TW201802198A - 底漆層形成用固化性組合物、阻氣性積層膜及阻氣性積層體 - Google Patents
底漆層形成用固化性組合物、阻氣性積層膜及阻氣性積層體 Download PDFInfo
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- TW201802198A TW201802198A TW106108894A TW106108894A TW201802198A TW 201802198 A TW201802198 A TW 201802198A TW 106108894 A TW106108894 A TW 106108894A TW 106108894 A TW106108894 A TW 106108894A TW 201802198 A TW201802198 A TW 201802198A
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- 230000004888 barrier function Effects 0.000 title claims abstract description 150
- 239000000203 mixture Substances 0.000 title claims abstract description 56
- -1 acrylate compound Chemical class 0.000 claims abstract description 54
- 229920000642 polymer Polymers 0.000 claims abstract description 43
- 229920000098 polyolefin Polymers 0.000 claims abstract description 36
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 146
- 150000001875 compounds Chemical class 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 150000002484 inorganic compounds Chemical class 0.000 claims description 21
- 229910010272 inorganic material Inorganic materials 0.000 claims description 21
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 229920001228 polyisocyanate Polymers 0.000 claims description 14
- 239000005056 polyisocyanate Substances 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 265
- 239000007789 gas Substances 0.000 description 147
- 238000000576 coating method Methods 0.000 description 64
- 239000011248 coating agent Substances 0.000 description 58
- 238000000034 method Methods 0.000 description 51
- 229920001709 polysilazane Polymers 0.000 description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 28
- 239000007788 liquid Substances 0.000 description 27
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 150000002500 ions Chemical class 0.000 description 20
- 239000003999 initiator Substances 0.000 description 18
- 239000012790 adhesive layer Substances 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- 239000011241 protective layer Substances 0.000 description 16
- 238000005468 ion implantation Methods 0.000 description 15
- 238000001035 drying Methods 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000002096 quantum dot Substances 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000005001 laminate film Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000001925 cycloalkenes Chemical class 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000005103 alkyl silyl group Chemical group 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- HMXHUUDRVBXHBQ-UHFFFAOYSA-N (2-hydroxyacetyl) 2-hydroxyacetate Chemical compound OCC(=O)OC(=O)CO HMXHUUDRVBXHBQ-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- ZMIRFCWMDNOYEN-UHFFFAOYSA-N 1-phosphorosooxyethane Chemical compound CCOP=O ZMIRFCWMDNOYEN-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SAFFSEYSJOXUCD-UHFFFAOYSA-N 2-[[(2,6-dimethoxyphenyl)methyl-(2,4,4-trimethylpentyl)phosphoryl]methyl]-1,3-dimethoxybenzene Chemical compound COC1=CC=CC(OC)=C1CP(=O)(CC(C)CC(C)(C)C)CC1=C(OC)C=CC=C1OC SAFFSEYSJOXUCD-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 240000008564 Boehmeria nivea Species 0.000 description 1
- PHQSYHHLVVDIFC-UHFFFAOYSA-N CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C Chemical compound CC1=C(C=P(C2=CC=CC=C2)C2=CC=CC=C2)C(=CC(=C1)C)C PHQSYHHLVVDIFC-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical group CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004687 Nylon copolymer Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BDAHDQGVJHDLHQ-UHFFFAOYSA-N [2-(1-hydroxycyclohexyl)phenyl]-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C1(O)CCCCC1 BDAHDQGVJHDLHQ-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- IKIWQIUJLIJZJB-UHFFFAOYSA-N [N].O=[C] Chemical class [N].O=[C] IKIWQIUJLIJZJB-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000003666 anti-fingerprint Effects 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 125000006448 cycloalkyl cycloalkyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical compound [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical group C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052945 inorganic sulfide Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OJNNAJJFLWBPRS-UHFFFAOYSA-N phenyl-[(2,4,6-trimethylphenyl)methyl]-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=CC2=C(C=C(C=C2C)C)C)C(=CC(=C1)C)C OJNNAJJFLWBPRS-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006112 polar polymer Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920003257 polycarbosilane Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000011191 terminal modification Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/048—Forming gas barrier coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/025—Copolymers of unspecified olefins with monomers other than olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/025—Copolymer of an unspecified olefine with a monomer other than an olefine
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7244—Oxygen barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2333/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
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Abstract
本發明的阻氣性積層膜之底漆層形成用固化性組合物,係至少含有:含極性基之聚烯烴系聚合體、及多官能基丙烯酸酯系化合物。本發明的阻氣性積層膜係具有由該固化性組合物的固化物所構成底漆層。本發明的阻氣性積層體,係在該阻氣性積層膜的表面上,積層著含有機化合物之層。根據本發明可提供:適於製造優異層間密接性阻氣性積層體時使用的底漆層形成用固化性組合物,具有由該固化性組合物的固化物所構成底漆層的阻氣性積層膜,以及由在該阻氣性積層膜的表面上積層著含有機化合物之層而形成的阻氣性積層體。
Description
本發明係關於底漆層形成用固化性組合物、具有由該固化性組合物的固化物所構成底漆層之阻氣性積層膜、及在該阻氣性積層膜表面上積層著含有機化合物層構成的阻氣性積層體。
近年,例如液晶顯示器、電激發光(EL)顯示器等顯示器,為求實現薄型化、輕量化、可撓化等,針對具有電極的基板,取代玻璃板,改為使用具阻氣性的薄膜(以下亦稱「阻氣薄膜」)。又,亦有開發出藉由在阻氣薄膜上積層其他的層,而具有新功能的薄膜。
例如專利文獻1有記載:在具阻氣層的基材(阻氣薄膜)之阻氣層面上,形成黏著劑層而形成的黏著片。藉由使用該黏著片,便可將有機EL元件等效率佳地密封。
[專利文獻1]國際公開第2012/032907號(US2013209800 A1)
如專利文獻1所述,藉由在阻氣薄膜的阻氣層上,積層著具有特定功能的其他層,便可獲得具有新功能的阻氣性積層體。
然而,一般阻氣薄膜的阻氣層因為在與含有機化合物的層間之親和性較低,因而若在阻氣薄膜的阻氣層上形成含有機化合物的層,則所獲得阻氣性積層體會有層間密接性差的傾向。
本發明係有鑑於上述實情而完成,目的在於提供:適於製造優異層間密接性阻氣性積層體時使用的底漆層形成用固化性組合物,具有由該固化性組合物的固化物所構成底漆層的阻氣性積層膜,以及由在該阻氣性積層膜的表面上積層著含有機化合物之層而形成的阻氣性積層體。
本發明者等為解決上述課題,針對具有以阻氣薄膜為材料的阻氣層之阻氣性積層膜進行深入鑽研。結果發現表面具有由特定底漆層形成用固化性組合物的固化物所構成底漆層之阻氣性積層膜,可在該底漆層上密接性佳地形成含有機化合物的層,遂完成本發明。
根據本發明將提供下述(1)~(4)之底漆層形成用固化性組合物、(5)~(10)之阻氣性積層膜、及下述(11)之阻氣性積層體。
(1)一種阻氣性積層膜之底漆層形成用固化性組合物,至少含有:含極性基之聚烯烴系聚合體、及多官能基丙烯酸酯系化合物。
(2)如(1)所述的底漆層形成用固化性組合物,其中,上述
多官能基丙烯酸酯系化合物的含有量,相對於含極性基之聚烯烴系聚合體100質量份係5~30質量份。
(3)如(1)所述的底漆層形成用固化性組合物,其中,上述底漆層形成用固化性組合物係更進一步含有聚異氰酸酯系交聯劑,且聚異氰酸酯系交聯劑的含有量,相對於含極性基之聚烯烴系聚合體100質量份係1~10質量份。
(4)如(1)所述的底漆層形成用固化性組合物,其中,上述底漆層形成用固化性組合物係更進一步含有矽烷偶合劑,且矽烷偶合劑的含有量,相對於含極性基之聚烯烴系聚合體100質量份係0.01~5質量份。
(5)一種阻氣性積層膜,具有:阻氣層、以及直接接觸於上述阻氣層的底漆層之阻氣性積層膜,其特徵在於:上述阻氣層係以阻氣薄膜為材料;上述底漆層係由(1)所述的底漆層形成用固化性組合物之固化物形成;至少其中一者的最外層係上述底漆層。
(6)如(5)所述的阻氣性積層膜,其中,上述阻氣薄膜的厚度係0.5~500μm。
(7)如(5)所述的阻氣性積層膜,其中,上述阻氣薄膜係具有:樹脂製基材、以及含無機化合物及/或金屬之層的積層薄膜。
(8)如(7)所述的阻氣性積層膜,其中,上述含無機化合物及/或金屬之層係經表面改質的含矽高分子化合物層。
(9)如(5)所述的阻氣性積層膜,其中,上述底漆層的厚度係0.05~2.5μm。
(10)如(5)所述的阻氣性積層膜,其中,更進一步具有直接接觸於上述阻氣層的其他層。
(11)一種阻氣性積層體,在構成上述(5)~(10)中任一項所述阻氣性積層膜最外層的底漆層上,積層著含有有機化合物的層。
根據本發明可提供:適於製造優異層間密接性阻氣性積層體時使用的底漆層形成用固化性組合物,具有由該固化性組合物的固化物所構成底漆層的阻氣性積層膜,以及由在該阻氣性積層膜的表面上積層著含有機化合物之層而形成的阻氣性積層體。
以下,針對本發明分為1)底漆層形成用固化性組合物、2)阻氣性積層膜、及3)阻氣性積層體逐項進行詳細說明。
1)底漆層形成用固化性組合物
本發明的底漆層形成用固化性組合物係至少含有:含極性基之聚烯烴系聚合體、以及多官能基丙烯酸酯系化合物的阻氣性積層膜之底漆層形成用固化性組合物。
底漆層形成用固化性組合物中所含的含極性基之聚烯烴系聚合體,係含極性基的聚烯烴系聚合體。藉由使用含極性基之聚烯烴系聚合體,便可效率佳地形成與阻氣層間之密接性優異的底漆層。
聚烯烴系聚合體係指含有例如:由乙烯衍生之重複單元、由丙烯衍生之重複單元等由烯烴衍生之重複單元的聚合體。由烯烴所衍生重複單元的含有量,相對於總重複單元,通常係50莫耳%以上、70莫耳%以上為佳、90莫耳%以上更佳。
聚烯烴系聚合體的具體例係可舉例如:聚丙烯、高密度聚乙烯、超高分子量聚乙烯、線狀低密度聚乙烯、低密度聚乙烯、超低密度聚乙烯、超級低密度聚乙烯、聚甲基戊烯、乙烯-丙烯共聚合體、丙烯-1-丁烯無規共聚合體、丙烯-乙烯-1-丁烯無規共聚合體、由丙烯與碳數5~12之α-烯烴形成的共聚合體、丙烯-非共軛二烯共聚合體、乙烯-非共軛二烯共聚合體、乙烯-丙烯-非共軛二烯共聚合體、聚丁烯、乙烯-醋酸乙烯酯共聚合體、乙烯-乙烯基三甲氧基矽烷共聚合體、乙烯-丙烯酸甲酯共聚合體、乙烯-丙烯酸乙酯共聚合體、乙烯-甲基丙烯酸甲酯共聚合體、苯乙烯-丁二烯嵌段共聚合體、及其氫化物等。
該等聚烯烴系聚合體係可單獨使用1種、或組合使用2種以上。
極性基係可舉例如:羥基、羧酸基、羧酸酯基、酸酐基等。該等之中,極性基以羧酸基、酸酐基或羥基為佳,羥基更佳。
含極性基之聚烯烴系聚合體係藉由對聚烯烴系聚合體使用具極性基的化合物施行改質處理,或者使用烯烴系單體與具極性基的單體進行共聚合便可獲得。該等之中,含極性基之聚烯烴系聚合體較佳係後述的酸改質聚烯烴系聚合體、經
導入羥基的聚烯烴系聚合體。
酸改質聚烯烴系聚合體係可例如將聚烯烴樹脂利用不飽和羧酸或其酸酐施行改質而獲得的聚合體。
該等係可單獨使用1種、或組合使用2種以上。
經導入羥基的聚烯烴系聚合體係可例如:將聚烯烴利用含羥基之(甲基)丙烯酸酯、含羥基之乙烯醚,施行末端改質、或接枝改質而獲得的聚合體。
含羥基之(甲基)丙烯酸酯係可舉例如:(甲基)丙烯酸羥乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸甘油酯等。
含羥基之乙烯醚係可舉例如:2-羥乙基乙烯醚、二乙二醇單乙烯醚、4-羥丁基乙烯醚等。
該等係可單獨使用1種、或組合使用2種以上。
含極性基之聚烯烴系聚合體的數量平均分子量(Mn),500~500,000為佳、1,000~200,000更佳、1,200~150,000特佳。
底漆層形成用固化性組合物中所含的多官能基丙烯酸酯系化合物,係具有使底漆層形成用固化性組合物能固化的功用。藉由使用含有多官能基丙烯酸酯系化合物的底漆層形成用固化性組合物,便可不易發生凝聚破壞地形成底漆層。
所謂「多官能基丙烯酸酯系化合物」係指具有參
與聚合反應之不飽和鍵達2以上的丙烯酸酯化合物或甲基丙烯酸酯化合物。
多官能基丙烯酸酯系化合物係可舉例如:三環癸烷二甲醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、新戊二醇己二酸酯二(甲基)丙烯酸酯、羥基三甲基乙酸新戊二醇二(甲基)丙烯酸酯、二(甲基)丙烯酸雙環戊酯、己內酯改質二(甲基)丙烯酸雙環戊烯酯、環氧乙烷改質磷酸二(甲基)丙烯酸酯、二(丙烯醯氧乙基)異三聚氰酸酯、二(甲基)丙烯酸烯丙基化環己酯等雙官能基丙烯酸酯系化合物;三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、丙酸改質二季戊四醇三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、環氧丙烷改質三羥甲基丙烷三(甲基)丙烯酸酯、三(2-丙烯醯氧乙基)異三聚氰酸酯等三官能基丙烯酸酯系化合物;二甘油四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等四官能基丙烯酸酯系化合物;丙酸改質二季戊四醇五(甲基)丙烯酸酯等五官能基丙烯酸酯系化合物;二季戊四醇六(甲基)丙烯酸酯、己內酯改質二季戊四醇六(甲基)丙烯酸酯等六官能基丙烯酸酯系化合物等等。
該等多官能基丙烯酸酯系化合物係可單獨使用一種、或組合使用二種以上。
此處「(甲基)丙烯酸酯」係指丙烯酸酯或甲基丙烯酸酯。
底漆層形成用固化性組合物中的多官能基丙烯酸酯系化合物含有量,就從能形成更不易發生凝聚破壞之底漆層的觀點,相對於含極性基之聚烯烴系聚合體100質量份,通常係5~30質量份、5~20質量份為佳。
底漆層形成用固化性組合物亦可含有光聚合起始劑。藉由使用含有光聚合起始劑的底漆層形成用固化性組合物,則藉由紫外線、可見光線的照射便可效率佳地進行固化反應,便可形成底漆層。
光聚合起始劑係可舉例如:2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥-環己基-苯酮等酮系光聚合起始劑;2,4,6-三甲基苯甲醯基-二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、亞膦酸乙基(2,4,6-三甲基苯甲醯基)-苯酯、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基氧化膦等磷系光聚合起始劑;雙(η5-2,4-環戊二烯-1-基)-雙[2,6-二氟-3-(1H-吡咯-1-基)-苯基]鈦等二茂鈦系光聚合起始劑;肟酯系光聚合起始劑;二苯基酮、對氯二苯基酮、4,4'-二乙胺基二苯基酮等二苯基酮系光聚合起始劑;氧硫等氧硫系光聚合起始劑;三異丙醇胺等胺系光聚合起始劑等等。該等係可單獨使用一種、或組合使用二種以上。
當底漆層形成用固化性組合物含有光聚合起始劑的情況,其含有量相對於多官能基丙烯酸酯系化合物100質量份,通常係0.01~20質量份範圍。
底漆層形成用固化性組合物亦可含有聚異氰酸酯系交聯劑。藉由使用含有聚異氰酸酯系交聯劑的底漆層形成用
固化性組合物,便可形成更加抑制凝聚破壞的底漆層。
聚異氰酸酯系交聯劑並無特別的限定,可使用分子中具有2個以上異氰酸酯基的化合物。此種聚異氰酸酯系交聯劑係可舉例如:甲苯二異氰酸酯、二異氰酸二苯基甲酯、伸苯二甲基二異氰酸酯等芳香族聚異氰酸酯;六亞甲基二異氰酸酯等脂肪族聚異氰酸酯;異佛爾酮二異氰酸酯、氫化二異氰酸二苯基甲酯等脂環式聚異氰酸酯;及該等的雙縮脲體、異三聚氰酸酯體、以及與例如乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、篦麻油等含低分子活性氫化合物的反應物之加成體等等。該等係可單獨使用一種、或組合使用二種以上。
當底漆層形成用固化性組合物係含有聚異氰酸酯系交聯劑的情況,就從能形成更不易發生凝聚破壞之底漆層的觀點,其含有量相對於含極性基之聚烯烴系聚合體100質量份,通常係1~10質量份、較佳2~8質量份。
底漆層形成用固化性組合物亦可含有矽烷偶合劑。藉由使用含有矽烷偶合劑的底漆層形成用固化性組合物,便可形成層間密接性更優異的底漆層。
矽烷偶合劑係可舉例如:3-胺丙基三甲氧基矽烷、3-胺丙基三乙氧基矽烷、3-(2-胺乙基)胺丙基三甲氧基矽烷、3-(2-胺乙基)胺丙基三乙氧基矽烷、3-(2-胺乙基)胺丙基甲基二甲氧基矽烷、3-(2-胺乙基)胺丙基甲基二乙氧基矽烷等胺基矽烷偶合劑;3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷等環氧矽烷偶合劑;3-巰基丙基三甲氧基矽烷;3-甲基丙烯醯氧丙基三甲氧基矽烷;日本專利特開
2000-239447號公報、日本專利特開2001-40037號公報等所述的高分子矽烷偶合劑等等。該等係可單獨使用一種、或組合使用二種以上。
當底漆層形成用固化性組合物係含有矽烷偶合劑的情況,其含有量相對於含極性基之聚烯烴系聚合體100質量份,通常係0.01~5質量份、0.01~3質量份為佳。
底漆層形成用固化性組合物亦可含有溶劑。
含有溶劑的底漆層形成用固化性組合物係可使用為底漆層形成用塗佈液。
溶劑係可舉例如:正己烷、正庚烷等脂肪族烴系溶劑;甲苯、二甲苯等芳香族烴系溶劑;二氯甲烷、氯乙烯、氯仿、四氯化碳、1,2-二氯乙烷、單氯苯等鹵化烴系溶劑;甲醇、乙醇、丙醇、丁醇、丙二醇單甲醚等醇系溶劑;丙酮、甲乙酮、2-戊酮、異佛爾酮、環己酮等酮系溶劑;醋酸乙酯、醋酸丁酯等酯系溶劑;乙基賽珞蘇等賽珞蘇系溶劑;1,3-二氧雜戊環烷等醚系溶劑等等。
本發明的底漆層形成用固化性組合物,係藉由將含極性基之聚烯烴系聚合體、多官能基丙烯酸酯系化合物、以及光聚合起始劑、聚異氰酸酯系交聯劑、矽烷偶合劑等其他成分,依照常法施行適當混合/攪拌便可製得。
藉由使用本發明的底漆層形成用固化性組合物,便可在阻氣薄膜的阻氣層上,效率佳地形成在與含有機化合物層間之親和性高的底漆層。所以,本發明的底漆層形成用固化性組合物頗適用於製造優異層間密接性的阻氣性積層體。
2)阻氣性積層膜
本發明的阻氣性積層膜係具有:阻氣層、以及直接接觸上述阻氣層的底漆層之阻氣性積層膜;其中,上述阻氣層係以阻氣薄膜為材料;上述底漆層係由本發明底漆層形成用固化性組合物的固化物形成;至少其中一者的最外層係上述底漆層。
(阻氣層)
構成本發明阻氣性積層膜的阻氣層係將阻氣薄膜使用為材料而形成者。
本發明所使用的阻氣薄膜係具有抑制氧與水蒸氣穿透之特性(以下稱「阻氣性」)的薄膜。
本發明所使用的阻氣薄膜在40℃、相對濕度90%環境下,水蒸氣穿透率為5.0g/m2/day以下為佳、0.5g/m2/day以下更佳。藉由使用具有此種阻氣性的阻氣薄膜,便可獲得更優異阻氣性的阻氣性積層膜。
再者,阻氣薄膜根據JIS K7361-1測定的全光線穿透率,80%以上為佳、85%以上更佳。藉由使用此種優異透明性的阻氣薄膜,便可獲得優異透明性的阻氣性積層膜。
阻氣薄膜的厚度並無特別的限定,只要配合阻氣性積層膜使用目的等再行適當決定便可。阻氣薄膜的厚度通常係0.5~500μm、1~100μm為佳。
阻氣薄膜係可舉例如:合成樹脂製薄膜;由2種以上合成樹脂製薄膜構成的積層薄膜;合成樹脂薄膜表面經改質的表面改質薄膜(但,被改質的層係含無機化合物及/或金屬的層除外);具有樹脂製基材、與含無機化合物及/或金屬之層
(以下稱「含無機化合物等的層」)的積層薄膜等等。
其中,阻氣薄膜係具有:樹脂製基材、與含無機化合物等之層的積層薄膜為佳。因為此種阻氣薄膜的阻氣性更優異,因而可輕易獲得更薄、更輕、耐屈曲性更優異的阻氣性積層膜。
具有樹脂製基材、與含無機化合物等之層的積層薄膜,所使用樹脂製基材的材質,係可舉例如:聚醯亞胺、聚醯胺、聚醯胺醯亞胺、聚伸苯醚、聚醚酮、聚醚醚酮、聚烯烴、聚酯、聚碳酸酯、聚碸、聚醚碸、聚苯硫醚、丙烯酸系樹脂、環烯烴系聚合物、芳香族系聚合體等。
該等之中,就從透明性優異、且具通用性的觀點而言,係聚酯、聚醯胺或環烯烴系聚合物為佳,聚酯或環烯烴系聚合物更佳。
聚酯係可舉例如:聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯、聚芳酯等,聚對苯二甲酸乙二酯為佳。
聚醯胺係可舉例如:全芳香族聚醯胺、尼龍6、尼龍66、尼龍共聚合體等。
環烯烴系聚合物係可舉例如:降烯系聚合體、單環的環狀烯烴系聚合體、環狀共軛二烯系聚合體、乙烯脂環式烴聚合體、及該等的氫化物。具體例係可舉例如:APEL(三井化學公司製的乙烯-環烯烴共聚合體)、Arton(JSR公司製的降烯系聚合體)、ZEONOR(日本ZEON公司製的降烯系聚合體)等。
樹脂製基材係在不致妨礙及本發明效果的範圍
內,亦可含有各種添加劑。添加劑係可舉例如:紫外線吸收劑、抗靜電劑、安定劑、抗氧化劑、可塑劑、滑劑、著色顏料等。該等添加劑的含有量係只要配合目的再行適當決定便可。
樹脂製基材的厚度範圍通常係0.4~400μm、0.5~95μm為佳、0.9~90μm更佳。
樹脂製基材係製備含有:樹脂成分及視所需的各種添加劑之樹脂組合物,藉由將其成形為薄膜狀便可獲得。成形方法並無特別的限定,可利用澆鑄法、熔融擠出法等公知方法。又,亦可使用市售的樹脂製薄膜作為樹脂製基材。
上述含無機化合物等的層係具有阻氣性的層。含無機化合物等的層係可形成於樹脂製基材的單面、亦可形成於樹脂製基材的雙面。又,含無機化合物等的層係可為單層、亦可為複數層積層。
含無機化合物等的層中所含有無機化合物,係可舉例如:氧化矽、氧化鋁、氧化鎂、氧化鋅、氧化銦、氧化錫等無機氧化物;氮化矽等無機氮化物;無機碳化物;無機硫化物;該等複合體的無機氮氧化物;無機碳氧化物;無機氮碳化物;無機氮碳氧化物等。
含無機化合物等的層中所含金屬係可例如:鋁、鎂、鋅、錫等。
含無機化合物等的層厚度並無特別的限制,通常係20nm至50μm、30nm至1μm為佳、40nm至500nm更佳。
形成含無機化合物等之層的方法並無特別的限定。例如:將上述無機化合物、金屬,利用蒸鍍法、濺鍍法、
離子鍍法、熱CVD法、電漿CVD法等形成於樹脂製基材上的方法(方法1);將由上述無機化合物、金屬溶解或分散於有機溶劑中的溶液,利用公知塗佈方法塗佈於樹脂製基材上,再將所獲得塗膜適度乾燥而形成的方法(方法2);在樹脂製基材上,直接或隔著其他層,形成含有含矽高分子化合物之層(含矽高分子化合物層)後,再將該含矽高分子化合物層的表面施行改質之方法(方法3)等。另外,當利用方法3形成含無機化合物等之層的情況,「含無機化合物等的層」係指經改質表面部與未改質內部的合稱。
含矽高分子化合物係可舉例如:聚矽氮烷系化合物、聚碳矽烷系化合物、聚矽烷系化合物、聚有機矽氧烷系化合物、聚(伸二矽烷基伸苯)系化合物、及聚(伸二矽烷基伸乙炔)系化合物等。
上述含矽高分子化合物層係除含矽高分子化合物之外,亦可在不致阻礙本發明目的之範圍內含有其他成分。其他成分係可例如:固化劑、抗老化劑、光安定劑、難燃劑等。
含矽高分子化合物層中的含矽高分子化合物含有量,就從獲得更優異阻氣性阻氣薄膜的觀點而言,係50質量%以上為佳、70質量%以上更佳。
含矽高分子化合物層的厚度並無特別的限制,通常係20nm至50μm、30nm至1μm為佳、40nm至500nm更佳。
含矽高分子化合物層係例如將由高分子化合物溶解或分散於有機溶劑中的溶液,利用公知塗佈方法塗佈於樹脂製基材上,藉由將所獲得塗膜適度乾燥便可形成。
含矽高分子化合物層表面的改質方法,係可例如:離子植入處理、電漿處理、紫外線照射處理、熱處理等。
離子植入處理係如後述,將經加速的離子植入於含矽高分子化合物層中,而改質含矽高分子化合物層的方法。
電漿處理係將含矽高分子化合物層暴露於電漿中,而改質含矽高分子化合物層的方法。例如依照日本專利特開2012-106421號公報所述方法便可施行電漿處理。
紫外線照射處理係對含矽高分子化合物層照射紫外線,而改質含矽高分子化合物層的方法。例如依照日本專利特開2013-226757號公報所述方法,便可施行紫外線改質處理。
該等之中,就從不會使含矽高分子化合物層的表面粗糙、可效率佳改質至內部、能獲得更優異阻氣性阻氣薄膜的觀點而言,改質含矽高分子化合物層表面的方法係離子植入處理為佳。
方法3的更佳方法係可例如在樹脂製基材上,直接或隔著其他層,形成含有聚矽氮烷系化合物之層(以下稱「聚矽氮烷層」)後,再對該聚矽氮烷層的表面利用離子植入處理施行改質。
所示重複單元的化合物。又,所使用聚矽氮烷系化合物的數量平均分子量並無特別的限定,100~50,000為佳。
上述式(1)中,n係表示任意自然數。Rx、Ry、Rz係表示各自獨立的氫原子、無取代(或具取代基)之烷基、無取代(或具取代基)之環烷基、無取代(或具取代基)之烯基、無取代(或具取代基)之芳基或烷基矽烷基等非水解性基。
上述無取代(或具取代基)之烷基的烷基,係可例如:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、新戊基、正己基、正庚基、正辛基等碳數1~10之烷基。
無取代(或具取代基)之環烷基的環烷基,係可舉例如:環丁基、環戊基、環己基、環庚基等碳數3~10之環烷基。
無取代(或具取代基)之烯基的烯基,係可舉例如:乙烯基、1-丙烯基、2-丙烯基、1-丁烯基、2-丁烯基、3-丁烯基等碳數2~10之烯基。
上述烷基、環烷基及烯基的取代基,係可舉例如:氟原子、氯原子、溴原子、碘原子等鹵原子;羥基;硫醇基;環氧基;環氧丙氧基;(甲基)丙烯醯氧基;苯基、4-甲基苯基、4-氯苯基等無取代(或具取代基)之芳基等等。
無取代(或具取代基)之芳基的芳基,係可舉例如:苯基、1-萘基、2-萘基等碳數6~15之芳基。
上述芳基的取代基係可舉例如:氟原子、氯原子、溴原子、碘原子等鹵原子;甲基、乙基等碳數1~6之烷基;甲氧基、乙氧基等碳數1~6之烷氧基;硝基;氰基;羥基;硫醇
基;環氧基;環氧丙氧基;(甲基)丙烯醯氧基;苯基、4-甲基苯基、4-氯苯基等無取代(或具取代基)之芳基等等。
烷基矽烷基係可舉例如:三甲矽烷基、三乙矽烷基、三異丙基矽烷基、三(第三丁基)矽烷基、甲基二乙矽烷基、二甲矽烷基、二乙矽烷基、甲矽烷基、乙矽烷基等。
該等之中,Rx、Ry、Rz較佳係氫原子、碳數1~6之烷基、或苯基,更佳係氫原子。
具有上述式(1)所示重複單元的聚矽氮烷系化合物,係可為Rx、Ry、Rz全部均為氫原子的無機聚矽氮烷,亦可為Rx、Ry、Rz中之至少1者非為氫原子的有機聚矽氮烷。
再者,本發明中,聚矽氮烷系化合物亦可使用聚矽氮烷改質物。聚矽氮烷改質物係可舉例如:日本專利特開昭62-195024號公報、日本專利特開平2-84437號公報、日本專利特開昭63-81122號公報、日本專利特開平1-138108號公報等、日本專利特開平2-175726號公報、日本專利特開平5-238827號公報、日本專利特開平5-238827號公報、日本專利特開平6-122852號公報、日本專利特開平6-306329號公報、日本專利特開平6-299118號公報、日本專利特開平9-31333號公報、日本專利特開平5-345826號公報、日本專利特開平4-63833號公報等所述者。
該等之中,作為聚矽氮烷系化合物,從取得容易性、及可形成具優異阻氣性之離子植入層的觀點而言,Rx、Ry、Rz全部均為氫原子的全氫聚矽氮烷為佳。
再者,聚矽氮烷系化合物亦可直接使用依玻璃塗佈材料等
形式市售的市售物。
聚矽氮烷系化合物係可單獨使用1種、或組合使用2種以上。
形成聚矽氮烷層的方法並無特別的限定。例如製備含有:聚矽氮烷系化合物中之至少一種、視所需的其他成分、及溶劑等之聚矽氮烷層形成用溶液,接著將該聚矽氮烷層形成用溶液利用公知方法施行塗佈,藉由將所獲得塗膜施行乾燥,便可形成聚矽氮烷層。
聚矽氮烷層形成用溶液所使用的溶劑係可舉例如:苯、甲苯等芳香族烴系溶劑;醋酸乙酯、醋酸丁酯等酯系溶劑;丙酮、甲乙酮、甲基異丁酮等酮系溶劑;正戊烷、正己烷、正庚烷等脂肪族烴系溶劑;環戊烷、環己烷等脂環式烴系溶劑等等。
該等溶劑係可單獨使用1種、或組合使用2種以上。
聚矽氮烷層形成用溶液的塗佈方法係可舉例如:棒塗法、旋塗法、浸漬法、輥塗佈法、凹版塗佈法、刀塗法、氣刀塗佈法、滾刀式塗佈法、模具塗佈法、網版印刷法、噴塗法、照相凹版法等。
藉由將所獲得塗膜施行乾燥,便可形成聚矽氮烷層。塗膜的乾燥方法並無特別的限定。例如可採用熱風乾燥、熱輥乾燥、紅外線照射等習知公知乾燥方法。加熱溫度通常係80~150℃,加熱時間通常係數十秒至數十分鐘。
植入聚矽氮烷層中的離子係可舉例如:氬、氦、氖、氪、氙等稀有氣體的離子;氟碳化物、氫、氮、氧、二氧
化碳、氯、氟、硫等的離子;甲烷、乙烷等烷烴系氣體類的離子;乙烯、丙烯等烯烴系氣體類的離子;戊二烯、丁二烯等二烯烴系氣體類的離子;乙炔等炔系氣體類的離子;苯、甲苯等芳香族烴系氣體類的離子;環丙烷等環烷烴系氣體類的離子;環戊烯等環烯烴系氣體類的離子;金屬的離子;有機矽化合物的離子等等。
該等離子係可單獨使用1種、或組合使用2種以上。
該等之中,就從可更簡便植入離子、獲得具有更優異阻氣性阻氣薄膜的觀點而言,氬、氦、氖、氪、氙等稀有氣體的離子為佳。
離子的植入量係可配合阻氣性積層膜之使用目的(必要的阻氣性、透明性等)等再行適當決定。
植入離子的方法係可例如:照射利用電場加速離子(離子束)的方法、植入電漿中之離子的方法等。其中,就從可簡便獲得目標阻氣層的觀點而言,後者的電漿離子植入之方法(電漿離子植入法)為佳。
電漿離子植入係例如使在含有稀有氣體等電漿生成氣體的環境下生成電漿,藉由對聚矽氮烷層施加負的電壓脈衝,便可將該電漿中的離子(陽離子)植入於聚矽氮烷層的表面部。電漿離子植入法更具體係利用WO2010/107018號公報等所述的方法便可實施。
利用離子植入而被植入離子區域的厚度,係可依照離子的種類、施加電壓、處理時間等植入條件進行控制,只要配合聚矽氮烷層的厚度、阻氣性積層膜的使用目的等再行決
定便可,通常係10~400nm。
植入離子之事,係藉由使用X光光電子能譜分析(XPS),施行距聚矽氮烷層表面10nm附近的元素分析測定便可確認。
藉由施行截至目前所說明的方法,便可利用離子植入處理,改質聚矽氮烷層的表面。
再者,利用同樣的方法,利用離子植入處理,便可改質聚矽氮烷層以外的先質層表面。
(底漆層)
構成本發明阻氣性積層膜的底漆層係直接接觸於由上述阻氣薄膜所構成阻氣層的層,由本發明底漆層形成用固化性組合物的固化物構成。
底漆層係當在本發明阻氣性積層膜上,更進一步積層含有機化合物之層時,有助於層間密接性的提升。
底漆層的厚度並無特別的限定,只要配合阻氣性積層膜的使用目的等再行適當決定便可。底漆層的厚度通常係0.05~2.5μm、較佳係0.10~1.0μm。
底漆層係將本發明底漆層形成用固化性組合物(底漆層形成用塗佈液),塗佈於阻氣薄膜的單面或雙面上,再將所獲得塗膜視需要施行乾燥後,藉由使塗膜固化便可形成。
底漆層形成用塗佈液的塗佈方法,係可使用尋常的濕式塗佈方法。例如:浸漬法、輥塗佈、凹版塗佈、刀塗、氣刀塗佈、滾刀式塗佈、模具塗佈、網版印刷法、噴塗、照相凹版法等。
將塗膜施行乾燥的方法係可舉例如:熱風乾燥、熱輥乾燥、紅外線照射等習知公知的乾燥方法。
將塗膜施行固化的方法並無特別的限定,可採用公知方法。例如當底漆層形成用固化性組合物係含有光聚合起始劑的情況,藉由對塗膜照射活性能量線便可使塗膜固化。活性能量線係可使用高壓水銀燈、無電極燈、氙燈等照射。
活性能量線的波長係200~400nm為佳、350~400nm更佳。照射量通常係照度50~1000mW/cm2、光通量範圍為50~5000mJ/cm2、1000~5000mJ/cm2為佳。照射時間通常係0.1~1000秒、1~500秒為佳、10~100秒更佳。考慮光照射步驟的熱負荷,為能滿足前述光通量亦可施行複數次照射。
再者,藉由對塗膜層照射電子束,亦可使塗膜固化。當照射電子束的情況,通常即便未利用光聚合起始劑,仍可使塗膜固化。照射電子束時,可使用電子束加速器等。照射量通常係10~1000krad範圍。照射時間通常係0.1~1000秒、較佳1~500秒、更佳10~100秒。
(阻氣性積層膜)
本發明的阻氣性積層膜係具有:上述阻氣層、以及直接接觸於該阻氣層的底漆層,且至少其中一者的最外層係上述底漆層。
藉由阻氣性積層膜至少其中一者的最外層係上述底漆層,便可在表面上密接性佳形成含有機化合物的層。含有機化合物的層係可例如:保護層、黏著劑層、量子點層等。
該等含有機化合物的層,係與後述阻氣性積層體中含有機
化合物的層同樣。
阻氣性積層膜係底漆層之外,尚亦可具有直接接觸於阻氣層的層。該層係可例如:保護層、黏著劑層等。
本發明阻氣性積層膜的層構成例,係可例如下示,惟並不僅侷限於該等。
(i)阻氣層/底漆層
(ii)底漆層(A)/阻氣層/底漆層(B)
(iii)黏著劑層/阻氣層/底漆層
(iv)硬塗層/阻氣層/底漆層
本發明阻氣性積層膜的厚度並無特別的限定,1~600μm為佳、5~200μm更佳、20~100μm特佳。
本發明阻氣性積層膜的水蒸氣穿透率,在40℃、相對濕度90%環境下,5.0g/m2/day以下為佳、0.5g/m2/day以下更佳。下限值並無特別的限制,越小越佳,通常係1×10-6g/m2/day以上。
水蒸氣穿透率係利用實施例所述方法便可測定
本發明阻氣性積層膜較佳係透明性優異者。根據JIS K7361-1所測定本發明阻氣性積層膜的全光線穿透率,係80%以上為佳、85%以上更佳。
本發明的阻氣性積層膜係可密接性佳形成阻氣性優異、且表面含有機化合物的層。所以,本發明的阻氣性積層膜頗適用為製造高性能阻氣性積層體時的材料薄膜。
2)阻氣性積層體
本發明的阻氣性積層體係在構成本發明阻氣性積層膜最
外層的底漆層上,積層著含有機化合物的層而形成。
在底漆層上所形成含有機化合物的層,係可例如:保護層、黏著劑層、量子點層等。
保護層係從外部施加衝擊時,具有保護阻氣性積層體功用的層。
保護層最好係透明性佳、耐擦傷性良好者。又,當阻氣性積層體組裝於電子裝置、光學裝置時,將保護層配置於最表面的情況,較佳係具備有防污性、抗指紋防附著性、抗靜電性、撥水性、親水性等功能。
保護層的材料並無特別的限制,可使用公知物。例如:含矽化合物;由光聚合性單體及/或光聚合性預聚物構成的光聚合性化合物、及含有至少利用可見光域光便能生成自由基之聚合起始劑的聚合性組合物;聚酯系樹脂、聚胺酯系樹脂(特別係聚丙烯酸多元醇、聚酯多元醇、聚醚多元醇等,與異氰酸酯化合物的雙液固化式樹脂)、丙烯酸系樹脂、聚碳酸酯系樹脂、氯乙烯/醋酸乙烯酯共聚合體、聚乙烯丁醛系樹脂、硝化纖維素系樹脂等樹脂類;烷基鈦酸酯;伸乙亞胺等。
該等係可單獨使用一種、或組合使用二種以上。
可使用活性能量線固化型化合物及光聚合起始劑等。
保護層係將由上述材料溶解或分散於適當溶劑而形成的保護層形成用塗佈液,利用公知方法塗佈於底漆層上,再將所獲得塗膜視需要施行乾燥後,藉由使塗膜固化便可形成。
保護層形成用塗佈液的塗佈方法、塗膜的乾燥、固化方
法,係可例如與就底漆層形成方法所說明同樣。
保護層的厚度並無特別的限制,可適當選定。保護層的厚度通常係0.05~10μm、0.1~8.0μm為佳、0.2~5μm更佳。
黏著劑層係對阻氣性積層體賦予黏著性。
構成黏著劑層的黏著劑種類並無特別的限定。黏著劑層係可例如:丙烯酸系黏著劑、胺酯系黏著劑、聚矽氧系黏著劑、橡膠系黏著劑等。
黏著劑層的厚度並無特別的限制,可適當選定。黏著劑層的厚度通常係0.5~100μm、1~60μm為佳、3~40μm更佳。
量子點層係由量子點分散於高分子化合物中而構成的層。
量子點係直徑數nm的金屬化合物,具特有的光吸收性等。藉由具有量子點層,阻氣性積層體便頗適用為光學零件等的材料薄膜。
量子點層的厚度並無特別的限制,可適當選定。量子點層的厚度通常係1~500μm、10~400μm為佳、5~200μm更佳。
本發明阻氣性積層體的層構成例,係可例如下示,惟並不僅侷限於該等。
(i)阻氣層/底漆層/保護層
(ii)阻氣層/底漆層/黏著劑層
(iii)阻氣層/底漆層/量子點層
(iv)底漆層(A)/阻氣層/底漆層(B)/保護層
(v)底漆層(A)/阻氣層/底漆層(B)/黏著劑層
(vi)底漆層(A)/阻氣層/底漆層(B)/量子點層
(vii)黏著劑層/阻氣層/底漆層/保護層
(viii)黏著劑層/阻氣層/底漆層/黏著劑層
(ix)黏著劑層/阻氣層/底漆層/量子點層
(x)硬塗層/阻氣層/底漆層/保護層
(xi)硬塗層/阻氣層/底漆層/黏著劑層
(xii)硬塗層/阻氣層/底漆層/量子點層
本發明的阻氣性積層體係阻氣性優異、且層間密接性優異。所以,本發明的阻氣性積層體頗適用為電子裝置用零件。
以下,舉實施例針對本發明進行更詳細說明。惟,本發明並不僅侷限於以下實施例。
各例中的「份」及「%」在無特別聲明前提下,係質量基準。
[製造例1]阻氣薄膜(1)之製造
在厚度50μm的聚對苯二甲酸乙二酯薄膜(以下稱「PET薄膜(1)」)(東洋紡公司製、PET50A4300)上,使用旋塗機(MIKASA公司製、MS-A200、轉數:3000rpm、旋轉時間:30秒),塗佈以全氫聚矽氮烷為主成分的塗佈劑(AZ Electronic Materials公司製、AQUAMICA NL110-20、溶劑:二甲苯、濃度:10%),而形成塗膜,藉由將所獲得具塗膜之PET薄膜(1),依120℃施行2分鐘加熱,便在PET薄膜(1)上形成厚度150nm的聚矽氮
烷層。
其次,對上述聚矽氮烷層使用電漿離子植入裝置,依照下述條件施行電漿離子植入,藉由將聚矽氮烷層的表面施行改質,便獲得阻氣薄膜(1)。
[電漿離子植入之處理條件]
電漿生成氣體:氬
氣體流量:100sccm
Duty比:0.5%
重複頻率:1000Hz
施加電壓:-10kV
RF輸出:1000W
RF電源:(頻率)13.56MHz、(施加電力)1000W
腔內壓:0.2Pa
脈衝寬:5μsec
處理時間(離子植入時間):5分鐘
搬送速度:0.2m/min
[製造例2]阻氣薄膜(2)之製造
利用真空蒸鍍法,在PET薄膜(1)上形成膜厚50nm的氧化矽膜,獲得阻氣薄膜(2)。
[製造例3]阻氣薄膜(3)之製造
利用真空蒸鍍法,在PET薄膜(1)上形成膜厚20nm的氧化鋁膜,獲得阻氣薄膜(3)。
[實施例1]底漆層形成用塗佈液(1)之製備
將含極性基之聚烯烴系聚合體(1)(三井化學公司製、
UNISTOLE P-801)100份、三環癸烷二甲醇二丙烯酸酯(新中村化學工業公司製、A-DCP)(多官能基丙烯酸酯系化合物(1))5份、二季戊四醇六丙烯酸酯(新中村化學工業公司製、A-DPH)(多官能基丙烯酸酯系化合物(2))5份、光聚合起始劑(1)(BASF公司製IRGACURE 184)0.3份、以及甲苯846份予以混合,獲得底漆層形成用塗佈液(1)。
[實施例2]底漆層形成用塗佈液(2)之製備
將含極性基之聚烯烴系聚合體(1)100份、多官能基丙烯酸酯系化合物(1)5份、多官能基丙烯酸酯系化合物(2)5份、光聚合起始劑(1)0.3份、聚異氰酸酯系交聯劑(1)(Nippon Polyurethane Industry公司製、CORONATE HX)5份、矽烷偶合劑(1)(信越化學工業公司製、KBM-403)0.3份、以及甲苯846份予以混合,獲得底漆層形成用塗佈液(2)。
[實施例3]底漆層形成用塗佈液(3)之製備
在實施例1中,除取代含極性基之聚烯烴系聚合體(1),改為使用含極性基之聚烯烴系聚合體(2)(三井化學公司製、UNISTOLE P-901)之外,其餘均依照與製造例2同樣地獲得底漆層形成用塗佈液(3)。
[實施例4]底漆層形成用塗佈液(4)之製備
將含極性基之聚烯烴系聚合體(1)100份、三(2-丙烯醯氧乙基)異三聚氰酸酯(新中村化學工業公司製、A-9300)(多官能基丙烯酸酯系化合物(3))10份、光聚合起始劑(1)0.3份、以及甲苯846份予以混合,獲得底漆層形成用塗佈液(4)。
[比較例1]底漆層形成用塗佈液(5)之製備
將含極性基之聚烯烴系聚合體(3)(日本製紙化學公司製、AUROREN 353S)70份、萜烯酚樹脂(1)(YASUHARA CHEMICAL公司製、YS Polystar TH130)30份、以及甲苯900份予以混合,獲得底漆層形成用塗佈液(5)。
[實施例5]
在製造例1所獲得阻氣薄膜(1)的改質處理面上,使用繞線棒,依成為膜厚150nm的方式,塗佈實施例1所獲得底漆層形成用塗佈液(1)。
所獲得塗膜依110℃施行1分鐘乾燥後,再對所獲得塗膜使用無電極UV燈系統(賀利氏公司製),依照度140mW/cm2、光通量300mJ/cm2施行UV照射而形成底漆層,獲得阻氣性積層膜(α1)。
其次,在該阻氣性積層膜(α1)的底漆層上,依膜厚成為10μm的方式,積層著UV固化系丙烯酸酯樹脂(1)(JSR公司製Opstar Z7530)後,再對所獲得積層物,使用無電極UV燈系統(賀利氏公司製),依照度140mW/cm2、光通量800mJ/cm2施行UV照射而使固化,獲得阻氣性積層體(β1)。
[實施例6]
在實施例5中,除取代底漆層形成用塗佈液(1),改為使用實施例2所獲得底漆層形成用塗佈液(2)之外,其餘均依照與實施例5同樣地獲得阻氣性積層膜(α2)與阻氣性積層體(β2)。
[實施例7]
在實施例5中,除取代底漆層形成用塗佈液(1),改為使用實施例3所獲得底漆層形成用塗佈液(3)之外,其餘均依照與實
施例5同樣地獲得阻氣性積層膜(α3)與阻氣性積層體(β3)。
[實施例8]
在實施例5中,除取代底漆層形成用塗佈液(1),改為使用實施例4所獲得底漆層形成用塗佈液(4)之外,其餘均依照與實施例5同樣地獲得阻氣性積層膜(α4)與阻氣性積層體(β4)。
[實施例9]
在實施例5中,除取代阻氣薄膜(1),改為使用製造例2所獲得阻氣薄膜(2)之外,其餘均依照與實施例5同樣地獲得阻氣性積層膜(α5)與阻氣性積層體(β5)。
[實施例10]
在實施例5中,除取代阻氣薄膜(1),改為使用製造例3所獲得阻氣薄膜(3)之外,其餘均依照與實施例5同樣地獲得阻氣性積層膜(α6)與阻氣性積層體(β6)。
[比較例2]
在實施例5中,於未形成底漆層情況下,在阻氣薄膜(1)上直接依膜厚成為10μm的方式積層著UV固化系丙烯酸酯樹脂(1)之後,再對所獲得積層物,使用無電極UV燈系統(賀利氏公司製),依照度140mW/cm2、光通量800mJ/cm2施行UV照射而使固化,便獲得阻氣性積層膜(7)。
[比較例3]
在實施例5中,除取代使用底漆層形成用塗佈液(1)形成底漆層,改為將有機無機混成樹脂(JSR公司製、Opstar Z7530)塗佈於阻氣薄膜(1)上,經乾燥獲得塗膜,再藉由對該塗膜施行UV照射,形成膜厚150nm的底漆層之外,其餘均依照與實施
例5同樣地獲得阻氣性積層膜(α8)與阻氣性積層體(β8)。
[比較例4]
在實施例5中,除取代底漆層形成用塗佈液(1),改為使用比較例1所獲得底漆層形成用塗佈液(5)之外,其餘均依照與實施例5同樣地獲得阻氣性積層膜(α9)與阻氣性積層體(β9)。
針對實施例5~10及比較例2~4所獲得阻氣性積層體,施行以下的評價。結果如第1表所示。
[層間密接性評價]
(層間密接性評價1)
將阻氣性積層膜(7)、以及阻氣性積層體(β1)~(β6)、(β8)及(β9)使用為試驗片,根據JIS K5600-5-6施行十字切割試驗,並依照以下基準施行層間密接性的評價。
○:100棋盤格中,剝落的棋盤格數為0
△:100棋盤格中,剝落的棋盤格數為1~49
×:100棋盤格中,剝落的棋盤格數為50~100
(層間密接性評價2)
除將試驗片在60℃、相對濕度90%環境下靜置250小時之外,其餘均施行與層間密接性試驗1同樣的試驗。
[阻氣性評價]
將阻氣性積層膜(α1)~(α6)、(7)、(α8)、及(α9)使用為測定試料,使用水蒸氣穿透率測定裝置(mocon公司製、PERMATRAN)測定其水蒸氣穿透率。測定係在40℃、相對濕度90%環境下實施。
[透明性評價]
將阻氣性積層膜(α1)~(α6)、(7)、(α8)及(α9)使用為測定試料,根據JIS K7361-1測定全光線穿透率,依照以下基準評價透明性。
○:全光線穿透率達80%以上
×:全光線穿透率未滿80%
由第1表得知以下事項。
實施例5~10之阻氣性積層體(β1)~(β6)係具有良好的層間密接性及水蒸氣阻斷性。
特別係實施例6的阻氣性積層體(β2),層間密接性與水蒸氣阻斷性均優異。
比較例2的阻氣性積層膜(7),因為沒有底漆層,因而層間
密接性差。
再者,比較例3、4的阻氣性積層體(β8)、(β9)係具有一般組成的底漆層,該等均呈現層間密接性差。
Claims (11)
- 一種阻氣性積層膜之底漆層形成用固化性組合物,至少含有:含極性基之聚烯烴系聚合體、及多官能基丙烯酸酯系化合物。
- 如申請專利範圍第1項之底漆層形成用固化性組合物,其中,上述多官能基丙烯酸酯系化合物的含有量,相對於含極性基之聚烯烴系聚合體100質量份係5~30質量份。
- 如申請專利範圍第1項之底漆層形成用固化性組合物,其中,上述底漆層形成用固化性組合物係更進一步含有聚異氰酸酯系交聯劑,且聚異氰酸酯系交聯劑的含有量,相對於含極性基之聚烯烴系聚合體100質量份係1~10質量份。
- 如申請專利範圍第1項之底漆層形成用固化性組合物,其中,上述底漆層形成用固化性組合物係更進一步含有矽烷偶合劑,且矽烷偶合劑的含有量,相對於含極性基之聚烯烴系聚合體100質量份係0.01~5質量份。
- 一種阻氣性積層膜,具有:阻氣層、以及直接接觸於上述阻氣層的底漆層之阻氣性積層膜,其特徵在於:上述阻氣層係以阻氣薄膜為材料;上述底漆層係由申請專利範圍第1至4項中任一項之底漆層形成用固化性組合物形成;至少其中一者的最外層係上述底漆層。
- 如申請專利範圍第5項之阻氣性積層膜,其中,上述阻氣薄膜的厚度係0.5~500μm。
- 如申請專利範圍第5項之阻氣性積層膜,其中,上述阻氣薄膜係具有:樹脂製基材、以及含無機化合物及/或金屬之層的積層薄膜。
- 如申請專利範圍第7項之阻氣性積層膜,其中,上述含無機化合物及/或金屬之層係經表面改質的含矽高分子化合物層。
- 如申請專利範圍第5項之阻氣性積層膜,其中,上述底漆層的厚度係0.05~2.5μm。
- 如申請專利範圍第5項之阻氣性積層膜,其中,更進一步具有直接接觸於上述阻氣層的其他層。
- 一種阻氣性積層體,在構成申請專利範圍第5至10項中任一項之阻氣性積層膜最外層的底漆層上,積層著含有有機化合物的層。
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US11987026B2 (en) | 2020-05-27 | 2024-05-21 | Proampac Holdings Inc. | Recyclable laminated polyolefin-based film structures |
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Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0618885B2 (ja) | 1986-02-12 | 1994-03-16 | 東燃株式会社 | ポリシロキサザンおよびその製法 |
JP2507714B2 (ja) | 1986-09-24 | 1996-06-19 | 東然株式会社 | 新規ポリチタノシラザン及びその製造方法 |
JP2613787B2 (ja) | 1987-08-13 | 1997-05-28 | 財団法人石油産業活性化センター | 無機シラザン高重合体、その製造方法及びその用途 |
JP2760555B2 (ja) | 1988-03-24 | 1998-06-04 | 東燃株式会社 | ポリボロシラザン及びその製造方法 |
JP2700233B2 (ja) | 1988-12-26 | 1998-01-19 | 財団法人石油産業活性化センター | 共重合シラザンおよびその製造法 |
JP3042537B2 (ja) | 1990-06-30 | 2000-05-15 | 東燃株式会社 | 改質ポリシラザン及びその製造方法 |
JP3283276B2 (ja) | 1991-12-04 | 2002-05-20 | 東燃ゼネラル石油株式会社 | 改質ポリシラザン及びその製造方法 |
JPH05238827A (ja) | 1992-02-26 | 1993-09-17 | Tonen Corp | コーティング用組成物及びコーティング方法 |
JPH06122852A (ja) | 1992-10-09 | 1994-05-06 | Tonen Corp | コーティング用組成物及びコーティング方法 |
JP3307471B2 (ja) | 1993-02-24 | 2002-07-24 | 東燃ゼネラル石油株式会社 | セラミックコーティング用組成物及びコーティング方法 |
JP3385060B2 (ja) | 1993-04-20 | 2003-03-10 | 東燃ゼネラル石油株式会社 | 珪素−窒素−酸素−(炭素)−金属系セラミックス被覆膜の形成方法 |
JP4070828B2 (ja) | 1995-07-13 | 2008-04-02 | Azエレクトロニックマテリアルズ株式会社 | シリカ質セラミックス形成用組成物、同セラミックスの形成方法及び同セラミックス膜 |
JP2000239447A (ja) | 1998-12-25 | 2000-09-05 | Nippon Mitsubishi Oil Corp | シリカ配合ゴム組成物 |
JP4482739B2 (ja) | 1999-07-30 | 2010-06-16 | 綜研化学株式会社 | 反応性アクリル系重合体およびその製造方法、硬化性アクリル系重合体、硬化性組成物、硬化体およびこれらの用途 |
JP2003145664A (ja) * | 2001-11-15 | 2003-05-20 | Mitsui Chemicals Inc | ガスバリヤー性フィルム積層体 |
AU2003266647A1 (en) * | 2002-09-27 | 2004-04-19 | Toyo Ink Mfg. Co., Ltd. | Gas barrier coating material and gas barrier laminates made by using the same |
JP2007237588A (ja) | 2006-03-09 | 2007-09-20 | Kyodo Printing Co Ltd | ガスバリア性フィルム及びその製造方法 |
JP2011121347A (ja) * | 2009-11-10 | 2011-06-23 | Gunze Ltd | ガスバリアフィルム |
US20130209800A1 (en) | 2010-09-07 | 2013-08-15 | Lintec Corporation | Adhesive sheet and electronic device |
JP5533585B2 (ja) | 2010-11-18 | 2014-06-25 | コニカミノルタ株式会社 | ガスバリアフィルムの製造方法、ガスバリアフィルム及び電子機器 |
JP6411707B2 (ja) * | 2011-10-07 | 2018-10-24 | 東京インキ株式会社 | ガスバリア性積層体 |
EP2839953B1 (en) * | 2012-03-29 | 2020-08-05 | Lintec Corporation | Gas barrier laminate, method for producing same, member for electronic devices, and electronic device |
JP5895687B2 (ja) | 2012-04-26 | 2016-03-30 | コニカミノルタ株式会社 | ガスバリア性フィルム |
JP2014069516A (ja) * | 2012-09-28 | 2014-04-21 | Unitika Ltd | 積層体及びその製造方法 |
CN108503870B (zh) * | 2013-01-11 | 2021-04-30 | 东丽株式会社 | 阻气性膜 |
CN104903090B (zh) * | 2013-01-11 | 2016-12-07 | 柯尼卡美能达株式会社 | 气体阻隔性膜 |
JP2014198448A (ja) * | 2013-03-30 | 2014-10-23 | 日本製紙株式会社 | ガスバリアフィルム |
WO2015080073A1 (ja) | 2013-11-28 | 2015-06-04 | 日本ゼオン株式会社 | 積層体 |
WO2015152077A1 (ja) * | 2014-03-31 | 2015-10-08 | リンテック株式会社 | 長尺のガスバリア性積層体およびその製造方法 |
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