JP2001148417A - Housing case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing case capable of surely and easily performing transportation without damaging the surface of a disk and improving the efficiency of investment in plant and machinery. SOLUTION: This housing case 10 for housing the disk (semiconductor wafer W) is provided with a disk housing space 4 and a holding part 5 for holding the peripheral edge of the disk D. The disk is surely held by the holding part 5 and the disk is housed in the housing case 10 functioning as a cover for covering the disk and carried. Also, by joining the two housing cases 10 by connections 6 and combining them, a sheet type disk case for completely covering the disk is constituted. Further, by binding the sheet type disk cases piled up in plural stages by a holder, the case is used as the housing case capable of housing a plurality of disks as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer, C
D (Compact Disk), LD (Laser
The present invention relates to an accommodation case for accommodating a disk body such as a disk, and particularly preferably to a wafer case which is an accommodation case for a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, in handling a semiconductor wafer, tweezers for holding the semiconductor wafer and a single-wafer case for accommodating the semiconductor wafer have been provided separately. The tweezers are used to handle semiconductor wafers one by one, and tweezers 110 of a type in which a semiconductor wafer is picked and handled by a member processed with Teflon (registered trademark) as shown in FIG.
Alternatively, there is an air suction type tweezers 120 having a suction portion 121 as shown in FIG. In addition, as shown in FIG.
There was a single-wafer case 130 having a function of accommodating only one sheet. Further, the single-wafer case 130 is used for accommodating one semiconductor wafer, and when accommodating a plurality of semiconductor wafers collectively, a dedicated cassette case separate from the single-wafer case is used. Was.

[0003]

However, as the diameter of a semiconductor wafer increases, the mass of one semiconductor wafer increases as the diameter of the semiconductor wafer increases. However, there is a problem that the possibility of falling is increased.

Further, tweezers for handling a semiconductor wafer are provided separately from a single-wafer case for accommodating a semiconductor wafer, so that it is necessary to prepare them separately. Further, when handling a plurality of semiconductor wafers, since a cassette case separate from the single-wafer case accommodating the semiconductor wafers is used, a plurality of types of cases are required depending on the number of sheets to be handled (one or more). Had to be prepared. In order to handle semiconductor wafers in this way, it is necessary to separately prepare various types of tools such as tweezers, single-wafer cases, and cassette cases, thus requiring extra capital investment. Exists.

[0005] These problems are not limited to semiconductor wafers, but generally occur in all techniques for handling and storing a disk body that does not want to damage the surface of the disk.

In view of the above problems, it is a first object of the present invention to provide a storage case that can be transported reliably and easily without damaging the surface of a disk body.

It is a second object of the present invention to provide a storage case for improving capital investment efficiency.

[0008]

In order to achieve the above object, a storage case according to claim 1 is a storage case for storing a disk body, and is a semicircular top plate arranged substantially parallel to each other. Part and a bottom plate portion, a peripheral wall portion provided between an arc peripheral portion of the top plate portion and an arc peripheral portion of the bottom plate portion, and the disk body provided between the top plate portion and the bottom plate portion. It is characterized by comprising a unit storage case having a disk storage space for storing therein, and a holding portion provided inside the disk storage space and holding a peripheral portion of the disk body.

The housing case according to the second aspect is the first aspect.
Wherein the storage case is a wafer case that stores a semiconductor wafer as the disk body.

[0010] The housing case according to the third aspect is the first aspect.
Alternatively, the storage case according to claim 2, wherein the unit storage case further includes a connection portion for performing connection with another unit storage case, and the two unit storage cases use the connection portion. The semi-circular top plate portion and the bottom plate portion are connected to each other with their straight portions facing each other, thereby being configured as a single-leaf disc case.

The housing case according to the fourth aspect is the first aspect.
Alternatively, the storage case according to claim 2, further comprising: a holder body for holding a plurality of stacked unit storage cases, wherein the holder body holds the plurality of unit storage cases in a stacked state. Thus, a plurality of disc bodies are accommodated.

The housing case according to the fifth aspect is the fourth aspect.
Wherein the holder body is capable of adjusting the number of unit storage cases held in a stacked state.

The housing case according to the sixth aspect is the fourth aspect.
Or, the storage case according to claim 5, wherein the unit storage case further includes a connection portion for performing connection with another unit storage case, and the holder body includes two unit storage cases. A plurality of single-leaf disk cases configured by being connected to each other in a state where the straight portions of the semicircular top plate portion and the bottom plate portion face each other using a connection portion are held in a stacked state. By doing
It is characterized by accommodating a plurality of disc bodies.

According to the seventh aspect of the present invention, there is provided a storage case.
6. The storage case according to claim 5, wherein the holding portion sandwiches an upper surface and a lower surface of a peripheral portion of the disk body.

The housing case described in claim 8 is the first embodiment.
6. The storage case according to claim 5, wherein the holding portion is held in contact with an edge or a side surface of a peripheral portion of the disk body.

The housing case according to the ninth aspect is the first aspect.
9. The storage case according to claim 8, wherein the unit storage case has an information display section for displaying information unique to each disk body stored therein. .

[0017]

FIG. 1 is a perspective view showing an accommodating case 10 according to the present invention, and FIG. 2 is a perspective view showing an accommodating case 10 and a disk body accommodated (accommodated) therein. D is a top view showing FIG. Here, among the storage cases 10, the storage case 10 according to the first embodiment is particularly indicated by reference numeral 10A. FIG. 3 is an enlarged cross-sectional view near the holding unit 5 (described later), and FIG. 4 is an enlarged top view near the holding unit 5. As shown in these figures, the storage case 10 has a disk body D (see FIG. 2 and the like).
Is shown, and here, a wafer case for accommodating a substantially disk-shaped semiconductor wafer W as a disk body D is shown.

The housing case 10 includes a top plate 1 having a semicircular shape, a bottom plate 2 having a semicircular shape similar to the top plate 1, and an arc peripheral portion of the top plate 1 and a bottom plate 2. A peripheral wall portion 3 provided between the peripheral wall portion and the circular arc peripheral portion. Of these, the top plate 1 and the bottom plate 2 have a semicircular planar shape,
They are arranged so as to face each other substantially in parallel with their diameter portions (linear peripheral portions) aligned. Further, the peripheral wall portion 3 has a semicircular ring shape having a predetermined width, and the semicircular top plate portion 1.
(And the bottom plate 2).

The storage case 10 has a disk storage space 4 for storing the disk D. The disk storage space 4 is a space formed between the top plate 1 and the bottom plate 2 arranged substantially in parallel, and the disk body D is stored in the disk storage space 4.

Further, the holding case 5 is provided inside the peripheral wall 3 and holds the peripheral portion of the disk D.
Is provided in the disk accommodation space 4. The holding unit 5
Among them, the holding portion 5 according to the first embodiment is particularly denoted by reference numeral 5
A is also shown. As shown in FIG. 2, the storage case 10 includes a plurality of (here, two) holding portions 5 (see an enlarged top view in FIG. 4). FIG.
2, the top plate 1 (or the bottom plate 2) is omitted in order to show the situation inside the disk accommodation space 4.

FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 2. As shown in FIG.
It has a so-called “U” shape having a side member 51, an upper member 52 and a lower member 53. The side member 51 is fixed to the peripheral wall 3. In addition, both the upper member 52 and the lower member 53 have their side members 5
1 and are configured to bend in directions approaching each other. The top plate portion 1 existing outside the upper member 52 and the bottom plate portion 2 existing outside the lower member 53 have appropriate flexibility. Of the bottom plate 2 and the portion of the bottom plate 2 where the lower member 53 is present are sandwiched between the hands (fingers) or the like of the operator, so that the top plate 1 and the bottom plate 2, and thus the upper member 5.
2 and the lower member 53 bend in a direction approaching each other. Thus, the upper surface and the lower surface of the peripheral portion of the disk body D are formed by the spherical protrusion 54 provided inside (lower side) of the upper member 52 and the spherical protrusion 55 provided inside (upper side) of the lower member 53. Thus, the disk body D accommodated in the disk accommodation space 4 can be reliably held. Conversely, the holding state of the disk body D can be released by not applying the above holding force.

As described above, the holding section 5 can detachably hold the disk D, and functions as a so-called "tweezer" for holding the disk D.
The holding portion 5 can reliably hold the disk body with a simple configuration.

According to such a "tweezers" mechanism,
For example, as shown in the top view of FIG. 2, the storage case 10 is slid from the side to cover the disk D with respect to the disk D held horizontally by a predetermined mechanism (not shown), and The semiconductor wafer W which is the disk body D can be held by using the portion 5. Then, the disk body D can be freely transported in any posture. Here, the case where the disk body D having the horizontal posture is held has been described. However, the present invention is not limited to this, and it is also possible to hold the disk body D having an arbitrary posture such as upright. It is. For example, to transport a disk body D having an upright posture,
The storage case 10 from above with respect to the disk body D in the upright posture.
And the disk body D is
It is possible to freely transport the disk body D by holding the semiconductor wafer W, pulling it upward, or changing its posture.

Here, since the storage case 10 of the above embodiment has the holding portion 5 for holding the peripheral portion of the disk D (semiconductor wafer W), the disk D can be easily handled by the holding portion 5. It becomes possible. In addition, since the top plate portion 1, the bottom plate portion 2, and the peripheral wall portion 3 function as "covers" for protecting the surface of the disk body D, a reliable gripping operation using these cover portions can be performed, thereby ensuring the operation. The disk body D can be carried. As described above, according to the storage case 10, the disk body D can be transported reliably and easily. Furthermore, since the holding case 5 for holding the disk D is also provided in the housing case 10 for housing the disk D, the holding unit 5 for holding the disk D is prepared as a separate and independent tool. No need. Therefore, it is possible to make capital investment more efficient.

The holding section 5 (5A) has a disk body D
Since the upper surface and the lower surface of the peripheral edge portion are sandwiched, the disk body can be securely held with a simple configuration. Further, since the disk surface of the disk D is sandwiched only by the peripheral portion, and there is no contact with any portion other than the peripheral portion (eg, the central portion of the disk D), it is possible to prevent the disk surface from being damaged. Can also.

As described later, the storage case 10 is a minimum unit when used as a single-wafer type disk case or a case for storing a plurality of disk bodies by combining a plurality of the storage cases. (More specifically, “unit wafer case”).

<Embodiment 2> FIG. 5 shows a disk housing case 20 (hereinafter referred to as a "housing case 2") according to a second embodiment.
0 ”). This storage case 2
Numeral 0 denotes an accommodation case for accommodating a disk D (here, a semiconductor wafer W), and a sheet for accommodating one disk D (semiconductor wafer W) using two unit accommodation cases (unit wafer cases) 10. It is configured as a leaf-type disc case (single-wafer type wafer case). Specifically, as shown in FIG. The bottom plate 2 is configured to be connected to each other with the straight portions facing each other.

Each unit housing case 10 includes a connection portion 6 for connecting to another unit housing case 10.
Here, left and right connecting portions 6a and 6b of different types are connected by one.
(Two in total). These connecting portions 6a,
6b, when the linear portions of the unit storage case 10 having a semicircular shape are arranged so as to face each other, the connection part 6a of one unit storage case 10 and the connection unit 6a of the other unit storage case 10 The connection part 6b faces. When the two unit housing cases 10 are relatively moved in a direction approaching each other, the connection between the two unit housing cases 10 is realized by fitting these two connecting portions 6a and 6b.

FIG. 7 is an enlarged view of the fitting portion. The connecting portion 6a of the one unit housing case 10 is
1 and 62 and spherical concave portions 63 and 64, and the connecting portion 6 b of the other unit housing case 10 has a convex forming member 65 and spherical convex portions 66 and 67. Both connecting parts 6a, 6
b moves in the approaching direction, the recess forming members 61, 6
When the convex portion forming member 65 is inserted between the two and further moved in the same direction, the spherical convex portions 66 and 67
Engage. Thereby, the connection between both connection parts 6a and 6b is realized.

As shown in this embodiment, the storage case 20 can completely cover one disk D by connecting the two unit storage cases 10 to each other using the connection portion 6. It is configured as a possible single-leaf disc case. Therefore, when the disk D (semiconductor wafer W) is transported while being stored in the disk storage space (wafer storage space) 4, it is possible to eliminate the influence of dust existing in the atmosphere during the transportation. Also, 1
By using the cover portion that covers the entire disc body D, a more reliable gripping operation can be performed, so that the transport can be performed more reliably.

Here, the two storage cases 10 have the same shape so that each of the two storage cases 10 can be used as a unit storage case 10 to form the single-leaf disc case 20. ing. Thereby, without preparing separate cases, the combination thereof can be used as the storage case 10 of the first embodiment or as the single-wafer disk case 20 of the second embodiment, so that the efficiency of capital investment is improved. Can be achieved.

<Embodiment 3> FIG. 8 is a perspective view showing a disk body housing case 30. FIG. The disk housing case 30 according to the third embodiment among the disk housing cases 30 is particularly indicated by the reference numeral 30A.

As shown in FIG. 8, a disc body accommodating case 30 (hereinafter referred to as “accommodating case 30”) includes a plurality of (five in the figure) single-leaf disc cases 20 and a plurality of stacked A holder body 7 for holding the leaf-type disc case 20 (unit storage case 10). In addition,
The holder body 7 according to the third embodiment among the holder bodies 7 is particularly indicated by reference numeral 7A.

As shown in the side view of FIG. 9, the holder body 7 includes an upper support member 71, a lower support member 72, and a support member 73, and has a substantially U-shaped concave portion. Has formed. This holder body 7 is a single-wafer type disk case 2
The storage case 30 is configured by bundling and holding a plurality of 0 (unit storage cases 10) in a stacked state (stacked state). Thereby, the storage case 30
Can accommodate a plurality of disk bodies D,
For example, it functions as a “cassette case” for the semiconductor wafer W.

Therefore, according to the storage case 30, the single-wafer disc case 20 is
Since a plurality of (unit storage cases 10) are held in a stacked state, one
By accommodating each disk D one by one, a plurality of disks D can be accommodated. in this way,
Single-sheet type disk case 20 (unit storage case 10) without separately providing a container for accommodating a plurality of disk bodies D
Case 30 for accommodating a plurality of disk bodies D using
Can be configured, so that capital investment can be made more efficient.

In other words, the storage case 10 has a function of holding the disk D, a function of storing the disk D as a single-wafer type disk case, and a storage case (for example, a semiconductor wafer W) for storing a plurality of disks D. It can be said that it is a multifunctional storage case that can exhibit the function as a cassette case).

Here, one holder 7
The case where five single-leaf disc cases 20 are bundled using the description above has been described. However, by stacking another holder body 7 on the holder body 7, five more single-leaf disc cases can be bundled, A total of ten single-leaf disc cases 20 can be bundled. At this time, it is preferable to provide a mechanism for detachably fixing the holder bodies 7 in order to prevent the holder bodies from shifting during transportation. In this way, by increasing or decreasing the number of holder bodies 7, it is possible to adjust the number of single-wafer disk cases 20 that can be held by the housing case 30.

In this embodiment, the holder 7 holds and holds five single-leaf disc cases 20. However, the present invention is not limited to this, and an arbitrary number of single-leaf disc cases 20 may be bundled. May be retained. For example, a plurality of holder bodies 7 having different sizes in the vertical direction (that is, a size between the upper support member 71 and the lower support member 72) according to the number of the single-wafer type disk cases 20 that can be held are provided. Depending on the number of single-wafer type disk cases 20 to be prepared and held in advance, the plurality of holder bodies 7
May be used by selecting a holder body 7 having a corresponding holdable number. Thus, one holder body 7
It is also possible to increase or decrease the number of the single-wafer type disk cases 20 that can be held.

As described above, the holder body 7 is
By increasing or decreasing the number of single-sided disk cases, or by increasing or decreasing the number of holders 7 that can hold single-sided disk cases 20, the number of single-sided disk cases to be held in a stacked state is adjusted. Is possible. Therefore, by adjusting the number of single-wafer disc cases 20 held by the holder body 7 according to individual situations,
Since the weight of the storage case 30 during transportation can be adjusted, it is possible to avoid breakage or the like due to dropping due to transport of the overweight semiconductor wafer W, and to increase reliability during transportation. is there.

<Fourth Embodiment> FIG. 10 shows a fourth embodiment.
It is a perspective view which shows the storage case 10B concerning. This storage case 10B is a modification of the first embodiment, has the same configuration as the storage case 10A of the first embodiment, and further has an IC card and a tag (TAG) system (FA).
Tag) or the like. The information display section 8 is provided on the outer peripheral surface of the peripheral wall section 3 and can display various information (process information and the like) such as a lot number (key number), a wafer number, and a process code.
These pieces of information are peculiar information associated with each disk D stored in each storage case 10B, and are displayed on the liquid crystal display screen of the information display unit 8.

FIG. 11 shows an example of information displayed on the information display section 8. This information is stored in various memories (semiconductor memories) such as a RAM, an EEPROM, a flash memory, etc. existing inside the information display unit 8, and can be electrically read and written. Here, the lot number 123 is shown.
By confirming this information, the worker can know that the lot number of the disk D (semiconductor wafer W) stored in the storage case 10B is “123”. Therefore, it is possible to determine or confirm the processing content to be performed on the disk body D based on this information.

Here, the storage case 10B is
Since the information display unit 8 for displaying unique information attached to each disk D accommodated therein is provided, management for each disk D can be easily performed.

<Fifth Embodiment> FIG. 12 shows a fifth embodiment.
It is sectional drawing of 10 C of accommodating cases concerning this. The storage case 10C is different from the storage case 10A (Embodiment 1) and the storage case 10B (Embodiment 4) in having a holding portion 5B instead of the holding portion 5A (see FIG. 3 and the like). ing. The holding portion 5B has a bent member 56 which is bent at a central portion and has a substantially U-shaped cross section, and an elastic member (spring) 57. When the semiconductor wafer W moves in the direction of arrow A in the figure, the semiconductor wafer W is moved in a state where the bending member 56 has its upper end and lower end in contact with the top plate 1 and the bottom plate 2, respectively. By being pressed in between, it is sandwiched and held between the bending members 56. Note that the elastic member 57 plays a role of buffering the semiconductor wafer W held in such a manner.

Here, since the holding portion 5B of the storage case 10C holds the disk D in contact with the edge of the peripheral portion of the disk D, it is possible to prevent the disk D from coming into contact with the disk surface while ensuring the contact. Retention becomes possible.

Conversely, in order to release the holding state of the disk body D held by the holding portion 5, the arc edge of the storage case 10C having a semicircular shape is positioned above the straight edge. It is sufficient that the storage case 10C is tilted by a predetermined degree from the horizontal state. According to this, it is possible to release the holding state of the disk D using the weight of the disk D itself. Alternatively, even if the horizontal state is maintained, the holding state of the disk body D can be released by swinging the disk body D using the elastic force of the elastic member 57.

<Sixth Embodiment> A storage case 30B according to a sixth embodiment is a modification of the storage case 30A of the third embodiment. In the storage case 30A in which a plurality of single-wafer disk cases 20 are stacked. Each of the single-wafer disc cases 20 has a configuration in which the information display unit 8 (of the fourth embodiment) is provided.

FIG. 13 shows a plurality of single-wafer disc cases 2.
FIG. 4 is a side view illustrating a state in which the information display unit 8 is provided on each of the peripheral wall portions 0 of the first embodiment. In FIG. 13, a disc body D (semiconductor wafer W) housed in each of the information display sections 8 provided in each single-wafer disc case 20
Specific information about is provided. Here, the lot number “123” is displayed on the information display section 8a, the lot number “124” is displayed on the information display section 8b, and the lot number “124” is displayed on the information display section 8c. As described above, in the storage case 30 configured by bundling and holding the plurality of single-wafer disk cases 20 by the holder body 7, the disk bodies D (semiconductor wafer W) stored in each single-wafer disk case 20 are stored. Even if there are lots with different lot numbers, it is possible to carry these discs D together by identifying each disc D based on the information displayed on the information display unit 8. become.

Here, the single-wafer type disk case 20 is provided with the information display section 8 for displaying unique information attached to each disk body D accommodated therein, so that management for each disk body D is performed. It can be done easily. In particular, by displaying the process management information assigned to each disk D (semiconductor wafer W), it is also possible to bundle and transport separate disks D belonging to different lots by the holder 7. According to this, even when the number of disks D per lot is small (that is, in the case of small lot production), more efficient management becomes possible, and furthermore, small lot custom products (custom order products) Delivery times can also be shortened.

<Seventh Embodiment> A seventh embodiment is a modification of the fifth embodiment.
C (FIG. 14).

FIG. 14 is a sectional view of a unit storage case 10 (10D) according to the seventh embodiment. As shown in FIG. 14, the holding portion 5C has a substantially “U” -shaped leaf spring portion 58 having an opening on the disk body D (semiconductor wafer W) side. The leaf spring portion 58 includes a mounting substrate portion 58a used for mounting (fixing) to the peripheral wall portion 3 and a pair of upper and lower holding pieces 58b and 58c extending in directions extending from upper and lower edges of the mounting substrate portion 58a. And
The leaf spring portion 58 is fixed to the peripheral wall portion 3, and the size of the opening increases toward the center of the disk body D. Then, the disk body D (semiconductor wafer W) pushed into the leaf spring portion 58 is held by being sandwiched by the leaf spring portion 58 at an edge portion of a peripheral portion thereof.

According to this, since the holding portion 5C of the storage case 10D is held by using the edge of the peripheral portion of the disk D, it is possible to reliably hold the disk D while avoiding contact with the disk surface. become.

In the above-described fifth embodiment, the case where the disc D is tilted or swung to a predetermined degree when releasing the holding state of the disc D is exemplified, but the present invention is not limited to this. . For example, disk body D
The disk body D is brought into contact with the side surface of the
A mechanism (not shown) for pushing out from the housing case 10 at an arbitrary position (preferably, a semicircular shape) of the peripheral wall portion 3.
(In the vicinity of the center position of the arc) to forcibly release the holding state. In this case, since the release mechanism of the holding state is separately secured, the holding force of the holding unit 5 is increased so that the disk body D can be held regardless of the posture of the disk body D. Since the setting can be made, it is possible to more reliably hold the disk body D.

Here, as shown in the third embodiment, a housing case for housing a plurality of disk bodies D by stacking a plurality of single-leaf disk cases 20 formed using the unit housing case 10 (10D). 30 may be configured.

Further, each of the single-wafer disc cases 20 may have an information display section 8 (similar to that of the fourth or sixth embodiment). In this case, since each single-disc type disk case 20 has the information display section 8, the same effect as that of the sixth embodiment, that is, the effect of facilitating the management of each disk D can be obtained. Can be. Note that, in this case, the information display section 8 displays at least one of the unit storage cases 1 of the two unit storage cases 10 constituting each of the single-wafer disc cases 20.
0, and need not necessarily be provided in all unit housing cases 10. For example, the information display section 8 may be detachable from the unit housing case 10 and may be attached to one unit housing case 10 as necessary.

<Eighth Embodiment> FIG. 15 shows an eighth embodiment.
FIG. 2 is a perspective view showing a disk body storage case 40 (hereinafter, referred to as “storage case 40”) according to the first embodiment. In the third embodiment described above, the plurality of single-wafer disk cases 20 are held by
However, in the eighth embodiment, the storage case 40 is bundled and held by the holder body 7 in a state where a plurality of unit storage cases 10 each having a semicircular shape are stacked (stacked). Is configured.

According to the storage case 40 having such a structure, the semicircular unit storage cases 10 are held by the holder body 7 in a state where a plurality of unit storage cases 10 are stacked with their linear portions (diameter portions) aligned. By accommodating the disk bodies D in each unit accommodating case 10, a plurality of disk bodies D can be accommodated. Therefore, without separately providing a container for accommodating a plurality of disk bodies D,
Since the storage case 40 that stores the plurality of disk bodies D can be configured using the unit storage case 10,
Capital investment can be made more efficient.

As in the third embodiment, the number of the holders 7 may be increased or decreased, or the number of holders 7 that can hold the single-leaf disk case 20 may be increased or decreased. By adjusting the number of the unit storage cases 10 held by the holder body 7, it is possible to adjust the number of the unit storage cases 10 held in the stacked state. It is possible to increase reliability during transportation.

The storage case 40 can be used not only for transporting the disk D but also for temporarily storing the disk D temporarily.
In such a case, each of the disk bodies D accommodated by the accommodation case 40 is accommodated in the disk accommodation space 4 of the unit accommodation case 10 with a half exposed, so that the disk body D is taken out (or stored). ) Can be easily performed.

<Ninth Embodiment> FIGS. 16 and 17 show
It is a perspective view and a side view showing a storage case 30C according to a ninth embodiment. This storage case 30C is a modification of the third embodiment, and includes a holder body 7B instead of the holder body 7A. The holder body 7B includes a cylindrical support member 75, a lower member 76, and an upper support member 77. These members 75, 76, and 77 form a substantially U-shaped concave portion. I have. This holder body 7
B stores the plurality of single-wafer-type disc cases 20 in a stacked state by using the concave portions, thereby forming a storage case 30C. Thus, the storage case 30C can store a plurality of disk bodies D.

The upper support member 77 has a circular hole 77.
The hole 77a is configured to be fitted into the support member 75 and slidable with respect to the support member 75 in the up-down direction (the direction indicated by the arrow B). The upper support member 77 has a bolt 78, and a plurality of bolts 78 are provided on the side surface of the cylindrical support member 75 at intervals of a size H (thickness) in the height direction of the single-wafer disc case 20. Nut portion 79 is formed. The upper support member 77 can be fixed at a desired position on the support member 75 by screwing the bolt 78 to a nut portion 79 selected from the plurality of nut portions 79. At this time, it is possible to hold a desired number of single-wafer type disk cases 20 between the lower support member 76 and the upper support member 77. Thus, according to the storage case 30C,
It is possible to adjust the number of single-wafer disc cases 20 to be held in a stacked state. Therefore, the weight of the storage case 30 during transportation can be adjusted by adjusting the number of the single-wafer-type disk cases 20 held by the holder body 7B according to individual circumstances, so that an overweight semiconductor It is possible to avoid breakage or the like due to dropping caused by transporting the wafer W, and to increase reliability during transport.

<Modifications> In the above description, the unit housing case 10 has been described as having the connection portion 6 having the structure as shown in FIG. 1 (or FIG. 7). However, the present invention is not limited to this. Connection portion 6B having a configuration like 18
The unit storage case 10E provided with (6Ba, 6Bb) may be used. Specifically, this unit storage case 10E
Is one linear projection provided in parallel with the top plate 1 and the bottom plate 2 in the connection portion 6Ba;
Bb is provided with one linear concave portion provided in parallel with the top plate portion 1 and the bottom plate portion 2, and these convex portions and concave portions are fitted to each other to form two unit accommodation cases 10E. Connection is realized. Even in this case, 2
The single-wafer type disk case 20 can be configured by using two identically shaped storage cases 10E as unit storage cases.

Further, in each of the fifth and seventh embodiments, the holding portions 5B and 5C for holding the semiconductor wafer W using the edge of the peripheral portion are shown as the holding portions 5. Without being limited to the configuration, a holding unit that holds the side surface of the semiconductor wafer W may be used. For example, a configuration may be adopted in which the disk body D (semiconductor wafer W) is held in contact with a side surface portion instead of an edge of the peripheral portion so as to avoid contact with the disk surface of the disk body D. Specifically, in FIG.
Instead of 6, the holding member attached to the elastic member (spring) 57 causes the contact member that contacts the side surface of the semiconductor wafer W to contact the side surface portion of the peripheral portion of the semiconductor wafer W to hold the semiconductor wafer W. can do. Even in this case,
Reliable holding is possible while avoiding contact of the disk with the disk surface. However, in this case, the holding portion is arranged at a portion near both ends of the diameter so that the disk body D does not jump out of the disk housing space 4 when holding, and / or a material having a large friction coefficient ( For example, rubber)
It is particularly preferable to form the holding portion by using.

Further, in the above description, the semiconductor wafer W is exemplified as the disk body D, but the present invention is not limited to this.
It is preferable to avoid damage to the surface of a general disk (for example, a CD (Compact Disk),
The present invention can be applied to an LD (Laser Disk).

[0064]

As described above, according to the storage case of the first aspect, since the holding portion for holding the peripheral portion of the disk body is provided, the disk body can be easily handled by the holding portion. Becomes possible. In addition, top plate part, bottom plate part,
In addition, since the peripheral wall portion functions as a cover for protecting the surface of the disk body, a reliable gripping operation using these cover portions can be performed, and the transport can be reliably performed. Thus, according to this storage case, the disk body can be transported reliably and easily. Further, since the holding case is also provided with the holding portion for holding the disk body, it is not necessary to prepare the holding portion for holding the disk body as a separate and independent tool. Therefore, it is possible to make capital investment more efficient.

A storage case according to a second aspect is a wafer case for storing a semiconductor wafer as a disk.
A holding portion for holding a peripheral portion of the semiconductor wafer,
In addition, the top plate, the bottom plate, and the peripheral wall function as a cover for protecting the surface of the semiconductor wafer. The semiconductor wafer can be easily handled by the holding portion, and a reliable gripping operation using these cover portions can be performed, so that the semiconductor wafer can be transported reliably. Thus, according to this storage case, it is possible to transport the semiconductor wafer reliably and easily. Furthermore, since the holding unit for holding the semiconductor wafer is also provided, there is no need to prepare the holding unit for holding the semiconductor wafer as a separate and independent tool. Therefore, it is possible to make capital investment more efficient.

According to the storage case described in claim 3, 2
The two unit storage cases are connected to each other in a state where the straight portions of the semicircular top plate and the bottom plate are respectively opposed to each other using the connection portion, so that the single storage case is configured as a single-leaf disk case. The disk body can be entirely covered. Therefore, it is possible to eliminate the influence of dust in the atmosphere during transportation. In addition, by using a cover portion that entirely covers one disk body, a more reliable gripping operation can be performed, so that the disk can be transported more reliably.

According to the accommodating case of the fourth aspect, since a plurality of unit accommodating cases are held in a stacked state by the holder body, a plurality of unit accommodating cases are accommodated in each unit accommodating case, whereby a plurality of unit accommodating cases are accommodated. It becomes possible to accommodate a disk body. Therefore, it is possible to configure a storage case for storing a plurality of disk bodies using the unit storage case without separately providing a container for storing a plurality of disk bodies, so that capital investment can be made more efficient. .

According to the storage case of the fifth aspect, the number of unit storage cases held in a stacked state can be adjusted, so that the weight during transportation can be adjusted. Therefore, it is possible to increase the certainty during transportation by adjusting the number of unit storage cases held by the holder body according to individual situations.

According to the storage case of the present invention, since a plurality of single-leaf disk cases are held in a stacked state by the holder body, the disk body can be stored in each single-leaf disk case. Thus, a plurality of disk bodies can be accommodated. Therefore, it is possible to accommodate a plurality of discs using a single-wafer disc case without separately providing a container for accommodating a plurality of discs, thereby making it possible to make capital investment more efficient.

According to the storage case of the present invention, since the holding portion sandwiches the upper surface and the lower surface of the peripheral portion of the disk, the disk can be securely held with a simple configuration.

According to the accommodating case of the eighth aspect, the holding portion abuts against the edge or side surface of the peripheral portion of the disk body and holds the disk body. Holding is possible.

According to the accommodating case of the ninth aspect, the unit accommodating case is provided with the information display section for displaying unique information attached to each disk body accommodated therein.
Specific information such as process information assigned to each disk body can be displayed. Therefore, management for each disk body can be easily performed.

[Brief description of the drawings]

FIG. 1 is a housing case 10 according to a first embodiment of the present invention.
FIG.

FIG. 2 is a top view showing the storage case 10. FIG.

FIG. 3 is an enlarged sectional view taken along the line III-III in FIG. 2;

FIG. 4 is an enlarged top view of the vicinity of a holding unit 5;

FIG. 5 is a perspective view showing a storage case 20 according to a second embodiment.

FIG. 6 is an exploded perspective view of an accommodating case (single-leaf disc case) 20.

FIG. 7 is an enlarged view of a connection section 6;

FIG. 8 is a perspective view showing a storage case 30A according to a third embodiment.

FIG. 9 is a side view of the storage case 30A.

FIG. 10 is a perspective view showing a storage case 10B according to a fourth embodiment.

FIG. 11 is a side view showing an example of information displayed on the information display section 8;

FIG. 12 is a sectional view of a storage case 10C according to a fifth embodiment.

FIG. 13 is a partial side view of a storage case 30B according to a sixth embodiment.

FIG. 14 is a unit storage case 10D according to the seventh embodiment.
FIG.

FIG. 15 is a perspective view showing a storage case 40 according to an eighth embodiment.

FIG. 16 is a perspective view showing a storage case 30C according to a ninth embodiment.

FIG. 17 is a side view of a storage case 30C.

FIG. 18 is a perspective view illustrating a modification of the unit storage case.

FIG. 19 is a view showing a conventional tweezers 110.

FIG. 20 is a diagram showing a conventional tweezers 120.

FIG. 21 is a view showing a conventional single-wafer case 130.

[Explanation of symbols]

1 top plate part, 2 bottom plate part, 3 peripheral wall part, 4 disk accommodation space, 5, 5A, 5B, 5C holding part, 6, 6B, 6
a, 6b connection part, 7, 7A, 7B holder body, 8,
8a, 8b, 8c Information display section, 10, 10A to 10E
Storage case (unit storage case), 20 storage case (single-sheet type disk case), 30, 30A to 30C storage case (cassette case), 40 storage case (cassette case), D disk body, W semiconductor wafer, 1
10,120 tweezers, 130 sheet case.

 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 3E068 AA33 AB04 AB05 AC06 BB01 BB09 CC01 CD02 CD03 DD25 DD27 DE13 DE14 EE01 EE06 EE17 EE32 3E096 AA01 AA14 BA16 BB04 CA03 CB02 DA03 DA11 DA13 DB01 DB07 DC01 DC02 FA09 GA19 GA27 5F031 CA01 CA02 DA01 DA12 EA10 EA19 PA18

Claims (9)

[Claims] An accommodating case for accommodating a disk body, comprising: a semicircular top plate and a bottom plate arranged substantially in parallel with each other; an arc edge of the top plate; and an arc edge of the bottom plate. A peripheral wall provided between the top plate and the bottom plate; a disk storage space provided between the top plate and the bottom plate for storing the disk; and a peripheral edge of the disk provided inside the disk storage space. And a holding unit for holding the unit. 2. The storage case according to claim 1, wherein the storage case is a wafer case that stores a semiconductor wafer as the disk body. 3. The storage case according to claim 1, wherein the unit storage case further includes a connection portion for connecting to another unit storage case, and the two unit storages are connected to each other. The case is configured as a single-leaf disc case by being connected to each other in a state where the straight portions of the semicircular top plate portion and the bottom plate portion face each other using the connection portion. Storage case. 4. The storage case according to claim 1, further comprising: a holder body for holding a plurality of stacked unit storage cases, wherein the holder body includes a plurality of the unit storage cases. An accommodating case characterized by accommodating a plurality of discs by holding them in a stacked state. 5. The storage case according to claim 4, wherein the holder body is capable of adjusting the number of unit storage cases held in a stacked state. 6. The storage case according to claim 4, wherein the unit storage case further includes a connection portion for connecting to another unit storage case, and the holder body is A plurality of single-wafer type disc cases constituted by two unit accommodating cases being connected to each other in a state where the straight portions of the semicircular top plate portion and the bottom plate portion face each other using the connection portion An accommodating case characterized by accommodating a plurality of discs by holding them in a stacked state. 7. The storage case according to claim 1, wherein the holding portion holds an upper surface and a lower surface of a peripheral portion of the disk body. 8. The storage case according to claim 1, wherein the holding portion is held in contact with an edge or a side surface of a peripheral edge portion of the disk body. Storage case. 9. The storage case according to claim 1, wherein the unit storage case displays information unique to each disk body stored in the unit storage case. A housing case having a portion.