CN102216488A - Deposition material supply apparatus and substrate treatment apparatus having the same - Google Patents
Deposition material supply apparatus and substrate treatment apparatus having the same Download PDFInfo
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- CN102216488A CN102216488A CN2009801464693A CN200980146469A CN102216488A CN 102216488 A CN102216488 A CN 102216488A CN 2009801464693 A CN2009801464693 A CN 2009801464693A CN 200980146469 A CN200980146469 A CN 200980146469A CN 102216488 A CN102216488 A CN 102216488A
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- 239000000758 substrate Substances 0.000 title claims abstract description 104
- 230000008021 deposition Effects 0.000 title claims abstract description 58
- 239000000463 material Substances 0.000 title claims abstract description 47
- 238000011282 treatment Methods 0.000 title claims description 18
- 230000008016 vaporization Effects 0.000 claims abstract description 78
- 238000009834 vaporization Methods 0.000 claims abstract description 74
- 239000011368 organic material Substances 0.000 claims abstract description 54
- 238000003860 storage Methods 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000002994 raw material Substances 0.000 claims abstract description 27
- 239000007858 starting material Substances 0.000 claims description 63
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 6
- 230000015556 catabolic process Effects 0.000 claims description 5
- 238000006731 degradation reaction Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 230000032258 transport Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 230000006866 deterioration Effects 0.000 description 10
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 described Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided are a deposition material supplying device and a substrate processing apparatus including the deposition material supplying device, which store a large amount of organic material without deteriorating the organic material and vaporize a desired amount of the organic material to a substrate. The deposition material supplying device includes: a pot in which a storage space filled with raw material communicates with a vaporization space where the raw material is vaporized; a transporting unit configured to continuously or periodically transport the raw material filling the storage space to the vaporization space; a heating unit disposed on an outside of the vaporization space of the pot to supply heat vaporizing the raw material; and a cooling unit disposed on an outside of the storage space to prevent the raw material stored in the storage space from being thermally deteriorated.
Description
Technical field
The present invention relates to a kind of deposition material supplying device and a kind of substrate board treatment with described deposition material supplying device, more specifically, relate to a kind of deposition material supplying device and a kind of substrate board treatment that comprises described deposition material supplying device, described deposition material supplying be installed under the condition that does not make described organic materials deterioration store a large amount of organic materialss and the aequum of vaporizing described organic materials to substrate.
Background technology
Because of organic light-emitting device (organic light emitting devices:OLEDs) is different from the selfluminous device of liquid crystal indicator (liquid crystal display devices), so it need not a backlight, therefore, its watt consumption is lower.In addition, because of organic light-emitting device has wide visual angle and high response speed, can show improvement image and the noresidue image with wide visual angle so comprise the display unit of organic light-emitting device.
Be different from inorganic materials, need not high vapor pressure, and change easily down and decompose in high temperature at the used organic materials of organic thin layer deposition manufacture process that is used for making organic light-emitting device.Because these features of organic materials, form the organic thin layer of correlation technique in the following manner: load organic materials in the groove that forms by tungsten, heat described groove to vaporize described organic materials and deposit described organic materials on substrate.Yet, limited because of the amount that is stored in the deposition material in the groove, so should load deposition material continually in described groove, thereby should make the shutdown of organic thin layer deposition apparatus continually.For prolonging the running dwelling period of organic thin layer deposition apparatus, can increase raw-material heap(ed) capacity.In in such cases, must increase the heat that produces by heater and be used to store described starting material with heating and the described raw-material larger slot of vaporizing, thereby cause the sedimentary starting material deterioration of institute's desire.
Summary of the invention
Technical problem
The present invention relates to a kind of deposition material supplying device and a kind of substrate board treatment that comprises described deposition material supplying device, described deposition material supplying device stores a large amount of organic materialss with the running dwelling period that prolongs deposition apparatus and prevent described organic materials deterioration.
The present invention also relates to a kind of deposition material supplying device and a kind of substrate board treatment that comprises described deposition material supplying device, described deposition material supplying device is with the stored organic materials of required speed vaporization aequum, in case the devaporation organic materials spreads unevenly.
Issue-resolution
According to exemplary embodiment, a kind of deposition material supplying device comprises: groove, and wherein storage area and vaporization space interconnect, and described storage area is filled with starting material, and described starting material are vaporized in described vaporization space; Delivery unit is in order to transport the described starting material that are filled in the described storage area continuously or periodically to described vaporization space; And heating unit, be arranged at the outside of the described vaporization space of described groove, make the heat of described starting material vaporization in order to supply.
Described deposition material supplying device can more comprise cooling unit, and described cooling unit is arranged at the outside of the described storage area of described groove, thermal degradation when occurs with the described starting material that prevent to be stored in the described storage area.
Described cooling unit can comprise cooling jacket (cooling jacket), and described cooling jacket comprises cooling channel, and described cooling channel is around the outside surface of described groove, and coolant flowing is in described cooling channel.
Described deposition material supplying device can more comprise: pipe connecting, and first side of described pipe connecting connects the described vaporization space of described groove, and to form passage, described vaporization starting material flow in described passage; And injector, be connected to second side of described pipe connecting, in order to spray described vaporization starting material.
Described deposition material supplying device can more comprise support component, integrally support described groove, described delivery unit and described injector, wherein said support component is installed on the track and can moves along described track, and described track extends the orientation direction of described injector.
Described first side of described pipe connecting can be connected with coupling component, and described coupling component screw thread couple is to described groove.
Described pipe connecting can have diameter between about 20 millimeters to about 200 millimeters.
Described deposition material supplying device can more comprise the emitted dose survey sensor, in order to measure the described raw-material emitted dose of injecting from described injector, the described raw-material described emitted dose that wherein said deposition material supplying device is measured according to described emitted dose survey sensor, control the running of described delivery unit, so that adjust described raw-material described emitted dose.
Can install tinsel on the inwall of the described vaporization space of described groove.
Described delivery unit can comprise: head is arranged in the described groove, in order to promote described starting material; Bar has first side and is connected to described head, and second side then is arranged at the outside of described groove, and described bar and described head integrally move; And drive element, be connected to described second side of described bar, in order to move described bar.
Described drive element can comprise motor and hydro-cylinder one of them.
Described heating unit can comprise core well heater (core heater) and lamp well heater one of them.
According to other exemplary embodiment, a kind of substrate board treatment comprises: chamber has reaction compartment; The organic materials supply part is arranged in the described reaction compartment, in order to the starting material of supply desire vaporization; And substrate holder (substrate holder), in order to supporting substrate, wherein said organic materials supply part comprises: groove, and wherein storage area and vaporization space interconnect, described storage area is filled with described starting material, and described starting material are vaporized in described vaporization space; Delivery unit is in order to transport the described starting material that are filled in the described storage area continuously or periodically to described vaporization space; Heating unit is arranged at the outside of the described vaporization space of described groove, makes the heat of described starting material vaporization to described vaporization space in order to supply; Pipe connecting, first side of described pipe connecting is connected to the described vaporization space of described groove, and to form passage, described vaporization starting material flow in described passage; And injector, being connected to second side of described pipe connecting and facing described substrate holder, described injector is in order to spray described vaporization starting material to described substrate.
Described substrate board treatment can more comprise cooling unit, and described cooling unit is arranged at the outside of the described storage area of described groove, thermal degradation when occurs with the described starting material that prevent to be stored in the described storage area.
Described chamber can be divided into a plurality of reaction compartments, and described organic materials supply part can a plurality of forms relate to, and wait in the reaction compartment to be arranged at the described of described chamber respectively, and described substrate holder can be transported to and faces organic materials supply parts such as described.
The invention benefit
According to exemplary embodiment such as described, the organic materials that prevents to be filled in the storage area because of cooling unit can be stored in a large amount of organic materialss in the deposition material supplying device, so that the running dwelling period of extension fixture because of being heated deterioration.Thus, can improve the sedimentary processing procedure efficient of organic film.
In addition, with required speed transport be filled in the storage area organic materials to vaporization space, and control so that adjust the evaporating capacity of organic materials, is prevented the inhomogeneous diffusion of devaporation organic materials and the quality of the raising organic thin layer that deposits in order to the heating unit of heating vaporization space by this.
Description of drawings
Read above explanation in conjunction with the accompanying drawings, can understand exemplary embodiment of the present invention in more detail, in the accompanying drawing:
Fig. 1 is according to exemplary embodiment, comprises the synoptic diagram of the system of substrate board treatment;
Fig. 2 is according to exemplary embodiment, the sectional view of substrate board treatment;
Fig. 3 is according to exemplary embodiment, the sectional view of deposition material supplying device; And
Fig. 4 and Fig. 5 are according to exemplary embodiment, the sectional view of the deposition material supplying device in the use.
Embodiment
Hereinafter describe specific embodiments of the invention with reference to the accompanying drawings in detail.Yet the present invention can be embodied as different forms, and should not be regarded as only limiting to embodiment as herein described.On the contrary, relate to these embodiment and be intended to make this disclosure thorough and complete, and pass on scope of the present invention comprehensively to those who familiarize themselves with the technology.
Fig. 1 is according to exemplary embodiment, comprises the synoptic diagram of the base plate processing system of substrate board treatment.Fig. 2 is the sectional view of described substrate board treatment.
Referring to Fig. 1 and Fig. 2, described base plate processing system is used for handling mass substrate 10 apace with straight column mode (in-line manner).Described base plate processing system comprises: loading portion 1000, and substrate 10 loads in the loading portion 1000; Unloading portion 5000, spaced apart with loading portion 1000; And a plurality of processing substrate 3000a of portion, 3000b and 3000c, be arranged between loading portion 1000 and the unloading portion 5000, in order to treatment substrate 10 in upright arrangemently.After processing procedure was finished, carried base board 10 unloaded in unloading portion 5000 certainly.Described base plate processing system more comprises processing procedure preparation portion 2000 and unloading preparation portion 4000.Processing procedure preparation portion 2000 is arranged at the front end of the 3000a of processing substrate portion, 3000b and 3000c, desires to be loaded on substrate 10 also alignment on substrate holder 200 of the 3000a of processing substrate portion, 3000b and 3000c with placement.Unloading preparation portion 4000 is arranged at the rear end of the 3000a of processing substrate portion, 3000b and 3000c, in order to remove substrate 10 from substrate holder 200, to transport substrate 10 to unloading portion 5000 behind processing procedure.
The loading portion 1000 that is arranged at first end of described base plate processing system is the space, and the substrate 10 of desire deposition organic thin layer is waited in described space.Substrate box and buffer platform are installed in the loading portion 1000, and substrate box is in order to mounting substrate 10, and buffer platform then is used to make the substrate 10 from the substrate box unloading to wait pending deposition manufacture process therein.
The 3000a of processing substrate portion, the 3000b and the 3000c that are arranged between loading portion 1000 and the unloading portion 5000 are the space in order to the deposition organic thin layer, and comprise: chamber 400 has or a plurality of reaction compartment; Or a plurality of organic materials supply parts 100 corresponding to the reaction compartment in the chamber 400; And substrate holder 200, be transported in the face of organic materials supply part 100 to support and to transport substrate 10.When only installation base plate handling part 3000a, 3000b and 3000c wherein and only organic materials supply part 100 one of them the time, just need not the discrete track that transports and transport substrate holder 200.Yet, when installation base plate handling part 3000a, 3000b and 3000c two and organic materials supply part 100 at least wherein at least wherein two the time, can transport substrate holder 200 along transporting track 300, so that substrate 10 is in the face of each described organic materials supply part 100.The method of transporting substrate holder 200 is not limited in the method for transporting track of utilizing, and therefore can utilize various methods.
Organic materials supply part 100 is arranged at the position in the face of substrate holder 200, desires to be deposited on organic materials on the substrate 10 with supply.
Fig. 3 is according to exemplary embodiment, the sectional view of deposition material supplying device.Referring to Fig. 3, organic materials supply part 100 comprises: groove 110, delivery unit 120, heating unit 130, cooling unit 140, pipe connecting 150 and injector 160.Vaporization space 110b interconnects to be filled with raw-material storage area 110a in form of straight lines and the groove 110, and starting material are vaporized in vaporization space 110b.Delivery unit 120 continuously or the starting material that periodically will fill described groove 110 be transported to vaporization space 110b from storage area 110a.Heating unit 130 is arranged at the outside of the vaporization space 110b of groove 110, makes the heat of starting material vaporization to vaporization space 110b for being applied to.Cooling unit 140 is arranged at the outside of the storage area 110a of groove 110, thermal degradation when occurs to prevent the starting material that are stored in the storage area 110a.First side of pipe connecting 150 is connected to the vaporization space 110b of groove 110, makes the vaporization starting material passage that one of flows therein with formation.Injector 160 is connected to second side of pipe connecting 150, with the carburation by spraying starting material.
According to the present invention, relate to a kind of manufacturing organic light-emitting device (organic light emitting device; OLED) device.For example, according to the present invention, can use organic materials as starting material.
Groove 110 is the cylindrical tube shape, has an open side.Be filled with raw-material storage area 110a and be arranged at the downside of the inside of groove 110, and be used to make the vaporization space 110b of starting material vaporization to be arranged at its inner upside.Storage area 110a and vaporization space 110b do not separate by predetermined partition member, but separate according to raw-material state.Therefore, starting material are in liquid or solid-state space is defined as storage area 110a, and space liquid or that solid-state starting material are vaporized because of being heated is defined as vaporization space 110b.Although not shown, vacuum pipeline can be connected to groove 110, is in the ultravacuum environment to keep groove 110 in deposition manufacture process.
Described drive element is any member of carriage release lever 122 vertically that is used for, for example motor 123 or hydro-cylinder, and present embodiment uses motor 123.Delivery unit 120 more comprises: by power-actuated motor 123; Ball screw 124 rotates according to the rotation of motor 123; Lifting body 125 vertically moves on ball screw 124 by the rotation of ball screw 124; And supporting body 126, the one side is fixed to lifting body 125 integrally to move with lifting body 125, and opposite side is support bar 122 then.Therefore, when the rotation of motor 123 makes ball screw 124 rotations and during vertically mobile lifting body 125, supporting body 126 integrally moves with lifting body 125, so that carriage release lever 122 vertically.Therefore, the head 121 that is arranged at the upper end of bar 122 transports starting material to vaporization space 110b from the storage area of groove 110 110a.
For ease of utilizing heating unit 130 heating raw materials, can be provided with tinsel 111 to be provided with in the part of vaporization space 110b in the inwall of groove 110 with high heat conductance.In in such cases, tinsel 111 can have annulus or tubular form.Cooling unit 140 prevents to be filled in the starting material of storage area 110a of groove 110 because of the heating deterioration of heating unit 130, and can be any member that stores raw-material storage area 110a in order to cooling.In present embodiment, (cooling jacket) is example with cooling jacket.Be provided with the part of storage area 110a in the outside surface of cooling unit 140 circumferential grooves 110, for example around with the adjacent part of part that heating unit 130 is installed.Cooling unit 140 comprises cooling channel 141, and coolant flowing is in cooling channel 141.Be provided with the part of storage area 110a in the outside surface of cooling channel 141 circumferential grooves 110.
Pipe connecting 150 is connected to the top of groove 110, to transport raw gas through heating unit 130 vaporization to injector 160.
Pipe connecting 150 can have predefined curved shape, to be used to be connected to injector 160.The outer setting of pipe connecting 150 has heating pipeline 151, is back to the liquid or solid state in order to anti-devaporation starting material.
The diameter of pipe connecting 150 and length can greatly influence raw-material transformation.Particularly, high temperature and the high pressure in the groove 110 can make starting material change.Therefore, temperature and pressure in the groove 110 should remain in lower level, change to prevent starting material.Vacuum tightness can greatly influence raw-material vaporization temperature.When vacuum tightness reduced, vaporization temperature reduced.Therefore, reduce the vacuum tightness in the groove 110, change to prevent starting material effectively.
The length that can be by greatly depending on pipe and conductivity (conductance) notion of diameter are explained the vacuum tightness in the groove 110.Conductivity can be expressed by equation 1.
[equation 1]
C＝3.81(T/M)
1/2D
3/(L+1.33D)
Wherein D represents the diameter of pipe, and L represents the length of pipe, and T represents temperature, and M represents raw-material molecular weight.
According to equation 1, when the length minimizing and the increasing diameter added-time thereof of pipe, conductivity increases.Therefore, in present embodiment, reduce the length of pipe connecting 150 and increase the diameter of pipe connecting 150,, prevent the starting material deterioration by this so that reduce the vacuum tightness in the groove 110.Particularly, the diameter of pipe connecting 150 is much bigger than the length of pipe connecting 150 to the influence of conductance values.Therefore, in present embodiment, consider as the temperature in raw-material organic materials and the groove 110, pipe connecting 150 have from about 20 millimeters to about 200 millimeters diameter.This is because of the diameter when pipe connecting 150 is about 20 millimeters or when following, and conductivity is too low and can not prevent the starting material deterioration, and the diameter of pipe connecting 150 is about 200 millimeters or when bigger, pipe connecting 150 can be restricted with the compatibility of other device.Particularly, consider that raw-material deterioration preventing efficient reaches and the compatibility of other device, pipe connecting 150 can have about 70 millimeters diameter.
First side of pipe connecting 150 is connected with coupling component 170, and coupling component 170 has screw thread, so that with the upper end of screw thread couple to groove 110.Therefore, the inside of the inside of the storage area 110a of groove 110 and vaporization space 110b, coupling component 170 and pipe connecting 150 is interconnected.Thus, with coupling component 170 with screw thread couple to groove 110, be beneficial to the coupling and the decoupling zero of coupling component 170 and groove 110.Therefore, when filling starting material, remove coupling component 170, easily the storage area 110a of groove 110 is filled with starting material then from groove 110.
One of be communicated with passage is arranged in the injector 160 with pipe connecting 150.A plurality of gas injection openings 161 are arranged at the end of described passage, in order to through its carburation by spraying starting material.Because of injector 160 has a rectilinear form, these gas injection openings 160 are arranged to face substrate 10 with a linear formula.The outer setting of injector 160 has heating pipeline 162, in case the devaporation starting material are back to the liquid or solid state.
For mounting groove 110, delivery unit 120 and injector 160 in chamber 400, it is integrally supported by support component 180.Support component 180 is installed on the track 185, and track 185 is used for injector 160 is moved to substrate 10, adjusts the distance of 10 of injector 160 and substrates by this.
The front side of injector 160 is provided with emitted dose survey sensor 184, in order to measure the raw-material emitted dose of vaporization of spraying by injector 160.The speed of the head 121 of the Heating temperature of heating unit 130 and delivery unit 120 is controlled according to emitted dose survey sensor 184 measured starting material emitted doses, so that adjust raw-material emitted dose.
Referring to Fig. 1, the unloading portion 5000 that is arranged at second end of base plate processing system is the space, and the substrate 10 that deposits organic thin layer is waited in described space being taken out to the preceding of outside.Emptier is installed on unloading portion 5000 places, with finish in deposition manufacture process and substrate 10 be taken out to the outside after substrate 10 is reloaded to substrate box.
The running of the base plate processing system that comprises described deposition material supplying device and described substrate board treatment of configuration as mentioned above hereinafter will be described.
Fig. 4 and Fig. 5 are according to exemplary embodiment, the sectional view of the deposition material supplying device in the use.
Referring to Fig. 4, the member 170 that is coupled certainly removes the groove 110 of described deposition material supplying device, then storage area 110a is filled to desire to be deposited on the starting material of substrate 10, also, fills with organic materials.Then, groove 110 is coupled to coupling component 170.When the various organic thin layer of storehouse in regular turn, the 3000a of processing substrate portion, 3000b and 3000c are arranged to corresponding to organic thin layer such as described, and organic materials supply part 100 is installed on respectively among the 3000a of processing substrate portion, 3000b and the 3000c, filling with the sedimentary organic materials of desire in the groove 110.At this moment, the storage area 110a of groove 110 is filled organic materials with sufficient quantity, to carry out the organic thin layer deposition manufacture process continuously or periodically.The organic materials that is filled in storage area 110a obtains cooling by cooling unit 140, therefore can store for a long time and deterioration not.Move the mobile body 181 be fixed with groove 110 and injector 160, with the distance of 10 of the substrates of setting injector 160 and desire processing.
When organic materials supply parts 100 are prepared as mentioned above, the substrate 10 that is ready in the loading portion 1000 is loaded on processing procedure preparation portion 2000, and is positioned on the substrate holder 200 substrate 10 and alignment.Then, transport substrate 10 by substrate holder 200, and with substrate 10 insert the appropriate location of the 3000a of processing substrate portion, 3000b and 3000c, in the face of being installed on organic materials supply part 100 among the 3000a of processing substrate portion, 3000b and the 3000c.
Be transported and be arranged at when substrate 10 on the front side of organic materials supply part 100, in the time of for example on the front side of injector 160, delivery unit 120 running of organic materials supply part 100 with the organic materials that transports the storage area 110a that is filled in groove 110 to vaporization space 110b, as shown in Figure 5.Particularly, when motor 123 rotation, ball screw 124 rotations are with mobile lifting body 125 vertically.Then, supporting body 126 integrally moves with lifting body 125, and carriage release lever 122 vertically.Therefore, the head 121 that is arranged at the upper end of bar 122 transport starting material to the storage area 110a of groove 110 to vaporization space 110b.Then, the described organic materials of installing around vaporization space 110b of heating unit 130 vaporizations.The amount of vaporization organic materials decides by the Heating temperature of control heating unit 130 and the speed of control head 121.The organic materials that is stored among the storage area 110a but is not transported to vaporization space 110b obtains cooling by the cooling unit of installing around storage area 110a 140, prevents the organic materials deterioration by this.
Thus, via the gas injection opening 161 of coupling component 170, pipe connecting 150 and injector 160, self-injection device 160 ejects the required organic materials amount of vaporizing in vaporization space 110b.Open flashboard 190, spraying organic materials effectively, described organic materials is deposited on the substrate 10 and forms organic thin layer on substrate 10.At this moment, the emitted dose survey sensor 184 of the front side by being arranged at injector 160 is measured the amount of the organic materials that self-injection device 160 sprays, and calculates the speed of measured amount with the head 121 of the Heating temperature of control heating unit 130 and delivery unit 120.
When transporting substrate 10 continuously, the flashboard 190 that is installed on the front side of injector 160 can remain in opened condition always.And when promptly periodically transporting substrate 10 discontinuously, flashboard 190 is closure or openness optionally.
Thus, when when being selected from one of the 3000a of processing substrate portion, 3000b and 3000c parts and finishing the deposition of single-layer type or multi-layer type organic thin layer, substrate 10 is transported to unloading preparation portion 4000, and removes from substrate holder 200.The substrate 10 that is removed is transported to unloading portion 5000.Thus, when substrate 10 is transported to unloading portion 5000, substrate 10 is loaded in the substrate box and in base plate processing system take out.
Although base plate processing system is handled mass substrate apace with straight column mode in present embodiment, yet in scope of the present invention, can various modes deposit organic thin layer.Although the state deposit organic thin layer that is provided with perpendicular to ground in substrate and injector in present embodiment, yet also flatly installation base plate support and organic materials supply part are to be provided with substrate and injector along the direction that is parallel to ground.
Although describe the deposition material supplying device and comprise the substrate board treatment of described deposition material supplying device above with reference to specific embodiment, it is not limited in this.Therefore, those who familiarize themselves with the technology will readily appreciate that, under the prerequisite that does not deviate from the spirit of the present invention that defined by appended claims and scope, can make various modifications and change to it.
Claims (15)
1. a deposition material supplying device is characterized in that, comprises:
Groove, wherein storage area and vaporization space interconnect, and described storage area is filled with starting material, and described starting material are vaporized in described vaporization space;
Delivery unit is in order to transport the described starting material that are filled in the described storage area continuously or periodically to described vaporization space; And
Heating unit is arranged at the outside of the described vaporization space of described groove, makes the heat of described starting material vaporization in order to supply.
2. deposition material supplying device according to claim 1 is characterized in that, more comprises cooling unit, and described cooling unit is arranged at the outside of the described storage area of described groove, thermal degradation when occurs with the described starting material that prevent to be stored in the described storage area.
3. deposition material supplying device according to claim 2, it is characterized in that described cooling unit comprises cooling jacket (cooling jacket), described cooling jacket comprises cooling channel, described cooling channel is around the outside surface of described groove, and coolant flowing is in described cooling channel.
4. deposition material supplying device according to claim 1 and 2 is characterized in that, it is characterized in that, more comprises:
Pipe connecting, first side of described pipe connecting connects the described vaporization space of described groove, and to form passage, described vaporization starting material flow in described passage; And
Injector is connected to second side of described pipe connecting, in order to spray described vaporization starting material.
5. deposition material supplying device according to claim 4 is characterized in that, more comprises support component, integrally supports described groove, described delivery unit and described injector,
Wherein said support component is installed on the track and can moves along described track, and described track extends the orientation direction of described injector.
6. deposition material supplying device according to claim 4 is characterized in that, described first side of described pipe connecting is connected with coupling component, and described coupling component screw thread couple is to described groove.
7. deposition material supplying device according to claim 4 is characterized in that, described pipe connecting has between about 20 millimeters to about 200 millimeters of diameter.
8. deposition material supplying device according to claim 4 is characterized in that, more comprises the emitted dose survey sensor, injects described raw-material emitted dose in order to measure from described injector,
The described raw-material described emitted dose that wherein said deposition material supplying device is measured according to described emitted dose survey sensor is controlled the running of described delivery unit, so that adjust described raw-material described emitted dose.
9. deposition material supplying device according to claim 1 and 2 is characterized in that, tinsel is installed on the inwall of described vaporization space of described groove.
10. deposition material supplying device according to claim 1 and 2 is characterized in that, described delivery unit comprises:
Head is arranged in the described groove, in order to promote described starting material;
Bar has first side and is connected to described head, and second side then is arranged at the outside of described groove, and described bar and described head integrally move; And
Drive element is connected to described second side of described bar, in order to move described bar.
11. deposition material supplying device according to claim 10 is characterized in that, described drive element comprise motor and hydro-cylinder one of them.
12. deposition material supplying device according to claim 1 and 2 is characterized in that, described heating unit comprise core well heater (core heater) and lamp well heater one of them.
13. a substrate board treatment is characterized in that, comprises:
Chamber has reaction compartment;
The organic materials supply part is arranged in the described reaction compartment, in order to the starting material of supply desire vaporization; And
Substrate holder (substrate holder), in order to supporting substrate,
Wherein said organic materials supply part comprises:
Groove, wherein storage area and vaporization space interconnect, and described storage area is filled with described starting material, and described starting material are vaporized in described vaporization space;
Delivery unit is in order to transport the described starting material that are filled in the described storage area continuously or periodically to described vaporization space;
Heating unit is arranged at the outside of the described vaporization space of described groove, makes the heat of described starting material vaporization to described vaporization space in order to supply;
Pipe connecting, first side of described pipe connecting is connected to the described vaporization space of described groove, and to form passage, described vaporization starting material flow in described passage; And
Injector is connected to second side of described pipe connecting and in the face of described substrate holder, described injector is in order to spray described vaporization starting material to described substrate.
14. substrate board treatment according to claim 13 is characterized in that, more comprises cooling unit, described cooling unit is arranged at the outside of the described storage area of described groove, thermal degradation when occurs with the described starting material that prevent to be stored in the described storage area.
15., it is characterized in that described chamber is divided into a plurality of reaction compartments according to claim 13 or 14 described substrate board treatments;
Described organic materials supply part relates to a plurality of forms, waits in the reaction compartment to be arranged at the described of described chamber respectively; And
Described substrate holder is transported to and faces the described organic materials supply part that waits.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080113866A KR100926437B1 (en) | 2008-11-17 | 2008-11-17 | Evaporation material supply apparatus and substrate processing apparatus having the same |
| KR10-2008-0113866 | 2008-11-17 | ||
| PCT/KR2009/006671 WO2010056057A2 (en) | 2008-11-17 | 2009-11-13 | Deposition material supply apparatus and substrate treatment apparatus having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102216488A true CN102216488A (en) | 2011-10-12 |
Family
ID=41561614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801464693A Pending CN102216488A (en) | 2008-11-17 | 2009-11-13 | Deposition material supply apparatus and substrate treatment apparatus having the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5406304B2 (en) |
| KR (1) | KR100926437B1 (en) |
| CN (1) | CN102216488A (en) |
| TW (1) | TWI397202B (en) |
| WO (1) | WO2010056057A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018176563A1 (en) * | 2017-03-29 | 2018-10-04 | 武汉华星光电技术有限公司 | Evaporation source |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101084234B1 (en) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | Deposition source, deposition apparatus and thin film formation method comprising the same |
| KR101172275B1 (en) * | 2009-12-31 | 2012-08-08 | 에스엔유 프리시젼 주식회사 | Vaporizing apparatus and control method for the same |
| CN105632978B (en) * | 2010-04-09 | 2018-10-30 | 株式会社尼康 | Substrate board treatment and substrate processing method using same |
| JP5674431B2 (en) * | 2010-11-17 | 2015-02-25 | 株式会社アルバック | Thin film forming equipment |
| WO2012081738A1 (en) * | 2010-12-13 | 2012-06-21 | Posco | Continuous coating apparatus |
| KR101052435B1 (en) | 2011-04-13 | 2011-07-28 | 에스엔유 프리시젼 주식회사 | Thin film deposition equipment |
| KR101233629B1 (en) * | 2011-04-13 | 2013-02-15 | 에스엔유 프리시젼 주식회사 | Large capacity depositing apparatus for forming thin film |
| KR20120116720A (en) * | 2011-04-13 | 2012-10-23 | 에스엔유 프리시젼 주식회사 | Apparatus for supplying materials |
| KR101320434B1 (en) * | 2011-05-12 | 2013-10-23 | 에스엔유 프리시젼 주식회사 | Apparatus for controlling supply of materials |
| KR101174633B1 (en) | 2011-05-12 | 2012-08-17 | 에스엔유 프리시젼 주식회사 | Apparatus for supplying materials |
| KR101754356B1 (en) * | 2011-12-15 | 2017-07-07 | 주식회사 원익아이피에스 | Evaporating source, deposition material supply apparatus and deposition apparatus comprising the same |
| KR101418714B1 (en) * | 2012-09-13 | 2014-07-10 | 주식회사 선익시스템 | Evaporation source and Apparatus for deposition having the same |
| KR101418712B1 (en) | 2012-09-14 | 2014-07-10 | 주식회사 선익시스템 | Evaporation source and Apparatus for deposition having the same |
| KR101422533B1 (en) * | 2012-12-04 | 2014-07-24 | 주식회사 선익시스템 | A Linear Type Evaporator with a Mixing Zone |
| JP6328766B2 (en) * | 2013-12-10 | 2018-05-23 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method for evaporating organic material |
| KR102313597B1 (en) * | 2014-12-30 | 2021-10-18 | (주)선익시스템 | A Deposition Source Having Cooling Device |
| KR102203725B1 (en) * | 2018-11-29 | 2021-01-15 | 주식회사 선익시스템 | Apparatus for thin film deposition |
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- 2009-11-13 WO PCT/KR2009/006671 patent/WO2010056057A2/en active Application Filing
- 2009-11-13 CN CN2009801464693A patent/CN102216488A/en active Pending
- 2009-11-16 TW TW098138822A patent/TWI397202B/en not_active IP Right Cessation
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| KR20020090934A (en) * | 2002-08-27 | 2002-12-05 | 에이엔 에스 주식회사 | Organic material point source feeding unit in organic semiconductor device and method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2010056057A2 (en) | 2010-05-20 |
| JP5406304B2 (en) | 2014-02-05 |
| TW201036227A (en) | 2010-10-01 |
| KR100926437B1 (en) | 2009-11-13 |
| TWI397202B (en) | 2013-05-21 |
| WO2010056057A3 (en) | 2010-07-08 |
| JP2012508815A (en) | 2012-04-12 |
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Application publication date: 20111012 |