201036227 六、發明說明： 【發明所屬之技術領域】 ^ 本發明係關於一種沉積材料供應裝置及一種具有該沉積材料供 應裝置之基板處理裝置，更具體而言，係關於一種沉積材料供應 裝置及一種包含該沉積材料供應裝置之基板處理裝置，該沉積材 料供應裝置於不使該有機材料劣化之條件下儲存大量有機材料並 汽化一所需量之該有機材料至一基板。 【先前技術】 因有機發光裝置（organic light emitting devices : OLEDs )不同 於液晶顯示裝置（liquid crystal display devices )之自發光裝置， 故其無需一背光燈，因此，其功率消耗較低。此外，因有機發光 裝置具有寬視角及高響應速度，故包含有機發光裝置之一顯示裝 置可顯示具有一寬視角之改良影像而無殘留影像。 不同於無機材料，在用於製造有機發光裝置之一有機薄層沉積 製程中所用之有機材料無需一高蒸氣壓力，且於高溫下容易轉變 及分解。由於有機材料之此等特徵，藉由以下方式形成一相關技 術之有機薄層：加載有機材料於由鎢形成之一槽内，加熱該槽以 汽化該有機材料並沉積該有機材料於一基板上。然而，因儲存於 一槽内之沉積材料之量有限，故應頻繁地加載沉積材料於該槽 内，因而應頻繁地使一有機薄層沉積裝置停機。為延長一有機薄 層沉積裝置之一運作停止週期，可增加原材料之加載量。於此種 情況下，須增加由一加熱構件產生之熱量以加熱用於儲存該原材 料及汽化該原材料之一較大槽，從而導致所欲沉積之原材料劣化。 201036227 【發明内容】 本發明提供〜插 裝置之基板處理材料供應裝置及—種包含該沉積材料供應 延長一沉積裝置該沉積材料供應裝置儲存大量有機材料以 之一運作停止週期並防止該有機材料劣化。 =明亦提供〜種沉積材 應裝置之基板處理_ s 4 匕3 ^積材料供 -所需量之術2 積材料供應裝置以一所需速度a化 Ο 子有機材料，以防止汽化有機材料不均 根據—眘存丨 頌政。 中 ，實施例，—種沉積材料供應裝置包含：一 Γ儲存空間與-汽化空間互相連通，該儲存空間填充有槽，其 t，該原材料係於該汽化空間中汽化；-運送單元，tr原村 於該储存，之_料至該汽；地 Ο 使該眉材料、ΙΓ之熱 1於該槽之該汽化空間之—外側，用以供應 °亥/几積材料供應裝置可更肖 該槽之讀儲存空間之-外二 部早凡’該冷卻單元設置於 村科出現熱劣化。 ，以防止儲存於該館存空間中之該眉 =單元可包含-冷卻套(_ngjacket) 二通道，該冷料道環繞該狀—外表面 匕含- 该冷卻通道中。 冷郃劑流動於 側供應裳置可更包含:-連接管，該連接管之1 連接_之該汽化空間，以形成—通道十 第- 於該通道中；以及一噴 …飞化原材料流動 15連接至朗接管之—第二倒，用以 201036227 喷射該汽化原材料。 該沉積材料供應裝置可更包含—支撑部件，係整體地支料 槽、戎運送單u該喷射器，其中該切部件係安裝於—軌道^ 並可沿該軌道移動，該軌道係延伸於該喷射器之—定向方向。 該連接管之該第-側可與一輕合構件相連接而 螺紋耦合至該槽。 件係 錢接管可具有一直徑介於約20毫米至約毫米間。 該沉積材料供應裝置可更包含一噴射量測量感測器用以測量 自該喷射器射人之該原材料之—噴射量，其中該沉積材料供應裝 置根據該喷射量測量感測器所測量之該原材料之該噴射量，控制 该運送單元之一運作，以便調整該原材料之該喷射量。 該槽之該汽化空間之一内壁上可裝設一金屬片。 、該運送單it可包含：―頭部’設置於該槽中，用以推動該原材 料；一桿’具有—第—側連接至該頭部’-第二侧則設置於該槽 之一外側，該桿係與該頭部整體地移動；以及一驅動部件，連接 至該桿之該第二侧，用以移動該桿。 該驅動部件可包含一馬達與一液壓缸其中之一。 s力熱單元可包含一核心加熱器（c〇reheater)與一燈加熱器其 中 - 〇 根據另一實例性實施例，一種基板處理裝置包含：一腔室，具 有反應空間；一有機材料供應部件，設置於該反應空間中，用 201036227 以供應欲汽化之一原材料；以及一基板支架（substrate holder)， 用以支撐一基板，其中該有機材料供應部件包含：一槽，其中一 儲存空間與一汽化空間互相連通，該儲存空間填充有該原材料， 該原材料係於該汽化空間中汽化；一運送單元，用以連續地或週 期性地運送填充於該儲存空間中之該原材料至該汽化空間；一加 熱單元，設置於該槽之該汽化空間之一外側，用以供應使該原材 料汽化之熱量至該汽化空間；一連接管，該連接管之一第一側係 連接至該槽之該汽化空間，以形成一通道，該汽化原材料流動於 ^ 該通道中；以及一喷射器，連接至該連接管之一第二側且面對該 基板支架，該喷射器係用以喷射該汽化原材料至該基板。 該基板處理裝置可更包含一冷卻單元，該冷卻單元設置於該槽 之該儲存空間之一外側，以防止儲存於該儲存空間中之該原材料 出現熱劣化。 該腔室可被劃分成複數反應空間，該有機材料供應部件可以複 數形式提供，以分別設置於該腔室之該等反應空間中，且該基板 ^ 支架可被運送至面朝該等有機材料供應部件。 【實施方式】 下文將參照附圖詳細描述本發明之具體實施例。然而，本發明 可實施為不同之形式，而不應被視為僅限於本文所述之實施例。 相反，提供該等實施例旨在使本揭露内容透徹且完整，並向熟習 此項技術者全面傳達本發明之範圍。 第1圖係為根據一實例性實施例，包含一基板處理裝置之一基 板處理系統之一示意圖。第2圖係為該基板處理裝置之一剖視圖。 201036227 參見第1圖及第2圖，該基板處理系統用於以—直列方式（in_Une manner)快速地處理大量基板1〇。該基板處理系統包含：一加載 部1000，基板1〇加載於加載部1000上；一卸载部5〇〇〇，與加載 部1〇〇〇間隔開；以及複數基板處理部3〇〇〇a、3〇〇〇b及3〇〇〇c，直 列地設置於加載部1000與卸載部5000之間，用以處理基板1〇。 於一製程完成後，自卸載部5000卸載基板1〇。該基板處理系統更 包3 製程準備部2000及一卸載準備部4000。製程準備部2〇〇〇 s曼置於基板處理部3000a、3000b及3000c之前端，以放置欲加載 至基板處理部3000a、3000b及3000c之基板10於一基板支架2〇〇 上並對齊。卸載準備部4000設置於基板處理部3〇〇〇a、3〇〇〇b及 3000c之後端，用以自基板支架2〇〇移除基板1〇，以於一製程後 運送基板10至卸載部5000。 設置於該基板處理系統之一第一端之加載部1〇〇〇係為一空間， 欲沉積有機薄層之基板10於該空間中等待。一基板盒及一緩衝平 台安裝於加載部1000内，基板盒用以裝載基板1〇,緩衝平台則用 於使自基板盒卸載之基板10在其中等待進行一沉積製程。 設置於加載部1000與卸载部5000之間之基板處理部3000a、 3000b及3000c係為用以沉積有機薄層之空間，並包含：一腔室 400，具有一或多個反應空間；一或多個對應於腔室4〇〇内之反應 空間之有機材料供應部件100;以及基板支架200,被運送至面對 有機材料供應部件100以支樓及運送基板1〇。當僅安裝基板處理 部3000a、3000b及3000c其中之一及僅有機材料供應部件1〇〇其 中之一時，便無需一分立之運送軌道來運送基板支架2〇〇。然而， 201036227 當安裝基板處理部3000a、3000b及3〇〇〇c至少其中之二及有機材 料供應部件100至少其中之二時，可沿一運这虹4 ^ J /α 運送軌道300運送基板 支架200 ’以使絲Η)輯各該有機材料供應部件1〇〇。運送基 板支架200之方法並不僅限於利用一運送軌道之方法，因此可利 用各種各樣之方法。 腔室400具有至少一反應空間，並包含—閑（圖未示出），基板 10與基板支架之-經該閘放人及取出。—排氣管線裝設於腔 〇室400巾，用以於腔室400内形成一真空狀態或自腔室_内排 出未反應之氣體。 基板支架200可係為任何用於以一被水平或垂直支樓之狀態運 送基板10之支架。於本實施例中，基板支架雇爽緊基板1〇之 邊緣並以-垂直狀態支揮基板1Q。於此種情況下，藉由設置於腔 室侧内之運送軌道3〇〇料並支樓及引導基板支架綱。201036227 VI. Description of the Invention: [Technical Field] The present invention relates to a deposition material supply device and a substrate processing device having the deposition material supply device, and more particularly to a deposition material supply device and a A substrate processing apparatus including the deposition material supply device that stores a large amount of organic material without vaporizing the organic material and vaporizes a desired amount of the organic material to a substrate. [Prior Art] Since the organic light emitting devices (OLEDs) are different from the self-illuminating devices of the liquid crystal display devices, they do not require a backlight, and therefore, their power consumption is low. In addition, since the organic light-emitting device has a wide viewing angle and a high response speed, the display device including the organic light-emitting device can display an improved image having a wide viewing angle without residual images. Unlike inorganic materials, the organic materials used in the organic thin layer deposition process for fabricating an organic light-emitting device do not require a high vapor pressure and are easily converted and decomposed at high temperatures. Due to these characteristics of the organic material, a related organic thin layer is formed by loading an organic material into a groove formed of tungsten, heating the groove to vaporize the organic material, and depositing the organic material on a substrate. . However, since the amount of deposition material stored in a tank is limited, the deposition material should be frequently loaded in the tank, and thus an organic thin layer deposition apparatus should be frequently shut down. In order to extend the operation stop period of one of the organic thin layer deposition devices, the loading of the raw materials can be increased. In this case, the heat generated by a heating member must be increased to heat a larger tank for storing the raw material and vaporizing the raw material, thereby causing deterioration of the raw material to be deposited. 201036227 SUMMARY OF THE INVENTION The present invention provides a substrate processing material supply device for a plug-in device, and a deposition device comprising the deposition material. The deposition material supply device stores a large amount of organic material to operate a stop period and prevent degradation of the organic material. . =Ming also provides substrate treatment for ~ deposited materials _ s 4 匕 3 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积 积Unequal basis - careful management. The embodiment, the deposition material supply device comprises: a storage space and a vaporization space are interconnected, the storage space is filled with a trough, and t, the raw material is vaporized in the vaporization space; - the transport unit, the tr original village In the storage, the material is supplied to the steam; the mantle is used to supply the heat of the eyebrow material and the heat of the eye to the outside of the vaporization space of the tank for supplying the material supply device of Read the storage space - the outer two parts of the early 'the cooling unit set in the village section showed thermal degradation. To prevent the eyebrow stored in the library space = unit can contain - cooling jacket (_ngjacket) two channels, the cold channel surrounds the shape - the outer surface contains - in the cooling channel. The cold sputum flowing to the side supply skirt may further comprise: - a connecting pipe, the connecting pipe 1 is connected to the vaporizing space to form - the channel ten - in the channel; and a spray ... flying raw material flow 15 Connected to the splicing pipe - the second pour, used 201036227 to spray the vaporized raw material. The deposition material supply device may further include a support member integrally supporting the trough, the ejecting unit, wherein the cutting member is mounted on the rail and movable along the rail, the rail system extending from the jet Orientation direction. The first side of the connecting tube can be coupled to a light engaging member for threaded coupling to the slot. The piece of money can have a diameter of between about 20 mm and about mm. The deposition material supply device may further include an injection amount measuring sensor for measuring an injection amount of the raw material from the injector, wherein the deposition material supply device measures the raw material measured by the sensor according to the injection amount. The amount of injection controls the operation of one of the transport units to adjust the amount of injection of the raw material. A metal piece may be disposed on an inner wall of one of the vaporization spaces of the groove. The transport order it may include: a "head" is disposed in the slot for pushing the raw material; a rod 'having - the first side is connected to the head' - the second side is disposed outside one of the slots The rod is integrally moved with the head; and a driving member is coupled to the second side of the rod for moving the rod. The drive component can include one of a motor and a hydraulic cylinder. The s strength unit may include a core heater and a lamp heater. - According to another exemplary embodiment, a substrate processing apparatus includes: a chamber having a reaction space; and an organic material supply unit , disposed in the reaction space, using 201036227 to supply one of the raw materials to be vaporized; and a substrate holder for supporting a substrate, wherein the organic material supply part comprises: a slot, wherein a storage space and a steam The storage spaces are interconnected, the storage space is filled with the raw material, and the raw material is vaporized in the vaporization space; a transport unit is configured to continuously or periodically transport the raw material filled in the storage space to the vaporization space; a heating unit disposed outside one of the vaporization spaces of the tank for supplying heat for vaporizing the raw material to the vaporization space; a connecting pipe, the first side of the connecting pipe being connected to the vaporization space of the groove , to form a channel, the vaporized raw material flows in the channel; and an injector connected to the connecting tube And a second side facing the substrate holder, the injector for injecting the vaporized material to the substrate. The substrate processing apparatus may further include a cooling unit disposed outside one of the storage spaces of the tank to prevent thermal degradation of the raw material stored in the storage space. The chamber may be divided into a plurality of reaction spaces, the organic material supply members may be provided in a plurality of forms to be respectively disposed in the reaction spaces of the chamber, and the substrate holder may be transported to face the organic materials Supply parts. [Embodiment] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments described herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention is fully disclosed. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of one of the substrate processing systems including a substrate processing apparatus, in accordance with an exemplary embodiment. Fig. 2 is a cross-sectional view showing the substrate processing apparatus. 201036227 Referring to Figures 1 and 2, the substrate processing system is used to quickly process a large number of substrates 1 in an in-line manner. The substrate processing system includes: a loading portion 1000, the substrate 1 is loaded on the loading portion 1000; an unloading portion 5A, spaced apart from the loading portion 1; and a plurality of substrate processing portions 3a, 3〇〇〇b and 3〇〇〇c are disposed in-line between the loading unit 1000 and the unloading unit 5000 for processing the substrate 1〇. After the completion of the process, the substrate 1 is unloaded from the unloading unit 5000. The substrate processing system further includes a process preparation unit 2000 and an unloading preparation unit 4000. The process preparation unit 2 is placed at the front end of the substrate processing units 3000a, 3000b, and 3000c to place the substrates 10 to be loaded onto the substrate processing units 3000a, 3000b, and 3000c on a substrate holder 2A and aligned. The unloading preparation unit 4000 is disposed at the rear ends of the substrate processing units 3a, 3b, and 3000c for removing the substrate 1 from the substrate holder 2 to transport the substrate 10 to the unloading portion after a process. 5000. The loading portion 1 disposed at one of the first ends of the substrate processing system is a space in which the substrate 10 on which the organic thin layer is to be deposited waits. A substrate cassette and a buffer platform are mounted in the loading portion 1000 for loading the substrate 1 , and the buffer platform is used to cause the substrate 10 unloaded from the substrate cassette to wait for a deposition process therein. The substrate processing portions 3000a, 3000b, and 3000c disposed between the loading portion 1000 and the unloading portion 5000 are spaces for depositing an organic thin layer, and include: a chamber 400 having one or more reaction spaces; one or more The organic material supply member 100 corresponding to the reaction space in the chamber 4; and the substrate holder 200 are transported to face the organic material supply member 100 to support the substrate and transport the substrate. When only one of the substrate processing units 3000a, 3000b, and 3000c and only one of the machine material supply members 1 are mounted, a separate transport track is not required to transport the substrate holder 2''. However, 201036227, when at least two of the substrate processing portions 3000a, 3000b, and 3〇〇〇c and the organic material supply member 100 are installed, at least one of the substrate holders 3000a, 3000b, and 3c can be transported along the carrier. 200 'to make the silk thread) each of the organic material supply parts 1〇〇. The method of transporting the substrate support 200 is not limited to the use of a method of transporting the track, and thus various methods can be utilized. The chamber 400 has at least one reaction space and includes - idle (not shown), and the substrate 10 and the substrate holder are removed by the gate. - An exhaust line is provided in the chamber 400 for forming a vacuum in the chamber 400 or discharging unreacted gas from the chamber. The substrate holder 200 can be any holder for transporting the substrate 10 in a state of being horizontal or vertical. In the present embodiment, the substrate holder employs the edge of the substrate 1 and holds the substrate 1Q in a vertical state. In this case, the substrate is guided by the transport rails 3 disposed in the chamber side.
有機材料供應部件1〇〇設置於面對基板支架之一位置以 供應欲沉積於基板10上之有機材料。 第®係為根據-實例性實施例，一沉積材料供應裝置之一剖 參見第3圖’有機材料供應部件1〇〇包含：一槽n〇、一運 單元120、_加熱單元13〇、—冷卻單元、一連接管以 、器160。一 ’/飞化空間1 l〇b以一直線形式與槽11〇内一填 有原材料之儲存空間110a互相連通，原材料於汽化空間110b 中汽化 0、蚕、、 送單凡120連續地或週期性地將填充該槽u〇之原材 料自儲存办Μ ，Λ、 工110&運送至汽化空間UOb。加熱單元130設置於槽 之'飞化空間ll〇b之外側，以供應用於使原材料汽化之熱量至 9 201036227 汽化空間110b。冷卻單元14〇設置於槽110之儲存空間ii〇a之外 側，以防止儲存於儲存空間u〇a内之原材料出現熱劣化。連接管 150之一第一側連接至槽11〇之汽化空間u〇b，以形成使汽化原 材料在其中流動之一通道。噴射器160連接至連接管15〇之一第 二側，以喷射汽化原材料。 根據本發明’提供一種製造一有機發光裝置（organic light emitting device，〇led )之裝置。舉例而言’根據本發明，可使 用有機材料作為原材判_。 槽110呈一圓柱管形狀，具有一開口側。填充有原材料之儲存 空間110a設置於槽u〇之内部之下側，且用於使原材料汽化之汽 化空間UOb設置於其内部之上側。儲存空間11〇a及汽化空間11〇b 未藉由一預定分隔構件分隔開，而是根據原材料之狀態分隔開。 因此’原材料處於液態或固態之一空間被定義為儲存空間110a， 而液態或固態原材料因受熱而汽化之一空間被定義為汽化空間 110b。儘管未不出’一真空管線可連接至槽110,以保持槽110於 一沉積製程中處於~超真空環境。 運送單兀120逐步運送填充於槽110之儲存空間ll〇a之原材料 至汽化空間11%。運送單元120包含：一頭部121，設置於槽Π0 中，用以推動原材料；一桿122,具有連接至頭部121之一第一側 及設置於肖UG之—外側之-第二側，且該桿係與頭# 121整體 地移動’以及-轉部件，連接至桿122之第二侧，用以移動桿 122 0 該驅動部件係為往何用於垂直地移動桿a:之構件，例如一馬 201036227 達123或一液壓缸，本實施例係使用馬達123。運送單元12〇更包 含：由電力驅動之馬達123 ; —滾珠螺桿124，根據馬達123之旋 轉而旋轉；一升降本體125，藉由滚珠螺桿124之旋轉而於滾珠螺 桿124上垂直地移動；以及一支撐本體126，其一側固定至升降本 體125以與升降本體us整體地移動，另一側則支撐桿122。因此， 當馬達I23之旋轉使滾珠螺桿I24旋轉而垂直地移動升降本體125 時’支撐本體126與升降本體125整體地移動，以便垂直地移動 桿Π2。因此，設置於桿122之上端之頭部μ自槽η〇之儲存空 〇 間110a運送原材料至汽化空濶ll〇b。 加熱單元丨30供應熱能來加熱及汽化自槽削之儲存空間⑽ 運送至汽化空間11〇b之原材料。加熱單元13〇可係為任何用於供 應使原材料汽化之熱能之構件。舉⑽言，可利用―核心加熱器 或-燈加熱器。於本實施例中’ t核心加熱器為例。加熱單元 130包含一電阻加熱絲131 ’電阻加熱絲131纏繞於槽11〇之外表 面的設置有汽化空間UOb之部分上。電阻加熱絲131係由组 〇 (Ta)， (W )、鉬（Mo )及其組合之其中之一形成。 為便於利用加熱單元130加熱原材料，可設置具有高熱導率之 -金屬片111於槽110之-内壁上設置有汽化空間u〇b之部分 卜於此種情況下，金屬片⑴可具有—圓環或管狀形狀。冷卻 單元140防止填充於槽110之儲存空間u〇a之原材料因加熱單元 130之加熱而劣化，並可係為任何用以冷卻儲存有原材料之儲存空 間ll〇a之構件。於本實施例中，以一冷卻套（c〇〇Hng jacket)為 例。冷卻單元14〇環繞槽lio之外表面中設置有儲存空間11〇&之 11 201036227 部分，例如環繞與安裝加熱單元130之部分相鄰之一部分。冷卻 單元140包含—冷卻通道141，一冷卻劑流動於冷卻通道141中。 冷卻通道141環繞槽n〇之外表面中設置有儲存空間ll〇a之部分。 連接管150連接至槽110之上部，以運送經加熱單元130汽化 之原材料氣體至喷射器160。 連接管150可具有一預定彎曲形狀’以用於連接至喷射器16〇。 連接管150之外部設置有一加熱管線151，用以防止汽化原材料返 回至液體或固體狀態。 連接管150之直徑及長度會極大地影響原材料之轉變。具體而 吕’槽110内之高溫及高壓會使原材料發生轉變。因此，槽11〇 内之溫度及壓力應保持於較低之水準，以防止原材料發生轉變。 真空度會極大地影響原材料之一汽化溫度。當真空度降低時，汽 化溫度降低。因此，降低槽110内之真空度，以有效地防止原材 料發生轉變。 可藉由極大地依賴於管之長度及直徑之傳導率（c〇nductance) 概念來解釋槽110内之真空度。傳導率可由方程式i表達。 [方程式1] c = 3.81(T/M)1/2D3/(L+1.33D) 其中D表示管之直彳i L表示管之長度’ τ表示溫度，以及m 表不原材料之分子量。 根據方程式卜當管之長度減少及其錄增加時傳導率增加。 因此’於本實施例中’減小連接管15G之長度並增大連接管15〇 12 201036227 之直徑，以便降低槽110内之一真空度，藉此防止原材料劣化。 具體而言，連接管150之直徑對傳導率值之影響較連接管150之 長度大得多。因此，於本實施例中，考慮到用作原材料之有機材 料及槽110内之溫度，連接管150具有自約20毫米至約200毫米 之一直徑。此乃因當連接管150之直徑係為約20毫米或以下時， 傳導率太低而不能防止原材料劣化，而連接管150之直徑係為約 200毫米或更大時，連接管150與其他裝置之相容性會受到限制。 具體而言，考慮到原材料之劣化防止效率及與其他裝置之相容 ^ 性，連接管150可具有約70毫米之一直徑。 連接管150之第一側與一耦合構件170連接，耦合構件170具 有螺紋，以便以螺紋耦合至槽110之上端。因此，槽110之儲存 空間110a及汽化空間110b、耦合構件170之内部以及連接管150 之内部相互連通。由此，將耦合構件170以螺紋耦合至槽110，以 利於耦合構件170與槽110之辆合及解耦。因此，當填充原材料 時，自槽110移除耦合構件170，然後方便地將槽110之儲存空間 Q ll〇a填充以原材料。 喷射器160連接至連接管150之第二側。 與連接管150連通之一通道設置於喷射器160中。複數氣體喷 射開口 161設置於該通道之一端，用以經其喷射汽化原材料。因 噴射器160具有一直線形狀，該等氣體噴射開口 160以一直線形 式排列以面對基板10。噴射器160之外部設置有一加熱管線162, 以防止汽化原材料返回至一液體或固體狀態。 喷射器160與連接管150連通，以影響槽110内之一真空度。 13 201036227 因 射連接管15〇之直徑之情形中相同之原因，嘴 具有自、約2〇毫米至約·毫米之-直徑。舉例而令， 喷射器160可具有約7η象+ 士〆 ° ' 耄米之一直徑，以對應於連接管150。噴 射器160之氣體噴射鬥 噴射開口 161可具有約8毫米或更大之一直徑。 為安裝槽110、運详。 '兀20及喷射器16〇於腔室400中，將其 整體地由—切部件刚支撐。支撐部件⑽安裝於-軌道185 用於將噴射$ 16G移動至基板1()，藉此調整喷射器 160與基板10間之距離。 支撐部件18G包含：—移動本體18卜沿轨道185移動；-支撑 框架182’ @定至移動本體18卜以健地切槽U0及運送單元 120 ;以及—支撐板183，用以支射_⑽。移動本體⑻、支 撐框架182 U及支撐板183之雜及結構不受限制，其限制條件 為，槽m、運送單元120及喷射器刚係被整體地支撐。移動本 體181可係為任何可於軌道185上移動之構件。舉例而古，可藉 由一滚珠轉或-線性運動（linear mGtkm; lm)導㈣驅動移 動本體181。 喷射器1 6〇之前側設署古 A 4+旦、日丨曰 h又置有一嘴射量測量感測器184，用以測量通 過喷射器_喷射之汽化原材料之—喷射量。加熱單元⑽之一 加熱溫度及運送單元120夕gg邱191 + ... 竭之頭# 121之—逮度係、根據噴射量測量 感測器1 84所測量之—甩刺_邊曰丄、丨^ 《原材枓嘴射置加以控帝J，以便調整原材料 之喷射量。 -間板刚安裝於嘴射器⑽之前侧，例如，安裝於喷射器160 與基板支架200之間，用以選擇性地限制經噴射器_喷射之原 14 201036227 材料之一流量。閘板190具有一表面覆蓋喷射器16〇之氣體噴射 開口 161之前側，並以滑動或旋轉方式運作。於本實施例中，藉 由一馬達191驅動閘板190旋轉，以便選擇性地開啟或閉合喷射 器160之前侧。閘板190之形狀及操作並不僅限於本實施例，其 限制條件為選擇性地限制自喷射器160喷射至基板1〇之原材料之 一流量。 參見第1圖，设置於基板處理系統之一第二端之卸載部5〇〇〇係 0 為一空間，沉積有有機薄層之基板10在被取出至外面之前在該空 間中等待。一卸載器安裝於卸栽部5000處，以於沉積製程完成且 基板10被取出至外面之後將基板10重新裝載至基板盒。 下文將描述如上所述配置之包含該沉積材料供應裝置及該基 板處理裝置之基板處理系統之運作。 第4圖及第5圖係為根據一實例性實施例，使用中之沉積材料 供應裝置之剖視圖。 〇 參見第4圖，自耦合構件170移除該沉積材料供應裝置之槽 110，然後將儲存空間110a填充以欲沉積於基板1〇之原材料，亦 即，填充以有機材料。然後，將槽11〇耦合至耦合構件17〇。當依 序堆疊各種有機薄層時，將基板處理部3000a、3〇〇〇b及3〇〇〇c設 置成對應於該等有機薄層，並將有機材料供應部件1〇〇分別安裝 於基板處理部3000a、3000b及3〇〇〇c中，以將槽110中填充以欲 沉積之有機材料。此時，將槽i 1〇之儲存空間丨丨〇a填充以一充足 里之有機材料，以連續地或週期性地執行一有機薄層沉積製程。 填充於儲存空間110a之有機材料藉由冷卻單元14〇得到冷卻，因 15 201036227 此可長時間儲存而不劣化。移動固定有槽110及喷射器160之移 動本體181，以設定喷射器160與欲處理之基板10間之距離。The organic material supply member 1 is disposed at a position facing the substrate holder to supply an organic material to be deposited on the substrate 10. The first system is a section of a deposition material supply device according to an exemplary embodiment. Referring to FIG. 3, the organic material supply unit 1 includes: a tank n〇, a transport unit 120, a heating unit 13〇, a cooling unit, a connecting tube, and a device 160. A '/flying space 1 l〇b is in a straight line with the storage space 110a filled with the raw material in the groove 11〇, and the raw material is vaporized in the vaporization space 110b, the silkworm, and the delivery unit 120 continuously or periodically. The raw materials that fill the tank are transported from the storage, transport, and 110& to the vaporization space UOb. The heating unit 130 is disposed on the outer side of the 'flying space 11' of the tank to supply heat for vaporizing the raw material to 9 201036227 vaporizing space 110b. The cooling unit 14 is disposed outside the storage space ii 〇 a of the tank 110 to prevent thermal deterioration of the raw materials stored in the storage space u 〇 a. The first side of one of the connecting tubes 150 is connected to the vaporizing space u〇b of the tank 11〇 to form a passage in which the vaporized raw material flows. The injector 160 is connected to one of the second sides of the connecting pipe 15 to spray the vaporized raw material. According to the present invention, there is provided an apparatus for manufacturing an organic light emitting device (〇led). For example, according to the present invention, an organic material can be used as a raw material. The groove 110 has a cylindrical tube shape and has an open side. The storage space 110a filled with the raw material is disposed on the lower side of the inside of the groove u, and the vaporization space UOb for vaporizing the raw material is disposed on the upper side of the inside thereof. The storage space 11〇a and the vaporization space 11〇b are not separated by a predetermined partition member, but are separated according to the state of the raw material. Therefore, a space in which a raw material is in a liquid state or a solid state is defined as a storage space 110a, and a space in which a liquid or solid raw material is vaporized by heat is defined as a vaporization space 110b. Although not a vacuum line can be attached to the tank 110 to maintain the tank 110 in an ultra-vacuum environment during a deposition process. The transport unit 120 gradually transports the raw material filled in the storage space 11a of the tank 110 to the vaporization space by 11%. The transport unit 120 includes a head 121 disposed in the slot 0 for pushing the raw material, and a rod 122 having a first side connected to one of the heads 121 and a second side disposed on the outer side of the shaw UG. And the rod is integrally moved with the head #121 and the 'rotating member' is connected to the second side of the rod 122 for moving the rod 122 0. The driving member is used for vertically moving the rod a: For example, a horse 201036227 up to 123 or a hydraulic cylinder, this embodiment uses a motor 123. The transport unit 12 further includes: an electric motor driven motor 123; a ball screw 124 that rotates according to the rotation of the motor 123; and an elevating body 125 that vertically moves on the ball screw 124 by the rotation of the ball screw 124; A support body 126 has one side fixed to the lift body 125 to move integrally with the lift body usus and the other side to support the rod 122. Therefore, when the rotation of the motor I23 causes the ball screw I24 to rotate to vertically move the elevating body 125, the support body 126 integrally moves with the elevating body 125 to vertically move the rod 2. Therefore, the head portion 51 provided at the upper end of the rod 122 transports the raw material to the vaporization space llb from the storage space 110a of the groove η. The heating unit 丨30 supplies heat to heat and vaporize the raw material transported from the slotted storage space (10) to the vaporization space 11〇b. The heating unit 13 can be any member for supplying thermal energy for vaporizing the raw material. As a result of (10), a “core heater” or a lamp heater can be used. In the present embodiment, the 't core heater is taken as an example. The heating unit 130 includes a resistance heating wire 131. The resistance heating wire 131 is wound around a portion of the surface of the groove 11 which is provided with the vaporization space UOb. The resistance heating wire 131 is formed of one of the group consisting of (Ta), (W), molybdenum (Mo), and combinations thereof. In order to facilitate the heating of the raw material by the heating unit 130, the metal sheet 111 having a high thermal conductivity may be disposed on the inner wall of the groove 110 with a vaporization space u〇b. In this case, the metal piece (1) may have a circle. Ring or tubular shape. The cooling unit 140 prevents the raw material filled in the storage space u〇a of the tank 110 from being deteriorated by the heating of the heating unit 130, and may be any member for cooling the storage space 〇 a stored with the raw material. In the present embodiment, a cooling jacket (c〇〇Hng jacket) is taken as an example. The cooling unit 14 is disposed in the outer surface of the groove lio with a portion of the storage space 11〇& 11 201036227, for example, a portion adjacent to a portion where the heating unit 130 is mounted. The cooling unit 140 includes a cooling passage 141 in which a coolant flows. The cooling passage 141 surrounds a portion of the outer surface of the groove n that is provided with the storage space 11a. A connecting pipe 150 is connected to the upper portion of the tank 110 to carry the raw material gas vaporized by the heating unit 130 to the ejector 160. The connecting tube 150 may have a predetermined curved shape 'for connection to the injector 16'. A heating line 151 is disposed outside the connecting pipe 150 to prevent the vaporized raw material from returning to a liquid or solid state. The diameter and length of the connecting tube 150 greatly affect the transformation of the raw materials. Specifically, the high temperature and high pressure in the tank 110 will cause the raw materials to change. Therefore, the temperature and pressure in the tank 11〇 should be kept at a low level to prevent the raw material from changing. The degree of vacuum greatly affects the vaporization temperature of one of the raw materials. When the degree of vacuum is lowered, the vaporization temperature is lowered. Therefore, the degree of vacuum in the tank 110 is lowered to effectively prevent the transition of the raw material. The degree of vacuum within the tank 110 can be explained by the concept of conductivity (c〇nductance) which greatly depends on the length and diameter of the tube. Conductivity can be expressed by equation i. [Equation 1] c = 3.81 (T/M) 1/2 D3 / (L + 1.33D) where D represents the straight diameter of the tube i L represents the length of the tube 'τ represents temperature, and m represents the molecular weight of the raw material. According to the equation, the length of the tube is reduced and the conductivity is increased as the recording increases. Therefore, in the present embodiment, the length of the connecting pipe 15G is reduced and the diameter of the connecting pipe 15〇 12 201036227 is increased to reduce a degree of vacuum in the groove 110, thereby preventing deterioration of the raw material. Specifically, the diameter of the connecting tube 150 has a much greater influence on the conductivity value than the length of the connecting tube 150. Therefore, in the present embodiment, the connection tube 150 has a diameter of from about 20 mm to about 200 mm in consideration of the temperature of the organic material used as the raw material and the inside of the tank 110. This is because when the diameter of the connecting pipe 150 is about 20 mm or less, the conductivity is too low to prevent deterioration of the raw material, and when the diameter of the connecting pipe 150 is about 200 mm or more, the connecting pipe 150 and other devices The compatibility will be limited. Specifically, the connection pipe 150 may have a diameter of about 70 mm in consideration of the deterioration prevention efficiency of the raw material and the compatibility with other devices. The first side of the connecting tube 150 is coupled to a coupling member 170 that is threaded for threading coupling to the upper end of the slot 110. Therefore, the storage space 110a and the vaporization space 110b of the groove 110, the inside of the coupling member 170, and the inside of the connection pipe 150 communicate with each other. Thus, the coupling member 170 is threadedly coupled to the slot 110 to facilitate engagement and decoupling of the coupling member 170 with the slot 110. Therefore, when the raw material is filled, the coupling member 170 is removed from the groove 110, and then the storage space Q ll 〇 a of the groove 110 is conveniently filled with the raw material. The injector 160 is coupled to the second side of the connecting tube 150. One passage communicating with the connecting pipe 150 is disposed in the injector 160. A plurality of gas injection openings 161 are provided at one end of the passage for ejecting vaporized raw materials therethrough. Since the ejector 160 has a straight line shape, the gas ejection openings 160 are arranged in a line shape to face the substrate 10. A heating line 162 is disposed outside the injector 160 to prevent the vaporized material from returning to a liquid or solid state. The ejector 160 is in communication with the connecting tube 150 to affect a degree of vacuum within the tank 110. 13 201036227 The nozzle has a diameter of about 2 mm to about mm for the same reason as in the case of the diameter of the connecting tube 15〇. For example, the ejector 160 may have a diameter of about 7 n like + ± ' ° 耄 to correspond to the connecting tube 150. The gas jet hopper opening 161 of the ejector 160 may have a diameter of about 8 mm or more. In order to install the slot 110, the operation is detailed. The '20' and the ejector 16 are entangled in the chamber 400 and are integrally supported by the cutting member as a whole. The support member (10) is mounted to the -rail 185 for moving the ejection $16G to the substrate 1(), thereby adjusting the distance between the injector 160 and the substrate 10. The support member 18G includes: - the moving body 18 moves along the track 185; - the support frame 182' is fixed to the moving body 18 to the ground slot U0 and the transport unit 120; and - the support plate 183 for the branch _ (10) . The structure and structure of the moving body (8), the support frame 182 U, and the support plate 183 are not limited, and the restriction is that the groove m, the transport unit 120, and the ejector rigid body are integrally supported. The moving body 181 can be any member that can be moved over the track 185. For example, the moving body 181 can be driven by a ball turn or a linear motion (linear mGtkm; lm) guide (four). On the front side of the injector 1 6 设, the old A 4+ denier and the sun 丨曰 h are further provided with a mouth fluence measuring sensor 184 for measuring the amount of injection of the vaporized raw material by the ejector_jet. One of the heating unit (10) heating temperature and the transport unit 120 夕 邱 191 +1 头 # # 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121 121丨^ "The raw material is sprayed to control the J, in order to adjust the amount of raw materials. The interplate is just mounted on the front side of the mouthpiece (10), for example, between the injector 160 and the substrate holder 200 to selectively limit the flow of one of the injectors through the injector. The shutter 190 has a surface that covers the front side of the gas injection opening 161 of the injector 16 and operates in a sliding or rotating manner. In the present embodiment, the shutter 190 is rotated by a motor 191 to selectively open or close the front side of the injector 160. The shape and operation of the shutter 190 is not limited to this embodiment, and is limited to selectively restrict a flow rate of the raw material ejected from the injector 160 to the substrate 1. Referring to Fig. 1, the unloading portion 5 disposed at the second end of the substrate processing system is a space in which the substrate 10 on which the organic thin layer is deposited waits in the space before being taken out to the outside. An unloader is mounted to the unloading section 5000 to reload the substrate 10 to the substrate cassette after the deposition process is completed and the substrate 10 is taken out to the outside. The operation of the substrate processing system including the deposition material supply device and the substrate processing device configured as described above will be described below. 4 and 5 are cross-sectional views of a deposition material supply device in use, according to an exemplary embodiment.参见 Referring to Fig. 4, the groove 110 of the deposition material supply device is removed from the coupling member 170, and then the storage space 110a is filled with the raw material to be deposited on the substrate 1, that is, filled with an organic material. Then, the groove 11 is coupled to the coupling member 17A. When the various organic thin layers are sequentially stacked, the substrate processing portions 3000a, 3〇〇〇b, and 3〇〇〇c are disposed to correspond to the organic thin layers, and the organic material supply members 1〇〇 are respectively mounted on the substrate. In the treatment portions 3000a, 3000b, and 3〇〇〇c, the groove 110 is filled with an organic material to be deposited. At this time, the storage space 丨丨〇a of the groove i 1 填充 is filled with a sufficient amount of organic material to continuously or periodically perform an organic thin layer deposition process. The organic material filled in the storage space 110a is cooled by the cooling unit 14 ,, which can be stored for a long time without deterioration due to 15 201036227. The moving body 181 of the slot 110 and the ejector 160 is moved to fix the distance between the ejector 160 and the substrate 10 to be processed.
當有機材料供應部件100如上所述進行準備時，將準備於加載 部1000中之基板10加載至製程準備部2000,且將基板10放置於 基板支架200上並對齊。然後，藉由基板支架200運送基板10， 且將基板10置入基板處理部3000a、3000b及3000c之適當位置、 面對安裝於基板處理部3000a、3000b及3000c中之有機材料供應 部件100。 當基板10被運送並設置於有機材料供應部件1〇〇之前側上，例 如喷射器160之前側上時，有機材料供應部件100之運送單元120 運作以運送填充於槽110之儲存空間ll〇a之有機材料至汽化空間 110b，如第5圖所示。具體而言，當馬達123旋轉時，滾珠螺桿 124旋轉，以垂直地移動升降本體125。然後，支撐本體126與升 降本體125整體地移動，並垂直地移動桿122。因此，設置於桿 122之上端之頭部121運送原材料至槽110之儲存空間110a至汽 化空間110b。然後，圍繞汽化空間110b安裝之加熱單元130汽化 該有機材料。汽化有機材料之量係藉由控制加熱單元130之加熱 溫度及控制頭部121之速度來決定。儲存於儲存空間110a中、但 未被運送至汽化空間ll〇b之有機材料藉由圍繞儲存空間110a安 裝之冷卻單元140得到冷卻，藉此防止有機材料劣化。 由此，經由耦合構件170、連接管150及喷射器160之氣體喷射 開口 161，自喷射器160噴射出在汽化空間110b中汽化的一所需 有機材料量。開啟閘板190，以有效地喷射有機材料，該有機材料 16 201036227 沉積於基板10上而於基板10上形成一有機薄層。此時，透過設 置於喷射器160之前側之喷射量測量感測器184,測量自噴射器 160喷射之有機材料之量，並計算所測量之量以控制加熱單元130 之加熱溫度及運送單元120之頭部121之速度。 當連續運送基板10時，安裝於喷射器160之前側之閘板190可 一直保持於一開啟狀態。而當不連續地即週期性地運送基板10 時’閘板190可選擇性地開啟或閉合。 Q 由此，當透過選自基板處理部3000a、3000b及3000c之一部件 完成一單層式或多層式有機薄層之沉積時，基板10被運送至卸載 準備部4000,並自基板支架200移除。所移除之基板10被運送至 卸載部5000。由此，當基板1〇被運送至卸載部5〇〇()時，將基板 10加載於基板盒中並自基板處理系統中取出。 儘管於本實施例中基板處理系統係以直列方式快速地處理大量 基板’然、而於本發明之範_，可以各種各樣之方式沉積一有機 ο薄層。儘管於本實施例中係於基板及噴射器垂直於地面設置之狀 態下沉積-有機薄層，然而亦可水平地安裝—基板支架及一有機 材料供應部件，以沿-平行於地面之方向設置基板及喷射器。 根據該等實例性實施例，因冷卻單元防止填充於儲存空間之有 機材料因受熱而劣化，可將大量有機材料儲存於沉積材料供應裝 置中，以便延長裝置之一運作停止週期。士+ ^ 、硐。由此，可提咼有機薄膜 >儿積之製程效率。 此外，以-所需速度運送填充於儲存空間之有機材料至汽化空 17 201036227 間，並控制用以加熱汽化空間之加熱單元，以便調整有機材料之 一汽化量，藉此防止汽化有機材料之不均勻擴散並提高一所沉積 有機薄層之品質。 儘管上文參照具體實施例描述沉積材料供應裝置及包含該沉積 材料供應裝置之基板處理裝置，但其並不僅限於此。因此，熟習 此項技術者將容易理解，於不背離由隨附申請專利範圍所界定之 本發明之精神及範圍之前提下，可對其作出各種修飾及改動。 【圖式簡單說明】 結合附圖閱讀上文說明，可更詳細地理解本發明之實例性實施 例，附圖中： 第1圖係為根據一實例性實施例，包含一基板處理裝置之一系 統之一示意圖； 第2圖係為根據一實例性實施例，一基板處理裝置之一剖視圖； '第3圖係為根據一實例性實施例，一沉積材料供應裝置之一剖 視圖；以及 第4圖及第5圖係為根據一實例性實施例，一使用中之沉積材 料供應裝置之剖視圖。 【主要元件符號說明】 10 :基板 100 :有機材料供應部件 110:槽 110a:儲存空間 110b :汽化空間 111 :金屬片 18 201036227 120 :運送單元 121 :頭部 122 :桿 123 :馬達 124 :滾珠螺桿 125 :升降本體 126 :支撐本體 130 :加熱單元 131 :電阻加熱絲 140 :冷卻單元 141 :冷卻通道 150 :連接管 〇 151:加熱管線 160 :喷射器 161:氣體喷射開口 162 :加熱管線 170 :耦合構件 180 :支撐部件 181 :移動本體 182 :支撐框架 183 :支撐板 184 :喷射量測量感測器 185 :軌道 190 :閘板 〇 191:馬達 200 :基板支架 300 :運送軌道 400 :腔室 1000 :加載部 2000 :製程準備部 3000a :基板處理部 3000b :基板處理部 3000c :基板處理部 5000 :卸載部 4000 :卸載準備部 19When the organic material supply member 100 is prepared as described above, the substrate 10 prepared in the loading portion 1000 is loaded to the process preparation portion 2000, and the substrate 10 is placed on the substrate holder 200 and aligned. Then, the substrate 10 is transported by the substrate holder 200, and the substrate 10 is placed at appropriate positions of the substrate processing portions 3000a, 3000b, and 3000c, and faces the organic material supply member 100 mounted in the substrate processing portions 3000a, 3000b, and 3000c. When the substrate 10 is transported and disposed on the front side of the organic material supply member 1〇〇, for example, on the front side of the ejector 160, the transport unit 120 of the organic material supply unit 100 operates to transport the storage space filled in the slot 110. The organic material is to the vaporization space 110b as shown in FIG. Specifically, when the motor 123 rotates, the ball screw 124 rotates to vertically move the lift body 125. Then, the support body 126 moves integrally with the lifter body 125 and vertically moves the rod 122. Therefore, the head portion 121 provided at the upper end of the rod 122 carries the raw material to the storage space 110a of the tank 110 to the vaporization space 110b. Then, the heating unit 130 installed around the vaporization space 110b vaporizes the organic material. The amount of vaporized organic material is determined by controlling the heating temperature of the heating unit 130 and controlling the speed of the head 121. The organic material stored in the storage space 110a but not transported to the vaporization space 11b is cooled by the cooling unit 140 installed around the storage space 110a, thereby preventing deterioration of the organic material. Thereby, a desired amount of organic material vaporized in the vaporization space 110b is ejected from the injector 160 via the coupling member 170, the connecting pipe 150, and the gas injection opening 161 of the injector 160. The shutter 190 is opened to efficiently eject the organic material, and the organic material 16 201036227 is deposited on the substrate 10 to form an organic thin layer on the substrate 10. At this time, the amount of organic material injected from the injector 160 is measured through the injection amount measuring sensor 184 disposed on the front side of the injector 160, and the measured amount is calculated to control the heating temperature of the heating unit 130 and the transport unit 120. The speed of the head 121. When the substrate 10 is continuously conveyed, the shutter 190 attached to the front side of the ejector 160 can be kept in an open state at all times. While the substrate 10 is being transported discontinuously, i.e., periodically, the shutter 190 can be selectively opened or closed. Therefore, when deposition of a single-layer or multi-layer organic thin layer is completed by a member selected from the substrate processing portions 3000a, 3000b, and 3000c, the substrate 10 is transported to the unloading preparation portion 4000 and moved from the substrate holder 200. except. The removed substrate 10 is transported to the unloading portion 5000. Thus, when the substrate 1 is transported to the unloading portion 5, the substrate 10 is loaded into the substrate cassette and taken out from the substrate processing system. Although in the present embodiment the substrate processing system quickly processes a large number of substrates in an in-line manner, the organic thin layer can be deposited in a variety of ways. Although in the present embodiment, the organic thin layer is deposited in a state in which the substrate and the ejector are disposed perpendicular to the ground, the substrate holder and an organic material supply member may be horizontally mounted to be disposed along the direction parallel to the ground. Substrate and injector. According to these exemplary embodiments, since the cooling unit prevents the organic material filled in the storage space from being deteriorated by heat, a large amount of organic material can be stored in the deposition material supply device to extend the operation stop period of one of the devices.士+ ^, 硐. Thereby, the process efficiency of the organic film > In addition, the organic material filled in the storage space is transported to the vaporization space 17 201036227 at a desired speed, and the heating unit for heating the vaporization space is controlled to adjust the vaporization amount of one of the organic materials, thereby preventing the vaporization of the organic material. Uniform diffusion and improve the quality of a deposited organic thin layer. Although the deposition material supply device and the substrate processing device including the deposition material supply device have been described above with reference to the specific embodiments, it is not limited thereto. It will be appreciated by those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Exemplary embodiments of the present invention can be understood in more detail by reading the above description in conjunction with the accompanying drawings in which: FIG. 1 is one of a substrate processing apparatus according to an exemplary embodiment. 1 is a schematic cross-sectional view of a substrate processing apparatus according to an exemplary embodiment; '3 is a cross-sectional view of a deposition material supply apparatus according to an exemplary embodiment; and 4th Figure 5 and Figure 5 are cross-sectional views of a deposition material supply device in use, in accordance with an exemplary embodiment. [Main component symbol description] 10: Substrate 100: Organic material supply member 110: Slot 110a: Storage space 110b: Vaporization space 111: Metal piece 18 201036227 120: Transport unit 121: Head 122: Rod 123: Motor 124: Ball screw 125: lift body 126: support body 130: heating unit 131: resistance heating wire 140: cooling unit 141: cooling passage 150: connection pipe 151: heating line 160: injector 161: gas injection opening 162: heating line 170: coupling Member 180: Support member 181: Moving body 182: Support frame 183: Support plate 184: Injection amount measuring sensor 185: Track 190: Gate 〇 191: Motor 200: Substrate holder 300: Transporting track 400: Chamber 1000: Loading unit 2000: Process preparation unit 3000a: Substrate processing unit 3000b: Substrate processing unit 3000c: Substrate processing unit 5000: Unloading unit 4000: Unloading preparation unit 19