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TW573947U - Heat sink including heat receiving surface with protruding portion - Google Patents

Heat sink including heat receiving surface with protruding portion

Info

Publication number
TW573947U
TW573947U TW92215955U TW92215955U TW573947U TW 573947 U TW573947 U TW 573947U TW 92215955 U TW92215955 U TW 92215955U TW 92215955 U TW92215955 U TW 92215955U TW 573947 U TW573947 U TW 573947U
Authority
TW
Taiwan
Prior art keywords
protruding portion
receiving surface
sink including
heat sink
heat receiving
Prior art date
Application number
TW92215955U
Other languages
English (en)
Inventor
Yasuhiro Ootori
Chiyoshi Sasaki
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of TW573947U publication Critical patent/TW573947U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW92215955U 1999-09-10 2000-09-07 Heat sink including heat receiving surface with protruding portion TW573947U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25693399A JP2001085877A (ja) 1999-09-10 1999-09-10 突起部を有する受熱面を備えたヒートシンク

Publications (1)

Publication Number Publication Date
TW573947U true TW573947U (en) 2004-01-21

Family

ID=17299395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92215955U TW573947U (en) 1999-09-10 2000-09-07 Heat sink including heat receiving surface with protruding portion

Country Status (10)

Country Link
EP (1) EP1142015A1 (zh)
JP (1) JP2001085877A (zh)
KR (1) KR20010104257A (zh)
CN (1) CN1321337A (zh)
AU (1) AU6872700A (zh)
BR (1) BR0007213A (zh)
CA (1) CA2349833A1 (zh)
HK (1) HK1039830A1 (zh)
TW (1) TW573947U (zh)
WO (1) WO2001020675A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100667932B1 (ko) 2004-11-15 2007-01-11 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100684751B1 (ko) 2004-11-17 2007-02-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100740119B1 (ko) 2004-11-17 2007-07-16 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100659071B1 (ko) * 2004-11-19 2006-12-21 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
KR100696516B1 (ko) * 2005-04-28 2007-03-19 삼성에스디아이 주식회사 회로소자 방열 구조 및 이를 구비한 플라즈마 디스플레이모듈
KR100766922B1 (ko) 2006-04-26 2007-10-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
CN103477430A (zh) * 2012-02-08 2013-12-25 华为技术有限公司 具有集成散热器的用于电子设备的壳体
KR101407194B1 (ko) * 2013-05-10 2014-06-12 현대오트론 주식회사 차량의 전자제어장치
US9253871B2 (en) 2013-10-31 2016-02-02 General Electric Company Circuit card assembly and method of fabricating the same
CN104882421A (zh) * 2014-02-28 2015-09-02 西安永电电气有限责任公司 Igbt器件的散热结构
JP6398815B2 (ja) * 2015-03-17 2018-10-03 株式会社デンソー 減速機付モータ
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
CN108323090A (zh) * 2017-01-14 2018-07-24 郭瑜 一种在导热垫应用中减小压缩应力的方法和装置
CN108550559B (zh) * 2018-05-28 2024-07-30 北京比特大陆科技有限公司 散热片、芯片组件及电路板
CN211404486U (zh) * 2019-08-09 2020-09-01 哈曼国际工业有限公司 用于ic元器件的散热器和ic散热组件
CN112490202A (zh) * 2019-09-12 2021-03-12 朋程科技股份有限公司 功率器件封装结构
DE102019131159A1 (de) * 2019-11-19 2021-05-20 Connaught Electronics Ltd. Kühlkörper zum Halten von Wärmeleitpaste und zur Wärmesenkung für eine Verwendung in einer elektronischen Steuereinheit (Electronic Control Unit - ECU)
CN111129195A (zh) * 2019-12-09 2020-05-08 珠海格力电器股份有限公司 一种光伏组件散热结构、背板玻璃及光伏组件
CN111276455B (zh) * 2020-02-17 2021-11-30 北京华电能源互联网研究院有限公司 一种功率模块及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145647A (ja) * 1984-01-10 1985-08-01 Fujitsu Ltd 発熱体モジユ−ルの放熱取付方法
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nippon Electric Co Kühlungsstruktur für elektronische Bauelemente
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US5729052A (en) * 1996-06-20 1998-03-17 International Business Machines Corporation Integrated ULSI heatsink

Also Published As

Publication number Publication date
EP1142015A1 (en) 2001-10-10
KR20010104257A (ko) 2001-11-24
HK1039830A1 (zh) 2002-05-10
CA2349833A1 (en) 2001-03-22
AU6872700A (en) 2001-04-17
CN1321337A (zh) 2001-11-07
WO2001020675A1 (en) 2001-03-22
JP2001085877A (ja) 2001-03-30
BR0007213A (pt) 2001-07-31

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model