[go: up one dir, main page]

TW438052U - Ball pad structure of ball grid array package - Google Patents

Ball pad structure of ball grid array package

Info

Publication number
TW438052U
TW438052U TW89206909U TW89206909U TW438052U TW 438052 U TW438052 U TW 438052U TW 89206909 U TW89206909 U TW 89206909U TW 89206909 U TW89206909 U TW 89206909U TW 438052 U TW438052 U TW 438052U
Authority
TW
Taiwan
Prior art keywords
ball
grid array
pad structure
array package
ball grid
Prior art date
Application number
TW89206909U
Other languages
Chinese (zh)
Inventor
Yuan-Heng Fan
Mark Chung
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW89206909U priority Critical patent/TW438052U/en
Publication of TW438052U publication Critical patent/TW438052U/en

Links

TW89206909U 2000-04-26 2000-04-26 Ball pad structure of ball grid array package TW438052U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89206909U TW438052U (en) 2000-04-26 2000-04-26 Ball pad structure of ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89206909U TW438052U (en) 2000-04-26 2000-04-26 Ball pad structure of ball grid array package

Publications (1)

Publication Number Publication Date
TW438052U true TW438052U (en) 2001-05-28

Family

ID=21667070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89206909U TW438052U (en) 2000-04-26 2000-04-26 Ball pad structure of ball grid array package

Country Status (1)

Country Link
TW (1) TW438052U (en)

Similar Documents

Publication Publication Date Title
GB2325340B (en) Ball grid array package
AU2002352865A1 (en) Ball grid array package
SG108245A1 (en) Ball grid array interposer, packages and methods
SG74679A1 (en) Ball grid array type package for semiconductor device
SG120216A1 (en) Single unit automated assembly of flex enhanced ball grid array packages
GB2358957B (en) Ball grid array module
AU7148298A (en) Ball grid array package employing solid core solder balls
SG75154A1 (en) Plastic ball grid array package
GB2368718B (en) Ball grid array package semiconductor device having improved power line routing
TW438052U (en) Ball pad structure of ball grid array package
GB2373924B (en) Ball grid array package
TW506623U (en) Multi-chip ball grid array packaging structure
TW443578U (en) Ball grid array package structure
TW440065U (en) Bare die-type ball grid array package device with an enhanced structure
TW467398U (en) Encapsulant structure of ball grid array package
TW407795U (en) Improvement of ball grid array packaging structure
TW411035U (en) The packaging structure of the multi-chip ball grid arrays
TW450425U (en) Substrate structure of ball grid array package body
TW446184U (en) Ball grid array encapsulation structure
TW452192U (en) Ball grid array packaging to prevent the diffusion of encapsulation
TW433542U (en) Ball grid array integrated circuit package
SG115323A1 (en) Enhanced reliability ball grid array package
SG114488A1 (en) Flexible ball grid array chip scale packages and methods of fabrication
TW440066U (en) Heat dissipation device of ball grid array package
TW529809U (en) Improved structure of ball grid array type IC socket

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees