TW201727805A - Substrate case, compartment, and substrate transfer container - Google Patents
Substrate case, compartment, and substrate transfer container Download PDFInfo
- Publication number
- TW201727805A TW201727805A TW105125311A TW105125311A TW201727805A TW 201727805 A TW201727805 A TW 201727805A TW 105125311 A TW105125311 A TW 105125311A TW 105125311 A TW105125311 A TW 105125311A TW 201727805 A TW201727805 A TW 201727805A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- locking
- portions
- tray
- storage
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 337
- 230000005484 gravity Effects 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 description 32
- 235000012431 wafers Nutrition 0.000 description 21
- 239000010410 layer Substances 0.000 description 7
- 238000009960 carding Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920006248 expandable polystyrene Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Stackable Containers (AREA)
Abstract
Description
本發明係關於基板盒、構成基板盒之收納部及具備有基板盒之基板搬運器。 The present invention relates to a substrate cassette, a housing portion constituting the substrate cassette, and a substrate carrier including the substrate cassette.
隨著行動電話、數位AV機器及IC卡等之高功能化,使被搭載之半導體矽晶片(以下,記為晶片)小型化及薄型化,依此越來越要求在封裝體內使該晶片高積體化。例如,在以CSP(chip size package)或MCP(multi-chip package)為代表,將複數晶片一次性封裝化之積體電路中,則要求薄型化。為了實現封裝體內之晶片之高積體化,必須使晶片之厚度薄至25~150μm之範圍。如此一來,當搬運被高度薄化之晶圓基板等時,使用收納基板之盒體。 With the high functionality of mobile phones, digital AV devices, and IC cards, the mounted semiconductor wafers (hereinafter referred to as wafers) are miniaturized and thinned, and accordingly, it is increasingly required to make the wafers high in the package. Integrated. For example, in an integrated circuit in which a plurality of wafers are packaged in a single package, which is represented by a CSP (chip size package) or an MCP (multi-chip package), thinning is required. In order to achieve high integration of the wafer in the package, it is necessary to make the thickness of the wafer as thin as 25 to 150 μm. In this manner, when a highly thinned wafer substrate or the like is transported, a case accommodating the substrate is used.
例如,在專利文獻1中記載著在能夠收納基板之溝狀之收納室內,在較其底面淺之位置,跨設略覆蓋其開口剖面之彈性膜,藉由該彈性膜,支撐基板之基板盒。 For example, Patent Document 1 discloses that in a trench-shaped housing chamber in which a substrate can be housed, an elastic film slightly covering the opening cross section is provided at a position shallower than the bottom surface thereof, and the substrate case supporting the substrate is supported by the elastic film. .
在專利文獻2中記載著藉由前端開口之剖面被形成「ㄑ」字形的保持器,夾持半導體晶圓之周緣部之半導體晶圓收納盒。 Patent Document 2 describes a semiconductor wafer storage case in which a peripheral portion of a semiconductor wafer is sandwiched by a holder having a U-shaped cross section formed by a front end opening.
在專利文獻3中記載著保持碟體之周緣部之保持部,被設置在收容碟片之碟片收容空間之內側的收容盒。 Patent Document 3 describes a storage case in which a holding portion for holding a peripheral portion of a disk is provided inside a disk housing space in which the disk is housed.
在專利文獻4中記載著單片式晶圓盒,其係於收納晶圓之時,藉由下側晶圓壓具及上側晶圓壓具夾持晶圓周緣部,將晶圓固定且保持在晶圓盒的晶圓盒。 Patent Document 4 describes a one-piece wafer cassette in which a wafer peripheral portion is sandwiched by a lower wafer press and an upper wafer presser to fix and hold the wafer when the wafer is stored. The wafer cassette in the wafer cassette.
在專利文獻5中記載著以框架保持黏貼晶圓之膠帶,同時於將具有該框架之捆包構件堆疊在捆包箱內之時,藉由隔著緩衝材進行堆疊,以防止由於運送中之衝擊等,膠帶從框架剝離之情形的晶圓之捆包方法。 Patent Document 5 describes that a tape for adhering a wafer to a wafer is held while a stacking member having the frame is stacked in a packing box, and is stacked by a buffer material to prevent transportation. A method of packing a wafer in the case where the tape is peeled off from the frame, such as impact.
專利文獻1:日本特開平8-17903號公報(1996年1月19日公開) Patent Document 1: Japanese Patent Publication No. 8-17903 (published on January 19, 1996)
專利文獻2:日本特開平8-236605號公報(1996年9月13日公開) Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 8-236605 (published on September 13, 1996)
專利文獻3:日本特開2001-148417號公報(2001年5月29日公開) Patent Document 3: Japanese Laid-Open Patent Publication No. 2001-148417 (published on May 29, 2001)
專利文獻4:日本特開2009-43862號公報(2009年2月26日公開) Patent Document 4: Japanese Laid-Open Patent Publication No. 2009-43862 (published on Feb. 26, 2009)
專利文獻5:日本特開2002-145380號公報(2002年5月22日公開) Patent Document 5: Japanese Laid-Open Patent Publication No. 2002-145380 (published on May 22, 2002)
但是,在專利文獻1~4所記載之基板盒中,藉由夾持或保持在基板之上面和底面的周緣部,固定該基板。再者,在專利文獻5所記載之技術中,基板之底面藉由切割膠帶被固定。 However, in the substrate cassettes described in Patent Documents 1 to 4, the substrate is fixed by being sandwiched or held on the upper surface of the substrate and the peripheral portion of the bottom surface. Further, in the technique described in Patent Document 5, the bottom surface of the substrate is fixed by a dicing tape.
在專利文獻1~4所記載之技術中,基板之上面及底面之一部分與用以固定基板之構件接觸。因此,在將基板收納於基板盒,且進行搬運之時,有在該基板之上面產生刮傷之問題。再者,以較專利文獻5所記載之基板盒,可以簡便地收納基板,並且可以防止在基板之上面產生刮傷的新穎基板盒為更有效用。 In the techniques described in Patent Documents 1 to 4, one of the upper surface and the bottom surface of the substrate is in contact with a member for fixing the substrate. Therefore, when the substrate is housed in the substrate cassette and transported, there is a problem that scratches occur on the upper surface of the substrate. Further, the substrate cassette described in Patent Document 5 can be used to easily accommodate the substrate, and it is possible to prevent the occurrence of scratches on the upper surface of the substrate.
另外,在專利文獻1~5所記載之基板盒等中,由於將複數基板收納於個別的空間,故於搬運多數基板時,有其搬運型態變大之問題。 Further, in the substrate cassettes and the like described in Patent Documents 1 to 5, since the plurality of substrates are housed in the individual spaces, there is a problem that the conveyance pattern becomes large when a large number of substrates are transported.
本案發明係鑒於上述問題而創作出,其主要目的在於提供具備可以防止在基板之上面產生刮傷,且縮小搬運基板之型態的收納部,且新穎的基板盒。 The present invention has been made in view of the above problems, and a main object thereof is to provide a novel substrate cassette having a housing portion that can prevent scratches on the upper surface of the substrate and that reduces the shape of the substrate to be transported.
為了解決上述課題,提供一種具有複數用以 收納基板之收納部的基板盒,其特徵在於:上述收納部具備:表面部,其具備擁有卡止上述基板之端部之階差的卡止部;和 背面部,其係具備卡止上述基板之端部的卡止凸部,在一個收納部之表面部的上述卡止部之內側,支撐上述基板,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,卡止上述基板之端部,依此保持上述基板。 In order to solve the above problems, a plurality of The substrate cassette accommodating the accommodating portion of the substrate, wherein the accommodating portion includes a surface portion having a locking portion having a step that locks an end portion of the substrate; The back surface portion includes a locking convex portion that locks an end portion of the substrate, and the substrate is supported inside the locking portion of the surface portion of the one storage portion, and is further positioned above the storage portion The locking convex portion on the back surface portion of the accommodating portion locks the end portion of the substrate, thereby holding the substrate.
若藉由本發明時,達到下述效果:可提供具備可以防止在基板之上面產生刮傷,並可以縮小用以搬運基板之型態之收納部的新穎基板盒。 According to the present invention, it is possible to provide a novel substrate cassette having a accommodating portion capable of preventing scratches on the upper surface of the substrate and reducing the type of the substrate to be transported.
10、10’、10”‧‧‧托盤(收納部) 10, 10', 10" ‧ ‧ tray (storage department)
11a、11b、11c、11d‧‧‧卡止部 11a, 11b, 11c, 11d‧‧‧ carding
11’a、11’c‧‧‧卡止部 11’a, 11’c‧‧‧ carding
11”a、11”b、11”c、11”d‧‧‧卡止部 11"a, 11"b, 11"c, 11"d‧‧‧ carding
12、12a、12b、12c、12d、12e‧‧‧支撐部 12, 12a, 12b, 12c, 12d, 12e‧ ‧ support
12’d、12’e‧‧‧支撐部 12’d, 12’e‧‧‧ support
12f‧‧‧支撐部 12f‧‧‧Support
13a、13c、13e、13g‧‧‧卡止凹部 13a, 13c, 13e, 13g‧‧‧ locking recesses
13’a、13’e‧‧‧卡止凹部 13’a, 13’e‧‧‧ card recess
13”a、13”c、13”e、13”g‧‧‧卡止凹部 13"a, 13"c, 13"e, 13"g‧‧‧ card recess
13b、13d、13f、13h‧‧‧卡止凸部 13b, 13d, 13f, 13h‧‧‧ locking projections
13’b、13’f‧‧‧卡止凸部 13’b, 13’f‧‧‧ carding convex
13”b、13”d、13”f、13”h‧‧‧卡止凸部 13"b, 13"d, 13"f, 13"h‧‧‧ stuck convex
14a、14b、14c、14d、14e、14e、14f、14g、14h、14J、14k、14l、14m、14n‧‧‧嵌合部 14a, 14b, 14c, 14d, 14e, 14e, 14f, 14g, 14h, 14J, 14k, 14l, 14m, 14n‧‧‧ fitting
15a、15b、15c、15d、15e、15e、15f、15g、15h、15i、15J、15k、15l、16a、16b、16c、16d、16e、16f‧‧‧第三抵接部 15a, 15b, 15c, 15d, 15e, 15e, 15f, 15g, 15h, 15i, 15J, 15k, 15l, 16a, 16b, 16c, 16d, 16e, 16f‧‧‧ third abutment
17a、17c、17e、17g‧‧‧第一抵接部 17a, 17c, 17e, 17g‧‧‧ first abutment
17’a、17’e‧‧‧第一抵接部 17’a, 17’e‧‧‧ first abutment
17b、17d、17f、17h‧‧‧第二抵接部 17b, 17d, 17f, 17h‧‧‧ second abutment
18a、18b、18c、18d、18e、18f、18g、18h‧‧‧第二抵接部 18a, 18b, 18c, 18d, 18e, 18f, 18g, 18h‧‧‧ second abutment
20‧‧‧基板 20‧‧‧Substrate
20a‧‧‧端部(基板) 20a‧‧‧End (substrate)
20b‧‧‧底面(基板) 20b‧‧‧Bottom (substrate)
a1‧‧‧倒角部位(端部) A1‧‧‧Chamfering part (end)
a2‧‧‧倒角部位(端部) A2‧‧‧Chamfering part (end)
30、30’‧‧‧基板盒 30, 30'‧‧‧ substrate box
40‧‧‧平板(板部) 40‧‧‧Table (board)
40a‧‧‧缺口部(板部) 40a‧‧‧Gap section (board part)
41‧‧‧綑束帶(帶部) 41‧‧‧Bundle belt (belt)
50‧‧‧基板搬運器 50‧‧‧Substrate carrier
圖1為說明與本發明之一實施型態(第一實施型態)有關之收納部之概略的圖示。 Fig. 1 is a view for explaining an outline of a housing portion relating to an embodiment (first embodiment) of the present invention.
圖2為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 Fig. 2 is a cross-sectional view showing the outline of a housing portion and a substrate cassette according to an embodiment (first embodiment) of the present invention.
圖3為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 Fig. 3 is a cross-sectional view showing the outline of a housing portion and a substrate cassette according to an embodiment (first embodiment) of the present invention.
圖4為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 Fig. 4 is a cross-sectional view showing the outline of a housing portion and a substrate cassette according to an embodiment (first embodiment) of the present invention.
圖5為說明與本發明之一實施型態有關之收納部及基板盒之概略的側面圖。 Fig. 5 is a side view showing the outline of a housing portion and a substrate cassette according to an embodiment of the present invention.
圖6為說明與本發明之一實施型態有關之收納部及基板盒之概略的另外的側面圖。 Fig. 6 is a side view showing another outline of a housing portion and a substrate cassette according to an embodiment of the present invention.
圖7為說明與本發明之一實施型態有關之基板搬運器之概略的圖示。 Fig. 7 is a view for explaining an outline of a substrate carrier according to an embodiment of the present invention.
圖8為說明與本發明之一實施型態(第二實施型態)有關之收納部及基板盒之概略的剖面圖。 Fig. 8 is a cross-sectional view showing the outline of a housing portion and a substrate cassette according to an embodiment (second embodiment) of the present invention.
圖9為說明與本發明之一實施型態(第三實施型態)有關之收納部之概略的圖示。 Fig. 9 is a view for explaining an outline of a housing portion according to an embodiment (third embodiment) of the present invention.
圖10為說明與本發明之一實施型態(第三實施型態)有關之收納部及基板盒之概略的剖面圖。 Fig. 10 is a cross-sectional view showing the outline of a housing portion and a substrate cassette according to an embodiment (third embodiment) of the present invention.
以下,針對與一實施型態(第一實施型態)有關之基板盒30,進行詳細說明。 Hereinafter, the substrate cassette 30 relating to one embodiment (first embodiment) will be described in detail.
與本實施型態有關之基板盒30具有複數圖1所示之用以收納基板之托盤(收納部)10。 The substrate cassette 30 according to this embodiment has a plurality of trays (accommodating portions) 10 for housing the substrates shown in FIG.
基板盒30係在一個托盤10之表面部,和另外之托盤10之背面部之間,保持基板20(圖2及圖3)。 基板盒30係在一個托盤10之表面部,一面支撐基板20之底面20c之一部分,一面在卡止部11c之階差卡止基板 20之端部20a(圖2之(c))。再者,如圖2(c)所示般,在支撐基板20之狀態下,如圖3(c)所示般,藉由位於上述一個托盤10之上方的另外之托盤10之背面部,卡止基板20之端部20a。 The substrate cassette 30 is held between the surface of one of the trays 10 and the back surface of the other tray 10, and holds the substrate 20 (Figs. 2 and 3). The substrate cassette 30 is attached to one surface portion of one tray 10, supports one portion of the bottom surface 20c of the substrate 20 on one surface, and latches the substrate on the step of the locking portion 11c. End portion 20a of 20 ((c) of Fig. 2). Further, as shown in FIG. 2(c), in the state of supporting the substrate 20, as shown in FIG. 3(c), the card is placed on the back side of the other tray 10 above the one tray 10. The end portion 20a of the substrate 20 is stopped.
依此,基板盒30不使位於基板20之上方的托盤10之背面部,接觸於較基板20之上面20b更內側,可以收納基板20(圖2(c)及圖3(c))。依此,可以防止於搬運基板20之時,在基板20之上面20b產生刮傷之情形。 Accordingly, the substrate cassette 30 does not allow the back surface portion of the tray 10 located above the substrate 20 to be in contact with the upper surface 20b of the substrate 20, and the substrate 20 can be housed (FIG. 2(c) and FIG. 3(c)). Accordingly, it is possible to prevent the occurrence of scratches on the upper surface 20b of the substrate 20 when the substrate 20 is transported.
再者,基板盒30係交互堆疊托盤10和基板20,依此在各托盤10之間,一片一片地收納基板20。因此,基板盒30係被設置在個別的基板盒之內部的空間一片一片地收納基板,比起堆疊該基板盒而進行搬運之型態,可以防止盒體本身變成大體積。因此,基板盒30可以大幅度地刪減收納基板20之空間,並且可以縮小用以搬運基板20之型態(圖2(b)及圖3(b))。 Further, the substrate cassette 30 alternately stacks the tray 10 and the substrate 20, whereby the substrate 20 is housed one by one between the trays 10. Therefore, the substrate cassette 30 is housed one by one in a space provided inside the individual substrate cassettes, and the cassette body itself can be prevented from being bulky compared to the type in which the substrate cassette is stacked. Therefore, the substrate cassette 30 can greatly reduce the space in which the substrate 20 is housed, and the form for transporting the substrate 20 can be reduced (FIG. 2(b) and FIG. 3(b)).
另外,基板盒30係當在一個托盤10上堆疊另外之托盤10時,對位於下方之托盤10,每次平行地改變180°方向,堆積位於上方之托盤10。由於在托盤10之俯視下的外周部之形狀為略正方形,故容易配合外周部之形狀,每次平行地改變180°方向而堆疊各托盤10。另外,即使對托盤10賦予表示特定方向之標示(無圖示)亦可。 Further, the substrate cassette 30 is such that when the other trays 10 are stacked on one tray 10, the trays 10 located above are stacked in the direction of 180° in parallel with the trays 10 located below. Since the shape of the outer peripheral portion in the plan view of the tray 10 is slightly square, it is easy to match the shape of the outer peripheral portion, and the trays 10 are stacked each time the direction of 180° is changed in parallel. Further, even if the tray 10 is provided with a mark indicating a specific direction (not shown).
基板20係在俯視下之形狀為圓形之例如玻璃基板。再者,基板20被施予倒角。更具體而言,如圖2(d)所示般,基板20係從端部20a之全周上的上面20b側,及從底面20c側之雙方,被倒c角。依此,在基板20中的端部20a設置有倒角部位a1和倒角部位a2。 The substrate 20 is, for example, a glass substrate having a circular shape in plan view. Furthermore, the substrate 20 is subjected to chamfering. More specifically, as shown in FIG. 2(d), the substrate 20 is inverted from the upper surface 20b side of the entire circumference of the end portion 20a and the bottom surface 20c side. Accordingly, the end portion 20a in the substrate 20 is provided with a chamfered portion a1 and a chamfered portion a2.
另外,在被收納於基板盒之基板中,被倒c角之去角部位的傾斜之角度並不限定於圖2(d)所示之角度。再者,雖然被收納在基板盒30之基板20,使用被倒c角之基板,但是被收納於與本發明之一實施型態有關之基板盒的基板並不限定於被倒c角之基板。基板盒也可以收納例如端部被倒r角之基板。 Further, in the substrate housed in the substrate cassette, the angle of inclination of the chamfered portion of the inverted c-angle is not limited to the angle shown in FIG. 2(d). In addition, although the substrate which is placed on the substrate 20 of the substrate cassette 30 is inverted, the substrate accommodated in the substrate cassette according to an embodiment of the present invention is not limited to the substrate which is inverted. . The substrate cassette may also house, for example, a substrate whose end portion is inverted.
被收納於基板盒30,且被搬運之基板20,之後從基板盒30被取出,能在上面20b形成電路。再者,雖然在與本實施型態有關之基板盒30收納之基板20為玻璃基板,但是基板並不限定於玻璃基板。收納於基板盒之基板的材質不被限定,除玻璃基板以外,可以收納矽基板、陶瓷基板及樹脂基板等。 The substrate 20 accommodated in the substrate cassette 30 and transported is taken out from the substrate cassette 30, and an electric circuit can be formed on the upper surface 20b. In addition, the substrate 20 accommodated in the substrate cassette 30 according to the present embodiment is a glass substrate, but the substrate is not limited to the glass substrate. The material of the substrate housed in the substrate cassette is not limited, and a ruthenium substrate, a ceramic substrate, a resin substrate, or the like can be accommodated in addition to the glass substrate.
圖1為說明構成與本實施型態有關之基板盒30之托盤10之概略的圖示。圖1(a)為由托盤10之俯視圖及三方向之側視圖所構成的4面圖,圖1(b)為托盤10之沿A-A’箭號線剖面圖,圖1(c)為托盤10之沿B-B’箭號線剖面圖。 Fig. 1 is a view for explaining the outline of a tray 10 constituting a substrate cassette 30 according to the present embodiment. Fig. 1(a) is a four-side view of a top view of the tray 10 and a side view of the three directions, and Fig. 1(b) is a cross-sectional view of the tray 10 along the arrow A-A', and Fig. 1(c) is A cross-sectional view of the tray 10 along the B-B' arrow line.
如圖1(a)所示般,托盤10係在俯視下之形狀為略正方形。另外,在本說明書中,托盤(收納部)之表面部係指設置有卡止部、支撐部及卡止凹部之側的面,在收納部的背面部係指設置有卡止凸部之側的面。 As shown in Fig. 1(a), the tray 10 has a substantially square shape in plan view. In the present specification, the surface portion of the tray (accommodating portion) refers to a surface on which the locking portion, the support portion, and the locking concave portion are provided, and the back portion of the storage portion refers to the side on which the locking convex portion is provided. Face.
如圖1(a)所示般,托盤10在其表面部形成卡止部11a~11d、支撐部12a~12e、卡止凹部13a、13c、13e及13g及第一抵接部17a、17c、17e及17g。 As shown in Fig. 1(a), the tray 10 has locking portions 11a to 11d, support portions 12a to 12e, locking recesses 13a, 13c, 13e, and 13g and first abutting portions 17a and 17c on the surface portion thereof. 17e and 17g.
如圖1(b)所示般,支撐部12a~12e被形成在形成於托盤10之表面部之卡止部11a及卡止部11c階差的內側。支撐部12a~12e同樣位於卡止部11b及11d之階差的內側。托盤10係在其表面部,卡止基板20之端部20a,且支撐基板20之底面20c之一部分。 As shown in FIG. 1(b), the support portions 12a to 12e are formed on the inner side of the stepped portion 11a and the locking portion 11c formed on the surface portion of the tray 10. The support portions 12a to 12e are also located inside the step of the locking portions 11b and 11d. The tray 10 is attached to the surface portion thereof, latches the end portion 20a of the substrate 20, and supports a portion of the bottom surface 20c of the substrate 20.
如圖1(c)所示般,托盤10在其背面部形成有卡止凸部13b及13f。與卡止凸部13b及13f相同,在托盤10之背面部,形成有圖1(a)所示之卡止凸部13d及13h。托盤10係藉由被形成在其背面部之卡止凸部,卡止基板20之端部20a。 As shown in Fig. 1(c), the tray 10 has locking projections 13b and 13f formed on the back surface portion thereof. Similarly to the locking projections 13b and 13f, the locking projections 13d and 13h shown in Fig. 1(a) are formed on the back surface of the tray 10. The tray 10 locks the end portion 20a of the substrate 20 by a locking convex portion formed on the back surface portion thereof.
再者,在托盤10之背面部,於該托盤10之表面部中的第一抵接部17a、17c、17e及17g之背側,形成有第二抵接部17b、17d、17f及17h(圖1(a))。 Further, on the back side of the tray 10, second abutting portions 17b, 17d, 17f, and 17h are formed on the back sides of the first abutting portions 17a, 17c, 17e, and 17g in the surface portion of the tray 10 ( Figure 1 (a)).
再者,托盤10在其側面部具備當複數托盤10僅在相同方向對齊時,進行嵌合的嵌合部14a~14n(圖1、5及6)。 Further, the tray 10 has fitting portions 14a to 14n (FIGS. 1, 5, and 6) that are fitted when the plurality of trays 10 are aligned only in the same direction on the side surface portion.
托盤10可以藉由例如真空成形或壓模成形 等,對平板進行成形而製造出。用以成形收納部之平板並不被限定,但是以樹脂製之平板為佳,例如可以舉出發泡聚苯乙稀等。再者,收納部即使藉由塗佈層被保護亦可。 The tray 10 can be formed by, for example, vacuum forming or compression molding Etc., the flat plate is formed and manufactured. The flat plate for forming the accommodating portion is not limited, but a flat plate made of a resin is preferable, and examples thereof include foamed polystyrene. Further, the accommodating portion may be protected by the coating layer.
使用圖1及圖2針對被設置在與本實施型態有關之托盤10之卡止部11a~11d,進行詳細說明。圖2(a)~(c)係根據圖1(a)中之沿A-A’箭號線剖面,說明藉由複數托盤10收納基板20之狀態的圖示。 The locking portions 11a to 11d provided in the tray 10 according to the present embodiment will be described in detail with reference to Figs. 1 and 2 . 2(a) to 2(c) are diagrams showing a state in which the substrate 20 is housed by the plurality of trays 10, based on the A-A' arrow line cross section in Fig. 1(a).
如圖2(a)所示般,卡止部11a及11c之階差,傾斜成離支撐部12e越遠越寬。與卡止部11a及11c相同,卡止部11b及11d也傾斜成離支撐部12e越遠越寬。再者,卡止部11a~11d係沿著被卡止於卡止部11a~11d之內側的基板20之外周部之形狀而彎曲(圖1之(a))。即是,托盤10之卡止部11a~11d具有設為相同形狀之階差,在被形成在該階差之內側的區域,收納基板20。 As shown in Fig. 2(a), the step of the locking portions 11a and 11c is inclined so as to be wider as far as the support portion 12e. Similarly to the locking portions 11a and 11c, the locking portions 11b and 11d are also inclined so as to be wider from the support portion 12e. Further, the locking portions 11a to 11d are curved along the shape of the outer peripheral portion of the substrate 20 that is locked inside the locking portions 11a to 11d (Fig. 1(a)). In other words, the locking portions 11a to 11d of the tray 10 have a step having the same shape, and the substrate 20 is housed in a region formed inside the step.
再者,從另外之觀點來看,卡止部11a~11d係藉由以形成卡止凹部13a、13c、13e及13g,以及第一抵接部17a、17c、17e及17g,且將在托盤10之表面部形成包圍被支撐之基板20的階差,朝向配置該基板20之外周部的位置更外側施予缺口而形成。在拖盤10之表面部,形成卡止部11a~11d之合計4處的缺口,係互相相向之缺口彼此成為在托盤10之表面部夾著支撐基板20之區 域而成為對稱的形狀。 Further, from another viewpoint, the locking portions 11a to 11d are formed by forming the locking recesses 13a, 13c, 13e, and 13g, and the first abutting portions 17a, 17c, 17e, and 17g, and will be on the tray. The surface portion of the surface portion 10 is formed with a step that surrounds the substrate 20 to be supported, and is formed by applying a notch to the outer side of the outer peripheral portion where the substrate 20 is disposed. In the surface portion of the tray 10, a total of four notches of the locking portions 11a to 11d are formed, and the notches facing each other are the regions sandwiching the support substrate 20 on the surface portion of the tray 10. The domain becomes a symmetrical shape.
如上述般被形成之卡止部11a~11d之階差,係保持基板20之時從該基板20之重心點以等間隔分離的位置,被設置在卡止基板20之端部20a的位置上。再者,互相鄰接之一個卡止部和另外的卡止部之間的距離相等(圖1之(a))。因此,如圖2(a)所示般,在堆疊複數托盤10之時,當每次平行地改變方向180°而堆疊各托盤10之時,交換設為相同形狀之卡止部11a和卡止部11c的配置,由於僅交換設為相同形狀之卡止部11b和卡止部11d之配置,藉由卡止部11a~11d,在卡止基板20之端部20a上不會產生變化。因此,如圖2(b)所示般,由複數托盤10所構成之基板盒30在各托盤10之表面部,可以在相同狀態下一片一片地卡止基板20。 The step of the locking portions 11a to 11d formed as described above is provided at a position separated from the center of gravity of the substrate 20 at equal intervals when the substrate 20 is held, and is provided at the position of the end portion 20a of the locking substrate 20. . Further, the distance between the adjacent one of the locking portions and the other locking portion is equal (Fig. 1 (a)). Therefore, as shown in FIG. 2(a), when the plurality of trays 10 are stacked, when the trays 10 are stacked each time the direction is changed by 180 degrees in parallel, the locking portions 11a and the locking portions having the same shape are exchanged. In the arrangement of the portion 11c, only the arrangement of the locking portion 11b and the locking portion 11d having the same shape is exchanged, and the locking portions 11a to 11d do not change in the end portion 20a of the locking substrate 20. Therefore, as shown in FIG. 2(b), the substrate cassette 30 composed of the plurality of trays 10 can lock the substrate 20 one by one in the same state on the surface portion of each tray 10.
在與本實施型態有關之托盤10中,支撐部12係由支撐部12a~12e所構成,該些係在托盤10之俯視下的形狀為以保持基板20之時的基板20之重心點為中心的圓狀之複數凸部(圖1(a)及(b))。依此,支撐部12a~12e被形成在托盤10之表面部,支撐基板20的底面20c之一部分(圖2及圖3)。因此,在托盤10之表面部,可以縮小支撐基板20之底面20c之面積,且可以使基板20之底面20c難以產生刮傷。再者,支撐部12a~12e由於藉由圓狀之凸部所構成,且其係以基板20之重心點為中心之圓狀的複數凸 部,故可以從其底面20c均等地支撐基板20。 In the tray 10 according to the present embodiment, the support portion 12 is constituted by the support portions 12a to 12e, and the shape of the tray 10 in a plan view is such that the center of gravity of the substrate 20 when the substrate 20 is held is The center of the circular plurality of convex parts (Fig. 1 (a) and (b)). Accordingly, the support portions 12a to 12e are formed on the surface portion of the tray 10, and support one portion of the bottom surface 20c of the substrate 20 (Figs. 2 and 3). Therefore, in the surface portion of the tray 10, the area of the bottom surface 20c of the support substrate 20 can be made small, and the bottom surface 20c of the substrate 20 can be hardly scratched. Further, the support portions 12a to 12e are formed by a circular convex portion, and are formed by a circular complex convex centering on the center of gravity of the substrate 20. Therefore, the substrate 20 can be equally supported from the bottom surface 20c thereof.
使用圖1及圖3,針對被設置在與本實施型態有關之托盤10的卡止凹部13a、13c、13e及13g,以及第一抵接部17a、17c、17e及17g,進行更詳細說明。 The locking recesses 13a, 13c, 13e, and 13g and the first abutting portions 17a, 17c, 17e, and 17g provided in the tray 10 according to the present embodiment will be described in more detail with reference to Figs. 1 and 3 . .
圖3(a)係根據圖1(a)中之沿B-B’箭號線剖面,說明藉由複數托盤10收納基板20之狀態的圖示。 Fig. 3(a) is a view showing a state in which the substrate 20 is housed by the plurality of trays 10, based on the cross section taken along line B-B' in Fig. 1(a).
如圖3(a)所示般,互相相向之卡止凹部13a及13e係在形成卡止部11a~11d之計4處的缺口之內側,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a)及(c))。再者,卡止凹部13a及13e分別在略正方形的托盤10,夾著通過卡止凹部13a及卡止凹部13e之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。 As shown in Fig. 3 (a), the locking recesses 13a and 13e facing each other are inside the notch forming the locking portion 11a to 11d, and sandwiching the surface of the substrate 10 supporting the substrate 20 It is symmetrically configured (Fig. 1 (a) and (c)). Further, the locking recesses 13a and 13e respectively sandwich the diagonal line above the locking recess 13a and the locking recess 13e in the slightly square tray 10 (that is, the B-B shown in Fig. 1(a) 'Line' and become an asymmetrical shape.
再者,如圖3(a)所示般,互相相向之卡止凹部13a及13e,係卡止部11a~11d具有的階差的部分,以比起位在遠離所保持的基板20之側的階差,位在接近該基板20之側的階差比較低之方式,形成其凹部。在此,卡止凹部13a及13e之凹部,係在水平配置托盤10之時,被形成在較支撐部12a~12e低之位置。因此,藉由把持基板20之端部20a,而將手部放入卡止凹部13a及13e中之任一者,可以將基板20頭尾良好地配置在卡止部11a~11d之內側的支撐部12a~12e上。再者,若將手部放 入至卡止凹部13a及13e中之任一者而把持該基板20之端部20a時,可以頭尾地取出藉由卡止部11a~11d包圍之基板20。 Further, as shown in Fig. 3(a), the locking recesses 13a and 13e facing each other are the portions of the step portions of the locking portions 11a to 11d which are located away from the substrate 20 which is held away from the substrate 20 The step of the step is such that the step closer to the side of the substrate 20 is relatively low, and the recess is formed. Here, the recessed portions of the locking recesses 13a and 13e are formed at positions lower than the support portions 12a to 12e when the tray 10 is horizontally placed. Therefore, by holding the end portion 20a of the substrate 20 and placing the hand in any of the locking recesses 13a and 13e, it is possible to arrange the head and tail of the substrate 20 well on the inner side of the locking portions 11a to 11d. On the parts 12a~12e. Furthermore, if you put your hand When the end portion 20a of the substrate 20 is held by any of the locking recesses 13a and 13e, the substrate 20 surrounded by the locking portions 11a to 11d can be taken out head and tail.
另外,卡止凹部13c及13g與卡止凹部13a及13e相同,被設置成互相相向,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a)及(c))。再者,卡止凹部13a及13e分別夾著通過被支撐於卡止凹部13a、卡止凹部13e、托盤10之表面部之基板20的重心點的對角線(無圖示),成為非對稱性的形狀。再者,卡止凹部13c及13g,係卡止部11a~11d具有的階差的部分,以比起位在遠離所保持的基板20之側的階差,位在接近該基板20之側的階差比較低之方式,形成其凹部。因此,即使在卡止凹部13c及13g,當然也與卡止凹部13a及13e相同,可以用於基板20對托盤10之表面部的配置或取出。 Further, the locking recesses 13c and 13g are disposed symmetrically with respect to the locking recesses 13a and 13e, and are disposed symmetrically with respect to the region of the surface of the tray 10 supporting the substrate 20 (Fig. 1(a) and c)). Further, the locking recesses 13a and 13e are asymmetrically opposed by a diagonal line (not shown) passing through the center of gravity of the substrate 20 supported by the locking recess 13a, the locking recess 13e, and the surface portion of the tray 10, respectively. Sexual shape. Further, the locking recesses 13c and 13g are portions of the step portions of the locking portions 11a to 11d which are located closer to the side of the substrate 20 than the step which is located away from the side of the substrate 20 held. The step is relatively low, forming a recess. Therefore, the locking recesses 13c and 13g are of course the same as the locking recesses 13a and 13e, and can be used for the arrangement or removal of the substrate 20 on the surface portion of the tray 10.
第一抵接部17a、17c、17e及17g在托盤10之俯視下,沿著所保持之基板20之外周部之形狀,形成各別地與卡止凹部13a、13c、13e及13g相鄰接。 The first abutting portions 17a, 17c, 17e, and 17g are formed adjacent to the locking recesses 13a, 13c, 13e, and 13g, respectively, in the plan view of the tray 10 along the outer peripheral portion of the substrate 20. .
在形成卡止部11a~11d之計4處的缺口之內側,互相相向之第一抵接部17a及17e,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a))。 The first abutting portions 17a and 17e facing each other inside the notch forming the locking portions 11a to 11d are symmetrically arranged with the first substrate portions 17a and 17e facing each other sandwiching the surface portion of the tray 10 (Fig. 1(a)).
再者,如圖3(a)所示般,在沿B-B’箭號線剖 面中,互相相向之第一抵接部17a及17e被設置在較卡止凹部13a及13e更朝向紙張深側,在水平配置托盤10之時,被設置在較卡止凹部13a及13e之凹部高,較支撐部12a~12e低之位置上。 Furthermore, as shown in Fig. 3(a), the section taken along the B-B' arrow line In the surface, the first abutting portions 17a and 17e facing each other are disposed on the deep side of the paper with respect to the locking recesses 13a and 13e, and are disposed in the recesses of the locking recesses 13a and 13e when the tray 10 is horizontally disposed. High, lower than the support portions 12a to 12e.
另外,互相相向之第一抵接部17c及17g與第一抵接部17a及17e相同,夾著托盤10之表面部支撐基板20之區域而對稱性地被配置,在水平配置托盤10之時,被配置在較卡止凹部13c及13g之凹部高,較支撐部12a~12e低之位置上。 Further, the first abutting portions 17c and 17g that face each other are identical to the first abutting portions 17a and 17e, and are disposed symmetrically with respect to the region of the surface of the tray 10 supporting the substrate 20, and when the tray 10 is horizontally arranged It is disposed at a position higher than the recesses of the locking recesses 13c and 13g and lower than the support portions 12a to 12e.
如圖3(a)所示般,卡止凸部13b及13f係藉由使卡止凹部13a及13e之背面突出而形成的凸部,以做為嵌合於卡止凹部13a及13e的凸部。 As shown in Fig. 3 (a), the locking projections 13b and 13f are projections formed by projecting the back surfaces of the locking recesses 13a and 13e so as to be convexly fitted to the locking recesses 13a and 13e. unit.
再者,卡止凸部13b及卡止凸部13f分別在略正方形的托盤10,夾著通過卡止凸部13b及卡止凸部13f之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。 Further, the locking convex portion 13b and the locking convex portion 13f are respectively on the diagonally upper tray 10, and sandwich the diagonal line above the locking convex portion 13b and the locking convex portion 13f (that is, Fig. 1 (a) ) The B-B' line shown) becomes an asymmetrical shape.
再者,在卡止凸部13b及13f的互相相向之兩面,係沿著被配置在托盤10之表面部之基板20之外周部的形狀而彎曲,具有離托盤10之背面部越遠越寬的傾斜(圖1(c))。在此,當在基板盒30保持基板20之時,以接觸於在圖2(d)所示之基板20的端部20a之倒角部位a1之方式,在卡止凸部13b及13f的互相相向之兩面分別設 置有傾斜。 Further, the mutually opposing surfaces of the locking projections 13b and 13f are curved along the outer peripheral portion of the substrate 20 disposed on the surface portion of the tray 10, and have a wider width from the back portion of the tray 10. Tilt (Fig. 1(c)). Here, when the substrate 20 is held by the substrate cassette 30, in contact with the chamfered portion a1 of the end portion 20a of the substrate 20 shown in FIG. 2(d), the mutual locking portions 13b and 13f are mutually engaged. Two sides of the opposite direction Tilted.
再者,在卡止凸部13b及13f的互相相向之兩面,係從被配置在托盤10之表面部的基板20之重心點以等間隔分離。因此,即使每次平行地改變180°方向而堆疊各托盤10,僅藉由在卡止凸部13b及13f中的互相相向之兩面交換配置,就可以卡止基板20之端部20a之倒角部位a1(圖3)。 Further, on both surfaces of the locking convex portions 13b and 13f facing each other, they are separated from the center of gravity of the substrate 20 disposed on the surface portion of the tray 10 at equal intervals. Therefore, even if the trays 10 are stacked each time the direction of 180° is changed in parallel, the chamfering of the end portion 20a of the substrate 20 can be locked only by the arrangement of the mutually opposing faces in the locking projections 13b and 13f. Part a1 (Fig. 3).
另外,如圖1(a)所示般,卡止凸部13d及13h係藉由使卡止凹部13c及13g之背面突出而形成,以作為嵌合於卡止凹部13c及13g的凸部。再者,在卡止凸部13d及13h的互相相向之兩面,係沿著被配置在托盤10之表面部之基板20之外周部的形狀而彎曲,具有離托盤10之背面部越遠越寬的傾斜。在此,當在基板盒30收納基板20之時,以接觸在該基板20的端部20a之倒角部位a1之方式,在卡止凸部13d及13h的互相相向之兩面分別設置有傾斜。再者,與卡止凸部13b及13f相同,卡止凸部13d及13h夾著通過卡止凸部13d及13h之上方的對角線(無圖示)而成為非對稱之形狀。再者,在卡止凸部13d及13h的互相相向之兩面,係從被配置在托盤10之表面部的基板20之重心點以等間隔分離。 Further, as shown in Fig. 1(a), the locking projections 13d and 13h are formed by projecting the back surfaces of the locking recesses 13c and 13g as convex portions fitted to the locking recesses 13c and 13g. Further, the mutually opposing surfaces of the locking projections 13d and 13h are curved along the outer peripheral portion of the substrate 20 disposed on the surface portion of the tray 10, and are wider as far as the back portion of the tray 10 is wider. The slope. Here, when the substrate 20 is housed in the substrate cassette 30, the two opposite surfaces of the locking convex portions 13d and 13h are inclined so as to be in contact with the chamfered portion a1 of the end portion 20a of the substrate 20. Further, similarly to the locking convex portions 13b and 13f, the locking convex portions 13d and 13h have an asymmetrical shape sandwiching a diagonal line (not shown) above the locking convex portions 13d and 13h. Further, on both surfaces of the locking convex portions 13d and 13h facing each other, they are separated from the center of gravity of the substrate 20 disposed on the surface portion of the tray 10 at equal intervals.
使用圖3及圖4,針對堆疊複數托盤10之時的卡止凹部、卡止凸部及第一抵接部之配置進行說明。圖 4(a)~(d)係根據圖1(a)所示之沿C-C’箭號線剖面,說明堆疊複數托盤10之狀態的圖示。另外,在圖4中,托盤10每次平行地改變180°方向而進行堆疊。因此,在如圖4(a)及(b)所示之3個托盤10中,位於正中間之托盤10配置有根據沿D-D’箭號線剖面之剖面。 The arrangement of the locking concave portion, the locking convex portion, and the first abutting portion when the plurality of trays 10 are stacked will be described with reference to FIGS. 3 and 4 . Figure 4(a) to (d) are diagrams showing the state of stacking the plurality of trays 10 according to the cross section along the C-C' arrow line shown in Fig. 1(a). In addition, in FIG. 4, the tray 10 is stacked every time the direction of 180 is changed in parallel. Therefore, in the three trays 10 shown in Figs. 4(a) and 4(b), the tray 10 located in the middle is disposed in a section according to the section along the arrow line D-D'.
卡止凸部13b及13f在略正方形的托盤10,夾著通過卡止凸部13b及卡止凸部13f之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。因此,如圖4(a)所示般,當每次平行地改變180°方向而堆疊各托盤10時,在位於最上方之托盤10中的卡止凸部13b之下方,配置有位於正中央之托盤10中的第一抵接部17e。再者,在位於正中央之托盤10的卡止凸部13f之下方,配置有位於其下方之托盤10中的第一抵接部17a。因此,當堆疊各托盤10時,如圖4(b)所示般,位於最上方之托盤10之卡止凸部13b之一部分,抵接於位於正中央之托盤10中的第一抵接部17e,且卡止凸部13b和卡止凹部13a不嵌合。同樣,位於正中央之托盤10中的卡止凸部13f,抵接於位於其下方之托盤10中的第一抵接部17a,卡止凸部13f和卡止凹部13e不嵌合。 The locking projections 13b and 13f sandwich the diagonal line above the locking convex portion 13b and the locking convex portion 13f in the slightly square tray 10 (that is, the B-B' shown in Fig. 1(a) Line) becomes an asymmetrical shape. Therefore, as shown in FIG. 4(a), when the respective trays 10 are stacked each time the direction of 180° is changed in parallel, the positioning convex portion 13b in the tray 10 located at the uppermost position is disposed in the center The first abutting portion 17e of the tray 10. Further, a first abutting portion 17a of the tray 10 located below is disposed below the locking convex portion 13f of the tray 10 located at the center. Therefore, when the trays 10 are stacked, as shown in FIG. 4(b), a portion of the locking projections 13b of the tray 10 located at the uppermost portion abuts against the first abutting portion in the tray 10 at the center. 17e, and the locking convex portion 13b and the locking concave portion 13a are not fitted. Similarly, the locking convex portion 13f in the tray 10 at the center thereof abuts against the first abutting portion 17a in the tray 10 located below, and the locking convex portion 13f and the locking concave portion 13e are not fitted.
同樣,如圖4(c)所示般,當每次平行地改變180°方向而堆疊各托盤10時,位於最上方之托盤10中的卡止凸部13h之下方,配置有位於正中央之托盤10中的第一抵接部17c。再者,在位於正中央之托盤10中的卡止凸部13d之下方,配置有位於其下方之托盤10中的第 一抵接部17g。因此,當堆疊各托盤10時,如圖4(d)所示般,位於最上方之托盤10之卡止凸部13h之一部分,抵接於位於正中央之托盤10中的第一抵接部17c,且卡止凸部13h和卡止凹部13c不嵌合。同樣,位於正中央之托盤10中的卡止凸部13d,抵接於位於其下方之托盤10中的第一抵接部17g,卡止凸部13d和卡止凹部13g不嵌合。 Similarly, as shown in FIG. 4(c), when the trays 10 are stacked each time the direction of 180° is changed in parallel, the locking convex portion 13h located in the uppermost tray 10 is disposed at the center. The first abutting portion 17c in the tray 10. Further, under the locking convex portion 13d in the tray 10 located in the center, the tray 10 located below it is disposed An abutting portion 17g. Therefore, when the trays 10 are stacked, as shown in FIG. 4(d), a portion of the locking projections 13h of the tray 10 located at the uppermost portion abuts against the first abutting portion in the tray 10 at the center. 17c, and the locking convex portion 13h and the locking concave portion 13c are not fitted. Similarly, the locking convex portion 13d in the tray 10 in the center thereof abuts against the first abutting portion 17g in the tray 10 located below, and the locking convex portion 13d and the locking concave portion 13g are not fitted.
如此一來,在托盤10之背面部,藉由使沿著基板20之外周之形狀而形成的卡止凸部13b、13d、13f及13h,在托盤10之表面部,抵接於第一抵接部17a、17c、17e及17g,可以在各托盤10中的表面部和背面部之間,於保持基板20之區域取得充分之空間(圖3(b))。另外,如圖4(a)~(d)所示般,在各托盤10中之第二抵接部17b、17d、17f及17h抵接於位於該些下方之托盤10之表面部之一部分。 In this manner, the locking projections 13b, 13d, 13f, and 13h formed along the outer circumference of the substrate 20 are brought into contact with the first abutment on the surface portion of the tray 10 at the back surface portion of the tray 10. The joint portions 17a, 17c, 17e, and 17g can obtain a sufficient space between the surface portion and the back surface portion of each tray 10 in the region where the substrate 20 is held (Fig. 3(b)). Further, as shown in FIGS. 4(a) to 4(d), the second abutting portions 17b, 17d, 17f, and 17h of the respective trays 10 abut against one of the surface portions of the trays 10 located below.
如圖4(a)~(d)所示般,在堆疊之各托盤10之間,基板20係在一個托盤10之表面部和另外托盤10之背面部之間,收納基板20(圖2(b)及圖3(b))。 As shown in FIGS. 4(a) to 4(d), between the stacked trays 10, the substrate 20 is placed between the surface portion of one tray 10 and the back portion of the other tray 10, and the substrate 20 is housed (FIG. 2 (FIG. 2) b) and Figure 3(b)).
在該狀態下,如圖3(c)所示般,被設置在位於上方之托盤10之背面部之卡止凸部13b,在較位於其下方之另外的托盤10之支撐部12e低之位置,抵接於第一抵接部17e。即使針對其他卡止凸部,同樣也在被設置 在較位於其下方之另外的托盤10之支撐部12e低之位置,抵接於第一抵接部。因此,當堆疊各托盤之時,藉由被設置在一個托盤10之背面部的卡止凸部13b、13d、13f及13h之傾斜的面,在從上面20b側卡止基板20之端部20a的狀態下,可以藉由使卡止凸部13b、13d、13f及13h抵接於第一抵接部而防止被施加該一個托盤10(或是被堆疊之複數托盤10及複數基板20)。因此,被收納於基板盒30之基板20之端部20a可以防止破損。 In this state, as shown in Fig. 3(c), the locking convex portion 13b provided on the back surface portion of the upper tray 10 is lower than the support portion 12e of the other tray 10 located below it. Abutting against the first abutting portion 17e. Even for other locking projections, it is also set The first abutting portion is abutted at a position lower than the support portion 12e of the other tray 10 located below. Therefore, when the respective trays are stacked, the end portion 20a of the substrate 20 is locked from the upper surface 20b side by the inclined faces of the locking projections 13b, 13d, 13f, and 13h provided on the back surface portion of one tray 10. In this state, the one tray 10 (or the plurality of stacked trays 10 and the plurality of substrates 20) can be prevented from being applied by causing the locking projections 13b, 13d, 13f, and 13h to abut against the first abutting portions. Therefore, the end portion 20a of the substrate 20 accommodated in the substrate cassette 30 can be prevented from being damaged.
再者,由於被形成在一個托盤10之背面部的卡止凸部13b、13d、13f及13h,在位於其下方之另外的托盤10之表面部卡止被支撐於支撐部12a~12e之基板20之端部20a之倒角部位a1,故不使托盤10接觸於基板20之上面20b,可以保持基板20,可以防止在基板20之上面20b產生刮傷(圖3(c))。 Further, the locking projections 13b, 13d, 13f, and 13h formed on the back surface of one tray 10 lock the substrate supported by the support portions 12a to 12e on the surface portion of the other tray 10 located below the tray 10. Since the chamfered portion a1 of the end portion 20a of the 20a is not brought into contact with the upper surface 20b of the substrate 20, the substrate 20 can be held, and scratching on the upper surface 20b of the substrate 20 can be prevented (Fig. 3(c)).
使用圖5及圖6針對被設置在與本實施型態有關之托盤10所具有之嵌合部14a~14n,進行詳細說明。圖5(a)及(b)係將另外的托盤10改變180°方向而堆疊在一個托盤10上之狀態的側面圖。圖6(a)及(b)係從與圖5(a)及(b)不同之側面,說明將另外的托盤10改變180°方向而堆疊在一個托盤10上之狀態之另外的側面圖。 The fitting portions 14a to 14n provided in the tray 10 according to the present embodiment will be described in detail with reference to Figs. 5 and 6 . 5(a) and (b) are side views showing a state in which the other trays 10 are changed in the 180° direction and stacked on one tray 10. 6(a) and 6(b) are side views showing another state in which the other trays 10 are stacked in a 180° direction and stacked on one tray 10, from the side different from those in Figs. 5(a) and 5(b).
圖5(a)及圖5(a)所示之被設置在托盤10之側面部的嵌合部14a~14n藉由朝向各圖之紙張之前方而突出 之凸部,和被形成在托盤10之背面部與該凸部嵌合之凹部而構成。再者,嵌合部14a~14n在側面視下,成為至少具有一個2層階差的凸形。 The fitting portions 14a to 14n provided on the side surface portions of the tray 10 shown in Figs. 5(a) and 5(a) are protruded toward the front of the sheets of the respective drawings. The convex portion is formed by a concave portion formed in the back surface portion of the tray 10 and fitted to the convex portion. Further, the fitting portions 14a to 14n have a convex shape having at least one step of two steps in a side view.
在圖5(a)所示之側面部中,由於位於一個托盤10上之另外的托盤10,改變180°方向而被配置,故位於上方之托盤10之嵌合部14a~14e,和位於下方之托盤10之嵌合部14h、14i、14l~14n被配置成相同方向。另外,在位於圖5(a)所示之一側面之相反側的側面部,於位於上方之托盤10,配置嵌合部14h、14i、14l~14n,在位於下方之托盤10,配置嵌合部14a~14e。因此,即使在位於圖5(a)之紙張之前方側及深側的側面部中之任一者,嵌合部之形狀也不會一致。 In the side surface portion shown in Fig. 5 (a), since the other tray 10 located on one tray 10 is disposed by changing the direction of 180, the fitting portions 14a to 14e of the tray 10 located above and below are located below. The fitting portions 14h, 14i, 14l to 14n of the tray 10 are arranged in the same direction. Further, in the side surface portion on the side opposite to the side surface shown in Fig. 5 (a), the fitting portions 14h, 14i, 14l to 14n are placed on the tray 10 located above, and the tray 10 is placed below. Parts 14a to 14e. Therefore, the shape of the fitting portion does not match even in any of the side portions on the side and the deep side before the sheet of FIG. 5(a).
如此一來,當平行地改變180°方向而配置托盤10時,在圖6(a)所示之另外的側面部,位於上方之托盤10之嵌合部14e~14h,和位於下方之托盤10之嵌合部14i~14k及14a被配置成相同方向。另外,在位於圖6(a)所示之側面部之相反側的側面部,於位於上方之托盤10,配置嵌合部14i~14k及14a,在位於下方之托盤10,配置嵌合部14e~14h。因此,即使在位於圖6(a)之紙張之前方側及深側的側面部中之任一者,嵌合部之形狀也不會一致。 In this way, when the tray 10 is placed in a 180° direction in parallel, the other side portions shown in FIG. 6(a), the fitting portions 14e to 14h of the upper tray 10, and the tray 10 located below The fitting portions 14i to 14k and 14a are arranged in the same direction. Further, in the side surface portion on the opposite side to the side surface portion shown in Fig. 6(a), the fitting portions 14i to 14k and 14a are disposed on the tray 10 located above, and the fitting portion 14e is disposed on the tray 10 located below. ~14h. Therefore, the shape of the fitting portion does not match even in any of the side portions on the side and the deep side of the sheet of the sheet of Fig. 6(a).
即是,當平行地改變180°方向而堆疊托盤10時,被形成在外周部之形狀為略正方形之托盤10之4側面的嵌合部14a~14n被配置成不會互相嵌合。 That is, when the trays 10 are stacked while changing the direction of 180° in parallel, the fitting portions 14a to 14n formed on the side faces of the trays 10 having the substantially square shape of the outer peripheral portion are disposed so as not to be fitted to each other.
在圖5(a)所示之一側面,嵌合部14a~14e、14h、14i、14l~14n分別設為具有2層之階差的凸形,在嵌合部14h、14i、14l~14n之從上方數起第1層之階差和第2層之階差之間,設置有第三抵接部15b、15d、15f及15h。 On one side shown in Fig. 5(a), the fitting portions 14a to 14e, 14h, 14i, and 14l to 14n are each formed into a convex shape having a step of two layers, and the fitting portions 14h, 14i, 14l to 14n are formed. The third abutting portions 15b, 15d, 15f, and 15h are provided between the step of the first layer and the step of the second layer from the top.
再者,在圖6(a)所示之另外的側面,嵌合部14e~14h、14i、14k及14a分別設為至少具有一個2層之階差的凸形,在嵌合部14i、14k、14a之從上方數起第1層之階差和第2層之階差之間,設置有第三抵接部16b、16d及16f。 Further, on the other side surface shown in Fig. 6 (a), the fitting portions 14e to 14h, 14i, 14k, and 14a are each formed into a convex shape having at least one step of two layers, and the fitting portions 14i, 14k are provided. The third abutting portions 16b, 16d, and 16f are provided between the step of the first layer and the step of the second layer from the top of 14a.
如圖5(a)所示般,當如此平行地改變180°方向而配置兩個托盤時,被設置在位於上方之托盤10之第三抵接部15a、15c、15e及15g,和被配置在位於上方之托盤10之嵌合部14h、14l~14n之第三抵接部15b、15d、15f及15h被配置成對。 As shown in FIG. 5(a), when the two trays are arranged in such a manner that the 180° direction is changed in parallel, the third abutting portions 15a, 15c, 15e, and 15g of the tray 10 located above are disposed, and are arranged. The third abutting portions 15b, 15d, 15f, and 15h of the fitting portions 14h, 14l to 14n of the tray 10 located above are arranged in pairs.
同樣,如圖6(a)所示般,被設置在位於上方之托盤10之第三抵接部16a、16c及16e,和被設置在位於下方之托盤10之嵌合部14h、14l~14n之第三抵接部16b、16d及16f被設置成對。另外,即使在圖5(a)及圖6(a)中無圖示之側面部,被設置在嵌合部14a~14n之抵接部也被配置成對。 Similarly, as shown in Fig. 6(a), the third abutting portions 16a, 16c, and 16e of the tray 10 positioned above and the fitting portions 14h, 14l to 14n of the tray 10 positioned below are provided. The third abutting portions 16b, 16d, and 16f are disposed in pairs. Further, even in the side portions (not shown) in FIGS. 5(a) and 6(a), the abutting portions provided in the fitting portions 14a to 14n are arranged in pairs.
當從圖5(a)所示之狀態,重疊上下兩個托盤10時,如圖6(b)所示般,第三抵接部15a和15b、第三抵 接部15c和15d、第三抵接部15e和15f、第三抵接部15g和15h成對被抵接。 When the upper and lower trays 10 are overlapped from the state shown in Fig. 5 (a), as shown in Fig. 6 (b), the third abutting portions 15a and 15b and the third abutment The joints 15c and 15d, the third abutting portions 15e and 15f, and the third abutting portions 15g and 15h are abutted in pairs.
同樣,從圖6(a)所示之狀態,當重疊上下兩個托盤10時,如圖6(b)所示般,第三抵接部16a和16b、第三抵接部16c及16d、第三抵接部16e和16f成對而被抵接。再者,即使在圖5(b)及圖6(b)中無圖示之側面部,被設置在嵌合部14a~14n之抵接部,和被設置在托盤10之側面部之底面的抵接部抵接。如此一來,藉由在外周部之形狀為略正方形之托盤10之4側面部,抵接各第三抵接部,並且,使在各嵌合部14a~14n之2層之階差中,位於上側之階差卡合於位於上方之托盤10之嵌合部14a~14n之內側之一部分,卡合位於上方之托盤10和位於下方之托盤10。 Similarly, from the state shown in Fig. 6 (a), when the upper and lower trays 10 are overlapped, as shown in Fig. 6 (b), the third abutting portions 16a and 16b and the third abutting portions 16c and 16d, The third abutting portions 16e and 16f are abutted in pairs. Further, even in the side portions (not shown) in FIGS. 5(b) and 6(b), the abutting portions provided in the fitting portions 14a to 14n and the bottom surface of the side surface portion of the tray 10 are provided. The abutment is abutted. In this way, the third side portions of the trays 10 having the substantially square shape in the outer peripheral portion are in contact with each of the third abutting portions, and in the step of the two layers of the respective fitting portions 14a to 14n, The step on the upper side is engaged with one of the inner sides of the fitting portions 14a to 14n of the upper tray 10, and the upper tray 10 and the lower tray 10 are engaged.
再者,如圖5(b)所示般,在第三抵接部15c和15d互相抵接之狀態下,如圖4(b)所示般,卡止凸部13f抵接於第一抵接部17a,卡止凸部13b抵接於第一抵接部17e。同樣,第三抵接部15i和15j成對而被抵接。即是,在第三抵接部互相抵接之狀態下,第一抵接部和卡止凸部互相抵接。如此一來,在與本實施型態有關之基板盒30中,第一抵接部和卡止凸部互相抵接,藉由使成對之第三抵接部互相抵接,可以防止由於位於上方之托盤10(或是被堆疊之複數托盤10及複數基板20)之重量,而使得力經由端部20a對被支撐於位在下方之托盤10之支撐部12a~12e的基板20過度施加。 Further, as shown in FIG. 5(b), in a state where the third abutting portions 15c and 15d are in contact with each other, as shown in FIG. 4(b), the locking convex portion 13f abuts against the first abutment. The receiving portion 17a abuts the locking convex portion 13b against the first abutting portion 17e. Similarly, the third abutting portions 15i and 15j are abutted in pairs. That is, in a state in which the third abutting portions abut each other, the first abutting portion and the locking convex portion abut each other. As a result, in the substrate cassette 30 according to the present embodiment, the first abutting portion and the locking convex portion abut each other, and by the pair of the third abutting portions abutting each other, it is possible to prevent the The weight of the upper tray 10 (or the plurality of stacked trays 10 and the plurality of substrates 20) is such that the force is excessively applied to the substrate 20 supported by the support portions 12a to 12e of the tray 10 positioned below via the end portion 20a.
如圖4(c)所示般,當使上下配置之兩個托盤10成為相同方向而配置時,在托盤10之側面部之嵌合部14a~14e(在相向之側面部,為嵌合部14h、14i、14l~14n)之配置一致。因此,如圖5(d)所示般,可以使位於上下之兩個托盤10互相嵌合。 As shown in Fig. 4(c), when the two trays 10 arranged in the vertical direction are arranged in the same direction, the fitting portions 14a to 14e on the side surface portions of the tray 10 (the fitting portions on the opposite side portions) The configurations of 14h, 14i, 14l~14n) are consistent. Therefore, as shown in FIG. 5(d), the two trays 10 located above and below can be fitted to each other.
同樣,如圖6(c)所示般,當使上下配置之兩個托盤10成為相同方向而配置時,在托盤10之側面部之嵌合部14e~14h(在相向之側面部,為嵌合部14i~14k及14a)之配置一致。因此,如圖6(d)所示般,可以使位於上下之兩個托盤10互相嵌合。 Similarly, as shown in FIG. 6(c), when the two trays 10 arranged in the vertical direction are arranged in the same direction, the fitting portions 14e to 14h on the side surface portions of the tray 10 are embedded in the opposite side portions. The configurations of the joints 14i to 14k and 14a) are the same. Therefore, as shown in FIG. 6(d), the two trays 10 located above and below can be fitted to each other.
再者,如圖5(c)及圖6(c)所示般,當使複數托盤10成為相同方向而疊層時,卡止凹部13a和卡止凸部13b卡合。同樣,可以卡合凹部13c和卡止凸部13d、卡止凹部13e和卡合凸部13f、卡止凹部13g和卡止凸部13h互相嵌合。而且,藉由被形成在托盤10之表面部的卡止部11a~11d所具有的階差包圍而形成的凹部,在托盤10之背面部,可以與藉由該階差所形成之凸部嵌合。 Further, as shown in FIGS. 5(c) and 6(c), when the plurality of trays 10 are stacked in the same direction, the locking recesses 13a and the locking projections 13b are engaged. Similarly, the engagement concave portion 13c and the locking convex portion 13d, the locking concave portion 13e and the engagement convex portion 13f, the locking concave portion 13g, and the locking convex portion 13h are fitted to each other. Further, the concave portion formed by the step formed by the locking portions 11a to 11d formed on the surface portion of the tray 10 can be embedded in the convex portion formed by the step on the back portion of the tray 10. Hehe.
因此,可以將複數托盤10收納成以成為相同方向之方式重疊複數托盤10而不會成為鬆厚(圖5(d)及圖6(d))。 Therefore, the plurality of trays 10 can be stacked so as to be in the same direction so as not to be loose (Fig. 5 (d) and Fig. 6 (d)).
使用圖7,針對與本實施型態有關之基板搬運器50,進行更詳細說明。圖7(a)係與本實施型態有關之基板搬運器50之俯視圖,圖7(b)係與本實施型態有關之基板搬運器50之側面圖。 The substrate carrier 50 according to this embodiment will be described in more detail with reference to Fig. 7 . Fig. 7(a) is a plan view of the substrate carrier 50 according to the present embodiment, and Fig. 7(b) is a side view of the substrate carrier 50 according to the present embodiment.
如圖7(a)及(b)所示般,基板搬運器50具備基板盒30、一對平板(板部)40及綑束帶(帶部)41。 As shown in FIGS. 7( a ) and ( b ), the substrate carrier 50 includes a substrate cassette 30 , a pair of flat plates (plate portions) 40 , and a binding tape (belt portion) 41 .
如此一來,藉由一對平板40把持由複數托盤10所構成之基板盒30,藉由綑束帶41進行綑束。依此,可以使基板盒30不會崩塌而適宜搬運。 In this manner, the substrate cassette 30 composed of the plurality of trays 10 is held by the pair of flat plates 40, and bundled by the binding tape 41. Accordingly, the substrate cassette 30 can be easily transported without being collapsed.
如圖7(a)所示般,平板40在俯視下之形狀為略正方形,在構成平板40之外周的4邊之中央部分設置有缺口部40a。平板40係以鋁等之金屬而被製作出。平板40係為了不使基板盒30崩塌而搬運,同時防止搬運時等基板盒30之破損,被配置在基板盒30之上下。缺口部40a之形狀並不特別限定,若為適宜進行藉由綑束帶41進行綑束之形狀即可。 As shown in Fig. 7(a), the flat plate 40 has a substantially square shape in plan view, and a notch portion 40a is provided at a central portion of the four sides of the outer periphery of the flat plate 40. The flat plate 40 is made of a metal such as aluminum. The flat plate 40 is conveyed so as not to cause the substrate cassette 30 to collapse, and is prevented from being damaged by the substrate cassette 30 during transportation, and is placed above and below the substrate cassette 30. The shape of the notch portion 40a is not particularly limited, and may be a shape that is bundled by the binding tape 41 as appropriate.
藉由使綑束帶41通過被設置在平板40之缺口部40a,可以防止藉由平板40上下把持基板盒30而進行綑束時,綑束帶41在平板40產生位置偏移之情形。依此,在搬運基板搬運器50之時,可以防止基板盒30之綑束鬆弛。 By passing the binding tape 41 through the notch portion 40a of the flat plate 40, it is possible to prevent the binding of the binding tape 41 to the flat plate 40 when the substrate cassette 30 is held up and down by the flat plate 40. Accordingly, the bundling of the substrate cassette 30 can be prevented from being slack when the substrate carrier 50 is transported.
綑束帶41係經由平板40而綑束基板盒30。綑束帶41若為可以綑束基板盒30和一對平板40時則並不加以限定,例如可以使用一般包裝所使用之扣帶型的綑束帶,或藉由加熱熔接之聚丙烯帶、橡膠等。 The binding tape 41 bundles the substrate cassette 30 via the flat plate 40. The binding tape 41 is not limited as long as it can bundle the substrate cassette 30 and the pair of flat plates 40. For example, a buckle type binding belt used in a general packaging or a polypropylene belt heated by welding may be used. Rubber, etc.
在與本實施型態有關之基板搬運器50中,使用兩條綑束帶,綑束一對平板40和基板盒30。在基板搬運器50中,在基板盒30之最上面和最下面配置平板40,使綑束帶通過在最上面之平板40的互相相向之缺口部40a,和相對於該相向之缺口部40a,在最下面之平板40中互相相向之缺口部40a,綑束基板盒30。 In the substrate carrier 50 according to this embodiment, a pair of flat plates 40 and a substrate cassette 30 are bundled using two binding bands. In the substrate carrier 50, the flat plates 40 are disposed on the uppermost and lowermost sides of the substrate cassette 30, and the binding tapes are passed through the mutually facing notches 40a of the uppermost flat plates 40, and the notched portions 40a with respect to the opposing faces. The substrate cassette 30 is bundled in the notch portion 40a facing each other in the lowermost flat plate 40.
如圖7(b)所示般,基板搬運器50係藉由一對平板40,經由該基板盒30之最上面和最下面把持由以樹脂成形之托盤10所構成的基板盒30。依此,可以防止為了搬運基板盒30而抬起時,基板盒30由於自重而撓曲的情形。依此,可以藉由基板盒30,適宜地搬運基板20。再者,由於藉由綑束帶41,經由一對平板40綑束基板盒30,故為了綑束基板盒30,藉由綑束帶41被施加之力均等地被施加在基板盒30之最上面及最下面。因此,可以適當地防止由於藉由綑束帶41被施加之力集中於基板盒30之一部分,使得構成基板盒30之托盤10破損之情形。 As shown in FIG. 7(b), the substrate carrier 50 holds the substrate cassette 30 composed of the resin-formed tray 10 via the pair of flat plates 40 via the uppermost and lowermost sides of the substrate cassette 30. Accordingly, it is possible to prevent the substrate cassette 30 from being bent due to its own weight when lifting the substrate case 30. Accordingly, the substrate 20 can be appropriately transported by the substrate cassette 30. Further, since the substrate cassette 30 is bundled via the pair of flat plates 40 by the binding band 41, the force applied by the binding tape 41 is equally applied to the most of the substrate cassette 30 in order to bundle the substrate cassette 30. Above and below. Therefore, it is possible to appropriately prevent the tray 10 constituting the substrate cassette 30 from being damaged due to the force applied by the binding band 41 being concentrated on one portion of the substrate cassette 30.
與本發明有關之基板盒並不限定於上述實施型態(第一實施型態)。例如,與一實施型態(第二實施型態)有關之基板盒中,一個托盤(收納部)係藉由其表面部所具備之卡止部之階差,從該基板之底面側支撐基板之端部,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,從該基板之上面側卡止基板之端部,依此保持基板。 The substrate cassette according to the present invention is not limited to the above-described embodiment (first embodiment). For example, in the substrate cassette relating to an embodiment (second embodiment), one tray (storage portion) supports the substrate from the bottom surface side of the substrate by the step of the locking portion provided on the surface portion thereof. At the end portion, the end portion of the substrate is locked from the upper surface side of the substrate by the locking convex portion on the back surface portion of the other housing portion located above the housing portion, thereby holding the substrate.
與本實施型態有關之基板盒30’在一個托盤10’之表面部的卡止部之階差之途中卡止基板20之端部20a之點,與托盤10不同(圖8(a)及(c))。再者,托盤10’係以將在一個托盤10’之卡止部之階差之途中被卡止之基板20之端部20a,從該基板20之上面側予以卡止的方式,調整被設置在位於該托盤10’之上方的另外托盤10’之背面部的卡止凸部之配置,隨此,在調整卡止凸部與表背一體成形之卡止凹部之配置之點,與托盤10不同(圖8(b)及(d))。除該些2點之外,托盤10’針對第一抵接部、第三抵接部及支撐部,具有與圖1所示之托盤10相同之配置。 The substrate cassette 30' according to the present embodiment is different from the tray 10 in that the end portion 20a of the substrate 20 is locked in the middle of the step of the locking portion of the surface portion of the tray 10' (Fig. 8(a) and (c)). Further, the tray 10' is adjusted so that the end portion 20a of the substrate 20 that is locked in the middle of the step of the locking portion of one tray 10' is locked from the upper surface side of the substrate 20. The arrangement of the locking projections on the back side of the other tray 10' located above the tray 10', and the arrangement of the locking recesses integrally formed by the locking projections and the front and back, and the tray 10 Different (Figures 8(b) and (d)). In addition to these two points, the tray 10' has the same arrangement as the tray 10 shown in Fig. 1 with respect to the first abutting portion, the third abutting portion, and the supporting portion.
因此,托盤10’與托盤10相同,可以每次平行地改變180°方向而進行堆疊。另外,針對在具有與托盤10相同功能之托盤10’的嵌合部、第一抵接部、第三抵接部及卡止凹部,省略其說明。 Therefore, the tray 10' is the same as the tray 10, and can be stacked every time the direction of 180 is changed in parallel. In addition, the description of the fitting portion, the first abutting portion, the third abutting portion, and the locking recess portion of the tray 10' having the same function as the tray 10 will be omitted.
如圖8(a)所示般,在基板盒30’中的托盤10’係在被設置在各托盤10’之表面部的階差之途中,從底面側卡止基板20之端部。再者,在圖8(a)所示之狀態下, 在一個托盤10’之表面部中,藉由位於支撐在基板20中的端部的托盤10上的另外托盤10’之卡止凸部,將基板之端部從上面側卡止該基板20之端部(圖8(b))。依此,基板20被收納在一個托盤10’之表面部,和位於該一個托盤10’之上方的另外托盤10’之背面部之間(圖8(a)及(b))。 As shown in Fig. 8 (a), the tray 10' in the substrate cassette 30' is engaged with the end portion of the substrate 20 from the bottom surface side while being placed on the step of the surface portion of each of the trays 10'. Furthermore, in the state shown in FIG. 8(a), In the surface portion of one tray 10', the end portion of the substrate is locked from the upper side by the locking portion of the other tray 10' located on the tray 10 supported at the end of the substrate 20 End (Fig. 8(b)). Accordingly, the substrate 20 is housed between the surface portion of one of the trays 10' and the back portion of the other tray 10' located above the one tray 10' (Figs. 8(a) and (b)).
在一個托盤10’中的卡止部11’c之階差,沿著基板20之外周部之形狀而彎曲,具有離支撐部12’e越遠越寬之傾斜。在此,卡止部11’c之階差係當基板20被收納於托盤10’之表面部之時,傾斜成圖2(d)所示之基板20中的端部20a之倒角部位a2被平行配置。另外,其他之卡止部也與圖8(c)所示之卡止部11’c相同,沿著基板20之外周部之形狀而彎曲,具有離支撐部12’e越遠越寬之傾斜。再者,其他之卡止部之階差也傾斜成在圖2(d)所示之基板20的端部20a之倒角部位a2被平行配置。依此,在該托盤10’之表面部,使基板20中的端部20a從該基板20之底面20c側經由倒角部a2而予以卡止(圖8(c))。 The step of the locking portion 11'c in one of the trays 10' is curved along the shape of the outer peripheral portion of the substrate 20, and has a width that is wider as the distance from the support portion 12'e is wider. Here, the step of the locking portion 11'c is inclined to the chamfered portion a2 of the end portion 20a of the substrate 20 shown in FIG. 2(d) when the substrate 20 is housed in the surface portion of the tray 10'. Are configured in parallel. Further, the other locking portions are also bent along the shape of the outer peripheral portion of the substrate 20, similarly to the locking portion 11'c shown in Fig. 8(c), and have a wider inclination from the support portion 12'e. . Further, the step of the other locking portions is also inclined so as to be arranged in parallel at the chamfered portion a2 of the end portion 20a of the substrate 20 shown in Fig. 2(d). As a result, the end portion 20a of the substrate 20 is locked from the bottom surface 20c side of the substrate 20 via the chamfered portion a2 on the surface portion of the tray 10' (Fig. 8(c)).
再者,如圖8(d)所示般,卡止凸部13’b係在抵接於第一抵接部17’e之狀態下,在具有其傾斜之面,卡止基板20之端部20a之倒角部位a1。再者,與卡止凸部13’b相同,其他卡止凸部也在具有其傾斜之面,卡止基板20之端部20a之倒角部位a1。在該狀態下,基板盒30’係在位於下方之托盤10’之支撐部12’d及12’e和基板20之底面20c之間,及位於該基板20之上面20b和該基 板20之上方的托盤10’之背面部之間的雙方,設置有空間。因此,基板盒30’可以藉由托盤10’接觸於較基板20之端部20a的倒角部位a1及a2更內側,防止在基板20之上面20b及底面20c產生刮傷。再者,由於即使在托盤10’,也設置有第一抵接部,故可以防止在基板20之端部20a由於托盤10’(或是,被堆疊之複數托盤10’及複數基板20)之重量,而使得力經由端部20a對被卡止於位在下方之托盤10’之卡止部的階差的基板20過度施加。 Further, as shown in FIG. 8(d), the locking projection 13'b is in the state of abutting against the first abutting portion 17'e, and has the inclined surface thereof to lock the end of the substrate 20. The chamfered portion a1 of the portion 20a. Further, similarly to the locking convex portion 13'b, the other locking convex portions also have the inclined surface thereof, and the chamfered portion a1 of the end portion 20a of the substrate 20 is locked. In this state, the substrate cassette 30' is disposed between the support portions 12'd and 12'e of the lower tray 10' and the bottom surface 20c of the substrate 20, and the upper surface 20b of the substrate 20 and the base. A space is provided between both sides of the back surface of the tray 10' above the plate 20. Therefore, the substrate cassette 30' can be prevented from being scratched on the upper surface 20b and the bottom surface 20c of the substrate 20 by the tray 10' contacting the inner side of the chamfered portions a1 and a2 of the end portion 20a of the substrate 20. Furthermore, since the first abutting portion is provided even in the tray 10', it is possible to prevent the end portion 20a of the substrate 20 from being attached to the tray 10' (or the plurality of stacked trays 10' and the plurality of substrates 20) The weight causes the force to be excessively applied to the substrate 20 that is locked by the step of the locking portion of the tray 10' positioned below via the end portion 20a.
另外,在與本實施型態有關之基板盒30’中,被設置在托盤10’之支撐部,並非隨時與被收納之基板20之底面20c接觸而進行支撐的構件。支撐部係當搬運基板盒30’時,由於衝擊使得基板20撓曲之時,或基板20由於自重撓曲等,以為了從背面支撐基板20而設置為佳。 Further, in the substrate case 30' according to the present embodiment, the support portion provided on the tray 10' is not a member that is in contact with the bottom surface 20c of the substrate 20 to be accommodated and supported. The support portion is preferably provided when the substrate 20 is handled, when the substrate 20 is deflected by an impact, or the substrate 20 is deflected by its own weight or the like in order to support the substrate 20 from the back surface.
與本發明有關之基板盒並不限定於上述實施型態(第一實施型態及第二實施型態)。例如,在與一實施型態(第三實施型態)有關之基板盒,背面部係具備第二抵接部18a~18h的構成,該第二抵接部18a~18h係與卡止凸部13”b、13”d、13”f及13”h相鄰接,並且於水平配置托盤10”之時,可以在較背面部中之最低面還高,且較背面部之最高面還低之位置,抵接於在另外的托盤10”之表面部中的最高面之一部分a~h。 The substrate cassette according to the present invention is not limited to the above-described embodiment (first embodiment and second embodiment). For example, in the substrate case relating to an embodiment (third embodiment), the back portion is provided with the second abutting portions 18a to 18h, and the second abutting portions 18a to 18h are coupled to the locking projections. 13"b, 13"d, 13"f, and 13"h are adjacent to each other, and when the tray 10" is horizontally disposed, it can be higher at the lowermost portion of the back portion and lower than the highest surface of the back portion. The position abuts on one of the highest faces in the surface portion of the other tray 10" a~h.
依此,當每次平行地改變180°方向而堆疊複 數托盤10”時,在各托盤10”之表面部和背面部之間,於保持基板20之區域可以取得充分之空間。 According to this, the stacking is repeated each time the direction of 180° is changed in parallel. In the case of the number of trays 10", a sufficient space can be obtained between the surface portion and the back surface portion of each tray 10" in the region where the substrate 20 is held.
圖9(a)所示般,托盤10”在表面部具備具有階差之卡止部11”a~11”d、具備有複數凹部r之支撐部12f和卡止凹部13”a、13”c、13”e及13”h。托盤10”係在其背面部具備卡止凸部13”b、13”d、13”f及13”h和第二抵接部18a~18g。再者,托盤10”在其側面部與第一實施型態有關之托盤10相同具有嵌合部14a~14n,各嵌合部具備第三抵接部。 As shown in Fig. 9(a), the tray 10" is provided with a locking portion 11"a to 11"d having a step, a supporting portion 12f having a plurality of concave portions r, and locking recesses 13"a, 13" on the surface portion. c, 13"e and 13"h. The tray 10" is provided with locking projections 13"b, 13"d, 13"f and 13"h and second abutting portions 18a-18g on the back side. Further, the tray 10" has fitting portions 14a to 14n in the same manner as the tray 10 according to the first embodiment, and each of the fitting portions includes a third abutting portion.
另外,由於托盤10”所具備之嵌合部及第三抵接部之形狀及功能與第一實施型態所涉及之托盤10具備的嵌合部及第三抵接部相同,故省略其說明。 In addition, since the shape and function of the fitting portion and the third abutting portion provided in the tray 10" are the same as those of the fitting portion and the third abutting portion of the tray 10 according to the first embodiment, the description thereof is omitted. .
圖9(b)為圖9(a)中之托盤10”之沿E-E’箭號線剖面圖。如圖9(b)所示般,托盤10”係在沿E-E’箭號線剖面中,卡止部11”a之階差和卡止部11”c之階差互相相向,具有離支撐部12f越遠越寬之傾斜。再者,在圖9(a)中之卡止部11”b之階差和卡止部11”d之階差互相相向。即是,卡止部11”a~11d”除藉由卡止凹部13”a、13”c、13”e及13”g,將設置在表面部之階差形成缺口之外,其他與托盤10之卡止部11a~11d相同。 Figure 9 (b) is a cross-sectional view along the E-E' arrow line of the tray 10" in Figure 9 (a). As shown in Figure 9 (b), the tray 10" is along the arrow along the E-E' In the line cross section, the step of the locking portion 11"a and the step of the locking portion 11"c face each other, and the inclination is wider as the distance from the support portion 12f is wider. Further, the step of the locking portion 11"b in Fig. 9(a) and the step of the locking portion 11"d face each other. That is, the locking portions 11"a to 11d" are formed by notching the recesses 13"a, 13"c, 13"e, and 13"g, and forming the step on the surface portion to form a notch, and other trays. The card stoppers 11a to 11d of 10 are the same.
圖9(c)為圖9(a)中之沿F-F’箭號線剖面圖。如圖9(c)所示般,在托盤10”之表面部形成有卡止凹部13”a及13”e。再者,在托盤10”之背面部,以使卡止凹部13”a及13”e之背面突出之方式,形成卡止凸部13”b及 13”f。再者,藉由使圖9(a)所示之被設置在托盤10”之表面部的卡止凹部13”c及13”g在背面部突出,形成有卡止凸部13”d及13”h。 Figure 9(c) is a cross-sectional view taken along line F-F' of Figure 9(a). As shown in Fig. 9(c), locking recesses 13"a and 13"e are formed on the surface portion of the tray 10". Further, in the back portion of the tray 10", the locking recess 13"a and a manner in which the back side of the 13" e protrudes to form a locking projection 13"b and 13"f. Further, the locking concave portions 13"c and 13"g provided on the surface portion of the tray 10" shown in Fig. 9(a) are protruded from the back surface portion, and the locking convex portion 13 is formed. "d and 13" h.
卡止凹部13”a、13”c、13”e及13”g除在俯視下之形狀為略正方形,及卡止凹部13”a和卡止凹部13”e夾著托盤10”之中心點而成為對稱性之形狀,卡止凹部13”c和卡止凹部13”g夾著托盤10”之中心點而成為對稱性的形狀之外,其他具有在托盤10中的與卡止凹部13a、13c、13e及13g相同的功能。 The locking recesses 13"a, 13"c, 13"e, and 13"g are slightly square in shape in plan view, and the locking recess 13"a and the locking recess 13"e sandwich the center of the tray 10" In the shape of the symmetry, the locking recess 13"c and the locking recess 13"g have a symmetrical shape sandwiching the center point of the tray 10", and the other has the locking recess 13a in the tray 10, 13c, 13e and 13g have the same function.
同樣,卡止凸部13”b、13”d、13”f、13”h也除了為略正方形,及卡止凸部13”b和卡止部凸部13”f夾著托盤10”之中心點而成為對稱性之形狀,卡止凸部13”d和卡止部凸部13”h夾著托盤10”之中心點而成為對稱性之形狀外,其他具有與在托盤10中的卡止凸部13b、13d、13f、13h相同的功能。 Similarly, the locking projections 13"b, 13"d, 13"f, 13"h are also slightly square, and the locking projections 13"b and the locking projections 13"f sandwich the tray 10" The center point becomes a symmetrical shape, and the locking convex portion 13"d and the locking portion convex portion 13"h sandwich the center point of the tray 10" to have a symmetrical shape, and the other has a card in the tray 10. The functions of the convex portions 13b, 13d, 13f, and 13h are the same.
如圖9(a)~(c)所示般,在與本實施型態有關之托盤10”中,藉由具備複數凹部r之支撐部12f,支撐基板20之底面20c。即使藉由如此之構成,在托盤10”之表面部,可以縮小支撐基板20之底面20c的面積。如圖9(b)及(c)所示般,被設置在支撐部12f之凹部r,雖然在托盤10”之背面部形成突出之凸部,但是該凸部不與被收納在位於下方之另外的托盤10”之表面部的基板20之上面20b 接觸。 As shown in Figs. 9(a) to 9(c), in the tray 10" according to the present embodiment, the bottom surface 20c of the substrate 20 is supported by the support portion 12f having the plurality of recesses r. In the surface portion of the tray 10", the area of the bottom surface 20c of the support substrate 20 can be reduced. As shown in FIGS. 9(b) and 9(c), the concave portion r provided in the support portion 12f has a convex portion formed on the back surface portion of the tray 10", but the convex portion is not accommodated in the lower portion. The upper surface 20b of the substrate 20 of the surface portion of the other tray 10" contact.
另外,在支撐部設置凹部之情況下,凹部之大小及數量因應收納之基板的形狀等而適當調整即可。 Further, when the concave portion is provided in the support portion, the size and the number of the concave portions may be appropriately adjusted depending on the shape of the substrate to be housed and the like.
使用圖10,針對與本實施型態有關之托盤10”所具備之第二抵接部,進行更詳細說明。如圖10(a)所示般,第二抵接部分別在俯視下為略正方形的卡止凹部13”a、13”c、13”e及13”h各設置成與互相相向之兩邊相鄰接。即是,第二抵接部分別在成為略正方形的卡止凸部13”b、13”d、13”f及13”g各設置成與互相相向之兩邊相鄰接。在此,當每次平行地使托盤10”旋轉180°一面進行堆疊之時,位於上方之托盤10”中的第二抵接部分別不與位於下方之另外的托盤10”中的第二抵接部互相重疊,抵接於該另外的托盤10”之表面部之一部分。 The second abutting portion provided in the tray 10" according to the present embodiment will be described in more detail with reference to Fig. 10. As shown in Fig. 10(a), the second abutting portions are respectively slightly in plan view. The square locking recesses 13"a, 13"c, 13"e, and 13"h are each disposed adjacent to the two sides facing each other. That is, the second abutting portions are respectively formed into a slightly square locking convex portion. 13"b, 13"d, 13"f, and 13"g are each disposed adjacent to the two sides facing each other. Here, when the tray 10" is rotated by 180° each time in parallel, the stacking is performed. The second abutting portions of the trays 10" do not overlap each other with the second abutting portions of the other trays 10" located below, and abut against one of the surface portions of the other trays 10".
圖10(a)係根據圖9(a)中之托盤10”之沿G-G’箭號線剖面圖,和根據沿H-H’箭號線剖面圖,說明一面使複數托盤10”每次平行旋轉180°一面進行堆疊之時,第二抵接部和托盤10”之表面部之一部分的配置的概略圖。另外,圖10(a)所示之3個托盤10”中,從上數起第1個及第3個之托盤10”表示根據沿G-G’箭號線的剖面,從上數起第2個的托盤10”表示根據沿G-G’箭號線的剖面。 Figure 10 (a) is a cross-sectional view along the G-G' arrow line according to the tray 10" in Figure 9 (a), and according to the cross-sectional view along the H-H' arrow line, one side of the plurality of trays 10" A schematic view of the arrangement of one of the surface portions of the second abutting portion and the tray 10" when stacked in parallel with a parallel rotation of 180°. In addition, in the three trays 10" shown in Fig. 10(a), from above The first and third trays 10" are shown in the section along the G-G' arrow line, and the second tray 10" from the top indicates the section along the arrow line along the G-G'.
如圖10(a)所示般,當每次平行地使3個托盤10”旋轉180°而配置時,被設置在位於上方之托盤10”之 背面的第二抵接部18g,被配置成位於處在正中央的托盤10”之表面部的最高面,且可以與卡止凹部13”g之開口之外周部分之一部分d抵接。在此,被設置在位於上方之托盤10”的卡止凹部13”e之一邊的第二抵接部18e,可以與被配置成位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分h抵接。再者,被設置在位於上方之托盤10”的卡止凹部13”e之一邊的第二抵接部18f,被配置成可以與位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分g抵接。 As shown in FIG. 10(a), when the three trays 10" are rotated by 180° in parallel each time, they are disposed in the upper tray 10" The second abutting portion 18g on the back surface is disposed so as to be located at the highest surface of the surface portion of the tray 10" at the center, and is abuttable with a portion d of the outer peripheral portion of the opening of the locking recess 13"g. Here, the second abutting portion 18e provided on one side of the locking recess 13"e of the upper tray 10" may be engaged with the locking recess 13"a of the other tray 10" disposed in the center One of the peripheral portions of the opening is abutted. Further, the second abutting portion 18f provided on one side of the locking recess 13"e of the upper tray 10" is disposed so as to be engageable with the locking recess 13"a of the other tray 10" located at the center One portion g of the outer peripheral portion of the opening abuts.
在該狀態下,被設置在位於正中央的托盤10”之背面的第二抵接部18a,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”g之開口之外周部分之一部分a抵接。在此,被設置在位於正中央之托盤10”的卡止凹部13”c之一邊的第二抵接部18c,被配置成可以與位於下方的另外的托盤10”之卡止凹部13”g之開口之外周部分之一部分e抵接。再者,被設置在位於正中央之托盤10”的卡止凹部13”c之一邊的第二抵接部18d,被配置成可以與位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分f抵接。 In this state, the second abutting portion 18a provided on the back surface of the tray 10" located at the center is disposed to be located at the highest surface of the surface portion of the tray 10" below, and can be engaged with the locking recess 13 A part a of the peripheral portion of the opening of the g is abutted. Here, the second abutting portion 18c provided on one side of the locking recess 13"c of the tray 10" located in the center is disposed to be located below The portion e of the outer peripheral portion of the opening of the locking recess 13"g of the other tray 10" abuts. Further, the second abutment of one of the locking recesses 13"c of the tray 10" located at the center The joint portion 18d is disposed so as to be abuttable with a portion f of the outer peripheral portion of the opening of the locking recess portion 13"a of the other tray 10" located at the center.
圖10(b)係根據圖9(a)中之托盤10”之沿I-I’箭號線剖面圖,和根據沿J-J’箭號線剖面圖,說明一面使複數托盤10”每次平行旋轉180°一面進行堆疊之時,第二抵接部和托盤10”之表面部之一部分的配置的概略圖。另外,圖10(a)所示之3個托盤10”中,從上數起第1個及第 3個之托盤10”表示根據沿I-I’箭號線的剖面,從上數起第2個的托盤10”表示根據沿J-J’箭號線的剖面。即是,如圖10(a)所示般,在重疊3個托盤10”之時,如圖10(b)所示般,根據沿I-I’箭號線剖面及沿J-J’箭號線剖面,複數托盤10”被重疊。 Figure 10 (b) is a cross-sectional view taken along line I-I' of the tray 10" in Figure 9 (a), and according to a cross-sectional view along the J-J' arrow line, the side of the plurality of trays 10" A schematic view of the arrangement of one of the surface portions of the second abutting portion and the tray 10" when stacked in parallel with a parallel rotation of 180°. In addition, in the three trays 10" shown in Fig. 10(a), from above Counting the first and the first The three trays 10" indicate the second tray 10' from the top according to the section along the I-I' arrow line, which indicates the section according to the arrow line along the J-J'. That is, as shown in FIG. 10(a), when three trays 10" are overlapped, as shown in FIG. 10(b), according to the I-I' arrow line section and along the J-J' arrow The line section, the plurality of trays 10" are overlapped.
如圖10(b)所示般,當每次平行地使3個托盤10”旋轉180°而配置時,被設置在位於上方之托盤10”之卡止凹部13”a之背面的第二抵接部18a,被配置成位於處於正中央之托盤10”之表面部之最高面,且可以與卡止凹部13”e之開口之外周部分之一部分a抵接,且被配置成第二抵接部18b可以與表面部之一部分b抵接。同樣,被設置在位於上方之托盤10”之卡止凹部13”g之背面的第二抵接部18h,被配置成位於處在正中央之托盤10”之表面部的最高面,且可以與卡止凹部13”g之開口之外周部分之一部分c抵接,且被配置成第二抵接部18g可以與表面部之一部分d抵接。 As shown in Fig. 10 (b), when the three trays 10" are rotated by 180° in parallel each time, the second abutment is provided on the back surface of the locking recess 13"a of the upper tray 10". The joint portion 18a is disposed so as to be located at the highest surface of the surface portion of the tray 10" at the center thereof, and is abuttable with a portion a of the outer peripheral portion of the opening of the locking recess portion 13"e, and is configured to be second abutted The portion 18b can abut against a portion b of the surface portion. Similarly, the second abutting portion 18h provided on the back surface of the locking recess 13"g of the upper tray 10" is disposed to be located in the center of the tray The highest surface of the surface portion of the 10" is abuttable with a portion c of the outer peripheral portion of the opening of the locking recess 13"g, and is disposed such that the second abutting portion 18g can abut against a portion d of the surface portion.
在該狀態下,被設置在位於正中央的托盤10”之卡止凹部13”e之背面的第二抵接部18e,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”a之開口之外周部分之一部分h抵接。再者,同樣,被設置在位於正中央的托盤10”之卡止凹部13”c之背面的第二抵接部18d,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”g之開口之外周部分之一部分f抵接。 In this state, the second abutting portion 18e provided on the back surface of the locking recess 13"e of the tray 10" located at the center is disposed so as to be located at the highest surface of the surface portion of the tray 10" below. Further, it is possible to abut against a portion h of the outer peripheral portion of the opening of the locking recess 13"a. Further, similarly, the second abutting portion 18d provided on the back surface of the locking recess 13"c of the tray 10" located at the center is disposed so as to be located at the highest surface of the surface portion of the tray 10" below. Further, it is possible to abut against a portion f of the outer peripheral portion of the opening of the locking recess 13"g.
如上述般,藉由配置第二抵接部18a~18h,當每次平行地使托盤10”旋轉而重疊時,將第二抵接部18a~18h位於卡止凹部13”a、13”c、13”e、13”g之開口之外周部分,且可以在托盤10”之表面部與最高面之一部分a~g抵接。 As described above, by arranging the second abutting portions 18a to 18h, the second abutting portions 18a to 18h are located at the locking recesses 13"a, 13"c when the trays 10" are rotated and overlapped each time in parallel. The outer peripheral portion of the opening of the 13"e, 13"g, and the surface portion of the tray 10" may abut against one of the highest surface portions a to g.
另外,即使在托盤10”中,也與托盤10及托盤10”之情況相同,藉由配合基板20之大小調整卡止部11”a~11”d之配置,使基板20之端部20a卡止於卡止部11”a~11”d當然亦可。 Further, even in the tray 10", as in the case of the tray 10 and the tray 10", the end portion 20a of the substrate 20 is card-carded by adjusting the arrangement of the locking portions 11"a to 11"d in accordance with the size of the substrate 20. It is of course also possible to stop the locking portions 11"a to 11"d.
與本發明有關之基板盒並不限定於上述實施型態(第一實施型態及第二實施型態)。例如,被設置在收納部之卡止凸部並不限定於互相相向之兩對凸部。 The substrate cassette according to the present invention is not limited to the above-described embodiment (first embodiment and second embodiment). For example, the locking convex portion provided in the accommodating portion is not limited to the two pairs of convex portions facing each other.
收納部之卡止凸部若為適當設計成因應基板之外周的形狀而卡止該基板之端部時,其配置及數量不被限定。同樣,收納部之卡止部之配置及數量也不被限定。構成基板盒之收納部若為在其表面部支撐基板,可以藉由被設置在另外的收納部之背面部的卡止凸部,卡止基板之端部,來保持該基板時即可,並不限定卡止凸部及卡止部之配置及數量。 When the locking convex portion of the accommodating portion is appropriately designed to lock the end portion of the substrate in accordance with the shape of the outer periphery of the substrate, the arrangement and the number thereof are not limited. Similarly, the arrangement and number of the locking portions of the accommodating portion are not limited. When the accommodating portion constituting the substrate cassette supports the substrate on the surface portion thereof, the end portion of the substrate can be locked by the locking convex portion provided on the back surface portion of the other accommodating portion, and the substrate can be held. The arrangement and the number of the locking projections and the locking portions are not limited.
因此,被收納於基板盒之基板之外周部的形狀也不被限定於圓形,及使為立方體或長方體亦可。收納部若為因應基板之形狀,適當地設計支撐部、卡止部及卡 止凸部之形狀及配置即可之故。 Therefore, the shape of the outer peripheral portion of the substrate housed in the substrate cassette is not limited to a circular shape, and may be a cube or a rectangular parallelepiped. If the accommodating portion is in accordance with the shape of the substrate, the support portion, the locking portion, and the card are appropriately designed. The shape and arrangement of the convex portion can be eliminated.
再者,與上述實施型態相同,在對位於下方的收納部,改變位於上方之收納部的方向而進行堆疊之構成的情況下,為從被各收納部之表面部支撐的基板之重心點等間隔分離的位置,若在配置基板20之外周端部的位置設置具有卡止凸部之傾斜的面即可。例如,在藉由被設置在合計3處的卡止凸部而卡止基板之構成中,若在該些3處之卡止凸部卡止基板的面,係以該基板之重心點為中心點,在配置基板之外周端部之圓周上,每次改變120°角度而配置即可。如此一來,在一面平行地改變方向一面堆疊各收納部之實施型態中,若形成具有各卡止凸部之傾斜的面,係以保持之基板之重心點為中心點,以等間隔分離,沿著該基板之外周之形狀時,被形成在收納部之卡止凸部之數量不被限定。 In the same manner as in the above-described embodiment, when the storage portion located below is placed in a direction in which the upper storage portion is changed and stacked, the center of gravity of the substrate supported by the surface portion of each storage portion is used. The position at which the spacers are separated at equal intervals may be provided with a surface having an inclination of the locking convex portion at a position at the peripheral end portion of the arrangement substrate 20. For example, in the configuration in which the substrate is locked by the locking projections provided in the total of three places, the surfaces of the locking portions of the three locking portions are centered on the center of gravity of the substrate. The point may be arranged on the circumference of the outer peripheral end portion of the arrangement substrate by changing the angle of 120° each time. In this embodiment, in the embodiment in which the storage portions are stacked while changing the direction in parallel, if the inclined surface having the respective locking projections is formed, the center of gravity of the substrate is held as a center point, and the surfaces are separated at equal intervals. When the shape is along the outer circumference of the substrate, the number of the locking projections formed in the housing portion is not limited.
而且,與另外的實施型態有關之基板盒中,在收納部的支撐部之形狀並不限定於以保持基板20之時之基板20之重心點為中心的圓狀。支撐部之形狀若配合應支撐基板的形狀,適當設計即可,即使形成以被支撐之基板的重心點為中心的圓弧狀亦可。 Further, in the substrate cassette according to another embodiment, the shape of the support portion of the housing portion is not limited to a circular shape centering on the center of gravity of the substrate 20 when the substrate 20 is held. The shape of the support portion may be appropriately designed in accordance with the shape of the support substrate, and may be formed in an arc shape centering on the center of gravity of the substrate to be supported.
再者,在與又另外的實施型態有關之基板盒中,卡止凸部具有與在基板之上面之外周端部線接觸的傾斜。即使藉由該構成,亦可以防止收納部之背面部接觸於較基板之上面的外周端部更內側。因此,可以防止在較基板之上面的外周端部更內側上產生刮傷。 Further, in the substrate cassette relating to still another embodiment, the locking projection has a slope which is in line contact with the outer peripheral end portion of the upper surface of the substrate. Even with this configuration, it is possible to prevent the back surface portion of the accommodating portion from coming into contact with the inner peripheral end portion of the upper surface of the substrate. Therefore, it is possible to prevent the occurrence of scratches on the inner side of the outer peripheral end portion of the upper surface of the substrate.
再者,在與又另外的實施型態有關之基板盒中,即使在收納部之表面部形成卡止凸部,形成有在收納部之背面部具有階差之卡止部的構成亦可。在收納部中,顯然表面部和背面部不會過於相對性的表現,即使在上述構成中,藉由僅卡止基板之端部,可以適當地保持基板。 Further, in the substrate cassette according to another embodiment, even if the locking convex portion is formed on the surface portion of the housing portion, a locking portion having a step on the back surface portion of the housing portion may be formed. In the accommodating portion, it is obvious that the surface portion and the back surface portion are not excessively expressed. Even in the above configuration, the substrate can be appropriately held by merely locking the end portion of the substrate.
本發明並不限定於上述各實施型態,能夠在請求項所示的範圍下做各種變更,即使針對將分別所揭示的技術手段與不同的實施型態做適當組合而得到的實施型態也包含在本發明之技術範圍內。 The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and even an embodiment obtained by appropriately combining the respective disclosed technical means and different embodiments can be used. It is included in the technical scope of the present invention.
本發明係可以適當地利用半導體晶圓基板或玻璃基板之搬運。 The present invention can suitably utilize the transportation of a semiconductor wafer substrate or a glass substrate.
10‧‧‧托盤(收納部) 10‧‧‧Tray (storage department)
11a、11b、11c、11d‧‧‧卡止部 11a, 11b, 11c, 11d‧‧‧ carding
12、12a、12b、12c、12d、12e‧‧‧支撐部 12, 12a, 12b, 12c, 12d, 12e‧ ‧ support
13a、13c、13e、13g‧‧‧卡止凹部 13a, 13c, 13e, 13g‧‧‧ locking recesses
13b、13d、13f、13h‧‧‧卡止凸部 13b, 13d, 13f, 13h‧‧‧ locking projections
14a、14b、14c、14d、14e、14e、14f、14g、14h、14i、14J、14k‧‧‧嵌合部 14a, 14b, 14c, 14d, 14e, 14e, 14f, 14g, 14h, 14i, 14J, 14k‧ ‧ fitting
17a、17c、17e、17g‧‧‧第一抵接部 17a, 17c, 17e, 17g‧‧‧ first abutment
17b、17d、17f、17h‧‧‧第二抵接部 17b, 17d, 17f, 17h‧‧‧ second abutment
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-194701 | 2015-09-30 | ||
JP2015194701A JP6652362B2 (en) | 2015-09-30 | 2015-09-30 | Substrate case, storage unit, and substrate transporter |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201727805A true TW201727805A (en) | 2017-08-01 |
TWI691011B TWI691011B (en) | 2020-04-11 |
Family
ID=58495148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105125311A TWI691011B (en) | 2015-09-30 | 2016-08-09 | Substrate case, compartment, and substrate transfer container |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6652362B2 (en) |
KR (1) | KR20170038683A (en) |
TW (1) | TWI691011B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI685050B (en) * | 2017-12-26 | 2020-02-11 | 日商Sumco股份有限公司 | Buffer body for packaging semiconductor wafer storage container |
TWI786306B (en) * | 2018-06-27 | 2022-12-11 | 日商村田機械股份有限公司 | Substrate carrier and substrate carrier stack |
TWI793341B (en) * | 2018-06-27 | 2023-02-21 | 日商村田機械股份有限公司 | Substrate carrier and substrate carrier stack |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6964952B2 (en) * | 2020-04-01 | 2021-11-10 | 旭テック株式会社 | Sheet tray |
TWI728922B (en) | 2020-10-07 | 2021-05-21 | 頎邦科技股份有限公司 | Storage device for flexible circuit packages and carrier thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427819Y2 (en) * | 1985-03-20 | 1992-07-03 | ||
JPH0817903A (en) | 1994-07-01 | 1996-01-19 | Ryoden Semiconductor Syst Eng Kk | Board case |
JPH08236605A (en) | 1995-02-28 | 1996-09-13 | Komatsu Electron Metals Co Ltd | Semiconductor wafer case |
AU750637B2 (en) * | 1998-11-30 | 2002-07-25 | Nippon Shokubai Co., Ltd. | Package, packing method and transporting method for brittle sheets |
JP2000226087A (en) * | 1998-11-30 | 2000-08-15 | Nippon Shokubai Co Ltd | Packaging body of fragile thin plate material and packaging method and transportation method |
JP2001148417A (en) | 1999-11-22 | 2001-05-29 | Mitsubishi Electric Corp | Housing case |
JP2002002695A (en) * | 2000-06-15 | 2002-01-09 | Kyocera Corp | Substrate storage tray and substrate package using the same |
JP2002145380A (en) | 2000-11-08 | 2002-05-22 | Sony Corp | Wafer packing method |
JP4329536B2 (en) * | 2003-12-26 | 2009-09-09 | アキレス株式会社 | Semiconductor wafer storage |
JP4999597B2 (en) | 2007-08-08 | 2012-08-15 | ミライアル株式会社 | Single wafer type wafer case |
-
2015
- 2015-09-30 JP JP2015194701A patent/JP6652362B2/en active Active
-
2016
- 2016-08-09 TW TW105125311A patent/TWI691011B/en active
- 2016-09-26 KR KR1020160122902A patent/KR20170038683A/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI685050B (en) * | 2017-12-26 | 2020-02-11 | 日商Sumco股份有限公司 | Buffer body for packaging semiconductor wafer storage container |
TWI786306B (en) * | 2018-06-27 | 2022-12-11 | 日商村田機械股份有限公司 | Substrate carrier and substrate carrier stack |
TWI793341B (en) * | 2018-06-27 | 2023-02-21 | 日商村田機械股份有限公司 | Substrate carrier and substrate carrier stack |
Also Published As
Publication number | Publication date |
---|---|
JP6652362B2 (en) | 2020-02-19 |
KR20170038683A (en) | 2017-04-07 |
JP2017069444A (en) | 2017-04-06 |
TWI691011B (en) | 2020-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI691011B (en) | Substrate case, compartment, and substrate transfer container | |
WO2016086469A1 (en) | Liquid crystal panel packaging box | |
CN101373725B (en) | Semiconductor chip storage tray | |
US9666468B2 (en) | Tray for a wafer with tape frame | |
TWI423911B (en) | Wafer container with overlapping wall structure | |
TW201022101A (en) | Reticle pod | |
TWI703075B (en) | Cushioning packaging device | |
KR100919292B1 (en) | Tray for carrying flat panel display device | |
CN103996646B (en) | Chip Carrier Structure | |
TWI608562B (en) | Structure of wafer carrier | |
TW200821234A (en) | Packing box for glass substrate and a package structure of a glass substrate using the same | |
JP7061857B2 (en) | Ring spacer | |
TWM487522U (en) | Chip bearing tray structure | |
JP2006082817A (en) | Blade case | |
JP2002334923A (en) | Electronic member container | |
TWI395691B (en) | Position plate | |
JP4811008B2 (en) | Pallet, optical component manufacturing method using the pallet, optical component packaging body and container | |
JP2004311779A (en) | Semiconductor wafer storage container and method for conveying semiconductor wafer | |
JPH06298290A (en) | Chip tray and chip package using the same | |
JPWO2004087535A1 (en) | Semiconductor wafer container | |
JP4064696B2 (en) | Pad for conveyance of plate-shaped body | |
CN108328054B (en) | Packaging structure for sheet products | |
TWI395698B (en) | Cushion within wafer container | |
CN110902142B (en) | Semiconductor wafer carrier and packaging method | |
TWM564028U (en) | Transporting device and supporting assembly thereof |