CN103996646B - Chip Carrier Structure - Google Patents

Abstract

The invention provides a structure of a chip bearing disc, which is used for placing a plurality of chips, the chip bearing disc of the invention is provided with a plurality of inverted alignment parts, the inverted alignment parts of one bearing disc with a plurality of chips and the inverted alignment parts of the other bearing disc without the chips are matched with each other, so that the bearing disc with the chips can be inverted and is inverted on the other bearing disc, thus the chips can be inverted and are actually inverted in the other bearing disc, in addition, the bearing disc is provided with a plurality of stack alignment parts, and the stack alignment parts are asymmetrically arranged on the bearing disc so as to assist the mutual stacking alignment of the bearing discs, namely, the stacking direction of the bearing discs which are stacked mutually is limited.

Description

Chip Carrier Structure

technical field

The present invention relates to a chip carrier, in particular to a structure of the chip carrier which is beneficial to flip-chip alignment and stack alignment.

Background technique

In the general chip (IC) manufacturing process, the carrier tray is usually used to place the chip. The carrier tray has multiple accommodating slots for placing the chip, so the IC tray (IC Tray) is used in the back-end process of the chip and transports the chip to the client. The above is an important holding container.

Chip on Glass (COG) is an advanced packaging technology that connects chips and substrates. Using flip chip (Flip Chip) technology, with anisotropic conductive film (ACF) as the intermediate interface, there will be gold The chip of the bump is bonded on the substrate; when it is applied to a liquid crystal display, it is called COG because the substrate is glass. The chip manufacturing process includes grinding, dicing, picking, visual inspection and packaging. The grinding process is a chip thinning process. The grinding process is to perform two processes of rough grinding and fine grinding on the back of the chip to thin the chip, which belongs to mechanical grinding.

The dicing process is to cut the wafer into chips for the later stage of die bonding (Die bond), wire bonding (Wirebond) and flip chip. Picking is to pick out the chip from the wafer and place it on the chip carrier, and finally check the appearance of the picked chip according to the customer's specification, and place the chip carrier in the packaging material required by the customer, and then pack it Shipped for finished product.

When performing chip bonding on a substrate, such as conductive glass, the chip is first taken out from the chip carrier plate, and then the chip is bonded to the substrate. However, the direction of bonding the chip to the substrate will be different for different bonding equipment. For example, the gold bump of the chip must face up and be pressed on the substrate, or the gold bump of the chip must face down and be pressed on the substrate. Therefore, when the chip When the direction of placing the chip on the carrier does not match the direction of the bonding equipment to press the chip on the substrate, the operator must first turn all the chips placed on the chip carrier and place them upside down on the chip carrier, which is very inefficient and time-consuming. Based on this problem, the existing industry has developed a double-sided chip carrier, but the cost of the double-sided chip carrier is higher than that of the single-sided chip carrier.

In order to facilitate transportation and save space, the chip carriers can be stacked on each other, but the chip carriers must be stacked together in a specific stacking direction. The conventional chip carrier does not have a special fool-proof mechanism to prevent the stacking direction from being wrong, so chips are prone to occur. The wrong direction of the carrier plate stack may easily cause abnormalities when the chip is pressed on the substrate. In addition, after placing the chip on the chip carrier, a protective paper will be placed on the chip carrier to cover the chip, such as Tyvek paper, to protect the chip. However, the conventional chip carrier does not have a structure for fixing the protective paper, so The protective paper is easy to shift, and if the protective paper is shifted, it is easy to cause poor stacking of the chip carrier.

It can be seen from the above that the conventional chip carrier has the following disadvantages. The first point is that it is not easy for operators to flip the chip from the conventional single-sided chip carrier and place it upside down in the chip carrier, and the error rate is high. It will increase the cost; the second point: the cost of double-sided chip carrier is higher than that of single-sided chip carrier. The stability of the disk manufacturing process is poor; the third point is that the conventional chip carrier does not have a fool-proof mechanism that specifically restricts the stacking direction, so it is easy to cause the chip carrier to stack in the wrong direction; the fourth point is that the conventional chip carrier cannot be fixed and protected Paper, so that the protective paper is easy to shift, and it is easy to cause poor stacking of the chip carrier tray.

In view of the above-mentioned shortcomings of the known technology, the present invention further improves the structure of the conventional chip carrier, and invents a structure of the chip carrier. The present invention provides a chip carrier, the chip carrier has multiple A flip-chip alignment piece and a plurality of stack alignment pieces, these flip-chip alignment pieces are convenient for the operator to turn over the chip carrying tray with the chip placed on another chip carrying tray, so as to flip the chip and place the other chip upside down In the carrier tray, the success rate of chip inversion is improved in this way. In addition, the stacking alignment parts are arranged on the chip carrier tray in an asymmetric manner to achieve the limitation of the stacking direction, and the protective paper can be fixed to avoid the offset of the protective paper .

Contents of the invention

One of the objectives of the present invention is to provide a chip carrier structure, which is convenient to turn over a chip carrier and put it upside down on another chip carrier, so as to turn over the chip in the chip carrier and put it upside down on this other chip carrier In this way, the labor cost of inverting the chip can be reduced, and the chip can be placed upside down in the chip carrier tray, thereby improving the success rate of the operation.

One of the objectives of the present invention is to provide a chip carrier structure, which has a structure that limits the stacking direction, so as to increase the stacking accuracy of the chip carrier.

One of the objectives of the present invention is to provide a chip carrier structure, which can fix the protective paper protecting the chip, so as to avoid the position deviation of the protective paper and avoid the occurrence of poor stacking of the chip carrier.

The invention discloses a structure of a chip carrier, which mainly includes a plurality of chip accommodation slots and a plurality of flip-chip alignment parts, and the flip-chip alignment parts are arranged on the upper surface of the chip carrier. In addition, the chip carrying plate further includes a plurality of stacking alignment elements, the stacking alignment elements are arranged on the chip carrying plate, and the stacking alignment elements are arranged asymmetrically.

The present invention discloses a structure of a chip carrier, which is used to flip chips to invert chips. The chip carrier mainly includes a first carrier and a second carrier, and the first carrier includes a plurality of first inverted chips. Alignment parts and a plurality of first chip accommodation slots, the second carrier tray includes a plurality of second flip chip alignment parts and a plurality of second chip accommodation slots, and the second flip chip alignment parts correspond to the some first flip-chip alignment parts, the second flip-chip alignment parts of the second carrier tray are matched with the first flip-chip alignment parts of the first carrier tray, the first carrier tray and the second carrier tray After the two carrier trays are turned upside down, the chips placed in the first chip accommodating grooves of the first carrier tray are turned over and placed in the second chip accommodating grooves of the second carrier tray upside down .

The present invention discloses another chip carrier structure, which limits the stacking direction of the chip carrier, and mainly includes a first carrier and a second carrier, and the first carrier includes a plurality of first stacking alignment parts and a plurality of first chip accommodating grooves, the first stacking alignment parts are arranged on the upper surface of the first carrier tray, and are arranged asymmetrically, and the second carrier tray includes a plurality of second stack alignment parts and A plurality of second chip accommodating grooves, the second stacking alignment parts correspond to the first stacking alignment parts, and are arranged on the bottom surface of the second carrier tray, the second stacking pairs of the second carrier tray The positioning parts are matched with the first stacking alignment parts of the first carrier tray, and the second carrier tray is stacked on the first carrier tray.

Furthermore, a protective paper is arranged on the first chip accommodating grooves, the protective paper is arranged between the first stacking alignment parts, and the protective paper is fixed on the first chip accommodating grooves .

Description of drawings

FIG. 1A: It is the first schematic diagram of the operation of the stacked carrier trays according to the first embodiment of the present invention;

FIG. 1B: It is the second schematic diagram of the operation of the stacked carrier trays according to the first embodiment of the present invention;

Fig. 2: it is the schematic diagram of the fixed protection paper of the first embodiment of the present invention;

Fig. 3: it is the structural representation of the second embodiment of the present invention;

FIG. 4A: It is the first schematic diagram of the operation of the inverted chip according to the third embodiment of the present invention;

FIG. 4B: It is the second schematic diagram of the operation of the inverted chip according to the third embodiment of the present invention;

FIG. 4C: It is the third schematic diagram of the operation of the inverted chip according to the third embodiment of the present invention;

FIG. 4D: It is a schematic diagram 4 of the operation of the inverted chip according to the third embodiment of the present invention;

Fig. 5: it is the schematic structural diagram of the fourth embodiment of the present invention;

FIG. 6A : It is the first schematic diagram of the operation of the stacked trays according to the fifth embodiment of the present invention;

FIG. 6B : It is the second schematic diagram of the operation of the stacking tray according to the fifth embodiment of the present invention; and FIG. 6C : It is the schematic diagram of the operation of the inverted chip according to the fifth embodiment of the present invention.

[Description of drawing number comparison]

10 First carrier plate

110 first substrate

120 First frame

1210 The first chip holding slot

1220 Storage tank for the second frame

130 First stack alignment parts

140 Third stack alignment piece

20 Second carrier tray

210 Second substrate

220 second frame

2210 Second chip holding slot

2220 First Frame Storage Tank

230 Second stack alignment piece

240 Fourth stack alignment piece

30 counterpoint

40 protective paper

50 chips

11 First carrier plate

111 First substrate

121 First frame

1211 The first chip holding slot

131 First Flip Chip Alignment

132 Flip Chip Alignment

141 Alignment parts for the third stack

21 Second carrier plate

211 Second substrate

221 Second frame

2211 Second chip holding slot

231 2nd stack aligner

241 Second Flip Chip Alignment

242 4th stack alignment piece

detailed description

In order to make the structural features of the present invention and the achieved effects have a further understanding and recognition, preferred embodiments and detailed descriptions are specially used, which are described as follows:

The present invention solves the problems related to the structure of the chip carrier in the prior art. In the process of bonding the chip to the substrate, the chip placed in the chip carrier sometimes needs to be turned over and placed upside down in the chip carrier. Flipping the chips one by one manually has a high error rate and is time-consuming, while using a double-sided chip carrier to place the chips costs a lot, and the stability of the manufacturing process of the double-sided chip carrier is poor. In addition, the conventional chip carrier The mechanism for preventing wrong stacking direction of the disc is insufficient, and the conventional chip carrier cannot fix the protective paper on the chip carrier. In order to overcome the above problems, the present invention provides a structure of the chip carrier.

First of all, please refer to FIG. 1A and FIG. 1B , which are schematic diagrams 1 and 2 of the operation of stacking trays according to the first embodiment of the present invention; as shown in the figures, this embodiment shows a second tray 20 Stacked on a first carrier plate 10, the plurality of first stacking alignment parts 130 of the first carrier plate 10 are matched with the plurality of second stacking alignment parts 230 of the second carrier plate 20, so that the The second carrier tray 20 is stacked on the first carrier tray 10 .

The first carrier tray 10 includes a first substrate 110, a first frame body 120 and the first stack alignment parts 130, the first frame body 120 is arranged on the first substrate 110, the first frame body 120 is arranged on the first substrate 110, the first frame body 120 A frame body 120 is smaller than the first substrate 110, and the first frame body 120 has a plurality of first chip accommodating grooves 1210, and the first stacking alignment parts 130 are asymmetrically arranged on the first frame body 120 and the second carrier 20 is stacked on the first carrier 10, the second carrier 20 includes a second substrate 210, a second frame 220 and the second stacking pairs Position member 230, the second frame body 220 is arranged on the second substrate 210, the second frame body 220 is smaller than the second substrate 210, and the second frame body 220 has a plurality of second chip accommodation The slots 2210 , and the second stacking alignment elements 230 corresponding to the first stacking alignment elements 130 are disposed on the bottom surface of the second substrate 210 , that is, are disposed on the bottom surface of the second carrier tray 20 . The above-mentioned asymmetrical arrangement means that the relative positions of the carrier plates are not provided with the same structure. As shown in FIG. 1A , the positions of the first stacking alignment parts 130 arranged on the left and right peripheral edges of the first frame body 120 are not the same, that is, the positions located on the left and right peripheral edges of the first carrier tray 10 The first stacking alignment elements 130 are not symmetrical, that is, the first stacking alignment elements 130 are arranged asymmetrically.

The first carrier tray 10 of the present invention has the first stacking alignment members 130 arranged asymmetrically, and the second carrier tray 20 has the second stacking alignment members corresponding to the first stacking alignment members 130 230, when the second carrier tray 20 is intended to be stacked on the first carrier tray 10, it is stacked according to the corresponding positions of the first stack alignment elements 130 and the second stack alignment elements 230, Since the second stacking alignment parts 230 must be respectively matched with the first stacking alignment parts 130, the second carrier tray 20 can be stacked on the first carrier tray 10, so that the second carrier tray 20 The direction of stacking on the first tray 10 is restricted.

The above-mentioned first stacking alignment members 130 of the present invention are convex members, and the second stacking alignment members 230 corresponding to the first stacking alignment members 130 are concave members, but the present invention is not limited to this The first stack alignment parts 130 and the second stack alignment parts 230 must be convex parts and concave parts respectively, which can be concave parts, convex parts or a combination of convex parts and concave parts. The positioning member 130 can be combined with the second stacking alignment members 230 by fitting, fixing or matching.

In addition, a first frame accommodating groove 2220 is provided on the bottom surface of the second substrate 210 of the second carrier tray 20, and the second stacking alignment parts 230 are disposed in the first frame accommodating groove 2220. The first stacking alignment parts 130 are matched with the second stacking alignment parts 230, and the first frame body 120 is accommodated in the first frame body accommodating groove 2220, thus increasing the first carrier plate 10 and Stack stability between the second carrier trays 20 .

Furthermore, the first tray 10 is further provided with a plurality of third stacking alignment parts 140, and these third stacking alignment parts 140 are arranged on the bottom surface of the first substrate 110, and these third stacking alignment parts 140 Corresponding to the plurality of stacking alignment members asymmetrically arranged on another carrier, this other carrier is the same or similar to the second carrier 20, so when the first carrier 10 is to be stacked on this other carrier When above, the third stacking alignment members 140 of the first carrier tray 10 must correspond to the stacking alignment members asymmetrically arranged on the other carrier tray, so that the first carrier tray 10 can be stacked on on this other carrier. From the above, it can be seen that the present invention uses asymmetric stacking alignment components on the carrier trays, so that the stacking directions between the carrier trays are limited. The present invention does not limit the third stacking alignment pieces 140 to be convex pieces, concave pieces or a combination of convex pieces and concave pieces. The third stacking alignment pieces 140 are to be fitted with corresponding stacking alignment pieces. , fixed or combined with other methods.

Furthermore, a second frame accommodating groove 1220 is provided on the bottom surface of the first carrier tray 10, and the third stacking alignment parts 140 are arranged in the second frame accommodating groove 1220, and the third stacking pairs The positioning member 140 is matched with the plurality of stacking alignment members of another carrier tray, and the frame body of the other carrier tray is accommodated in the second frame body accommodating groove 1220, so as to increase the connection between the first carrier tray 10 and the other carrier tray. Stack stability between carrier trays.

In addition, the second carrier tray 20 is further provided with a plurality of fourth stacking alignment parts 240, and these fourth stacking alignment parts 240 are asymmetrically arranged on the periphery of the second frame body 220, and these fourth stacking alignment parts The part 240 corresponds to a plurality of stacking alignment parts arranged asymmetrically on the bottom of another carrier, which is the same as or similar to the first carrier 10, so that when the other carrier is to be stacked on the second When the carrier tray 20 is on top, the stacking alignment members at the bottom of the other carrier tray must correspond to the fourth stack alignment members 240 asymmetrically arranged on the second carrier tray 20, and the other carrier tray The stacking direction between the second carrier tray 20 and the other carrier tray is limited. The present invention does not limit the fourth stacking alignment pieces 240 to be convex pieces, concave pieces or a combination of convex pieces and concave pieces. These fourth stacking alignment pieces 240 are to be fitted with corresponding stacking alignment pieces. , fixed or combined with other methods.

The second tray 20 of the present invention is stacked on the first tray 10 , and the first substrate 110 of the first tray 10 is stacked on the second substrate 210 of the second tray 20 . In addition, one corner of the first substrate 110 serves as a first alignment angle 310, and one corner of the second substrate 210 serves as a second alignment angle 320, and the shape of the second alignment angle 320 corresponds to the first alignment angle. The shape of the alignment angle 310, when the second carrier tray 20 is to be stacked on the first carrier tray 10, the first alignment angle 310 and the second alignment angle 320 are used to facilitate direct visual inspection by operators And the stacking directions of the first tray 10 and the second tray 20 are obtained. In an embodiment of the present invention, both the first alignment angle 310 and the second alignment angle 320 are cut corners.

As can be seen from the above description and illustration, in one embodiment of the present invention, the structure of the second carrier plate 20 is the same as that of the first carrier plate 10, so that it is convenient to develop molds and produce carrier plates, and only need to use the same mold The carrying plate of the present invention can be produced, and the cost is reduced. In addition, the first stacking alignment members 130 on the first tray 10 do not have to be arranged on the periphery of the first frame body 120 , they can also be arranged on the periphery of the first substrate 110 , or arranged on The peripheral edge of the first frame body 120 and the peripheral edge of the first substrate 110 may be disposed at other suitable positions according to usage requirements. The fourth stacking alignment members 240 located on the second carrier tray 20 can also be disposed on the periphery of the second substrate 210 . In other words, the first stacking alignment members 130 and the fourth stacking alignment members 240 of the present invention are respectively arranged on the upper surfaces of the first carrier tray 10 and the second carrier tray 20 , and the second The stacking alignment parts 230 and the third stacking alignment parts 140 are respectively disposed on the bottom surfaces of the second carrier tray 20 and the first carrier tray 10 .

In addition, please refer to FIG. 2 , which is a schematic diagram of the fixed protective paper in the first embodiment of the present invention; 40, the protective paper 40 is arranged between the first stack alignment parts 130, because the first stack alignment parts 130 are arranged around the first chip accommodating slots 1210, and the protective paper 40 Restricted by the first stacking alignment parts 130, and the first stacking alignment parts 130 cooperate with the second stacking alignment parts 230, so that the protective paper 40 is limited to the first chip accommodating groove 1210, so that the protective paper 40 is not easy to shift, but can indeed protect the chip, and will not cause the problem of poor stacking of the chip carrier tray. Wherein, the protective paper 40 is Tyvek paper.

Please also refer to FIG. 3 , which is a schematic structural diagram of the second embodiment of the present invention; as shown in the figure, in this embodiment, the first stack alignment members 130 and the fourth stack alignment members 240 are strip-shaped convex pieces, and the second stacking alignment pieces 230 and the third stacking alignment pieces 140 are strip-shaped concave pieces. Please refer to FIG. 1A, the first stacking alignment parts 130 and the fourth stacking alignment parts 240 shown in FIG. 1A are cylindrical protrusions, and the second stacking alignment parts 230 and the third stacking alignment parts The aligning member 140 is a cylindrical concave member, so it can be seen that the present invention does not limit the shape of these stacking aligning members. The shape of the first stacking alignment parts 130 is corresponding to the shape of the second stacking alignment parts 230, and is combined with each other in a manner of fitting, fixing or matching, and the third stacking alignment parts 140 and the third stacking alignment parts 140 The combination of the corresponding stack alignment parts is also combined with the mutual fitting, fixing or matching described in this paragraph. The combination of the fourth stack alignment parts 240 and its corresponding stack alignment parts is also the same. It is also combined in the ways of interfitting, fixing or matching described in this paragraph.

Please refer to FIG. 4A to FIG. 4D , which are schematic diagrams 1 to 4 of the action of the inverted chip of the third embodiment of the present invention; A plurality of chips 50 are placed upside down in a second carrier plate 21 . The plurality of first flip-chip alignment parts 131 of the first carrier tray 11 cooperate with the plurality of second flip-chip alignment parts 241 of the second carrier tray 21, so that the first carrier tray 11 can be turned over And put it upside down on the second carrier plate 21, so that the plurality of first chip accommodating grooves 1211 of the first carrier plate 11 correspond to the plurality of second chip accommodating grooves 2211 of the second carrier plate 21, so placed on The chips 50 in the first chip receiving slots 1211 are turned over and placed upside down in the second chip receiving slots 2211 of the second carrier tray 21 . Wherein, the second flip-chip alignment parts 241 of the second carrier tray 21 correspond to the first flip-chip alignment parts 131 of the first carrier tray 11, and the first flip-chip alignment parts 131 It may be the same as the first stack alignment members 130 in the foregoing embodiments.

The first tray 11 includes a first substrate 111, a first frame 121 and the first flip-chip alignment parts 131, the first frame 121 is arranged on the first substrate 111, and The first frame body 121 has the first chip accommodating slots 1211, and the first flip-chip alignment parts 131 are asymmetrically arranged on the periphery of the first frame body 121, and the first flip-chip alignment parts Components 131 can also be arranged on the periphery of the first substrate 111, or arranged on the periphery of the first frame body 121 and the periphery of the first substrate 111; the chips 50 are placed in the first chip containers respectively. Put it in the groove 1211. The second carrier 21 includes a second substrate 211, a second frame 221 and the second flip-chip alignment parts 241, the second frame 221 is arranged on the second substrate 211, and The second frame body 221 has the second chip accommodating grooves 2211, and the second flip chip alignment parts 241 are arranged on the periphery of the second frame body 221 corresponding to the first flip chip alignment parts 131. superior.

When turning over the chips 50 placed on the first carrier 11 and placing them upside down in the second carrier 21, as shown in FIG. 241 and the corresponding positions of the first flip-chip alignment parts 131 of the first carrier tray 11, flip the second carrier tray 21 on the first carrier tray 11, so that the second chip accommodating grooves 2211 corresponds to the first chip receiving slots 1211 , and let the second chip receiving slots 2211 correspond to the chips 50 placed in the first chip receiving slots 1211 . Afterwards, as shown in FIG. 4B, after the first carrier tray 11 and the second carrier tray 21 are turned over together, as shown in FIG. 4C, the first carrier tray 11 is placed upside down on the second carrier tray 21 , the chips 50 are placed upside down from the first chip receiving slots 1211 of the first carrier tray 11 into the second chip receiving slots 2211 of the second carrier tray 21 . Finally, the first carrier tray 11 is turned over from the second carrier tray 21 , as shown in FIG. 4D , that is, the action of turning over the chips 50 and placing them upside down in the second carrier tray 21 is completed.

Based on the above, the chip carrier of the present invention can be used for flipping chips. Flip the alignment member 131, and then turn the second carrier 21 over the first carrier 11, so that the first chip receiving grooves 1211 of the first carrier 11 will correspond to the second carrier The second chip accommodating grooves 2211 of the disc 21 are connected, and then flipped and inverted between the two, so that the chips 50 are placed upside down in the second chip accommodating grooves 2211 . The above-mentioned method eliminates the labor cost of chip inversion, and increases the success rate of chip inversion operations. Compared with the previous use of double-sided chip carrier trays, it is also cheaper, and the process stability of double-sided chip carrier trays is higher. Difference.

The above-mentioned first flip-chip alignment parts 131 of the present invention are convex parts, and the second flip-chip alignment parts 241 corresponding to the first flip-chip alignment parts 131 are concave parts, but the present invention does not It is not limited that the first flip chip alignment parts 131 and the second flip chip alignment parts 241 must be convex parts and concave parts respectively, and both may be concave parts, convex parts or a combination of convex parts and concave parts, The first flip-chip alignment elements 131 can be combined with the second flip-chip alignment elements 241 by fitting, fixing or mating.

Please also refer to FIG. 5 , which is a schematic structural view of a fourth embodiment of the present invention; as shown in the figure, in this embodiment, the first flip-chip alignment parts 131 include strip-shaped convex parts and concave parts, The second flip-chip alignment parts 241 also include strip-shaped convex parts and concave parts, so that the two can cooperate with each other. Please refer to FIG. 4A, the first flip chip alignment parts 131 and the second flip chip alignment parts 241 shown in FIG. 4A are cylindrical convex parts and cylindrical concave parts respectively, so it can be seen that the present invention is not limited to The shapes of the flip-chip alignment parts, the shapes of the first flip-chip alignment parts 131 and the shapes of the second flip-chip alignment parts 241 are corresponding to each other, and are combined by mutual fitting, fixing or matching.

Please refer to FIG. 6A to FIG. 6C together, which are schematic diagrams of the operation of the stacked carrier tray and the operation diagram of the inverted chip according to the fifth embodiment of the present invention; as shown in the figure, this embodiment and the third embodiment (FIG. 4A) The difference is that the second carrier tray 21 is further provided with a plurality of second stacking alignment members 231, and these second stacking alignment members 231 correspond to the first flip-chip alignment members 131, and are arranged on the second On the bottom surface of the substrate 211 , the second stacking alignment parts 231 are matched with the first flip chip alignment parts 131 , so that the second carrier 21 can be stacked on the first carrier 11 . It can be seen from the above that the first flip-chip alignment elements 131 have a stacking function, which is the same as that of the first stacking alignment elements 130 shown in FIG. 1A .

Furthermore, the first carrier tray 11 is further provided with a plurality of third stacking alignment members 141, and the third stacking alignment members 141 are asymmetrically arranged on the bottom surface of the first substrate 111, and the second carrier tray 21 is further Further set a plurality of fourth stack alignment parts 242, these fourth stack alignment parts 242 correspond to the third stack alignment parts 141, and are arranged on the periphery of the second frame body 221, these fourth stack alignment parts 242 The aligning member 242 can cooperate with the third stacking aligning members 141 , as shown in FIG. 6B , so that other carrier trays same as the first carrier tray 11 are stacked on the second carrier tray 21 .

In addition, a plurality of upside-down alignment parts 132 are arranged on the first carrier tray 11, and these upside-down alignment parts 132 correspond to the fourth stack alignment parts 242 of the second carrier tray 21, that is, the upside-down alignment parts 242 The aligning components 132 cooperate with the fourth stacking aligning components 242 , so that, as shown in FIG. 6C , the second tray 21 can be turned over and placed on the first tray 11 upside down. Afterwards, according to the action shown in FIG. 4B , the first carrier tray 11 and the second carrier tray 21 are turned over. As shown in FIG. 4C, the first carrier plate 11 is placed upside down on the second carrier plate 21, that is, the second chip accommodating grooves 2211 of the second carrier plate 21 correspond to those of the first carrier plate 11. The first chip receiving grooves 1211 are thus turned over and the chips located in the first chip receiving grooves 1211 are turned upside down in the second chip receiving grooves 2211 .

As can be seen from the above, the first flip-chip alignment members 131 of the first tray 11 not only have the function of inversion alignment, but also have the function of stack alignment, and the fourth trays of the second tray 21 In addition to the function of stack alignment, the stack alignment member 242 also has the function of inversion alignment. It can be seen from the above description and illustration that the first carrier tray 11 of this embodiment is the same as the second carrier tray 21 , which is convenient for production.

To sum up, the present invention provides a structure of a chip carrier, which has a plurality of flip-chip alignment parts. The flip-chip alignment parts of a carrier tray of these chips cooperate with the flip-chip alignment parts of another carrier tray without chips, so that the carrier tray with these chips can be turned over and and place them upside down on the other carrier, so that the chips will be turned over and indeed placed upside down in the other carrier. The chip carrying plate of the present invention can be used to flip the chip to invert the chip, which reduces the cost of inverting the chip and increases the success rate and efficiency of the inversion chip operation.

In addition, the chip carrier tray of the present invention further includes a plurality of stacking alignment parts, and these stacking alignment parts are asymmetrically arranged on the carrier tray. When the second carrier tray is to be stacked on the first carrier tray, the second carrier tray The stacking alignment parts of the disk must be matched with the stacking alignment parts of the first carrier tray, so that the second carrier tray can be successfully stacked on the first carrier tray, because the stacking alignment parts are arranged asymmetrically , so these stack alignment parts limit the stacking direction of the two carrier trays, so as to avoid the error of the stacking direction when the two carrier trays are stacked, and have the function of limiting the stacking direction.

Furthermore, protective paper is provided on the plurality of chip accommodating slots of the carrier tray, and the protective paper is arranged between the stacking alignment parts, and these stacking alignment parts will fix the protective paper protecting the chips, so the protective paper It is limited above the first chip accommodating grooves, so as to prevent the protective paper from deviating from the chip accommodating grooves, thereby avoiding the problem of poor stacking of the chip carrier trays.

The above is only a preferred embodiment of the present invention, and is not intended to limit the implementation scope of the present invention. All equivalent changes and modifications made in accordance with the shape, structure, characteristics and spirit described in the scope of the claims of the present invention shall be included in the scope of the claims of the present invention.

Claims (19)

1. a kind of structure of chip bearing disc, is suitable to upside-down mounting and is arranged on another chip bearing disc, it is characterised in that it is included：

Multiple chip containing grooves；And

Multiple first upside-down mounting para-position parts, are arranged at the upper surface of the chip bearing disc；

The upper surface of wherein another chip bearing disc has multiple second upside-down mounting para-position parts, when the upper surface of the chip bearing disc When relative with the upper surface of another chip bearing disc, those the first upside-down mounting para-position parts are right each other with those the second upside-down mounting para-position parts Should, so that the upper surface of the chip bearing disc is fixed on separately by those the first upside-down mounting para-position parts and those the second upside-down mounting para-position parts The upper surface of one chip bearing disc.

2. the structure of chip bearing disc as claimed in claim 1, it is characterised in that further include:

One substrate；And

One framework, is arranged at the substrate, and those chip containing grooves are arranged at the framework；

Wherein, those the first upside-down mounting para-position parts are arranged at the substrate and/or the framework.

3. the structure of chip bearing disc as claimed in claim 2 a, it is characterised in that wherein corner of the substrate is a para-position Angle.

4. the structure of chip bearing disc as claimed in claim 1, it is characterised in that wherein those the first upside-down mounting para-position parts are in non- Symmetric arrays.

5. the structure of chip bearing disc as claimed in claim 1, it is characterised in that further include:

Multiple storehouse para-position parts, are arranged at the chip bearing disc, and those storehouse para-position parts are in asymmetric geometry.

6. the structure of chip bearing disc as claimed in claim 5, it is characterised in that wherein more enter on those chip containing grooves One step arranges a protection sheet, and the protection sheet is arranged between those storehouse para-position parts.

7. a kind of structure of chip bearing disc, it is characterised in that it is included：

One first carrier, comprising multiple first upside-down mounting para-position parts and multiple first chip containing grooves, those the first upside-down mounting para-positions Part is arranged at the upper surface of first carrier；And

One second carrier, comprising multiple second upside-down mounting para-position parts and multiple second chip containing grooves, those the second upside-down mounting para-positions Part corresponds to those the first upside-down mounting para-position parts, and those the second upside-down mounting para-position parts are arranged at the upper surface of second carrier, when this The upper surface of one carrier in the face of the upper surface of second carrier when, those the first upside-down mounting para-position parts and those second upside-down mountings pair Position part corresponds to each other；

Wherein, those the second upside-down mounting para-position parts of second carrier are matched with those the first upside-down mounting para-positions of first carrier Part, first carrier overturns with second carrier and after inversion, is positioned over those first chips appearances of first carrier The multiple chips for putting groove are reversed, and are inverted in those second chip containing grooves of second carrier, and

The upper surface of first chip bearing disc is fixed on by those the first upside-down mounting para-position parts and those the second upside-down mounting para-position parts The upper surface of second chip bearing disc.

8. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein first carrier is further included:

One first substrate；And

One first framework, is arranged at the first substrate, and those first chip containing grooves are arranged at first framework；

Wherein, those the first upside-down mounting para-position parts are arranged at the first substrate and/or first framework；

Second carrier is further included:

One second substrate；And

One second framework, is arranged at the second substrate, and those second chip containing grooves are arranged at the second framework；

Wherein, those the second upside-down mounting para-position parts are arranged at the second substrate and/or the second framework.

9. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein those the first upside-down mounting para-position parts with should A little second upside-down mounting para-position parts are in asymmetric geometry.

10. the structure of chip bearing disc as claimed in claim 7, it is characterised in that wherein second carrier is further Comprising multiple storehouse para-position parts, those storehouse para-position parts to should the first carrier those the first upside-down mounting para-position parts, and arrange In the bottom surface of second carrier, those storehouse para-position parts of second carrier be matched with first carrier those first Upside-down mounting para-position part, and second carrier is stacked over first carrier.

The structure of 11. chip bearing discs as claimed in claim 7, it is characterised in that wherein first carrier further includes many Individual storehouse para-position part, those storehouse para-position parts are arranged at the bottom surface of first carrier, and in asymmetric geometry.

12. a kind of structures of chip bearing disc, it is characterised in that it is included：

One first carrier, comprising multiple first storehouse para-position parts and multiple first chip containing grooves, those the first storehouse para-positions Part is arranged at the upper surface of first carrier, and in asymmetric geometry；And

One second carrier, comprising multiple second storehouse para-position parts and multiple second chip containing grooves, those the second storehouse para-positions Part corresponds to those the first storehouse para-position parts, and is arranged at the bottom surface of second carrier；

Wherein, those the second storehouse para-position parts of second carrier are matched with those the first storehouse para-positions of first carrier Part, and second carrier is stacked over first carrier.

The structure of 13. chip bearing discs as claimed in claim 12, it is characterised in that wherein first carrier is further included:

One first substrate；And

One first framework, is arranged at the first substrate, and those first chip containing grooves are arranged at first framework；

Wherein, those the first storehouse para-position parts are arranged at the first substrate and/or first framework；

Second carrier is further included:

One second substrate；And

One second framework, is arranged at the second substrate, and those second chip containing grooves are arranged at the second framework；

Wherein, those the second storehouse para-position parts are arranged at the bottom surface of the second substrate.

The structure of 14. chip bearing discs as claimed in claim 12, it is characterised in that wherein first carrier is further Comprising multiple 3rd storehouse para-position parts, those the 3rd storehouse para-position parts are arranged at the bottom surface of first carrier, and in non-right Claim arrangement.

The structure of 15. chip bearing discs as claimed in claim 12, it is characterised in that wherein second carrier is further Comprising multiple 4th storehouse para-position parts, those the 4th storehouse para-position parts are arranged at the upper surface of second carrier, and in non- Symmetric arrays.

The structure of 16. chip bearing discs as claimed in claim 15, it is characterised in that wherein first carrier is further wrapped Containing multiple upside-down mounting para-position parts, those upside-down mounting para-position parts of first carrier are arranged at the upper surface of first carrier, and right Should be in those the 4th storehouse para-position parts of second carrier, and second carrier further includes multiple upside-down mounting para-position parts, Those upside-down mounting para-position parts of second carrier are arranged at the upper surface of second carrier, and corresponding to first carrier Those the first storehouse para-position parts, those upside-down mounting para-position parts of second carrier are matched with those first heaps of first carrier Stack para-position part, and those upside-down mounting para-position parts of first carrier are matched with those the 4th storehouse para-positions of second carrier Part, after first carrier flips upside down with second carrier, those first chips for being positioned over first carrier are housed Multiple chips of groove are reversed, and are inverted in those second chip containing grooves of second carrier.

The structure of 17. chip bearing discs as claimed in claim 12, it is characterised in that wherein second carrier is further wrapped Containing multiple upside-down mounting para-position parts, those upside-down mounting para-position parts are arranged at the upper surface of second carrier, second carrier those Upside-down mounting para-position part corresponding to first carrier those the first storehouse para-position parts, those upside-down mounting para-position parts be matched with those first Storehouse para-position part, after first carrier and second carrier flip upside down, be positioned over first carrier those first Multiple chips of chip containing groove are reversed, and are inverted in those second chip containing grooves of second carrier.

The structure of 18. chip bearing discs as claimed in claim 12, it is characterised in that wherein those first chip containing grooves it On a protection sheet is further set, the protection sheet is arranged between those the first storehouse para-position parts.

The structure of 19. chip bearing discs as claimed in claim 12, it is characterised in that a wherein corner of first carrier For one first pair of parallactic angle, and a corner of second carrier is one second pair of parallactic angle, and the shape of second pair of parallactic angle is to should The shape of first pair of parallactic angle.