200926091 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種數位電子看板之散熱系統，特別是指 一種針對數位電子看板内之電路板進行散熱之散熱系統。 【先前技術】 隨著數位電子看板產品逐漸走向高性能化、高頻化、高 速化與輕薄化的方向發展，同時晶片尺寸亦逐漸小型化，造 成電子元件之發熱密度愈來愈高，因此’「散熱問題」變得 〇愈來愈棘手也愈來愈重要；另，因電子看板的體積都很龎 大，因此，其内部產生的溫度也相當高，若不將其内部的高 溫帶走’將會導致電子看板於運作時易發生故障等情形。有 鑑於此，現今要如何提供經濟又有效率的散熱方式，則是當 前相關產業刻不容緩的課題。200926091 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation system for a digital electronic signage, and more particularly to a heat dissipation system for dissipating heat from a circuit board in a digital electronic signage. [Prior Art] With the development of digital electronic signage products in the direction of high performance, high frequency, high speed and lightness and thinness, the chip size is also gradually miniaturized, resulting in higher heat density of electronic components. The "heat dissipation problem" has become more and more difficult and more and more important. In addition, because the size of the electronic kanban is very large, the temperature generated inside is also quite high, if the internal high temperature is not taken away' This will cause the electronic signage to be prone to malfunctions during operation. In view of this, how to provide an economical and efficient cooling method today is an urgent task for the relevant industries.
…由此可見’上述習用方式仍有諸多缺失，實非_良善之 §史§十者’而亟待加以改良。 本案發明人鑑於上诚翌田士 4 / '上这％用方式所衍生的各項缺點，乃亟 思加以改良創新，並經多年 孤h潛心研究後，終於成功 研發元成本件數位電子看板 【發明内容】 4 本發明之目的即在於提供一種 板及電腦主機板進行散熱，㈣ ，+看板内主電路 之數位電子看板之散熱“。彳讓高溫迅速抽離功效 200926091 本發明之次一目的係在於提供一種結構簡單、安裝簡 易、低成本製作及設置費用低之數位電子看板之散熱系統。 可達成上述發明目的之數位電子看板之散熱系統，其係 由第一散熱子系統及第二散熱子系統所構成；其中，該第— 散熱子系統係設置於為數位電子看板的主電路板區域，而第 二散熱子系統則設置於為數位電子看板的電腦主機板區 域，而該主電路板區域内至少設置有兩個以上之散熱風扇， ❹其中一個散熱風扇係設置於主電路板區域側邊處，另一個散 熱風扇則設置於一電源供應器側邊處，且設置於電源供應器 側邊處之散熱風扇，可在外接一導風管體；而該電腦主機板 區域上至少設置兩個以上之散熱風扇’其中一個散熱風扇係 汉置於電腦主機板區域侧邊處，另一個散熱風扇則設置於電 腦主機板的微處理器上方；透過上述各散熱風扇之設置，即 形成一散熱系統，以將電子看板内之高溫迅速抽離至電子看 ❹板外部’使得電子看板内不因溫度過高，而導致電子看板發 生故障等情形發生。 【實施方式】 明參閱圖〜圖二所示，為本發明所提供數位電子看板 之散熱系統背視圖，其包括有： 一數位電子看板1，該數位電子看板1係由第一散熱子 系統4及第二散熱子系統5所構成，且該兩散熱子系統4、5 並透過-隔板2將兩子系統4、5分隔成兩散熱區域(如圖一 200926091 A、B所示），最後，再透過一背蓋3罩合於兩子系統4、5 上； 第一散熱子系統4，係設置於數位電子看板1的主電路 板41區域，並於主電路板41區域内至少設置兩個以上之散 熱風扇411’其中一個散熱風扇411係設置於主電路板41區 域侧邊適當處，以針對主電路板41區域進行散熱，另一個 散熱風扇411則設置於一電源供應器412侧邊處，且設置於 ❹電源供應器412側邊處之散熱風扇411，可在外接一導風管 體413’以針對電源供應器412進行散熱，透過散熱風扇4ΐι 的設置即可將主電路板41區域内的高溫抽離至外部； 第二散熱子系統5，係設置於數位電子看板丨的電腦主 機板51區域，該電腦主機板51區域内至少設置兩個以上之 散熱風扇511，其中—個散熱風扇511係設置於電腦主機板 5 1區域側邊適當處，以針對電腦主機板5丨區域進行散熱， ©另一個散熱風扇5 11係設置於一電腦主機板5丨區域的微處 理器512上方，以針對微處理器512進行散熱，透過散熱風 扇511的設置可將電腦主機板51區域内的高溫抽離至外部； 一背蓋3，該背蓋3上任一處佈設有數排以上之散熱孔 3 1，且部分之散熱孔3丨係會對應開設於兩散熱子系統*、5 散熱風扇411、511及導風管體513之排風處（如圖二所示）； 藉由上述各構件之組成，即形成發明之數位電子看板】 200926091 之散熱系統（如圖三所示），便可讓數 紙见电于耆板i内兩子系 統4、5散熱區域的高溫由散熱孔 心逆抽離排出至數位電 子看板1之外部，俾而有效讓數位 丁賡极1保持在最佳穩 定運作之目的。 本發明所提供之數位電子看板之散熱系統，與其他習用 技術相互比較時，更具有下列之優點： 1.本發明係在於提供—種可針對電子看板内主電路板及 電腦主機板進行散熱，以確實達到針對高溫迅速抽離功效。 2·本發明係在於提供一種結構簡單、安裝簡易、低成本 製作以及設置費用低等諸多功效。 上列詳細說明係針對本發明之一可行實施例之且㈣ 明’惟該實施例並㈣職制本發明之專利範圍，凡未脫離 本發明技藝精神所為之等效實施或變更，均應包含於本案之 專利範圍中。 〇綜上所述，本㈣但在技術思想上確屬錢，並能較習 用物品增進上述多項功效’應已充分符合新穎性及進步性之 法定發明專利要件4依法提“請，㈣貴局核准本件 發明專利申請案，以勵發明，至感德便。 【圖式簡單說明】 π參閱以下有關本發明—較佳實施例之詳細說明及其附 圖，將可進-步瞭解本發明之技術内容及其目的功效·有關 S亥實施例之附圖為： 200926091 圖一 A、B本發明數位電子看板之散熱系統之兩子系統 視圖；以及 圖二為該數位電子看板之散熱系統之散熱風扇與背蓋散 熱孔對應設置視圖；以及 圖三為該數位電子看板之散熱系統之組合視圖。 【主要元件符號說明】 1數位電子看板 ❹ 2 3 隔板 背蓋 3 1 散熱孔 4 第一散熱子系統 41 主電路板 411 散熱風扇 412 電源供應裔 〇 413 5 導風管體 第二散熱子系統 5 1電腦主機板 5 11散熱風扇 5 1 2微處理器... It can be seen that there are still many shortcomings in the above-mentioned methods of use, which are not _good § history § ten and need to be improved. The inventor of this case, in view of the shortcomings derived from the use of this method by Shangcheng 翌田士4 / ', is the improvement and innovation of 亟思, and after years of research, finally succeeded in the development of digital cost digital electronic kanban [ SUMMARY OF THE INVENTION [4] The purpose of the present invention is to provide a board and a computer motherboard for heat dissipation, (4), + the heat dissipation of the digital electronic board of the main circuit in the board. "彳 Let the high temperature quickly pull off the effect 200926091 The second purpose of the present invention The invention provides a heat dissipation system for a digital electronic signboard with simple structure, simple installation, low cost production and low installation cost. The heat dissipation system of the digital electronic signboard capable of achieving the above object is composed of a first heat dissipation subsystem and a second heat sink. The system is configured; wherein the first heat dissipation subsystem is disposed in a main circuit board area of the digital electronic signboard, and the second heat dissipation subsystem is disposed in a computer motherboard area of the digital electronic board, and the main circuit board area There are at least two cooling fans installed inside, and one of the cooling fans is disposed on the side of the main circuit board area. The other cooling fan is disposed at a side of the power supply, and the cooling fan disposed at the side of the power supply can be connected to an air guiding body; at least two or more of the computer main board area are disposed. The cooling fan's one cooling fan is placed at the side of the computer motherboard area, and the other cooling fan is disposed above the microprocessor of the computer motherboard; through the setting of the above cooling fans, a heat dissipation system is formed. In order to quickly remove the high temperature in the electronic kanban to the outside of the electronic kanban board, the electronic kanban does not cause the electronic kanban to malfunction due to the excessive temperature. [Embodiment] Referring to the figure to Figure 2, A rear view of a heat dissipation system for a digital electronic signboard provided by the present invention includes: a digital electronic signboard 1 composed of a first heat dissipation subsystem 4 and a second heat dissipation subsystem 5, and the two The heat dissipation subsystems 4, 5 and the two subsystems 4, 5 are separated into two heat dissipation regions through the partition plate 2 (as shown in Fig. 1 200926091 A, B), and finally, through a back The cover 3 is disposed on the two subsystems 4, 5; the first heat dissipation subsystem 4 is disposed in the area of the main circuit board 41 of the digital electronic board 1, and at least two or more cooling fans are disposed in the area of the main circuit board 41. One of the cooling fans 411 is disposed at a side of the main circuit board 41 to dissipate heat for the main circuit board 41, and the other cooling fan 411 is disposed at a side of the power supply 412. The heat dissipating fan 411 at the side of the power supply 412 can be externally connected to a wind guiding body 413' to dissipate heat for the power supply 412, and the high temperature in the main circuit board 41 can be pumped through the setting of the cooling fan 4ΐ. The second heat dissipation subsystem 5 is disposed in the area of the computer motherboard 51 of the digital electronic signboard. At least two or more cooling fans 511 are disposed in the area of the computer motherboard 51, wherein one cooling fan 511 is disposed. Appropriately on the side of the area of the computer motherboard 5 1 to dissipate heat for the area of the computer motherboard 5, © another cooling fan 5 11 is a microprocessor 5 disposed in the area 5 of a computer motherboard 12, in order to dissipate heat for the microprocessor 512, through the setting of the cooling fan 511, the high temperature in the area of the computer motherboard 51 can be extracted to the outside; a back cover 3, the back cover 3 is provided with a plurality of rows or more The heat dissipation hole 3 1 and a part of the heat dissipation hole 3 are correspondingly arranged in the air outlets of the two heat dissipation subsystems*, 5 heat dissipation fans 411 and 511 and the air guiding tube body 513 (as shown in FIG. 2); The composition of each component, that is, the digital electronic signboard of the invention] 200926091 The heat dissipation system (shown in Figure 3) allows the paper to be seen in the heat dissipation area of the heat dissipation area of the two subsystems 4 and 5 in the raft The heart is reversed and discharged to the outside of the digital electronic signboard 1, which effectively keeps the digital Dingji 1 in the best stable operation. The heat dissipation system of the digital electronic signage provided by the invention has the following advantages when compared with other conventional technologies: 1. The invention provides a heat dissipation system for the main circuit board and the computer motherboard in the electronic signage. In order to achieve rapid separation of the effect against high temperatures. 2. The present invention provides a system having a simple structure, simple installation, low cost production, and low installation cost. The detailed description above is intended to be a preferred embodiment of the invention, and the scope of the invention is intended to be included in the scope of the invention. The patent scope of this case. In summary, this (4) is technically thought to be money, and can improve the above-mentioned multiple functions compared with the customary items. 'The statutory invention patents that should have fully complied with the novelty and progressiveness. 4According to the law, please, (4) Your Bureau Approving the invention patent application, in order to invent the invention, to the sense of convenience. [Simplified description of the drawings] π Referring to the following detailed description of the present invention - the preferred embodiment and the accompanying drawings, the present invention will be further understood. Technical content and its purpose effects. The drawings relating to the S-Hing embodiment are: 200926091 Figure 1A, B. Two subsystem views of the heat dissipation system of the digital electronic signage of the present invention; and Figure 2 is the heat dissipation of the heat dissipation system of the digital electronic signage The fan and the back cover vent corresponding to the setting view; and Figure 3 is a combination view of the digital electronic kanban heat dissipation system. [Main component symbol description] 1 digital electronic sign ❹ 2 3 partition back cover 3 1 vent hole 4 first heat dissipation Subsystem 41 Main Circuit Board 411 Cooling Fan 412 Power Supply 〇 413 5 Air Duct Body Second Cooling Subsystem 5 1 Computer Motherboard 5 11 Cooling Fan 5 1 2 Micro Processor