KR100696516B1 - Circuit element heat dissipation structure and plasma display module having same - Google Patents

Abstract

An object of the present invention is to provide a circuit element heat dissipation structure capable of efficiently dissipating heat generated from a circuit element and a plasma display module having the same by providing a heat conductive layer formed to contact the circuit element and the circuit board. In order to achieve the object, the present invention includes a circuit board, a circuit element disposed on the circuit board, and a thermally conductive layer made of a material that is not electrically conductive and thermally conductive and formed to contact the circuit element and the circuit board. A circuit device heat dissipation structure and a plasma display module having the same are provided.

Description

Heat dissipating structure for circuit element and plasma display module comprising the same}

1 is a perspective view of an example of a display module used in a conventional plasma display device.

FIG. 2 is an enlarged schematic cross-sectional view of a circuit board part of the plasma display module of FIG. 1.

3 is a schematic perspective view of an embodiment of a plasma display module including a circuit element heat dissipation structure according to a first embodiment of the present invention.

4 is a schematic perspective view illustrating an enlarged portion of a circuit board on which a circuit device heat dissipation structure according to a first embodiment of the present invention is implemented.

5 is a cross-sectional view taken along the line VV of FIG. 4.

6 is a schematic perspective view illustrating an enlarged portion of a circuit board on which a circuit device heat dissipation structure according to a second exemplary embodiment of the present invention is implemented.

FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

Explanation of symbols on the main parts of the drawings

200: plasma display module 210: plasma display panel

211: first substrate 212: second substrate

220, 320: circuit boards 230, 330: chassis

240, 340: heat conductive layers 251, 351: boss

252, 352: volts 260, 360: circuit elements

370: auxiliary thermal conductive layer 380: heat sink

381: heat sink fins

The present invention relates to a circuit element heat dissipation structure and a plasma display module having the same, and more particularly, a circuit capable of efficiently dissipating heat generated from a circuit element by having a heat conductive layer formed to contact the circuit element and the circuit board. The present invention relates to a device heat dissipation structure and a plasma display module having the same.

Recently, a plasma display panel (PDP), which is drawing attention as a replacement for a conventional cathode ray tube display device, is discharged after a discharge gas is filled between two substrates on which a plurality of electrodes are formed. The phosphor formed in a predetermined pattern is excited by the ultraviolet rays generated thereby to obtain a desired image.

1 is a perspective view of an example of a display module used in a conventional plasma display device.

As shown in FIG. 1, the plasma display module 100 typically includes a plasma display panel 110, a plurality of circuit boards 120 on which circuits driving the plasma display panel 110 are arranged, and the plasma display panel. And a chassis 130 for supporting the panel 110 and the circuit board 120.

FIG. 2 is a schematic cross-sectional view illustrating an enlarged portion of the circuit board 120 of the plasma display module of FIG. 1.

As shown in FIG. 2, the circuit board 120 is mounted to the chassis 130 at a predetermined distance from the chassis 130 by the boss 151 and the screw bolt 152. 140 are mounted on the circuit board 120.

The circuit element 140 includes a circuit element 141 having a large amount of heat generated and a circuit element 142 having a small amount of heat generated. In the case of a circuit element 141 having a large amount of heat generated, a heat sink 160 having a heat radiation fin is formed. Is installed in contact.

The heat sink 160 is installed in contact with one surface of the circuit element 141, and a lower end thereof is mounted on the circuit board 120 by a fixed leg 161.

Therefore, heat generated in the circuit element 141 is discharged to the air behind the circuit board 120 by convective heat transfer via the heat dissipation fin of the heat sink 160.

However, in the conventional circuit element heat dissipation structure, there is a problem in that heat generated from the circuit element 141 may not be efficiently released.

That is, in the conventional circuit element heat dissipation structure, the heat generated from the circuit element 141 is discharged only through the heat dissipation fin of the heat sink 160, but the expansion of the surface area of the heat dissipation fin of the heat sink 160 is limited. Since the flow of air in contact with the heat radiating fins is limited, heat generated in the circuit element 141 may not be sufficiently discharged, and heat is concentrated to cause the circuit element 141 to overheat.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and a main object of the present invention is to provide a heat conductive layer formed to contact a circuit element and a circuit board, thereby efficiently dissipating heat generated from the circuit element. It is to provide a circuit element heat dissipation structure and a plasma display module having the same.

In order to achieve the above object and other objects, the present invention, the circuit board, the circuit element disposed on the circuit board, made of a non-electrically conductive and thermally conductive material and the circuit element and the circuit Provided is a circuit device heat dissipation structure including a heat conduction layer formed to contact a substrate.

In addition, the object of the present invention as described above, a display panel for implementing an image, a circuit board for driving the display panel, a chassis for supporting the display panel and the circuit board, and a circuit element disposed on the circuit board And a plasma display module comprising a thermally conductive layer formed of a material which is not electrically conductive and is thermally conductive and formed to contact the circuit device and the circuit board.

Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings.

3 is a schematic perspective view of an embodiment of a plasma display module including a circuit element heat dissipation structure according to the first embodiment of the present invention, and FIG. 4 is a circuit in which the circuit element heat dissipation structure according to the first embodiment of the present invention is implemented. An enlarged schematic perspective view of a substrate portion, and FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4.

As shown in FIG. 3, the plasma display module 200 including the circuit element heat dissipation structure according to the first embodiment of the present invention includes a plurality of plasma display panels 210 and a plurality of plasma driving panels 210. And a circuit board 220, a chassis 230 supporting the plasma display panel 210 and the circuit board 220, and a thermal conductive layer 240.

The plasma display panel 210 includes a first substrate 211 and a second substrate 212. The first substrate 211 and the second substrate 212 are spaced at a predetermined interval and face each other. Is placed. The first substrate 211 is made of transparent glass so that visible light can pass therethrough.

The circuit board 220 is mounted to the chassis 230 at a predetermined distance from the chassis 230 by the boss 251 and the bolt 252, and the circuit element 260 is mounted on the circuit board 220. Is mounted.

The chassis 230 is usually made of a metal such as aluminum, and manufactured by casting or press working, if necessary.

The circuit element 260 includes a circuit element 261 having a large amount of heat generated and a circuit element 262 having a small amount of generated heat.

The circuit element 261 having a large heat generation amount mounted on the circuit board 220 may be a switching element. In particular, an IPM having a function such as a field effect transistor (FET), a switching element, or an element driving circuit may be used. Intelligent Power Module), and may be a diode that generates a large amount of heat.

The heat conductive layer 240 is made of a silicone resin and is in contact with the circuit board 220 and the circuit element 260.

That is, as shown in FIGS. 4 and 5, the thermal conductive layer 240 is formed to surround the circuit element 260 and is formed by being applied to the entire front surface of the circuit board 220.

That is, since the thermal conductive layer 240 is formed surrounding the outer surface of the circuit element 260, the portion of the thermal conductive layer 240 in contact with the circuit element 260 is maximized, and thus, the thermal conductive layer 240 The circuit device 260 is configured to receive the maximum heat generated.

In addition, since the heat conductive layer 240 is formed by being applied to the entire front surface of the circuit board 220 as a whole, the heat conductive layer 240 maximizes the heat transferred from the circuit element 260 to the circuit board 220. Has a configuration that can be passed to.

The thermal conductive layer 240 of the first embodiment is configured to be surrounded by only the circuit element 260 disposed on the circuit board 220 irrespective of the circuit element 261 and the circuit element 262 having a high heat generation amount. However, the present invention is not limited thereto. That is, the heat conductive layer of the present invention can be formed so as to contact only the circuit element 261 with a large amount of heat generated.

In addition, in the first embodiment, the thermal conductive layer 240 almost covers the entire surface of the circuit board 220, but the present invention is not limited thereto. That is, the thermal conductive layer of the present invention is advantageous in heat transfer and heat diffusion as the portion of the thermal conductive layer contacts the circuit board 220 as much as possible. However, at least a portion of the thermal conductive layer is in contact with the circuit board 220 so that the temperature is low. Since heat conduction and heat diffusion to 220 are possible, the present invention is not particularly limited in the area where the heat conduction layer is in contact with the circuit board 220.

In addition, in the first embodiment, as shown in FIGS. 4 and 5, the thickness of the thermal conductive layer 240 is formed to be substantially constant over the circuit element 260 and the circuit board 220, and the thermal conductive layer ( Although the 240 is formed, the thickness of the circuit element 260 is apparent to the extent that the circuit element 260 is disposed on the circuit board 220 due to the unevenness of the heat conductive layer 240, but the present invention is not limited thereto. That is, the thickness of the heat conductive layer of the present invention is not particularly limited as long as the heat conduction and heat diffusion are possible. That is, the thermal conductive layer of the present invention may be formed in the form of a very thin layer so that the external appearance of the circuit device and the circuit board is exposed as it is, and may be formed so thick that the location of the circuit device is not visible on the circuit board. have. In addition, the thickness of the thermal conductive layer of the present invention may be formed differently for each circuit element according to the degree of heat generation of the circuit element wrapped around the thermal conductive layer.

The thermal conductive layer 240 is formed of a silicone resin as described above, in order to form the thermal conductive layer 240 of the silicone resin on the circuit board 220 and the circuit element 260 by applying a thick silicone resin thickly It may be formed so as to harden after forming, or may be formed by a low pressure injection molding method.

Although the material of the heat conductive layer 240 is made of silicon resin in the first embodiment, the present invention is not limited thereto. That is, the heat conductive layer of the present invention may be made of acrylic resin, polyurethane, other new materials, etc., but the material of the heat conductive layer of the present invention is not electrically conductive but is made of a material having high thermal conductivity. There is no special limitation.

Hereinafter, a process of operating the plasma display module having the circuit device heat dissipation structure according to the first embodiment will be described.

When the user operates the plasma display module 200, the circuit board 220 is driven to apply a voltage to the plasma display panel 210.

When a voltage is applied to the plasma display panel 210, address discharge and sustain discharge occur, and ultraviolet rays are emitted while the energy level of the discharge gas excited during sustain discharge is lowered. The ultraviolet rays excite the phosphors of the phosphor layer applied in the discharge cell, and the visible light is emitted as the energy level of the excited phosphors is lowered. The image can be formed.

At this time, the circuit element 260 disposed on the circuit board 220 generates heat, and the heat generated from the circuit element 260 is transferred to a relatively low temperature conductive layer 240.

A portion of the heat transferred to the heat conductive layer 240 reaches the surface of the heat conductive layer 240 and is then transferred directly by convection to air in contact with the heat conductive layer 240.

Of the heat transferred to the heat conductive layer 240, except for the heat directly transferred by the convection action to the air contacting the heat conductive layer 240, the remaining heat is rapidly diffused to the surroundings by the heat conduction action. That is, the heat generated from the circuit element 260 is rapidly spread and transferred to the thermal conductive layer 240 and the circuit board 220 near the circuit element 260 that generates heat.

In particular, since the thermal conductive layer 240 is formed in contact with the circuit board 220, heat is rapidly diffused and transferred to the circuit board 220 having a relatively low temperature.

Therefore, since the heat generated from the circuit element 260 is effectively discharged to the surrounding heat conducting layer 240 and the circuit board 220, heat is not concentrated in the circuit element 260, and the temperature of the circuit element 260 is Will be lowered. This not only preserves the performance of the circuit element 260, but also increases the life of the circuit element 260 in the long term.

In addition, since the thermal conductive layer 240 of the first embodiment is not an electrically conductive material, the thermal conductive layer 240 may be located between the circuit elements 260 arranged in a compact manner to prevent electrical short between the circuit elements 260. Arrangement of the element 260 can be performed efficiently.

In addition, since the thermal conductive layer 240 has strength in itself, the circuit element 260 is protected from an external impact when the circuit board 220 is installed.

As described above, according to the first embodiment of the present invention, the heat conductive layer 240 is formed to be in contact with the circuit element 260 and the circuit board 220, thereby rapidly dissipating heat generated from the circuit element 260. Can be released. As a result, heat condensation of the circuit element 260 is prevented, and heat can be removed from the circuit element 260 quickly and efficiently to lower the temperature of the circuit element 260, thereby reducing the circuit element 260 and the circuit. It is possible to increase the life of the substrate 220.

Hereinafter, a circuit device heat dissipation structure according to a second embodiment of the present invention will be described with reference to FIGS. 6 and 7.

FIG. 6 is a schematic perspective view illustrating an enlarged portion of a circuit board on which a circuit device heat dissipation structure according to a second exemplary embodiment of the present invention is implemented, and FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

6 and 7, the circuit device heat dissipation structure according to the second embodiment of the present invention includes a circuit board 320, a circuit device 360, and a thermal conductive layer 340.

The circuit board 320 is mounted to the chassis 330 at a predetermined distance from the chassis 330 by the boss 351 and the bolt 352, and the circuit device 360 is mounted to the circuit board 320. do.

The circuit device 360 includes a circuit device 361 with a large amount of heat generated and a circuit element 362 with a small amount of heat generated, and the circuit device 360 is the same as the circuit device 260 of the first embodiment of the present invention described above. Since a circuit element is included, description is abbreviate | omitted here.

The heat conductive layer 340 is made of a silicone resin and is in contact with the circuit board 320 and the circuit element 360.

As illustrated in FIGS. 6 and 7, the thermal conductive layer 340 is formed to surround the circuit element 360 and is coated on the front surface of the circuit board 320.

That is, since the thermal conductive layer 340 is formed surrounding the outer surface of the circuit element 360, the portion where the thermal conductive layer 340 contacts the circuit element 360 is maximized, and thus, the thermal conductive layer 340. The circuit device 360 is configured to receive the maximum heat generated.

In addition, since the thermal conductive layer 340 is formed by being applied to the entire front surface of the circuit board 320 as a whole, the thermal conductive layer 340 maximizes the heat transferred from the circuit element 360 to the circuit board 320. Has a configuration that can be passed to.

Meanwhile, in the second embodiment, the heat conduction layer 340 formed surrounding the circuit element 360 and the heat conduction layer 340 formed on the portion of the circuit board on which the circuit element 360 is not arranged have the same high heat conduction. Layer 340 is formed. Therefore, due to the unevenness of the thermal conductive layer 340, the position where the circuit element 360 is disposed on the circuit board 320 cannot be known.

As described above, in order to form the heat conductive layer 340 thickly with silicon resin on the circuit board 320 and the circuit element 360, a frame is formed to surround the edge of the circuit board 320, and then the silicone resin with high viscosity is formed. It may be formed by applying a thick, or may be formed by a low pressure injection molding method.

The heat conducting layer 340 of the second embodiment is configured to be surrounded by only the circuit element 360 disposed on the circuit board 320 irrespective of the circuit element 361 and the circuit element 362 having a high heat generation amount. However, the present invention is not limited thereto. That is, the heat conductive layer of the present invention can be formed so as to contact only the circuit element 361 with a large amount of heat generated.

In addition, in the second embodiment, the thermal conductive layer 340 almost covers the entire surface of the circuit board 320, but the present invention is not limited thereto. That is, the thermal conductive layer of the present invention is advantageous in heat transfer and heat diffusion as the portion of the thermal conductive layer contacts the circuit board 320 as much as possible. However, at least a portion of the thermal conductive layer is relatively low in temperature as long as the thermal conductive layer is in contact with the circuit board 320. Since heat conduction and heat diffusion to the circuit board 320 are possible, the present invention is not particularly limited in terms of the area in which the heat conducting layer contacts the circuit board 320.

In the second embodiment, the material of the thermal conductive layer 340 is made of silicon resin, and as described in the case of the first embodiment, as long as the thermal conductive layer 340 is made of a material having high thermal conductivity and not electrical conductivity, There is no limit.

Meanwhile, an auxiliary thermal conductive layer 370 is formed on the back of the circuit board 320.

The auxiliary thermal conductive layer 370 is disposed on the rear surface of the circuit board 320, and serves to prevent heat concentration by diffusing heat generated locally on the circuit board 320 to the periphery.

The auxiliary thermal conductive layer 370 is made of a silicone resin similarly to the thermal conductive layer 340.

Although the material of the auxiliary heat conductive layer 370 is made of silicon resin in the second embodiment, the present invention is not limited thereto. In other words, the auxiliary heat conductive layer of the present invention may be made of a material such as acrylic resin, polyurethane, other new materials, as long as the material is made of a material having high thermal conductivity instead of electrical conductivity, a particular limitation in material selection is none.

Although the auxiliary thermal conductive layer 370 is formed separately from the thermal conductive layer 340 in the second embodiment, the present invention is not limited thereto. That is, the auxiliary thermal conductive layer 370 of the present invention can be configured to be connected to the thermal conductive layer 340 beyond the edge of the circuit board 320, in which case, the auxiliary thermal conductive layer gives heat to the thermal conductive layer mutually I can receive it. As described above, when the auxiliary heat conducting layer and the heat conducting layer are connected to each other to be integrally formed, the immersion which immerses the circuit board in the material of the heat conducting layer, pulls it out and forms a thin layer according to the material of the heat conducting layer. The thermal conductive layer and the auxiliary thermal conductive layer may be formed at once by a method or a spray coating method.

On the other hand, the heat sink 380 having the heat radiation fins 381 is provided on the top surface of the heat conductive layer 340.

The heat sink 380 receives heat from the heat conducting layer 340, which is directly transferred to the air contacting the heat sink fins 381 by convection from the surface of the heat sink fins 381 of the heat sink 380. .

 Hereinafter, the main transfer path of the heat generated by the circuit device 360 in the second embodiment will be described.

Heat generated in the circuit device 360 is transferred to a relatively low thermal conductive layer 340.

A part of the heat transferred to the heat conductive layer 340 reaches the surface of the heat conductive layer 340 and is then transferred to the heat sink 380 provided with the heat dissipation fins 381. Heat transferred to the heat sink 380 is released from the surface of the heat sink fin 381 to the air contacting it by the convective heat transfer action.

Of the heat transferred to the heat conductive layer 340 except for the heat directly emitted by the heat sink 380, the remaining heat is quickly diffused to the surroundings by the heat conduction action. That is, the heat generated from the circuit device 360 is rapidly diffused and transferred to the thermal conductive layer 340 and the circuit board 320 near the circuit device 360 that generates heat.

In particular, since the thermal conductive layer 340 is formed in contact with the circuit board 320, heat is rapidly spread and transferred to the circuit board 320 having a relatively low temperature.

On the other hand, the auxiliary thermal conductive layer 370 is provided on the back surface of the circuit board 320, thereby preventing the temperature of the back surface of the circuit board 320 locally rise.

Therefore, since heat generated from the circuit device 360 is effectively discharged to the surrounding heat conducting layer 340 and the circuit board 320, heat is not concentrated in the circuit device 360, and the temperature of the circuit device 360 is Will be lowered. This not only preserves the performance of the circuitry 360, but also increases the life of the circuitry 360 in the long run.

In addition, since the thermal conductive layer 340 of the second embodiment is not an electrically conductive material, the thermal conductive layer 340 may be located between the circuit elements 360 that are densely arranged to prevent electrical short between the circuit elements 360. Arrangement of the element 360 can be performed efficiently.

In addition, since the thermal conductive layer 340 has strength in itself, the thermal protection layer 340 protects the circuit element 360 from external impact when the circuit board 320 is installed.

As described above, according to the second embodiment of the present invention, the heat conductive layer 340 is formed to contact the circuit device 360 and the circuit board 320, thereby rapidly dissipating heat generated from the circuit device 360. Can be released. As a result, heat concentration of the circuit device 360 can be prevented, and heat can be removed from the circuit device 360 quickly and efficiently to lower the temperature of the circuit device 360. In addition, by installing the heat sink 380 having the heat dissipation fins 381 on the heat conductive layer 340, heat passing through the heat conductive layer 340 can be effectively released.

In addition, the second embodiment of the present invention can be efficiently applied to a plasma display module in which a plurality of circuit boards and circuit elements are installed as in the above-described first embodiment.

As described above, according to the present invention, by providing a thermally conductive layer formed in contact with the circuit element and the circuit board, there is an effect that can effectively release the heat generated from the circuit element.

That is, according to the present invention, by forming the thermal conductive layer in contact with the circuit element and the circuit board at the same time, it is possible to quickly diffuse the heat generated from the circuit element to prevent heat concentration phenomenon of the circuit element and lower the temperature of the circuit element There is.

In addition, since the thermally conductive layer of the present invention is not an electrically conductive material, the thermally conductive layer is disposed between circuit elements to prevent electrical short between circuit elements.

Moreover, since the heat conductive layer of this invention has strength by itself, it also has the effect of protecting a circuit element from an external shock.

In addition, if the present invention is applied to the case of a plasma display module in which a large number of circuit boards and circuit elements are present, the effect is even greater.

  Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (16)

Circuit board; A circuit element disposed on the circuit board; And A heat dissipation structure of a circuit device comprising a thermally conductive layer formed of a material which is not electrically conductive and is thermally conductive and is in contact with the circuit device and the circuit board. The method of claim 1, A circuit device heat dissipation structure in which an auxiliary thermal conductive layer is disposed on the rear surface of the circuit board. The method of claim 2, The auxiliary thermal conductive layer is a circuit element heat dissipation structure comprising one selected from the group consisting of silicone resin, acrylic resin and polyurethane. The method of claim 1, The heat conduction layer is a circuit element heat dissipation structure is formed so as to surround the circuit element. The method of claim 1, And the heat conducting layer is disposed in a front direction of the circuit board. The method of claim 1, The heat conducting layer is a circuit element heat dissipation structure comprising one selected from the group consisting of silicone resin, acrylic resin and polyurethane. The method of claim 1, The heat dissipation structure of the heat conduction layer is a heat sink is mounted. The method of claim 7, wherein The heat sink is a circuit device heat dissipation structure having a plurality of heat dissipation fins. A display panel for implementing an image; A circuit board on which a circuit element for driving the display panel is mounted; A chassis supporting the display panel and the circuit board; And And a thermally conductive layer formed of a material which is not electrically conductive and is thermally conductive, and is formed to contact the circuit device and the circuit board. The method of claim 9, And an auxiliary thermal conductive layer disposed on a rear surface of the circuit board. The method of claim 10, The auxiliary thermal conductive layer is a plasma display module comprising one selected from the group consisting of silicone resin, acrylic resin and polyurethane. The method of claim 9, And the thermal conductive layer is formed to surround the circuit element. The method of claim 9, And the heat conductive layer is disposed in a front direction of the circuit board. The method of claim 9, The thermal conductive layer is a plasma display module comprising one selected from the group consisting of silicone resin, acrylic resin and polyurethane. The method of claim 9, And a heat sink mounted on the heat conductive layer. The method of claim 15, The heat sink is a plasma display module having a plurality of heat radiation fins.

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