TW202348765A - 二液硬化型組合物組、硬化物及電子機器 - Google Patents

二液硬化型組合物組、硬化物及電子機器 Download PDF

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Publication number: TW202348765A
Authority: TW; Taiwan
Prior art keywords: agent; mentioned; weight; parts; composition set
Prior art date: 2022-03-29

Application number

TW112111879A

Other languages

English (en)

Chinese (zh)

Inventor

小野塚正雄

金井朋之

Original Assignee

日商電化股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2022-03-29

Filing date

2023-03-29

Publication date

2023-12-16

2023-03-29 Application filed by 日商電化股份有限公司 filed Critical 日商電化股份有限公司

2023-12-16 Publication of TW202348765A publication Critical patent/TW202348765A/zh

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125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
239000007921 spray Substances 0.000 description 1
230000003068 static effect Effects 0.000 description 1
238000003756 stirring Methods 0.000 description 1
125000000542 sulfonic acid group Chemical group 0.000 description 1
238000012360 testing method Methods 0.000 description 1
YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
239000002470 thermal conductor Substances 0.000 description 1
238000012719 thermal polymerization Methods 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
239000011135 tin Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
125000005023 xylyl group Chemical group 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Materials Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Compositions Of Macromolecular Compounds (AREA)

TW112111879A 2022-03-29 2023-03-29 二液硬化型組合物組、硬化物及電子機器 TW202348765A (zh)

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JP4101391B2 (ja) *	1999-03-31	2008-06-18	電気化学工業株式会社	電子部品の放熱部材
US20150008361A1 (en) *	2012-03-02	2015-01-08	Fuji Polymer Industries Co., Ltd.	Putty-like heat transfer material and method for producing the same
US9441107B2 (en) *	2012-08-27	2016-09-13	Nippon Valqua Industries, Ltd.	Shaped product suppressed in bleeding and production process therefor
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EP3722391B1 (en) *	2017-12-04	2024-09-04	Sekisui Polymatech Co., Ltd.	Thermally conductive composition
JPWO2019230607A1 (ja) *	2018-05-29	2020-07-02	デンカ株式会社	電子機器及び電磁波シールド性放熱シート
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