TW201901771A - Cutting device - Google Patents

Abstract

The subject of the present invention is to detect chippings or cracks of a workpiece as detected objects during dicing process. The solution is a dicing device that dices a workpiece held on a holding stage by a dicing knife (43), which comprises: an elastic wave sensor (71) that detects the elastic wave generated during dicing the workpiece by the dicing knife; and an analysis means (76) which may divide the continuous time axis waveform of the elastic wave detected by the elastic wave sensor at intervals of sampling time, and set the sampling time to be shorter than the time required by the dicing knife passing the chipping size or the crack size of the detected object.

Description

Cutting device

The present invention relates to a cutting device for cutting a workpiece with a cutting edge.

The plate-shaped workpiece represented by a semiconductor wafer is, for example, a wafer that is cut with a circular cutting edge in a cutting device and is divided into a plurality of wafers. The cutting edge vibrates if chipping of a cutting edge, a reduction in cutting performance, contact with a foreign body, or a change in processing load occur during cutting of a workpiece. As a method of detecting such an abnormality of the cutting edge, there is a method of detecting a gap of the cutting edge with an optical sensor (for example, refer to Patent Document 1) or monitoring a motor current of a spindle on which the cutting edge is mounted to detect a processing load. The method is proposed.

In the method of detecting the chipping of the cutting edge with an optical sensor, abnormalities other than the chipping of the cutting edge cannot be appropriately detected. In addition, in the method of monitoring the motor current of the main shaft, although various abnormalities affecting the rotation of the cutting edge can be detected, a certain degree of measurement error occurs, so it is not suitable for detection of slight abnormalities. Therefore, there is a method of detecting an elastic wave corresponding to the vibration of the cutting edge by an elastic wave detection sensor, and analyzing the frequency of the detection result of the elastic wave, thereby detecting an abnormality in cutting accompanied by the vibration of the cutting edge. Proposed (for example, refer to Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4704816 [Patent Document 2] Japanese Patent Laid-Open No. 2015-170743

(Problems to be solved by the invention)

However, even if there are abnormalities in cutting, fine chips generated in the workpiece are not a problem, but there are cases where it is desired to detect sudden large chips or cracks that occur during cutting of glass or the like. hope. However, in the above-mentioned frequency analysis, it is difficult to appropriately detect such chips or cracks in the workpiece.

The present invention has been made by a developer in view of such a point, and it is an object of the present invention to provide a cutting device that detects chips or cracks that are a target of detection during a cutting process. (Means for solving problems)

A cutting device according to one aspect of the present invention includes: (i) a holding platform that holds a workpiece; (ii) a cutting means that includes a cutting edge for cutting a workpiece that is held on the holding platform; (ii) a cutting feed means , Which makes the holding platform and the cutting means move relatively in the cutting feed direction; indexing feed means, which makes the holding platform and the cutting means move relatively to the index orthogonal to the cutting feed direction Feed direction; and control means for controlling the cutting device, characterized by having: an elastic wave detection sensor, which is arranged on the cutting means or the holding platform and detects that the cutting edge is cutting the workpiece Elastic wave generated from time to time; and analysis means, which are cut from sampling time T interval from the time axis waveform of the continuity of the elastic wave when the workpiece is cut and processed by the elastic wave detection sensor. Frequency analysis: The sampling time T is the chips, Crack size (cutting feed direction) W [μm], the cutting feed speed of the feed means S [mm / sec], is set to become T ≦ W / (S × 1000) [sec].

According to this configuration, the frequency can be analyzed by cutting out the time axis waveform of the continuity of the elastic wave during the cutting process at an appropriate sampling time in consideration of the cutting feed rate. Since cutting is performed at an appropriate sampling time in accordance with the chip size or crack size, and the frequency analysis is performed, the occurrence of chips or cracks in the cutting process can be detected, and the occurrence location of the chips or cracks can be specified. [Effect of the invention]

According to the present invention, it is possible to detect the occurrence of chips or cracks during cutting by performing frequency analysis with an appropriate sampling time in consideration of the cutting feed rate.

Hereinafter, a cutting device according to this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view of a cutting device according to this embodiment. The cutting device may have a structure capable of detecting the elastic wave generated at the cutting edge as in the present embodiment, and is not limited to the configuration shown in FIG. 1.

As shown in FIG. 1, the cutting device 1 is configured to move the cutting edge 43 and the holding table 15 in the cutting feed direction, thereby cutting the workpiece W held by the holding table 15 with the cutting edge 43. . The surface of the object to be processed W is divided into a plurality of areas in accordance with a grid-like planned division line, and various devices are formed in each area divided by the planned division line. The workpiece W is attached to the cutting tape T inside the ring frame F, and is carried into the cutting device 1 with the cutting tape T being supported by the ring frame F.

The center of the upper surface of the base 10 of the cutting device 1 is opened so as to extend in the X-axis direction (cutting feed direction). This opening is covered by a moving plate 11 and a bellows-shaped waterproof cover 12 that can be moved together with the holding platform 15. cover. A holding surface 16 is formed on the surface of the holding platform 15 by a porous material, and a negative pressure generated on the holding surface 16 attracts and holds the workpiece W. Four air-driven clamp portions 17 are provided around the holding platform 15. The ring frame F around the workpiece W is clamped and fixed to each clamp portion 17 from all directions. Below the waterproof cover 12 is provided a feed screw type cutting feed means 18 for cutting the feed of the holding table 15 in the X-axis direction (cutting feed direction).

The upper surface of the base 10 is provided with an elevator means 21 for placing a cassette (not shown) and an washing means 24 for washing the processed object W through the opening. The lifter means 21 raises and lowers the stage 22 on which the cassette is placed, and adjusts the position of the workpiece W in the cassette to the height direction. The washing means 24 lowers the rotator platform 25 holding the workpiece W into the base 10, sprays washing water toward the rotating rotator platform 25 to wash the workpiece W, and then sprays dry air to dry Workpiece W. In addition, a gate-shaped standing wall portion 13 is erected on the upper surface of the base 10 so as to span the moving path of the holding platform 15.

The standing wall portion 13 includes indexing feeding means 30 that feeds a pair of cutting means 40 in the Y-axis direction (indexing feeding direction), and cutting means 40 that feeds in the Z-axis direction ( Punch-in feed means 35). The indexing feeding means 30 includes a pair of guide rails 31 arranged parallel to the Y-axis direction on the front surface of the standing wall portion 13, and a Y-axis stage 32 slidably provided on the pair of guide rails 31. The cut-in feeding means 35 includes a pair of guide rails 36 arranged on the Y-axis stage 32 in parallel with the Z-axis direction, and a Z-axis stage 37 slidably arranged on the pair of guide rails 36.

A cutting means 40 for cutting the workpiece W is provided below each Z-axis stage 37. Nut portions are formed on the back sides of the Y-axis stage 32 and the Z-axis stage 37, respectively, and the feed screws 33 and 38 are screwed to the nut portions. One end of the feed screw 33 for the Y-axis stage 32 and the feed screw 38 for the Z-axis stage 37 are connected to drive motors 34 and 39, respectively. Each of the feed screws 33 and 38 is rotationally driven by the drive motors 34 and 39, whereby each cutting means 40 moves along the guide rail 31 in the Y-axis direction, and each cutting means 40 cuts the feed along the guide rail 36. In the Z axis direction.

The pair of cutting means 40 is a main shaft 42 (see FIG. 2) which is rotatably supported by a main shaft housing 41, and a cutting edge 43 is attached to the front end of the main shaft 42. The cutting edge 43 is formed in a disc shape with an adhesive to fix the diamond grains. A cutting edge cover 45 is fixed to the spindle housing 41, and the periphery of the cutting edge 43 is partially covered by the cutting edge cover 45. The cutting edge cover 45 is provided with cutting water supply means 46 that supplies cutting water to the cutting edge 43 when cutting the workpiece W, and cuts the workpiece W while supplying cutting water from various nozzles of the cutting water supply means 46. .

In the cutting device 1 configured as described above, it is necessary to detect an abnormality of the cutting edge 43 during cutting of the workpiece W, but a detection method using a general optical sensor cannot detect abnormalities other than the gap of the cutting edge 43. In this case, by detecting an elastic wave corresponding to the vibration of the cutting edge 43 and analyzing the frequency of the detection result of the elastic wave, an abnormality in cutting caused by the vibration of the cutting edge 43 can be detected. In frequency analysis, the continuous time axis waveform of the elastic wave is cut out at a predetermined sampling time, and is converted into a frequency component at each sampling time to detect an abnormality during cutting.

However, chipping or cracking may occur during the cutting process of the workpiece W, but it may be ignored if it is a fine chip or cracking of several [μm]. However, when cutting glass and the like, there is a size of about 100 [μm], and chips or cracks may be generated suddenly, and the chips or cracks of this size cannot be ignored. In order to detect the abnormality of chips or cracks during cutting by frequency analysis, it is necessary to cooperate with the appropriate sampling time for the chip size or crack size.

Here, the inventors have learned that when inspecting the relationship between chip size or crack size and sampling time, shortening the sampling time and frequency conversion is more effective for chip detection during cutting. At the usual sampling time (for example, 100 [msec]), although the frequency decomposition energy is high and the frequency components can be carefully analyzed, the noise such as fine chips is also picked up, so it indicates the peak of the chip or crack of the detection object. Will be buried. In addition, since the sampling time is long, it is impossible to specify at which timing of the sampling time the chipping or cracking occurs.

In contrast, in a short sampling time (for example, 1 [msec]), although the frequency resolution energy is low and the analysis of frequency components becomes coarse, the number of data is small, so the occurrence of chipping or cracking of the detection target can be detected. . In addition, since the sampling is repeated in a short time, the timing at which chips or cracks are generated can be specified. Therefore, in cutting processing, it is more important to focus on the detection of chip or crack occurrence timing than high-precision frequency analysis. In this embodiment, the vibration waveform is cut out in accordance with the sampling time of chip size or crack size. And frequency analysis.

The cutting means according to this embodiment will be described with reference to FIGS. 2 and 3. FIG. 2 is an exploded perspective view of a cutting means according to this embodiment. FIG. 3 is a diagram schematically showing a cross section and the like of the cutting means according to this embodiment. In addition, in FIGS. 2 and 3, for convenience of description, a wheel cover covering the outer periphery of the cutting edge is omitted. In addition, the cutting means may have a configuration in which the cutting edge of this embodiment is mounted, and is not limited to the configuration shown in FIGS. 2 and 3.

As shown in FIG. 2, the cutting means 40 is provided with a blade holder 51 at the front end of the main shaft 42, and the cutting blade 43 is attached to the blade holder 51. The main shaft 42 is, for example, an air main shaft, and is supported in a floating state with respect to the main shaft housing 41 via a compressed air layer. A cover member 47 covering a front end side of the main shaft 42 is attached to a front end surface of the main shaft case 41. The cover member 47 is provided with a pair of brackets 48. The bracket 48 is screwed to the spindle housing 41 via the bracket 48, and the front end portion of the spindle 42 protrudes from the central opening 49 of the cover member 47.

A cutting edge holder 51 supporting a cutting blade 43 is attached to a front end portion of the main shaft 42. A fitting hole 52 (see FIG. 3) attached to the front end portion of the main shaft 42 is formed on the back side of the blade holder 51, and a cylindrical protrusion 53 is formed on the front side of the blade holder 51. A circular recessed portion 54 is formed on the surface side of the protruding portion 53, and a through hole 55 connected to the fitting hole 52 is formed on the bottom surface of the circular recessed portion 54. As a result, the front end surface of the main shaft 42 inserted into the blade holder 51 is exposed from the through hole 55, and the fixing bolt 59 is locked to the screw hole 44 on the front end surface of the main shaft 42 through the washer 58, thereby the blade holder 51 Will be fixed to the main shaft 42.

The blade holder 51 is formed with a flange portion 56 that extends from the peripheral surface of the protruding portion 53 to the outside in the radial direction. The cutting blade 43 is pressed against the flange portion 56 and is attached to the blade holder 51. The cutting blade 43 is a hub blade in which an annular cutting blade 62 is attached to the outer periphery of a substantially disc-shaped hub base 61, and a protrusion 53 inserted into the blade holder 51 is formed in the center of the hub base 61.入 孔 63。 The insertion hole 63. Once this insertion hole 63 is pushed into the protruding portion 53, the protruding portion 53 protrudes from the hub base 61. Then, the fixing nut 65 is locked to the male screw 57 formed on the protruding portion of the protruding portion 53, and the cutting edge 43 is fixed to the cutting edge holder 51.

Further, the cutting means 40 is provided with an elastic wave detection sensor 71 that can detect an elastic wave generated when the cutting edge 43 cuts the workpiece W. The elastic wave detection sensor 71 is a so-called AE (Acoustic Emission) sensor. The elastic wave propagating to the blade holder 51 is converted into an electrical change by a vibrator 72 and output as a detection signal. Since the elastic wave detection sensor 71 is held near the cutting edge holder 51 of the cutting edge 43, vibration from the cutting edge 43 is easily transmitted. Therefore, the vibration of the cutting edge 43 is detected by the elastic wave detection sensor 71 with high accuracy.

A first coil means 73 (see FIG. 3) connected to the vibrator 72 is provided on the blade holder 51 side, and a second coil means 74 is provided on the cover member 47 side. For the first coil means 73 and the second coil means 74, for example, a circular flat coil is used. The first and second coil means 73 and 74 are magnetically coupled, and a detection signal from the vibrator 72 is transmitted from the first coil means 73 to the second coil means 74 by mutual induction. As described above, since the detection signal is transmitted non-contact by the first and second coil means 73 and 74, an elastic wave detection sensor 71 can be provided on the blade holder 51 that rotates with the cutting blade 43.

As shown in FIG. 3, the elastic wave detection sensor 71 is connected to control means 75 that controls each part of the cutting device 1 (see FIG. 1) through a magnetic combination of the first and second coil means 73 and 74. The control means 75 is provided with analysis means 76 for frequency analysis of the time-axis waveform detected by the elastic wave detection sensor 71, and chips that determine the size of the object (for example, about 100 [μm]) from the frequency analysis result. Or cracked judgment means 77. The analysis means 76 is to cut out the continuous time-axis waveform of the elastic wave detected by the elastic wave detection sensor 71 during the machining of the workpiece W at a sampling interval, and use FFT (Fast Fourier Transform) Frequency analysis.

The sampling time T [sec] is set such that if the chip size or crack size in the cutting feed direction of the cutting groove (notch) to be detected which is to be detected is set to W [μm], When the feed rate of the feeding means 18 (refer to FIG. 1) is set to S [mm / sec], the condition of the formula (1) is satisfied. (1) T ≦ W / (S × 1000) [sec] In this way, the sampling time T is set to be shorter than the time required for the cutting edge 43 to pass the chip size (crack size) W.

The chip size (crack size) W and the feed speed S are set in accordance with the type or processing content of the workpiece W. For example, during glass processing, the chip size (crack size) W is preferably set to several [μm] to several hundred [μm], and the feed rate S is preferably set to several [mm / sec] to several tens [mm / sec]. . In silicon processing, the chip size (crack size) W is preferably set to several [μm] to several tens [μm], and the feed rate S is preferably set to several tens [mm / sec] to 100 [mm / sec]. .

The determination means 77 determines the presence or absence of chips or the like to be detected from a peak included in the frequency analysis result of the analysis means 76. When the peak value of the frequency analysis result is equal to or greater than the critical value, it is determined that chips or the like having a size larger than the object size are generated during cutting, and the operator is notified of the occurrence of chips or the like. When the peak value of the frequency analysis result is smaller than the critical value, it is determined that chips or the like of the object size have not occurred in the cutting process, and the cutting process is continued. In addition, the critical value for the determination of chips and the like is a value that can be experimentally, empirically, or theoretically used.

In addition, since the sampling time is set to be short, the number of samples to be sampled is small, indicating that peaks such as chips are difficult to be buried by surrounding noise. In addition, since the frequency analysis is repeated for a short time, it is possible to specify the generation position of the chips and the like in the cutting feed direction of the workpiece W from the sampling time at which the peaks of chips and the like are detected. In this way, by setting the sampling time in accordance with the size of the chips and the like to be detected and the feed speed of the cutting feed means 18, the chip and the like of the objects to be detected can be appropriately detected from the vibration waveform of the elastic wave detection sensor 71. .

In addition, when the cutting device 1 is provided with a notification means 78, when the determination means 77 is judged to generate chips or the like, the notification is notified. With this, it is possible to report that an operator has generated a chip to be detected during cutting, and to urge maintenance work. Each part of the control means 75 is configured by a processor, a memory, and the like that perform various processes. The memory is constituted by one or a plurality of memory media such as a ROM (Read Only Memory), a RAM (Random Access Memory), and the like according to the application. The memory stores, for example, a program for driving control of each part of the device or a program for detecting chips and the like.

The detection of chips or cracks will be described with reference to FIGS. 4 and 5. FIG. 4 is an explanatory diagram of detection processing of chips and the like according to the present embodiment. FIG. 5 is a diagram showing an example of frequency analysis corresponding to a sampling time. In addition, FIG. 5A is a frequency analysis showing the present embodiment when the sampling time is set to T1, and FIG. 5B is a frequency analysis showing a comparative example when the sampling time is set to T2. In addition, here is an example of the generation of chips on the surface of the workpiece, but the same method can be used to detect cracks on the surface of the workpiece.

As shown in FIG. 4, when the workpiece W is cut with the cutting edge 43 (see FIG. 2), a cut (cutting groove) 81 is formed on the surface of the workpiece W. Fine chips 85 or chips 86 to be detected at the cutting edge 82 occur suddenly along the cutting feed direction. Here, as described above, the sampling time T1 is set in accordance with the size of the chip 86 to be detected and the feed rate of the cutting process. That is, the sampling time T1 is set to be shorter than the time required for the cutting edge 43 to pass the chip size. Therefore, the generation position of the chips 86 can be carefully detected in the time axis direction.

For example, as shown in FIG. 5A, in this embodiment, the continuous vibration waveform during cutting is cut out at each sampling time T1 (for example, 1 msec) and the frequency is analyzed. Since the sampling time T1 is set to be short, the number of samples to be sampled is small, and the frequency resolution can be reduced. Even if chips 86 to be detected are generated during the cutting process, the frequency indicating that the peak of the chip 86 is established cannot be detected with high accuracy, but it is possible to recognize that a peak above the critical value is established in a certain frequency band. That is, it can be detected within the sampling time T1 whether or not the detection target chip 86 is generated.

In addition, since the sampling time T1 is set to be short, it is difficult to detect the chip 86 to be detected and other fine chips 85 at the same time. Therefore, it is difficult for other fine chips 85 to appear as peripheral noise around the peak of the chip 86 which is the detection target, and the peak of the chip 86 to be detected can be detected. Since the frequency conversion is performed every elapse of the sampling time T1, the presence or absence of the chips 86 to be detected is determined in units of the sampling time T1. Therefore, the generation position of the chips 86 on the workpiece W can be detected from the timing of generating the chips 86 during the cutting process.

On the other hand, as shown in FIG. 5B, in the comparative example, the continuous vibration waveform during cutting is cut out at each sampling time T2 (for example, 100 msec) and the frequency is analyzed. The sampling time T2 is set to be longer than the sampling time T1. Since the sampling time T2 is set to be long, the number of samples to be sampled is large, and the frequency resolution can be increased. Since the frequency resolution is high, the frequency at which the peak is established can be detected with high accuracy. However, in addition to the chip 86 that is the object of detection, fine chip 85 and the like also appear as peripheral noise, indicating that the peak of the chip 86 will be difficult to find.

Since the frequency conversion is performed every elapse of the sampling time T2, the presence or absence of the chips 86 to be detected is determined in units of the sampling time T2. Since the sampling time T2 is long, even if the detection target chip 86 is detected within the sampling time T2, the timing of the chip 86 generated during the cutting process cannot be specified. Therefore, in the frequency analysis of the comparative example, although the frequency at which the peak value is established can be determined with high accuracy, the timing of chip 86 generation cannot be specified, and the occurrence position of chip 86 on workpiece W cannot be detected.

As described above, according to the cutting device 1 of the present embodiment, it is possible to cut out and analyze the frequency from the time axis waveform of the continuity of the elastic wave during the cutting process at an appropriate sampling time in consideration of the cutting feed rate. Since cutting is performed at an appropriate sampling time to match the chip size or crack size, and the frequency is analyzed, the occurrence of chips or cracks during cutting can be detected, and the location of the chip or crack occurrence can be specified.

In addition, in this embodiment, the AE sensor is used as an example to describe the elastic wave detection sensor, but it is not limited to this. The elastic wave detection sensor is only required to detect an elastic wave, and for example, it may be a vibration sensor. In addition, the AE sensor is a resonance-type AE sensor that can obtain a high sensitivity at a specific frequency, a wide-band AE sensor that can obtain a certain sensitivity in a wide frequency band, and a built-in preamplifier. Which of the built-in AE sensors is included in the amplifier. In addition, the resonance type AE sensor may be provided with a plurality of vibrators (piezoelectric elements) having different resonance frequencies, and may be appropriately selected according to processing conditions and the like.

The vibrator of the elastic wave detection sensor is, for example, barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb (Zi, Ti) O ₃ ), lithium niobate (LiNbO ₃ ), or lithium tantalate ( LiTaO ₃ ).

In addition, in this embodiment, the dicing tape may be a DAF (Dai Attach Film) tape in which DAF is affixed to a tape substrate, in addition to a normal adhesive tape in which an adhesive layer is coated on a tape substrate.

Moreover, in this embodiment, the analysis means is a structure which analyzes the time-axis waveform of an elastic wave by FFT, but it is not limited to this structure. The analysis means is only required to perform frequency analysis for cutting out the continuous time-axis waveform of the elastic wave at the sampling time. For example, DFT (Discrete Fourier Transform) can also be used to frequency-analyze the time-axis waveform of the elastic wave.

In this embodiment, the cutting feed means is a configuration in which the holding table moves in the cutting feed direction with respect to the cutting means, but it is not limited to this configuration. The cutting feed means may have a configuration in which the holding table and the cutting means are relatively moved in the cutting feed direction, and the cutting means may be moved in the cutting feed direction with respect to the holding table.

In the present embodiment, the indexing feed means is a configuration in which the cutting means moves the index table in the indexing feed direction for holding the table, but is not limited to this configuration. The indexing feed means may be configured to move the holding table and the cutting means relatively to the indexing feed direction orthogonal to the cutting feed direction, or the holding table may be moved to the indexing feed to the cutting means. Give directions.

In the present embodiment, the cutting feed means is a configuration in which the cutting means moves the holding table in the cutting feed direction, but is not limited to this configuration. The plunge feed means may be a configuration in which the holding table and the cutting means are relatively moved in a plunging feed direction orthogonal to the surface of the workpiece, and the holding table may be moved in the plunging feed direction with respect to the cutting means. Just fine.

In the present embodiment, the vibrator of the elastic wave detection sensor has a configuration in which a blade holder is attached to a cutting means, but it is not limited to this configuration. The vibrator of the elastic wave detection sensor is only required to be provided where the vibration of a cutting blade such as a blade cover or a spindle is easily transmitted.

In the present embodiment, the elastic wave detection sensor is configured to be disposed in a cutting means, but is not limited to this configuration. The elastic wave detection sensor can also be arranged on the holding platform.

In the present embodiment, the cutting device is described by taking a cutting device that reduces a workpiece into an example, but is not limited to this configuration. The present invention is applicable to other cutting devices such as a trimming device and a cluster device provided with a cutting device, which are applicable to the mounting of a cutting edge.

In addition, the workpieces to be processed may be processed according to the type of processing, for example, a semiconductor device wafer, an optical device wafer, a package substrate, a semiconductor substrate, an inorganic material substrate, an oxide wafer, a green ceramic substrate, a piezoelectric substrate, etc. Of various artifacts. As the semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation can also be used. The optical device wafer may be a sapphire wafer or a silicon carbide wafer after device formation. A CSP (Chip Size Package) substrate may be used as a package substrate, silicon or gallium arsenide may be used as a semiconductor substrate, and sapphire, ceramics, glass, or the like may be used as an inorganic material substrate. As the oxide wafer, lithium tantalate or lithium niobate may be used after the device is formed or before the device is formed.

In the present embodiment, the cutting blade is described by taking a hub blade for cutting vermiculite fixed on the hub base as an example, but it is not limited to this configuration. The cutting edge is a washer blade of a hubless type.

In this embodiment, the holding platform is not limited to a suction-suction type platform, and may be an electrostatic chuck-type platform.

In addition, although the embodiment and the modification have been described, the above-mentioned embodiment and the modification may be combined in whole or in part as another embodiment of the present invention.

In addition, the embodiment of the present invention is not limited to the above-mentioned embodiment, and various changes, substitutions, and alterations can be made without departing from the spirit of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized by other methods through technological progress or derived technology, this method can also be used for implementation. Therefore, the scope of patent application is all embodiments covered by the scope of the technical idea of the present invention.

In the present embodiment, the configuration in which the present invention is applied to a cutting device will be described. However, the present invention is also applicable to other processing devices that detect chips or cracks that are targets of detection in a workpiece. [Industrial availability]

As described above, the present invention has the effect of detecting chips or cracks that are the object of detection during the cutting process, and is particularly useful for a cutting device that cuts the object along a predetermined division line.

1‧‧‧ cutting device

15‧‧‧ keep the platform

18‧‧‧ cutting feed means

30‧‧‧ indexing feeding means

40‧‧‧cutting means

43‧‧‧ cutting blade

71‧‧‧ Elastic Wave Detection Sensor

75‧‧‧control means

76‧‧‧Analytical means

81‧‧‧cut (cutting groove)

86‧‧‧crumbs

W‧‧‧Processed

FIG. 1 is a perspective view of a cutting device according to this embodiment. FIG. 2 is an exploded perspective view of the cutting means of this embodiment. FIG. 3 is a diagram schematically showing a cross section and the like of the cutting means of the present embodiment. FIG. 4 is an explanatory diagram of a detection process of chips and the like according to the present embodiment. 5 is a diagram showing an example of frequency analysis corresponding to a sampling time.

Claims (1)

A cutting device is provided with: (i) a holding platform for holding a workpiece; (ii) a cutting means including a cutting edge for cutting a workpiece to be held on the holding platform; (ii) a cutting feed means for making the The holding platform moves relative to the cutting means in the cutting feed direction; indexing feeding means moves the holding platform and the cutting means relative to the indexing feed direction orthogonal to the cutting feed direction; and The control means controls the cutting device, and is characterized by having: an elastic wave detection sensor, which is arranged on the cutting means or the holding platform and detects an elastic wave generated when the cutting edge cuts a workpiece And analysis means, which are cut from the time axis waveform of the continuity of the elastic wave when the workpiece is cut and processed by the elastic wave detection sensor, and are analyzed at a frequency of sampling time T, The time T is the size of chips and cracks that may be generated in the cutting groove after cutting (cutting). To direction) W [μm], the cutting feed speed of the feed means S [mm / sec], is set to become T ≦ W / (S × 1000) [sec].