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TW449113U - Sealing resin structure of SOC ball grid array packaging - Google Patents

Sealing resin structure of SOC ball grid array packaging

Info

Publication number
TW449113U
TW449113U TW88221588U TW88221588U TW449113U TW 449113 U TW449113 U TW 449113U TW 88221588 U TW88221588 U TW 88221588U TW 88221588 U TW88221588 U TW 88221588U TW 449113 U TW449113 U TW 449113U
Authority
TW
Taiwan
Prior art keywords
soc
sealing resin
grid array
ball grid
resin structure
Prior art date
Application number
TW88221588U
Other languages
Chinese (zh)
Inventor
Mark Chung
C I Tsai
M L Huang
S K Chen
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88221588U priority Critical patent/TW449113U/en
Publication of TW449113U publication Critical patent/TW449113U/en

Links

TW88221588U 1999-12-16 1999-12-16 Sealing resin structure of SOC ball grid array packaging TW449113U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88221588U TW449113U (en) 1999-12-16 1999-12-16 Sealing resin structure of SOC ball grid array packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88221588U TW449113U (en) 1999-12-16 1999-12-16 Sealing resin structure of SOC ball grid array packaging

Publications (1)

Publication Number Publication Date
TW449113U true TW449113U (en) 2001-08-01

Family

ID=21657575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88221588U TW449113U (en) 1999-12-16 1999-12-16 Sealing resin structure of SOC ball grid array packaging

Country Status (1)

Country Link
TW (1) TW449113U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004