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SG115323A1 - Enhanced reliability ball grid array package - Google Patents

Enhanced reliability ball grid array package

Info

Publication number
SG115323A1
SG115323A1 SG9900009A SG1999000009A SG115323A1 SG 115323 A1 SG115323 A1 SG 115323A1 SG 9900009 A SG9900009 A SG 9900009A SG 1999000009 A SG1999000009 A SG 1999000009A SG 115323 A1 SG115323 A1 SG 115323A1
Authority
SG
Singapore
Prior art keywords
grid array
ball grid
array package
enhanced reliability
reliability ball
Prior art date
Application number
SG9900009A
Inventor
Thiam Beng Lim
Yong Chua Teo
Hong Meng Ho
Beng Lim Thiam
Chua Teo Yong
Meng Ho Hong
Original Assignee
Inst Of Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Of Microelectronics filed Critical Inst Of Microelectronics
Priority to SG9900009A priority Critical patent/SG115323A1/en
Publication of SG115323A1 publication Critical patent/SG115323A1/en

Links

SG9900009A 1999-01-12 1999-01-12 Enhanced reliability ball grid array package SG115323A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9900009A SG115323A1 (en) 1999-01-12 1999-01-12 Enhanced reliability ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9900009A SG115323A1 (en) 1999-01-12 1999-01-12 Enhanced reliability ball grid array package

Publications (1)

Publication Number Publication Date
SG115323A1 true SG115323A1 (en) 2005-10-28

Family

ID=35453582

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9900009A SG115323A1 (en) 1999-01-12 1999-01-12 Enhanced reliability ball grid array package

Country Status (1)

Country Link
SG (1) SG115323A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US5729050A (en) * 1996-03-11 1998-03-17 Lg Semicon Co., Ltd. Semiconductor package substrate and ball grid array (BGA) semiconductor package using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same
US5729050A (en) * 1996-03-11 1998-03-17 Lg Semicon Co., Ltd. Semiconductor package substrate and ball grid array (BGA) semiconductor package using same

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