 7
Heat receiving surface, 8 protrusions, 9 curved surfaces, 10 through holes.

Claims (6)

[Claims] A package for housing a semiconductor chip;
In a semiconductor device with a heat spreader having a heat spreader disposed on a package, a heat conductive material disposed on the heat spreader, and a heat sink disposed on the heat conductive material, the heat sink is convex at a central portion on the heat conductive material side. A semiconductor device with a heat sink, wherein the semiconductor device is formed in a shape. 2. The semiconductor device with a heat sink according to claim 1, wherein the convex shape of the heat sink is an arc shape. 3. The semiconductor device with a heat sink according to claim 1, wherein the heat sink is provided with projections at both ends thereof that are in contact with a package. 4. The semiconductor device with a heat sink according to claim 1, wherein the heat spreader is formed in a concave shape such that a surface in contact with the heat conductive material corresponds to a surface of the heat sink in contact with the heat conductive material. A semiconductor device with a heat sink, comprising: 5. The semiconductor device with a heat sink according to claim 1, wherein the heat sink has a plurality of through holes formed on a heat conductive material. 6. A package for housing a semiconductor chip,
In a semiconductor device having a heat spreader disposed on a package, a heat conductive material disposed on the heat spreader, and a heat sink disposed on the heat conductive material, the heat sink has a plurality of through holes on the heat conductive material. A semiconductor device with a heat sink, wherein a semiconductor device is provided.