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JP4704816B2 - Cutting equipment - Google Patents

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JP4704816B2
JP4704816B2 JP2005189772A JP2005189772A JP4704816B2 JP 4704816 B2 JP4704816 B2 JP 4704816B2 JP 2005189772 A JP2005189772 A JP 2005189772A JP 2005189772 A JP2005189772 A JP 2005189772A JP 4704816 B2 JP4704816 B2 JP 4704816B2
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cutting
cutting blade
detection means
leg
blade
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JP2007012770A (en
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正視 佐藤
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Disco Corp
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Description

本発明は,切削装置に関し,特に,切削ブレードの破損または磨耗などの状態や切削ブレードの位置等を検出する検出手段を備える切削装置に関する。   The present invention relates to a cutting device, and more particularly, to a cutting device including a detecting means for detecting a state such as breakage or wear of a cutting blade, a position of the cutting blade, and the like.

半導体デバイス製造工程において,略円板形状である半導体ウェハの表面に格子状に形成されたストリート(切断ライン)によって区画された多数の領域にIC,LSI等の回路が形成され,回路が形成された各領域をストリートに沿って分割することにより個々の半導体チップを製造している。半導体ウェハを分割する分割装置としては,一般に,ダイシング装置としての切削装置が用いられている。この切削装置は,一般にダイヤモンド砥粒からなる砥石部から構成された切削ブレードを回転しつつ,ストリートに沿って相対的に切削送りさせることによって切削する。このようにして分割された半導体チップは,パッケージングされて携帯電話やパソコン等の電気機器に広く利用されている。   In a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions partitioned by streets (cutting lines) formed in a lattice shape on the surface of a substantially disc-shaped semiconductor wafer. Each semiconductor chip is manufactured by dividing each region along the street. As a dividing device for dividing a semiconductor wafer, a cutting device as a dicing device is generally used. This cutting device generally performs cutting by rotating a cutting blade formed of a grindstone portion generally made of diamond abrasive grains while relatively cutting and feeding along a street. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

切削装置には,切削中の切削ブレードの破損を確認するために,例えば,切削ブレードカバーに切削ブレードの破損を光学的に検出する破損検出センサが備えられている。かかる破損検出センサは,例えば,発光素子と受光素子とを対向配置して,発光素子と受光素子とを結ぶ光軸上に切削ブレードが位置するように設けられている。この受光素子が受光する光量によって,切削ブレードの破損状態を検知する。しかし,発光素子の発光面や受光素子の受光面に水滴が付着していると,光が屈折・散乱し,切削ブレード破損検出の精度を低下させてしまう。したがって,破損検出センサの発光素子の発光面や受光素子の受光面に水滴が付着しないようにすることが必要である。   In order to confirm the breakage of the cutting blade during cutting, the cutting device is provided with, for example, a breakage detection sensor that optically detects the breakage of the cutting blade on the cutting blade cover. Such a breakage detection sensor is provided, for example, so that a light emitting element and a light receiving element are arranged to face each other, and a cutting blade is positioned on an optical axis connecting the light emitting element and the light receiving element. The breakage state of the cutting blade is detected by the amount of light received by the light receiving element. However, if water droplets adhere to the light emitting surface of the light emitting element or the light receiving surface of the light receiving element, the light is refracted and scattered, and the accuracy of detecting the cutting blade breakage is lowered. Therefore, it is necessary to prevent water droplets from adhering to the light emitting surface of the light emitting element of the breakage detection sensor and the light receiving surface of the light receiving element.

特開平11−8211号公報Japanese Patent Laid-Open No. 11-8211 特開平4−22206号公報JP-A-4-22206

切削ブレードカバーの構造は,基本的に,外部に切削液が拡散しないようになっている。このため,切削ブレードカバーのスピンドル軸方向の幅を狭くした場合,切削ブレードの周囲で連れ回る切削液の流量が増加する。また,切削液の流量を増加させた場合にも,切削ブレードの周囲で連れ回る切削液の量は増加する。このように,切削ブレードカバーの幅を狭くしたり,切削液の流量を増加させると,切削ブレードの周囲で連れ回る切削液の流れが乱流が生じ,発光素子や受光素子に切削液が付着し易くなるという問題があった。   The structure of the cutting blade cover basically prevents the cutting fluid from diffusing outside. For this reason, when the width of the cutting blade cover in the spindle axis direction is narrowed, the flow rate of the cutting fluid that rotates around the cutting blade increases. Further, when the flow rate of the cutting fluid is increased, the amount of the cutting fluid that moves around the cutting blade increases. As described above, when the width of the cutting blade cover is reduced or the flow rate of the cutting fluid is increased, the flow of the cutting fluid around the cutting blade generates turbulent flow, and the cutting fluid adheres to the light emitting element and the light receiving element. There was a problem that it was easy to do.

そこで,本発明は,上記問題に鑑みてなされたものであり,本発明の目的とするところは,破損検出センサに切削液が付着しにくいようにし,破損検出センサに切削液が付着しても容易に排出される,新規かつ改良された切削装置を提供することにある。   Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to make it difficult for the cutting fluid to adhere to the breakage detection sensor and to prevent the cutting fluid from adhering to the breakage detection sensor. It is to provide a new and improved cutting device that is easily discharged.

上記課題を解決するために,本発明のある観点によれば,スピンドルの先端部に取り付けられた切削ブレードと,切削ブレードを覆うブレードカバーと,対向配置された発光素子と受光素子とを結ぶ光軸が切削ブレードの刃先によって遮蔽される量に基づいて,切削ブレードの状態を検知する検出手段と,を備える切削装置が提供される。上記切削装置において,検出手段は,切削ブレードの刃先の両側で,発光素子と受光素子をそれぞれ支持する一対の脚部を有し,各脚部の端面は,脚部の端面の中心位置と切削ブレードの回転中心軸とを結ぶ直線に対して垂直に配設される。また,各脚部の切削ブレード側の内側面と各脚部の端面とが接合するコーナー部は,R形状であることを特徴とする。   In order to solve the above-described problem, according to one aspect of the present invention, a light that connects a cutting blade attached to the tip of a spindle, a blade cover that covers the cutting blade, and a light emitting element and a light receiving element that are arranged to face each other. There is provided a cutting device including detection means for detecting a state of the cutting blade based on an amount of the shaft shielded by a cutting edge of the cutting blade. In the above cutting apparatus, the detection means has a pair of leg portions that respectively support the light emitting element and the light receiving element on both sides of the cutting edge of the cutting blade, and the end surface of each leg portion corresponds to the center position of the end surface of the leg portion and the cutting position. It is arranged perpendicular to a straight line connecting the rotation center axis of the blade. Further, the corner portion where the inner side surface of each leg portion on the cutting blade side and the end surface of each leg portion are joined has an R shape.

かかる構成により,検出手段の各脚部の端面が,切削ブレードの接線と略平行となるように配設される。これにより,検出箇所の周辺での切削ブレードの回転にともなって連れ回る切削液の流れに対して逆らわないように,各脚部の端面が略平行にされるため,切削液の流れが層流となり,発光素子や受光素子の表面から切削液が円滑に排出されるようになる。したがって,検出手段に配置された発光素子の発光面と受光素子の受光面に切削液が付着しにくくなり,検出精度の低下を防止することができる。   With this configuration, the end surfaces of the leg portions of the detection means are disposed so as to be substantially parallel to the tangent line of the cutting blade. As a result, the end surface of each leg is made substantially parallel so that it does not oppose the flow of the cutting fluid that rotates with the rotation of the cutting blade around the detection location. Thus, the cutting fluid is smoothly discharged from the surface of the light emitting element or the light receiving element. Therefore, it becomes difficult for the cutting fluid to adhere to the light emitting surface of the light emitting element and the light receiving surface of the light receiving element arranged in the detecting means, and a reduction in detection accuracy can be prevented.

さらに,各脚部の切削ブレード側の内側面と各脚部の端面とが接合するコーナー部の形状を,例えばR形状等の曲面とすることにより,発光素子または受光素子の周囲に切削液が付着しても,曲線に沿って脚部の端面側に流れやすくなる。したがって,発光素子や受光素子の周囲に滞留する切削液が,各脚部の端面側に排出されやすくなる。   Furthermore, the shape of the corner portion where the inner side surface of each leg portion on the cutting blade side and the end surface of each leg portion are joined is a curved surface such as an R shape, so that the cutting fluid is surrounded around the light emitting element or the light receiving element. Even if it adheres, it tends to flow to the end face side of the leg along the curve. Therefore, the cutting fluid staying around the light emitting element and the light receiving element is easily discharged to the end face side of each leg.

また,検出手段は,切削ブレードの外周の接線に対して,切削ブレード回転方向上流側から鋭角に配設させることができる。ここで,各脚部の切削ブレード回転方向下流側の背面と,各脚部の端面とのなす角は,鋭角であってもよい。すなわち,切削ブレード回転方向下流側に鋭角部が位置するため,切削ブレードに連れ回されて端面に付着した切削液が鋭角部に集中し,各脚部の鋭角部から切削液が離脱しやすくなる。なお,切削ブレード回転方向下流側とは,切削ブレード検出位置(すなわち,発光素子または受光素子の位置)を基準として,切削ブレードの進行方向側である。また,切削ブレード上流側とは,切削ブレードの進行方向と反対側である。   The detecting means can be arranged at an acute angle with respect to the tangent line on the outer periphery of the cutting blade from the upstream side in the cutting blade rotation direction. Here, the angle formed between the back surface of each leg portion on the downstream side in the rotation direction of the cutting blade and the end surface of each leg portion may be an acute angle. That is, since the acute angle portion is located downstream of the cutting blade rotation direction, the cutting fluid that is rotated by the cutting blade and adheres to the end surface concentrates on the acute angle portion, and the cutting fluid is easily detached from the acute angle portion of each leg. . The downstream side of the cutting blade rotation direction is the traveling direction side of the cutting blade with reference to the cutting blade detection position (that is, the position of the light emitting element or the light receiving element). Further, the upstream side of the cutting blade is the side opposite to the traveling direction of the cutting blade.

さらに,検出手段は,一対の脚部を連結する連結部を備えてもよい。各脚部と連結部とは,別体形成された複数の部材を相互に連結してもよく,あるいは,一体形成してもよい。連結部において切削ブレードと対向する対向面と,連結部の切削ブレード回転方向上流側の前面とが接合するコーナー部は,例えばR形状であってもよい。これにより,連結部の切削ブレード回転方向上流部側のコーナー部が広く開口され,かつ切削液がR形状に沿って流れるため,切削ブレードに連れ回る切削液の流れを乱すことなく,切削液が円滑に排出されるようにすることができる。したがって,発光素子や受光素子の表面に切削液が付着しにくくなり,検出精度の低下を防ぐことができる。   Furthermore, the detection means may include a connecting portion that connects the pair of leg portions. Each leg part and connecting part may mutually connect a plurality of members formed separately, or may be integrally formed. The corner portion where the facing surface facing the cutting blade in the connecting portion and the front surface upstream of the connecting portion in the rotation direction of the cutting blade may be, for example, R-shaped. As a result, the corner of the connecting portion upstream of the cutting blade rotation direction is wide open, and the cutting fluid flows along the R shape, so that the cutting fluid flows without disturbing the flow of the cutting fluid accompanying the cutting blade. It can be discharged smoothly. Therefore, it becomes difficult for the cutting fluid to adhere to the surface of the light emitting element or the light receiving element, and a decrease in detection accuracy can be prevented.

また,検出手段に切削液がより付着しないようにするため,検出手段の表面に,例えば,サウンドブラスト加工を施したり,親水性物質を被覆してもよい。親水性物質としては,例えば,界面活性剤や親水性樹脂等を使用することができる。これにより,検出手段の表面に切削液がより付着しにくくなり,検出精度の低下を防ぐことができる。   Further, in order to prevent the cutting fluid from adhering to the detection means, for example, the surface of the detection means may be subjected to sound blasting or coated with a hydrophilic substance. As the hydrophilic substance, for example, a surfactant or a hydrophilic resin can be used. As a result, the cutting fluid is less likely to adhere to the surface of the detection means, and a reduction in detection accuracy can be prevented.

以上説明したように本発明によれば,破損検出センサに切削液が付着しにくいようにし,破損検出センサに切削液が付着しても容易に排出される,切削装置を提供することができる。   As described above, according to the present invention, it is possible to provide a cutting device that makes it difficult for the cutting fluid to adhere to the breakage detection sensor and that is easily discharged even if the cutting fluid adheres to the breakage detection sensor.

以下に添付図面を参照しながら,本発明の好適な実施の形態について詳細に説明する。なお,本明細書及び図面において,実質的に同一の機能構成を有する構成要素については,同一の符号を付することにより重複説明を省略する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(第1の実施形態)
まず,図1に基づいて,本発明の第1の実施形態にかかる切削装置について説明する。なお,図1は,本実施形態にかかるダイシング装置10の全体構成を示す斜視図である。
(First embodiment)
First, based on FIG. 1, the cutting device concerning the 1st Embodiment of this invention is demonstrated. FIG. 1 is a perspective view showing the overall configuration of the dicing apparatus 10 according to the present embodiment.

図1に示すように,ダイシング装置10は,例えば,半導体ウェハなどの被加工物12を切削加工する切削手段である切削ユニット20と,被加工物12を保持する被加工物保持手段であるチャックテーブル15と,切削ユニット移動機構(図示せず。)と,チャックテーブル移動機構(図示せず。)とを備える。   As shown in FIG. 1, the dicing apparatus 10 includes a cutting unit 20 that is a cutting unit that cuts a workpiece 12 such as a semiconductor wafer, and a chuck that is a workpiece holding unit that holds the workpiece 12. A table 15, a cutting unit moving mechanism (not shown), and a chuck table moving mechanism (not shown) are provided.

切削ユニット20は,スピンドル(図示せず)に装着された切削ブレード22を備えている。この切削ユニット20は,切削ブレード22を高速回転させながら被加工物12に切り込ませることにより,被加工物12を切削して極薄のカーフ(切溝)を形成する。   The cutting unit 20 includes a cutting blade 22 mounted on a spindle (not shown). The cutting unit 20 cuts the workpiece 12 by cutting the workpiece 12 while rotating the cutting blade 22 at a high speed to form an extremely thin kerf.

また,チャックテーブル15は,例えば,その上面が略平坦な円盤状のテーブルであり,その上面に真空チャック(図示せず。)等を具備している。このチャックテーブル15上には,例えば,ウェハテープ13を介してフレーム14に支持された状態の被加工物12が載置される。チャックテーブル15は,かかる被加工物12を真空吸着して安定的に保持する。   The chuck table 15 is, for example, a disk-shaped table having a substantially flat upper surface, and is provided with a vacuum chuck (not shown) on the upper surface. On the chuck table 15, for example, the workpiece 12 supported by the frame 14 via the wafer tape 13 is placed. The chuck table 15 stably holds the workpiece 12 by vacuum suction.

切削ユニット移動機構は,切削ユニット20をY軸方向に移動させる。このY軸方向は,切削方向(X軸方向)に対して直交する水平方向であり,切削ユニット20内に延設されたスピンドルの軸方向と一致する。切削ユニット20をY軸方向に移動させることにより,切削ブレード22の刃先を被加工物12の切削位置(切削ライン)に位置合わせすることができる。また,この切削ユニット移動機構は,切削ユニット20をZ軸方向(垂直方向)にも移動させる。これにより,被加工物12に対する切削ブレード22の切り込み深さを調整することができる。   The cutting unit moving mechanism moves the cutting unit 20 in the Y-axis direction. The Y-axis direction is a horizontal direction orthogonal to the cutting direction (X-axis direction), and coincides with the axial direction of the spindle extending in the cutting unit 20. By moving the cutting unit 20 in the Y-axis direction, the cutting edge of the cutting blade 22 can be aligned with the cutting position (cutting line) of the workpiece 12. The cutting unit moving mechanism also moves the cutting unit 20 in the Z-axis direction (vertical direction). Thereby, the cutting depth of the cutting blade 22 with respect to the workpiece 12 can be adjusted.

チャックテーブル移動機構は,切削加工時に,被加工物12を保持したチャックテーブル15を切削方向(X軸方向)に往復移動させて,被加工物12に対し切削ブレード22の刃先を直線的な軌跡で作用させる。   The chuck table moving mechanism reciprocates the chuck table 15 holding the workpiece 12 in the cutting direction (X-axis direction) during the cutting process so that the cutting edge of the cutting blade 22 moves linearly with respect to the workpiece 12. Let it work with.

かかる構成のダイシング装置10は,高速回転する切削ブレード22を被加工物12に切り込ませながら,切削ユニット20とチャックテーブル15とを相対移動させることにより,被加工物12の格子状に配置された複数の切削ラインを切削する。これによって,被加工物12をダイシング加工して,複数のチップに分割することができる。   The dicing apparatus 10 having such a configuration is arranged in a lattice shape of the workpiece 12 by relatively moving the cutting unit 20 and the chuck table 15 while cutting the cutting blade 22 rotating at high speed into the workpiece 12. Cutting multiple cutting lines. Thereby, the workpiece 12 can be diced and divided into a plurality of chips.

次に,図2および図3に基づいて,本実施形態にかかる切削ユニット20の構成について詳細に説明する。ここで,図2は,本実施形態にかかる切削ユニット20を示す正面図である。また,図3は,切削ユニット20を示す右側面図である。   Next, based on FIG. 2 and FIG. 3, the structure of the cutting unit 20 concerning this embodiment is demonstrated in detail. Here, FIG. 2 is a front view showing the cutting unit 20 according to the present embodiment. FIG. 3 is a right side view showing the cutting unit 20.

図2に示すように,切削ユニット20は,例えば,切削ブレード22と,スピンドル23と,ブレードカバー25と,切削液供給ノズル(ブレードクーラノズル)28と,を主に備える。   As shown in FIG. 2, the cutting unit 20 mainly includes, for example, a cutting blade 22, a spindle 23, a blade cover 25, and a cutting fluid supply nozzle (blade cooler nozzle) 28.

切削ブレード22は,例えば,略リング形状を有する極薄の切削砥石である。かかる切削ブレード22は,例えば,フランジおよびナットなどによって,スピンドル23の先端部に装着される。本実施形態にかかる切削ブレード22は,例えば,外周部に配される切削砥石部22aと,当該切削砥石部22aをスピンドル23に軸着するための基体部22bとが一体構成されたハブブレードで構成されている。しかし,かかる例に限定されず,切削ブレード22は,所謂ワッシャーブレードで構成され,その両側をフランジで挟持してナットで固定することによって,スピンドル23に軸着させてもよい。   The cutting blade 22 is, for example, an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 22 is attached to the tip of the spindle 23 by, for example, a flange and a nut. The cutting blade 22 according to the present embodiment is, for example, a hub blade in which a cutting grindstone portion 22 a disposed on the outer peripheral portion and a base portion 22 b for attaching the cutting grindstone portion 22 a to the spindle 23 are integrally configured. It is configured. However, the present invention is not limited to this example, and the cutting blade 22 may be a so-called washer blade, and may be pivotally attached to the spindle 23 by sandwiching both sides thereof with a flange and fixing with a nut.

スピンドル23は,例えば,モータ(図示せず。)の回転駆動力を切削ブレード22に伝達するための回転軸であり,装着された切削ブレード22を例えば30000rpmで高速回転させることができる。このスピンドルの大部分は,スピンドルハウジング(図示せず)に覆われているが,その先端部は,スピンドルハウジングから露出しており,かかる先端部に切削ブレード22等が装着される。なお,このスピンドルは,切削方向(X軸方向)と直交するY軸方向に延設されている。また,本実施形態において,切削ブレード22は,図2の矢印F方向に回転しているものとする。   The spindle 23 is, for example, a rotating shaft for transmitting the rotational driving force of a motor (not shown) to the cutting blade 22, and the mounted cutting blade 22 can be rotated at a high speed of, for example, 30000 rpm. Most of the spindle is covered with a spindle housing (not shown), but its tip is exposed from the spindle housing, and a cutting blade 22 or the like is attached to the tip. The spindle extends in the Y-axis direction orthogonal to the cutting direction (X-axis direction). In this embodiment, it is assumed that the cutting blade 22 rotates in the direction of arrow F in FIG.

ブレードカバー25は,切削ブレード22の外周を覆うようにして配設され,スピンドルハウジングの先端部に固定される。このブレードカバー25は,切削ブレード22を保護するとともに,切削加工に伴う切削液や切削屑,破損したブレード片などが,切削ユニット20外部に飛散することを防止する。具体的には,このブレードカバー25は,例えば,ブレードカバー支持部24と,上部ブレードカバー26とから構成されている。上部ブレードカバー26は,ブレードカバー支持部24にネジ等により固定支持されて,切削ブレード22の上側(Z軸正方向側)に切削ブレード22の外周を覆うように配設されている。   The blade cover 25 is disposed so as to cover the outer periphery of the cutting blade 22, and is fixed to the tip of the spindle housing. The blade cover 25 protects the cutting blade 22 and prevents the cutting fluid, cutting waste, broken blade pieces, and the like accompanying the cutting from scattering outside the cutting unit 20. Specifically, the blade cover 25 includes, for example, a blade cover support portion 24 and an upper blade cover 26. The upper blade cover 26 is fixed and supported by the blade cover support portion 24 with screws or the like, and is disposed on the upper side (Z-axis positive direction side) of the cutting blade 22 so as to cover the outer periphery of the cutting blade 22.

また,かかるブレードカバー25には,切削ブレード22の側面側から切削液を供給する一対の切削液供給ノズル(ブレードクーラノズル)28が設けられている。切削液供給ノズル28は,切削ブレード22の正面側および背面側と対向配置されている。なお,切削ブレード22の正面とは,スピンドル23の軸方向先端側(Y軸正方向側)の側面であり,切削ブレード22の背面とは,スピンドル23の軸方向奥側(Y軸負方向側)の側面である。かかる切削液供給ノズル28は,切削ブレード22の側面下部および加工点に向けて,切削液を噴射する。切削液としては,例えば,純水や水道水等の切削水を用いることができる。このように切削液を供給することによって,切削ブレード22および加工点を冷却して,切削加工時に被加工物にチッピングが発生することを防止できる。   Further, the blade cover 25 is provided with a pair of cutting fluid supply nozzles (blade cooler nozzles) 28 for supplying the cutting fluid from the side surface side of the cutting blade 22. The cutting fluid supply nozzle 28 is disposed opposite to the front side and the back side of the cutting blade 22. The front surface of the cutting blade 22 is the side surface on the tip end side in the axial direction (Y-axis positive direction side) of the spindle 23, and the rear surface of the cutting blade 22 is the back side in the axial direction of the spindle 23 (Y-axis negative direction side). ) Side. The cutting fluid supply nozzle 28 injects the cutting fluid toward the lower portion of the side surface of the cutting blade 22 and the processing point. As the cutting fluid, for example, cutting water such as pure water or tap water can be used. By supplying the cutting fluid in this manner, the cutting blade 22 and the processing point can be cooled, and chipping can be prevented from occurring on the workpiece during the cutting process.

さらに,ブレードカバー25には,支持基台50により支持された検出手段40が設けられる。かかる検出手段40は,切削ブレード22の回転中に切削ブレード22の破損または磨耗を検出する。検出手段40は,第1の位置調整ボルト51と,検出手段40の第2の位置調整ボルト56とにより支持基台50に固定され,切削ブレード回転方向上流側から斜めに配置される。このとき,各脚部43の端面43aは,検出手段40の脚部43の端面43aの,X軸方向における中心位置Mと切削ブレード22の回転中心軸Cとを結ぶ直線に対して,略垂直となるように配設される。   Further, the blade cover 25 is provided with detection means 40 supported by the support base 50. Such detection means 40 detects breakage or wear of the cutting blade 22 during rotation of the cutting blade 22. The detection means 40 is fixed to the support base 50 by the first position adjustment bolt 51 and the second position adjustment bolt 56 of the detection means 40, and is arranged obliquely from the upstream side in the cutting blade rotation direction. At this time, the end face 43a of each leg 43 is substantially perpendicular to the straight line connecting the center position M of the end face 43a of the leg 43 of the detecting means 40 in the X-axis direction and the rotation center axis C of the cutting blade 22. It arrange | positions so that it may become.

また,検出手段40は,図3に示すように,各脚部43,43に,発光素子41aと受光素子41bとを備え,発光素子41aと受光素子41bとを結ぶ光軸の間に切削ブレード22の刃先が位置するように配置される。切削ブレード22が破損している場合には,光が切削ブレードの刃先によって遮蔽されない(あるいは,遮蔽量が大幅に減少する。)ため,受光素子41bが検出する受光量が増加する。この受光量は,光電変換部で電気信号に変換されて電圧値として測定され,受光素子41bが受光する光量が増加すると電圧値は上昇する。したがって,測定された電圧値が所定のしきい値以上の電圧となると,切削ブレード22が破損したと認識される。   Further, as shown in FIG. 3, the detection means 40 includes a light emitting element 41a and a light receiving element 41b at each leg 43, 43, and a cutting blade between the optical axes connecting the light emitting element 41a and the light receiving element 41b. It is arranged so that 22 cutting edges are located. When the cutting blade 22 is broken, the light is not shielded by the cutting edge of the cutting blade (or the shielding amount is greatly reduced), so the amount of received light detected by the light receiving element 41b increases. This amount of received light is converted into an electrical signal by the photoelectric conversion unit and measured as a voltage value, and the voltage value increases as the amount of light received by the light receiving element 41b increases. Therefore, it is recognized that the cutting blade 22 is damaged when the measured voltage value is equal to or higher than a predetermined threshold value.

以上,本実施形態にかかる切削ユニット20の構成について説明した。次いで,図4および図5に基づいて,本実施形態の特徴的部分である検出手段40について,より詳細に説明する。かかる検出手段40は,発光素子40aまたは受光素子40bの表面に切削液が付着しにくくすることの可能な形状を有することを特徴とする。なお,図4は,本実施形態にかかる検出手段40と支持基台50とを示す分解斜視図である。また,図5は,検出手段40を切削ブレード回転方向上流側である前面から示した斜視図である。   The configuration of the cutting unit 20 according to the present embodiment has been described above. Next, based on FIG. 4 and FIG. 5, the detection means 40 that is a characteristic part of the present embodiment will be described in more detail. Such detection means 40 is characterized by having a shape that makes it difficult for the cutting fluid to adhere to the surface of the light emitting element 40a or the light receiving element 40b. FIG. 4 is an exploded perspective view showing the detection means 40 and the support base 50 according to the present embodiment. FIG. 5 is a perspective view showing the detection means 40 from the front surface upstream of the cutting blade rotation direction.

検出手段40は,図4に示すように,2つの第1の位置調整ボルト51,51と,第2の位置調整ボルト56とにより支持基台50に固定され,支持される。支持基台50は,例えば略L字形状であり,略L字形状を構成する一面が,Z軸に対して切削ブレード回転方向上流側に例えば約45°傾斜されて,ブレードカバーに配設される。かかる形状の支持基台50の一内面54に沿って,検出手段40は嵌挿される。   As shown in FIG. 4, the detection means 40 is fixed to and supported by the support base 50 by two first position adjustment bolts 51, 51 and a second position adjustment bolt 56. The support base 50 is, for example, approximately L-shaped, and one surface constituting the approximately L-shaped is inclined by, for example, about 45 ° upstream of the cutting blade rotation direction with respect to the Z axis, and is disposed on the blade cover. The The detection means 40 is inserted along the inner surface 54 of the support base 50 having such a shape.

支持基台50の一内面54には,検出手段40を案内する一対のガイド53,53が形成されている。また,一対のガイド53,53の間に位置する面は,検出手段40の凸面40aと嵌合するように窪んでいる。この窪んだ凹面には,ガイド53,53と略平行にスリット58,58が形成されている。支持基台50に嵌挿された検出手段40は,第1の位置調整ボルト51,51を,スリット58,58を通して検出手段40の第1の貫通孔48,48に螺合させることにより,支持基台50に固定される。   A pair of guides 53 and 53 for guiding the detection means 40 are formed on the inner surface 54 of the support base 50. Further, the surface located between the pair of guides 53 is recessed so as to be fitted to the convex surface 40a of the detecting means 40. Slits 58 and 58 are formed in the recessed concave surface substantially in parallel with the guides 53 and 53. The detection means 40 inserted into the support base 50 is supported by screwing the first position adjusting bolts 51, 51 into the first through holes 48, 48 of the detection means 40 through the slits 58, 58. It is fixed to the base 50.

また,支持基台50の他面には,第2の貫通孔57と,検出手段40の発光素子41aおよび受光素子41bにそれぞれ接続された光ファイバーケーブル42,42が挿通される2つの貫通孔52,52とが形成されている。支持基台50に嵌挿された検出手段40は,第2の位置調整ボルト56を,貫通孔57を通して第2の貫通孔47と螺合させることにより,支持基台50に固定される。   Further, on the other surface of the support base 50, two through holes 52 through which the second through holes 57 and the optical fiber cables 42 and 42 respectively connected to the light emitting elements 41 a and the light receiving elements 41 b of the detection means 40 are inserted. , 52 are formed. The detecting means 40 inserted into the support base 50 is fixed to the support base 50 by screwing the second position adjusting bolt 56 with the second through hole 47 through the through hole 57.

このように,検出手段40は,直交する2方向から,第1の位置調整ボルト51,51と第2の位置調整ベルト56とによって支持基台50に固定される。この第1の位置調整ボルト51,51および第2の位置調整ボルト56による検出手段40の固定位置を変化させることにより,発光素子41aおよび受光素子41bを上下させて,切削ブレード22の検出位置を調整することができる。   As described above, the detection means 40 is fixed to the support base 50 by the first position adjustment bolts 51 and 51 and the second position adjustment belt 56 from two orthogonal directions. By changing the fixing position of the detecting means 40 by the first position adjusting bolts 51 and 51 and the second position adjusting bolt 56, the light emitting element 41a and the light receiving element 41b are moved up and down to change the detection position of the cutting blade 22. Can be adjusted.

検出手段40は,図5に示すように,例えば,コの字型に形成されており,一対の脚部43,43と,一対の脚部43,43の間に位置する連結部45とからなる。各脚部43,43の形状は,例えば略四角柱とすることができる。ここで,脚部43について,光ファイバーケーブル42,42が延出する面40cと反対側の面を端面43a,切削ブレード22と対向する側の面(発光素子41aおよび受光素子41bの設置面)を内側面43b,内側面43bと反対側にある面を外側面43c,切削ブレード回転方向上流側の面を前面43d,切削ブレード回転方向下流側の面を背面43eとする。また,連結部45の切削ブレード22と対向する面を,対向面45aとする。   As shown in FIG. 5, the detection means 40 is formed in, for example, a U-shape, and includes a pair of leg portions 43 and 43 and a connection portion 45 positioned between the pair of leg portions 43 and 43. Become. The shape of each leg part 43 and 43 can be made into a substantially square pole, for example. Here, with respect to the leg portion 43, the surface opposite to the surface 40c from which the optical fiber cables 42 and 42 extend is the end surface 43a, and the surface opposite to the cutting blade 22 (the installation surface of the light emitting element 41a and the light receiving element 41b). The inner surface 43b, the surface opposite to the inner surface 43b is the outer surface 43c, the upstream surface in the cutting blade rotation direction is the front surface 43d, and the downstream surface in the cutting blade rotation direction is the rear surface 43e. Further, the surface of the connecting portion 45 that faces the cutting blade 22 is referred to as a facing surface 45a.

検出手段40の脚部43の端面43aと脚部43の背面43eとは,鋭角,例えば約45°をなしており,切削ブレード回転方向下流側に鋭角部が位置するように配置される。これにより,切削ブレード22の回転にしたがって連れ回される切削液60の切れがよくなり,発光素子41aまたは受光素子41bの周辺に切削液60が滞留しないようにすることができる。さらに,切削液60の流れが層流となり,発光素子41aや受光素子41bの表面から円滑に切削液60を排出することができる。   The end surface 43a of the leg portion 43 of the detection means 40 and the back surface 43e of the leg portion 43 have an acute angle, for example, about 45 °, and are arranged so that the acute angle portion is located downstream in the cutting blade rotation direction. As a result, the cutting fluid 60 that is rotated along with the rotation of the cutting blade 22 is better cut off, and the cutting fluid 60 can be prevented from staying around the light emitting element 41a or the light receiving element 41b. Furthermore, the flow of the cutting fluid 60 becomes a laminar flow, and the cutting fluid 60 can be smoothly discharged from the surfaces of the light emitting element 41a and the light receiving element 41b.

また,脚部43の端面43aと脚部43の内側面43bとが接合するコーナー部44は,R形状となっている。このように,かかるコーナー部をR形状とすることにより,脚部43の内側面43b側の切削液60を端面43a側に排出することができるという効果を奏する。なお,R形状の半径は約1.5mm以上とすることにより効果が生じ,例えば,約2.5mmとすることができる。   Further, the corner portion 44 where the end surface 43a of the leg portion 43 and the inner side surface 43b of the leg portion 43 are joined has an R shape. Thus, by making this corner part into R shape, there exists an effect that the cutting fluid 60 by the side of the inner surface 43b of the leg part 43 can be discharged | emitted to the end surface 43a side. The effect of the radius of the R shape is about 1.5 mm or more. For example, the radius can be about 2.5 mm.

一方,検出手段40の連結部45における切削ブレード22と対向する対向面45aと,連結部45の背面40aとは,切削ブレード22と接触しないように,鋭角をなしている。この鋭角は,例えば約45°であり,脚部43の端面43aと略平行に形成することができる。また,連結部45の対向面45aと連結部45の前面40bとが接合するコーナー部45bは,例えばR形状に形成されている。これにより,連結部45の切削ブレード回転方向上流側における切削液60の流れが乱流となることを防止し,切削液60を円滑に排出することができる。   On the other hand, the facing surface 45a of the connecting portion 45 of the detecting means 40 facing the cutting blade 22 and the back surface 40a of the connecting portion 45 form an acute angle so as not to contact the cutting blade 22. This acute angle is, for example, about 45 °, and can be formed substantially parallel to the end face 43 a of the leg 43. Moreover, the corner part 45b where the opposing surface 45a of the connection part 45 and the front surface 40b of the connection part 45 join is formed in R shape, for example. Thereby, it can prevent that the flow of the cutting fluid 60 in the cutting blade rotation direction upstream of the connection part 45 becomes a turbulent flow, and can discharge the cutting fluid 60 smoothly.

かかる形状を有する検出手段40の一対の脚部43,43の内側面43b,43bには,発光素子41aと受光素子41bとが対向配設されている。発光素子41aおよび受光素子41bは,光ファイバーケーブル42,42と接続されており,発光または受光する。そして,図2に示すように,検出手段40の脚部43の端面43aを,検出手段40の脚部43の端面43aの,X軸方向における中心位置Mと切削ブレード22の回転中心軸Cとを結ぶ直線に対して,略垂直となるように配設する。このように,脚部43の端面43aを切削ブレード22の接線と略平行に配設することにより,切削液の流れに対しても,検出手段40の各脚部43の端面43aは略平行となり,切削液が排出されやすい状態となる。さらに,かかる構造により,切削液の流れが層流となり,発光素子41aや受光素子41bの表面から円滑に切削液が排出されるようにすることができる。   A light emitting element 41a and a light receiving element 41b are arranged to face each other on the inner side surfaces 43b, 43b of the pair of leg portions 43, 43 of the detecting means 40 having such a shape. The light emitting element 41a and the light receiving element 41b are connected to the optical fiber cables 42 and 42 and emit or receive light. Then, as shown in FIG. 2, the end surface 43a of the leg portion 43 of the detection means 40 is changed from the center position M in the X-axis direction of the end surface 43a of the leg portion 43 of the detection means 40 to the rotation center axis C of the cutting blade 22. It is arranged so as to be substantially perpendicular to the straight line connecting In this way, by arranging the end face 43a of the leg 43 substantially parallel to the tangent line of the cutting blade 22, the end face 43a of each leg 43 of the detecting means 40 becomes substantially parallel to the flow of the cutting fluid. , The cutting fluid is easily discharged. Furthermore, with this structure, the flow of the cutting fluid becomes a laminar flow, and the cutting fluid can be smoothly discharged from the surfaces of the light emitting element 41a and the light receiving element 41b.

以上,本実施形態にかかる検出手段40について説明した。次に,図6および図7に基づいて,本実施形態にかかる検出手段40を使用した場合と,従来の検出手段を使用した場合との,切削液60の流れの相違について説明する。なお,図6は,本実施形態にかかる検出手段40を示すものであり,(a)は左側面図,(b)は正面図である。また,図7は,従来の検出手段1を示すものであり,(a)は左側面図,(b)は正面図である。   The detection unit 40 according to the present embodiment has been described above. Next, based on FIG. 6 and FIG. 7, the difference in the flow of the cutting fluid 60 between the case where the detection means 40 according to the present embodiment is used and the case where the conventional detection means is used will be described. FIG. 6 shows the detection means 40 according to the present embodiment, where (a) is a left side view and (b) is a front view. FIGS. 7A and 7B show the conventional detection means 1, wherein FIG. 7A is a left side view and FIG. 7B is a front view.

まず,従来の検出手段1を使用した場合の,検出手段1の周囲における切削液60の流れについて説明する。従来の検出手段1は,図7(a)に示すように,脚部3の端面3aと脚部3の内側面3bとが接合するコーナー部5は,略直角に形成されている。このため,切削液60の表面張力により,発光素子4aおよび受光素子4bの表面に切削液60が残存してしまい,センサ光軸上に切削液60が滞留してしまう。   First, the flow of the cutting fluid 60 around the detection means 1 when the conventional detection means 1 is used will be described. As shown in FIG. 7A, in the conventional detection means 1, the corner portion 5 where the end surface 3a of the leg portion 3 and the inner side surface 3b of the leg portion 3 are joined is formed at a substantially right angle. For this reason, the cutting fluid 60 remains on the surfaces of the light emitting element 4a and the light receiving element 4b due to the surface tension of the cutting fluid 60, and the cutting fluid 60 stays on the sensor optical axis.

また,図7(b)に示すように,脚部3の背面3eと脚部3の端面3aとがなす角は略直角である。このため,検出手段1を検出位置に配置されたとき,センサ光軸の直下に脚部3の前面3dと脚部3の端面3aとが接合する略直角のコーナー部7に,切削液60が滞留し易くなり,センサ光軸付近に切削液60が集中する。さらに,検出手段1の連結部の切削ブレード22と対向する対向面6aと脚部3の内側面3bとが接合するコーナー部6の形状は略直角であったため,切削液60が滞留し易くなっていた。   Further, as shown in FIG. 7B, the angle formed between the back surface 3e of the leg 3 and the end surface 3a of the leg 3 is substantially a right angle. For this reason, when the detection means 1 is arranged at the detection position, the cutting fluid 60 is applied to the substantially perpendicular corner portion 7 where the front surface 3d of the leg portion 3 and the end surface 3a of the leg portion 3 are joined immediately below the sensor optical axis. It tends to stay and the cutting fluid 60 concentrates in the vicinity of the sensor optical axis. Further, since the shape of the corner portion 6 where the facing surface 6a facing the cutting blade 22 of the connecting portion of the detecting means 1 and the inner side surface 3b of the leg portion 3 are joined is substantially perpendicular, the cutting fluid 60 tends to stay. It was.

さらに,連結部の切削ブレード22と対向する対向面6aは,検出位置での切削ブレード接線方向と略平行である。このため,切削ブレード回転方向上流側における連結部の対向面6aと切削ブレード22との間隔が狭く,切削ブレード回転方向上流側から流入した切削液60は複雑に入り乱れて流れ,発光素子4aまたは受光素子4bの周囲で乱流となってしまう。したがって,発光素子4aまたは受光素子4bの周囲の切削液60を円滑に排出されない。   Furthermore, the facing surface 6a facing the cutting blade 22 of the connecting portion is substantially parallel to the cutting blade tangential direction at the detection position. For this reason, the distance between the facing surface 6a of the connecting portion on the upstream side in the rotation direction of the cutting blade and the cutting blade 22 is narrow, and the cutting fluid 60 flowing in from the upstream side in the rotation direction of the cutting blade flows in a complicated manner. A turbulent flow occurs around the element 4b. Therefore, the cutting fluid 60 around the light emitting element 4a or the light receiving element 4b is not smoothly discharged.

このように,従来の検出手段1を使用した場合,略直角であるコーナー部5,6,7に切削液60が滞留しやすいために,発光素子4aと受光素子4bとの表面に切削液60が付着して光が屈折・反射してしまい,破損検出を正確に行うことができなかった。   As described above, when the conventional detection means 1 is used, the cutting fluid 60 tends to stay in the corners 5, 6 and 7 that are substantially perpendicular, so that the cutting fluid 60 is formed on the surfaces of the light emitting element 4a and the light receiving element 4b. As a result, the light was refracted and reflected, and the damage was not accurately detected.

一方,本実施形態にかかる検出手段40では,図6(a)に示すように,脚部43の内側面43bと脚部43の端面43aとが接合するコーナー部44は,R形状となっている。これにより,脚部43の内側面43bの切削液60は,R形状に沿って矢印A方向に流れ,脚部43の端面43a側に逃がすことができる。また,検出手段40の連結部45の,切削ブレード22と対向する対向面45aと脚部43の内側面43bとが接合するコーナー部45cをR形状にしてもよい。従来の検出手段1では,かかるコーナー部6は略直角であったため,切削液60が滞留しやすかったが,本実施形態にかかる検出手段40のように,コーナー部45cをR形状とすることにより,コーナー部45cの滞留する切削液60の量を減少させることができる。   On the other hand, in the detection means 40 according to the present embodiment, as shown in FIG. 6A, the corner portion 44 where the inner surface 43b of the leg portion 43 and the end surface 43a of the leg portion 43 are joined has an R shape. Yes. As a result, the cutting fluid 60 on the inner side surface 43 b of the leg 43 can flow in the direction of arrow A along the R shape and escape to the end surface 43 a side of the leg 43. Further, the corner portion 45c of the connecting portion 45 of the detecting means 40 where the facing surface 45a facing the cutting blade 22 and the inner side surface 43b of the leg portion 43 are joined may be formed in an R shape. In the conventional detection means 1, since the corner portion 6 was substantially perpendicular, the cutting fluid 60 was likely to stay. However, like the detection means 40 according to the present embodiment, the corner portion 45c has an R shape. The amount of the cutting fluid 60 that stays in the corner portion 45c can be reduced.

さらに,脚部43の背面43eと脚部43の端面43aとがなす角は,上述したように,水切れをよくするために鋭角(例えば,45°)に形成されている。また,検出手段40は,脚部43の端面43aが切削ブレード22の接線と略平行となるようにに配置されている。このため,切削液60は,付着した切削液60の流れにしたがって図6(b)矢印B方向に流れ,切削液60を光軸から遠ざけることができる。   Further, as described above, the angle formed between the back surface 43e of the leg portion 43 and the end surface 43a of the leg portion 43 is formed at an acute angle (for example, 45 °) in order to improve drainage. The detection means 40 is arranged so that the end surface 43 a of the leg 43 is substantially parallel to the tangent line of the cutting blade 22. For this reason, the cutting fluid 60 flows in the direction of arrow B in FIG. 6 (b) according to the flow of the attached cutting fluid 60, and the cutting fluid 60 can be moved away from the optical axis.

また,連結部45の対向面45aと検出手段40の前面40bとが接合するコーナー部45bをR形状に形成することにより,切削液60が整然と流れるようになる。このように,切削液60の流れが層流となることにより,発光素子41aや受光素子41bの表面から切削液60が円滑に排出されるようにすることができる。   In addition, the corner portion 45b where the opposing surface 45a of the connecting portion 45 and the front surface 40b of the detecting means 40 are joined is formed in an R shape, so that the cutting fluid 60 flows in an orderly manner. As described above, the flow of the cutting fluid 60 becomes a laminar flow, so that the cutting fluid 60 can be smoothly discharged from the surfaces of the light emitting element 41a and the light receiving element 41b.

このように,本実施形態にかかる検出手段40のように,切削液60が滞留し易いコーナー部をR形状とすることにより,切削液60が滞留しにくくなり,発光素子41aや受光素子41bの表面に切削液60が付着しにくくすることができる。したがって,切削ブレード破損検出の精度が低下することを防止できる。   Thus, like the detection means 40 according to the present embodiment, the corner portion in which the cutting fluid 60 is likely to stay is formed in an R shape, so that the cutting fluid 60 is less likely to stay and the light emitting element 41a and the light receiving element 41b The cutting fluid 60 can be made difficult to adhere to the surface. Therefore, it is possible to prevent the accuracy of detecting the cutting blade breakage from being lowered.

さらに,検出手段40の表面に,例えばサウンドブラスト加工や親水性物質のコーティング処理を行うより,切削液60をより付着しにくくすることができる。親水性のコーディング処理は,例えば,親水性物質を含有する液体を,スプレー等によって吹き付けて塗布することにより行われる。親水性物質としては,例えば,界面活性剤や親水性シリコン,親水性アクリル,親水性ウレタン等の親水性樹脂等を使用することができる。   Furthermore, the cutting fluid 60 can be made less likely to adhere to the surface of the detection means 40 than when, for example, a sound blast process or a hydrophilic substance coating process is performed. The hydrophilic coding process is performed, for example, by spraying a liquid containing a hydrophilic substance by spraying or the like. As the hydrophilic substance, for example, a hydrophilic resin such as a surfactant, hydrophilic silicon, hydrophilic acrylic, and hydrophilic urethane can be used.

以上,第1の実施形態にかかる検出手段40について説明した。ダイシング装置10の切削ブレード22の破損検出手段40をかかる構成とすることにより,検出手段40の周囲に切削液60が滞留しにくくすることができる。これにより,発光素子41aまたは受光素子41bの表面に切削液60が付着しにくくすることができ,検出精度の低下を防ぐことができる。次に,検出手段40を上記構造とすることによる効果を検証するため,実験を行った。以下,実験の内容について説明する。   The detection unit 40 according to the first embodiment has been described above. By configuring the breakage detection means 40 of the cutting blade 22 of the dicing apparatus 10 as described above, it is possible to make it difficult for the cutting fluid 60 to stay around the detection means 40. Thereby, it is possible to make it difficult for the cutting fluid 60 to adhere to the surface of the light emitting element 41a or the light receiving element 41b, and to prevent a decrease in detection accuracy. Next, an experiment was conducted to verify the effect of the detection means 40 having the above structure. The contents of the experiment are described below.

(実験:検出手段の形状の相違による光透過量の比較)
本実験では,上記第1の実施形態にかかる検出手段40を使用した場合と,従来の検出手段1を使用した場合とについて,各検出手段で検出される光量を測定し,受光素子により安定して受光することができるかという観点から比較した。
(Experiment: Comparison of light transmission due to differences in detection means shape)
In this experiment, the amount of light detected by each of the detection means is measured and stabilized by the light receiving element when the detection means 40 according to the first embodiment is used and when the conventional detection means 1 is used. From the viewpoint of whether or not the light can be received.

実験は,上記第1の実施形態にかかるダイシング装置10を使用して行い,スピンドル軸方向の幅を従来の約30%程度狭くしたブレードカバーに,第1の実施形態にかかる検出手段40を装着させた場合と,従来の検出手段1を挿着させた場合とについてそれぞれ測定した。そして,2インチの切削ブレード22の刃先を削り,検出手段の発光素子と受光素子とを結ぶ光軸上に切削ブレード22が存在しないように形成された切削ブレードを,スピンドルに取り付け,加工物のない状態でスピンドルを回転数60000rpm/分で回転させた。ここで,測定される光量は,電圧値に変換される。本実験では,光軸上に加工物がない状態での電圧値が5Vとなるように調整した。   The experiment was performed using the dicing apparatus 10 according to the first embodiment, and the detection means 40 according to the first embodiment was mounted on a blade cover whose spindle axial width was reduced by about 30% of the conventional one. The measurement was performed for the case where the conventional detection means 1 was inserted and the case where the conventional detection means 1 was inserted. Then, the cutting edge of the 2-inch cutting blade 22 is cut, and a cutting blade formed so that the cutting blade 22 does not exist on the optical axis connecting the light emitting element and the light receiving element of the detecting means is attached to the spindle, The spindle was rotated at a rotational speed of 60000 rpm / min. Here, the measured light quantity is converted into a voltage value. In this experiment, the voltage value in the state where there is no workpiece on the optical axis was adjusted to 5V.

この状態で,切削液60の流量を0.5リットル/分,1.0リットル/分,1.5リットル/分と変化させ,発光素子が発した光を受光素子が受光したときの光量を測定した。この結果を図8および図9に示す。なお,図8は,本実施形態にかかる検出手段40を用いたときの透過量平均値を示すグラフである。また,図9は,従来の検出手段1を用いたときの透過量平均値を示すグラフである。   In this state, the flow rate of the cutting fluid 60 is changed to 0.5 liter / minute, 1.0 liter / minute, and 1.5 liter / minute, and the amount of light when the light receiving element receives the light emitted from the light emitting element is changed. It was measured. The results are shown in FIGS. In addition, FIG. 8 is a graph which shows the permeation | transmission amount average value when the detection means 40 concerning this embodiment is used. FIG. 9 is a graph showing the average transmission amount when the conventional detection means 1 is used.

従来の検出手段1を使用した場合,図9に示すように,検出された光の透過量にばらつきが生じた。これは,発光素子4aまたは受光素子4bの表面に切削液60が付着してしまい,この付着した切削液60によって光が屈折・散乱してしまったためと考えられる。このため,実際に受光した光量と本来受光される光量とは相違してしまい,光の透過量を正確に測定することができない。   When the conventional detection means 1 was used, the transmission amount of the detected light varied as shown in FIG. This is considered because the cutting fluid 60 adhered to the surface of the light emitting element 4a or the light receiving element 4b, and the light was refracted and scattered by the adhered cutting fluid 60. For this reason, the amount of light actually received and the amount of light originally received are different, and the amount of transmitted light cannot be measured accurately.

一方,第1の実施形態にかかる検出手段40を使用した場合,図8に示すように,検出された透過量は,安定してほぼ一定の値を示した。これは,検出手段40の形状により,検出手段40の周辺から切削液60が排出され易くなっているためと考えられる。このため,発光素子43aまたは受光素子43bの表面に切削液60が付着しにくくなり,光の屈折・散乱も生じにくくなる。したがって,第1の実施形態にかかる検出手段40を使用することにより,より正確に光の透過量を測定することができる。   On the other hand, when the detection means 40 according to the first embodiment is used, as shown in FIG. 8, the detected transmission amount stably shows a substantially constant value. This is considered because the cutting fluid 60 is easily discharged from the periphery of the detection means 40 due to the shape of the detection means 40. For this reason, the cutting fluid 60 is less likely to adhere to the surface of the light emitting element 43a or the light receiving element 43b, and light refraction and scattering are less likely to occur. Therefore, the amount of transmitted light can be measured more accurately by using the detection means 40 according to the first embodiment.

以上,添付図面を参照しながら本発明の好適な実施形態について説明したが,本発明は係る例に限定されないことは言うまでもない。当業者であれば,特許請求の範囲に記載された範疇内において,各種の変更例または修正例に想到し得ることは明らかであり,それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

例えば,上記実施形態では,検出手段40を切削ブレード22の破損検出のために利用したが,本発明はかかる例に限定されない。検出手段40は,切削ブレードの刃先を含む側面を測定するものであれば適用可能であり,例えば,切削ブレードの高さ方向の基準位置を測定する検出,あるいは,切削ブレードの磨耗検出にも使用することができる。   For example, in the above embodiment, the detection means 40 is used for detecting breakage of the cutting blade 22, but the present invention is not limited to such an example. The detection means 40 can be applied as long as it measures the side surface including the cutting edge of the cutting blade. For example, the detection means 40 can be used to detect the reference position in the height direction of the cutting blade or to detect wear of the cutting blade. can do.

また,上記実施形態では,検出手段40の形状は略コの字型であったが,本発明はかかる例に限定されず,例えば,連結部を設けずに一対の脚部のみで形成することもできる。   Moreover, in the said embodiment, although the shape of the detection means 40 was a substantially U shape, this invention is not limited to this example, For example, it forms only with a pair of leg part, without providing a connection part. You can also.

さらに,上記実施形態では,連結部を設けずに,切削装置としてダイシング装置10の例を挙げて説明したが,本発明はかかる例に限定されない。例えば,スピンドルにより高速回転する切削ブレード22を用いて被加工物12を切削加工する装置であれば,ダイシング加工以外の切削加工を行う各種の切削装置であってもよい。   Furthermore, although the said embodiment gave and demonstrated the example of the dicing apparatus 10 as a cutting device, without providing a connection part, this invention is not limited to this example. For example, as long as it is a device that cuts the workpiece 12 using a cutting blade 22 that rotates at high speed with a spindle, various cutting devices that perform cutting other than dicing may be used.

本発明は,切削装置に適用可能であり,特に,切削ブレードの破損または磨耗などの状態や切削ブレードの位置等を検出する検出手段を備える切削装置に適用可能である。   The present invention can be applied to a cutting apparatus, and in particular, can be applied to a cutting apparatus provided with a detecting means for detecting a state such as breakage or wear of the cutting blade, a position of the cutting blade, and the like.

本発明の第1の実施形態にかかるダイシング装置を示す斜視図である。1 is a perspective view showing a dicing apparatus according to a first embodiment of the present invention. 同実施形態にかかる切削装置の切削ユニットを示す正面図である。It is a front view which shows the cutting unit of the cutting device concerning the embodiment. 同実施形態にかかる切削装置の切削ユニットを示す右側面図である。It is a right view which shows the cutting unit of the cutting device concerning the embodiment. 同実施形態にかかる検出手段と支持基台とを示す分解斜視図である。It is a disassembled perspective view which shows the detection means and support base concerning the embodiment. 同実施形態にかかる検出手段を示す斜視図である。It is a perspective view which shows the detection means concerning the embodiment. 同実施形態にかかる検出手段を示した左側面図(a)と,正面図(b)である。It is the left view (a) which showed the detection means concerning the embodiment, and the front view (b). 従来の検出手段を示した左側面図(a)と,正面図(b)である。It is the left view (a) which showed the conventional detection means, and the front view (b). 本発明の第1の実施形態にかかる検出手段を用いたときの透過量平均値を示すグラフである。It is a graph which shows the permeation | transmission amount average value when the detection means concerning the 1st Embodiment of this invention is used. 従来の検出手段を用いたときの透過量平均値を示すグラフである。It is a graph which shows the permeation | transmission amount average value when the conventional detection means is used.

符号の説明Explanation of symbols

10 ダイシング装置
20 切削ユニット
22 切削ブレード
23 スピンドル
40 検出手段
41a 発光素子
41b 受光素子
42 光ファイバーケーブル
43 脚部
45 連結部
50 支持基台
51 第1の位置調整ボルト
56 第2の位置調整ボルト
60 切削液
DESCRIPTION OF SYMBOLS 10 Dicing apparatus 20 Cutting unit 22 Cutting blade 23 Spindle 40 Detection means 41a Light emitting element 41b Light receiving element 42 Optical fiber cable 43 Leg part 45 Connecting part 50 Support base 51 First position adjusting bolt 56 Second position adjusting bolt 60 Cutting fluid

Claims (4)

スピンドルの先端部に取り付けられた切削ブレードと,前記切削ブレードを覆うブレードカバーと,対向配置された発光素子と受光素子とを結ぶ光軸が前記切削ブレードの刃先によって遮蔽される量に基づいて,前記切削ブレードの状態を検知する検出手段と,を備える切削装置において:
前記検出手段は,前記切削ブレードの刃先の両側で,前記発光素子と前記受光素子をそれぞれ支持する一対の脚部を有し,
前記各脚部の端面は,前記脚部の端面の中心位置と前記切削ブレードの回転中心軸とを結ぶ直線に対して垂直に配設され,
前記各脚部の前記切削ブレード側の内側面と前記各脚部の端面とが接合するコーナー部は,R形状であり,
前記検出手段は,前記切削ブレードの外周の接線に対して,前記切削ブレード回転方向上流側から鋭角に配設され,
前記各脚部の切削ブレード回転方向下流側の背面と,前記各脚部の端面とのなす角は,鋭角であることを特徴とする,切削装置。
Based on the amount that the cutting blade attached to the tip of the spindle, the blade cover that covers the cutting blade, and the optical axis that connects the light emitting element and the light receiving element that are arranged to face each other are shielded by the cutting edge of the cutting blade, In a cutting device comprising: detecting means for detecting the state of the cutting blade:
The detection means has a pair of legs that respectively support the light emitting element and the light receiving element on both sides of the cutting edge of the cutting blade,
The end face of each leg is arranged perpendicular to a straight line connecting the center position of the end face of the leg and the rotation center axis of the cutting blade,
The corners end face and are bonded to said inner surface of the cutting blade side each leg of each leg, Ri R shape der,
The detection means is disposed at an acute angle from the upstream side in the rotation direction of the cutting blade with respect to the tangent of the outer periphery of the cutting blade,
The cutting apparatus according to claim 1, wherein an angle formed between a back surface of each leg portion on the downstream side in the rotation direction of the cutting blade and an end surface of each leg portion is an acute angle .
前記一対の脚部を連結する連結部を備え,
前記連結部の,前記切削ブレードと対向する対向面と,切削ブレード回転方向上流側の前面とが接合するコーナー部は,R形状であることを特徴とする,請求項に記載の切削装置。
A connecting portion for connecting the pair of legs,
2. The cutting apparatus according to claim 1 , wherein a corner portion of the coupling portion where the facing surface facing the cutting blade and the front surface upstream of the cutting blade rotation direction are R-shaped.
前記検出手段の表面は,サウンドブラスト加工処理がなされていることを特徴とする,請求項1または2に記載の切削装置。 The cutting device according to claim 1 or 2 , wherein the surface of the detecting means is subjected to a sound blasting process. 前記検出手段の表面は,親水性物質により被覆されていることを特徴とする,請求項1または2に記載の切削装置。 The cutting device according to claim 1 or 2 , wherein a surface of the detection means is coated with a hydrophilic substance.
JP2005189772A 2005-06-29 2005-06-29 Cutting equipment Active JP4704816B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180124742A (en) 2017-05-12 2018-11-21 가부시기가이샤 디스코 Cutting device

Families Citing this family (6)

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JP2010114251A (en) * 2008-11-06 2010-05-20 Disco Abrasive Syst Ltd Cutting device
JP5511325B2 (en) * 2009-11-18 2014-06-04 株式会社ディスコ Cutting equipment
JP6101140B2 (en) * 2013-04-18 2017-03-22 株式会社ディスコ Cutting equipment
JP6707396B2 (en) * 2016-05-11 2020-06-10 株式会社ディスコ Cutting equipment
JP6866217B2 (en) 2017-04-21 2021-04-28 株式会社ディスコ Cutting equipment
JP6974087B2 (en) * 2017-09-14 2021-12-01 株式会社ディスコ Cutting equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133845U (en) * 1989-04-11 1990-11-07
JPH09123160A (en) * 1995-10-30 1997-05-13 Hitachi Cable Ltd Dicing method and apparatus therefor
JP2002343745A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133845U (en) * 1989-04-11 1990-11-07
JPH09123160A (en) * 1995-10-30 1997-05-13 Hitachi Cable Ltd Dicing method and apparatus therefor
JP2002343745A (en) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd Dicing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180124742A (en) 2017-05-12 2018-11-21 가부시기가이샤 디스코 Cutting device

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