[go: up one dir, main page]

TW450425U - Substrate structure of ball grid array package body - Google Patents

Substrate structure of ball grid array package body

Info

Publication number
TW450425U
TW450425U TW88206700U TW88206700U TW450425U TW 450425 U TW450425 U TW 450425U TW 88206700 U TW88206700 U TW 88206700U TW 88206700 U TW88206700 U TW 88206700U TW 450425 U TW450425 U TW 450425U
Authority
TW
Taiwan
Prior art keywords
package body
grid array
ball grid
substrate structure
array package
Prior art date
Application number
TW88206700U
Other languages
Chinese (zh)
Inventor
Su Tao
Chih-Ming Chung
Jian-Cheng Chen
Chun-Chi Lee
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW88206700U priority Critical patent/TW450425U/en
Publication of TW450425U publication Critical patent/TW450425U/en

Links

TW88206700U 1999-04-27 1999-04-27 Substrate structure of ball grid array package body TW450425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Publications (1)

Publication Number Publication Date
TW450425U true TW450425U (en) 2001-08-11

Family

ID=21647461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88206700U TW450425U (en) 1999-04-27 1999-04-27 Substrate structure of ball grid array package body

Country Status (1)

Country Link
TW (1) TW450425U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633975B2 (en) 2013-02-04 2017-04-25 Invensas Corporation Multi-die wirebond packages with elongated windows

Similar Documents

Publication Publication Date Title
GB2325340B (en) Ball grid array package
AU2002352865A1 (en) Ball grid array package
AU2002254027A1 (en) Tape ball grid array semiconductor package structure and assembly process
GB0024398D0 (en) Methods of manufacturing semiconductor devices
SG74679A1 (en) Ball grid array type package for semiconductor device
SG96622A1 (en) Single unit automated assembly of flex enhanced ball grid array packages
GB2358957B (en) Ball grid array module
SG75154A1 (en) Plastic ball grid array package
TW450425U (en) Substrate structure of ball grid array package body
GB9826937D0 (en) Cavity-down ball grid array module
GB2373924B (en) Ball grid array package
TW407795U (en) Improvement of ball grid array packaging structure
TW411035U (en) The packaging structure of the multi-chip ball grid arrays
TW467398U (en) Encapsulant structure of ball grid array package
GB9930064D0 (en) Squid array readout
TW438052U (en) Ball pad structure of ball grid array package
TW440065U (en) Bare die-type ball grid array package device with an enhanced structure
TW433542U (en) Ball grid array integrated circuit package
SG115323A1 (en) Enhanced reliability ball grid array package
TW506623U (en) Multi-chip ball grid array packaging structure
TW443578U (en) Ball grid array package structure
TW452192U (en) Ball grid array packaging to prevent the diffusion of encapsulation
TW478707U (en) Ball point array package substrate
TW444931U (en) Surface structure of ball-grid array packaged substrate
TW449113U (en) Sealing resin structure of SOC ball grid array packaging

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model