JP2003168884A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component whose cooling capability is increased by making a cooling wind to be supplied into a duct uniform and in which the structural strength of the duct is enhanced. <P>SOLUTION: The electronic component comprises a PCB1, an LSI2 mounted on the PCB1, the duct 5 which is provided with an entrance and an exit for the cooling wind and which covers the PCB1 and a fan 4 which supplies the cooling wind to a space between the PCB1 and the duct 5. The space on the side of the entrance of the duct from the LSI2 between the PCB1 and the duct 5 is provided with an effect of straightening the cooling wind and an effect of reinforcing the duct 5, and a cell in a shape not forming the air resistance of the cooling wind is formed of a slit plate 6 bonded to the duct 5 installed in parallel to the wind direction of the cooling wind. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a structure for equalizing cooling air to be supplied to an object to be cooled,
In particular, it relates to an electronic component having a structure for improving the mechanical strength of a cooling duct.

[0002]

2. Description of the Related Art Conventionally, L has been used for computer equipment.
SI (Large Scale Integrated circuit) tends to have higher power consumption and higher heat generation as well as higher performance.
Forced air cooling by a fan is often applied. FIG. 13 shows the structure of a conventional electronic component. This electronic component is a PCB (Printed Circuit Board) 1, LS
It has I2, heat sink 3, fan 4 and duct 5. The PCB 1 is a printed wiring board, and an electric circuit made of copper foil or the like is printed on an insulating board. PCB
A duct 5 is provided around the heat sink 3 so as to cover the heat sink 3. LSI2 is a transistor, a diode,
Parts such as resistors and capacitors are formed on the semiconductor chip. The heat sink 3 is an LSI due to heat generated during operation.
The air-cooling fins are provided to prevent the elements such as the transistors integrated in 2 from being destroyed or causing a malfunction. The fan 4 is a device that supplies cooling air to the heat sink 3 to promote heat dissipation to the atmosphere. The heat sink 3 is mounted on the LSI 2 mounted on the PCB 1, and the cooling air is supplied from the fan 4.

In the conventional electronic component, the fan 4 is the duct 5
The cooling performance is improved by supplying cooling air to the inside and forcibly circulating the air inside the duct 5 to promote the heat dissipation of the heat sink 3.

[0004]

However, since the fan 4 has a structure in which the blades are arranged around the motor located at the center of rotation, the cooling air supplied to the inside of the duct 5 is not always uniform. It is not always supplied to each part. FIG. 14 shows cooling air supplied to the inside of the duct by a conventional electronic component. In this figure, the wind speed is schematically represented by the length of the arrow. As shown in the figure, since the wind speed is low at the rotation center of the fan 4 and becomes higher toward the outside, the cooling air is sufficiently supplied to the peripheral portion of the duct 5, but the central portion of the duct 5, that is, the LSI 2 and the heat sink. Cooling air was not sufficiently supplied to No. 3.

Further, a structure (LSI
(2, heat sink 3, etc.) are arranged,
The tendency that the load and static pressure on the fan 4 increases and the cooling air supplied to the inside of the duct 5 becomes nonuniform becomes even stronger. As described above, in the conventional electronic component, the cooling performance of the heat sink 3 was not maximized.

Further, a circuit board (sub-board) on which a heavy-weight semiconductor device or heat sink is mounted is a PCB.
In the case of three-dimensional mounting on PCB 1, excessive stress may be generated due to vibration or impact and the PCB 1 may be damaged.
Therefore, it has been required that the duct 5 have a function as a reinforcing material for the PCB 1. That is, it has been required to improve the structural strength of the duct 5.

The present invention has been made in view of the above problems, and it is an object of the present invention to improve the cooling performance and the structural strength of the duct by making the cooling air supplied into the duct uniform.

[0008]

To achieve the above object, the present invention comprises, as a first aspect, a circuit board, a semiconductor device mounted on the circuit board, and an inlet and an outlet for cooling air. An electronic component having a duct covering the circuit board and a means for supplying cooling air to the space between the circuit board and the duct, the space being closer to the duct inlet side than the semiconductor device between the circuit board and the duct. In addition, the present invention provides an electronic component in which a cell having a predetermined shape is formed by a straightening plate which is installed in parallel with a wind direction of cooling air and which is joined to a duct. Thereby, the cooling air is uniformly supplied to the inside of the duct to improve the cooling efficiency and the structural strength of the duct.

In order to achieve the above object, the present invention, as a second aspect, covers a circuit board, a semiconductor device mounted on the circuit board, and an inlet and an outlet for cooling air to cover the circuit board. An electronic component having a duct and means for forcibly discharging air in a space between the circuit board and the duct from a duct outlet to supply the cooling air to the space, the circuit board and the duct An electronic component characterized in that a cell having a predetermined shape is formed in a space between the semiconductor device and the duct outlet side by a rectifying plate that is installed in parallel with the wind direction of the cooling air and is joined to the duct. Is. As a result, air is uniformly discharged from the inside of the duct, cooling efficiency is improved, and structural strength of the duct is improved.

In order to achieve the above object, the present invention provides, as a third aspect, a circuit board, a semiconductor device mounted on the circuit board, and an inlet and an outlet for cooling air to cover the circuit board. A means for supplying cooling air to the space between the duct and the circuit board and the duct, and forcibly exhausting air in the space between the circuit board and the duct from the duct outlet to supply the cooling air to the space. An electronic component having a supply means, wherein cells of a predetermined shape are provided in a space between the circuit board and the duct on the duct inlet side and the duct outlet side of the semiconductor device in parallel with the wind direction of the cooling air. The present invention provides an electronic component characterized by being formed by a current plate installed and joined to a duct. As a result, the cooling air is uniformly supplied to the inside of the duct, and the air is uniformly discharged from the inside of the duct to improve the cooling efficiency and the structural strength of the duct.

In the above-mentioned first, second or third aspect of the present invention, the shape of the cell has a rectifying effect of cooling air and a duct reinforcing effect, and does not become an air resistance of the cooling air. It is preferably shaped. By forming the cells in such a shape, a rectifying effect can be obtained and the structural strength of the duct can be improved.

In order to achieve the above object, the present invention, as a fourth aspect, includes a circuit board, a semiconductor device mounted on the circuit board, and an inlet and an outlet for cooling air to cover the circuit board. A means for supplying cooling air to the space between the duct and the circuit board and the duct, and forcibly exhausting air in the space between the circuit board and the duct from the duct outlet to supply the cooling air to the space. An electronic component having a supply means, wherein a cell having a first shape is installed in a space between a circuit board and a duct on a duct inlet side of a semiconductor device in parallel with a direction of cooling air and joined to the duct. A second shape cell formed in parallel with the cooling air in a space between the circuit board and the duct on the duct outlet side of the semiconductor device between the circuit board and the duct. Formed by 2 straightening vanes There is provided an electronic component characterized in that it. In the fourth aspect of the present invention described above, it is preferable that the shapes of the first and second cells are shapes that respectively have a rectifying effect of the cooling air and a duct reinforcing effect and do not become an air resistance of the cooling air. . As a result, the cooling air is uniformly supplied to the inside of the duct and the air is uniformly discharged from the inside of the duct, so that the cooling efficiency is improved and the structural strength of the duct is further improved.

Further, in any of the above aspects of the present invention, it is preferable that the cells formed in the central portion of the duct are larger than the cells formed in the peripheral portion of the duct, and the semiconductor device is provided with a heat sink. preferable. Thereby, the cooling efficiency can be further improved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment in which an electronic component according to the present invention is preferably implemented will be described. FIG. 1 shows the configuration of the electronic component according to the present embodiment. This electronic component has a PCB 1, an LSI 2, a heat sink 3, a fan 4, a duct 5 and a slit plate 6. The PCB 1, LSI 2, heat sink 3, fan 4 and duct 5 are the same as in the prior art. Slit plate 6
Is installed over the entire inlet portion of the duct 5 on the inlet side of the heat sink 3. FIG. 2 shows a case where the slit plates 6 are installed in a grid shape so that the cells have a rectangular shape, and the positions where the slit plates 6 and the duct 5 contact each other are joined.

FIG. 3 shows the cooling air supplied to the inside of the duct by the electronic component according to this embodiment. Note that, similarly to FIG. 14, the wind speed is schematically represented by the length of the arrow. In the electronic component according to the present embodiment, the cooling air supplied from the fan 4 to the inside of the duct 5 is averaged and leveled by the rectifying effect of the slit plate 6 and uniformly supplied, so that the heat sink 3
The heat is efficiently dissipated from the atmosphere to the atmosphere. In addition, since the portion where the duct 5 and the slit plate 6 are in contact with each other is joined, the structural strength of the duct 5 is improved.

Examples of the slit plate 6 applied to the electronic component according to the present embodiment are shown in FIGS. FIG. 4 shows a case where the slit plate 6 is installed in a honeycomb structure so that the cells have a regular hexagonal shape. Further, FIG. 5 shows a case where the slit plate 6 is installed so that the cells have a circular shape. Even in these cell shapes, the contact points between the slit plate 6 and the duct 5 are joined. Therefore, the slit plate 6 is formed in a grid pattern.
As in the case of arranging, the cooling air supplied into the duct 5 can be made uniform by the rectifying effect of the slit plate 6, and the structural strength of the duct 5 is improved.

FIGS. 6, 7 and 8 show the case where the slit plate 6 is arranged so that the cells near the center of the opening of the duct 5 are large and the cells at the periphery of the opening are small. 6 shows the case where the slit plates 6 are installed in a grid pattern, FIG. 7 shows the case where the slit plates 6 are installed in a honeycomb structure, and FIG. 8 shows the case where the slit plates 6 are installed so that the cells are circular. In any of these structures, the portions where the duct 5 and the slit plate 6 contact each other are joined. By enlarging the cells near the center of the opening of the duct 5, the air volume at the center of the duct 5 increases, so that the cooling air supplied to the LSI 2 and the heat sink 3 increases and the cooling efficiency improves. Also,
Since the portion where the duct 5 and the slit plate 6 contact each other is joined, the structural strength of the duct 5 is improved. In addition, here, the slit plate 6 is installed so that two types of large and small cells are formed, but the slit plate 6 may be installed so that three or more types of cells are formed, and You may install the slit plate 6 so that a size may change continuously.

[Second Embodiment] A second embodiment in which the electronic component according to the present invention is preferably implemented will be described. FIG. 9 shows the configuration of the electronic component according to the present embodiment. This electronic component is similar to the first embodiment in that the PCB 1 and the LSI are
2, a heat sink 3, a fan 4, a duct 5 and a slit plate 6. However, in this embodiment, the fan 4 and the slit plate 6 are installed on the exhaust side.

In the present embodiment, the cooling air is supplied to the LSI 2 and the heat sink 3 by forcibly discharging the air inside the duct 5 by the fan 4. As shown in FIG. 10, due to the rectifying effect of the slit plate 6 installed between the fan 2 and the LSI 2 and heat sink 3, the duct 5
Air is uniformly discharged from the inside. Therefore, the cooling air supplied to the LSI 2 and the heat sink 3 is increased, and the cooling efficiency is improved. Moreover, the structural strength of the duct 5 is improved by joining the portions where the duct 5 and the slit plate 6 are in contact with each other. In this embodiment, the same slit plate as that of the first embodiment shown in FIG. 2 or FIGS. 4 to 8 can be applied.

[Third Embodiment] A third embodiment in which the electronic component according to the present invention is preferably implemented will be described. FIG. 11 shows the configuration of the electronic component according to the present embodiment. This electronic component is similar to the first embodiment in that the PCB 1 and the LSI are
2, heat sink 3, fan 4 (4a, 4b), duct 5 and slit plate 6 (6a, 6b). However, in this embodiment, the fan 4 and the slit plate 6 are installed on both the intake side and the exhaust side.

In the present embodiment, the fan 4a forcibly feeds the air into the duct 5 and the fan 4b forcibly discharges the air inside the duct 5, so that the LS is reduced.
Cooling air is supplied to I2 and the heat sink 3. Figure 1
As shown in FIG. 2, air is uniformly supplied to the inside of the duct 5 by the rectifying effect of the slit plate 6a installed between the LSI 2 and the heat sink 3 and the fan 4a. Further, air is uniformly discharged from the inside of the duct 5 by the rectifying effect of the slit plate 6b installed between the LSI 2 and the heat sink 3 and the fan 4b. Therefore, LSI2
The cooling air supplied to the heat sink 3 is increased, and the cooling efficiency is improved. Further, the structural strength of the duct 5 is improved by joining the portions where the duct 5 and the slit plate 6a are in contact with each other and the portions where the duct 5 and the slit plate 6b are in contact with each other. In this embodiment, the same slit plate as that of the first embodiment shown in FIGS. 2 and 4 to 8 can be applied. The slit plates 6a and 6b may have the same shape, or may have different shapes.

According to each of the above embodiments, L having a large mass is used.
Even when the PCB on which the SI or the heat sink is mounted is three-dimensionally mounted, the force applied to the PCB by the vibration / impact is dispersed by the slit plate. Therefore, the present invention can be suitably applied even when the duct itself is required to have structural strength against vibration and impact.

It should be noted that each of the above embodiments is an example of a preferred embodiment of the present invention, and the present invention is not limited to this. For example, the shape of the cell formed by the slit plate 6 is not limited to the illustrated one, and any shape can be used as long as it has a rectifying effect and a duct reinforcing effect and does not become the air resistance of the cooling air. It may be in any shape. For example, the cell shape may be a triangular shape, or a flat plate may be arranged on both sides of a corrugated plate material so as to have a cell shape similar to that of a corrugated board. Further, the duct 5 and the slit plate 6 may have an integrated structure. Alternatively, the heat sink 3 does not necessarily have to be provided. As described above, the present invention can be variously modified.

[0024]

As is apparent from the above description, according to the present invention, the cooling air supplied into the duct is made uniform by the rectifying effect of the slit plate, so that the cooling efficiency is improved. Further, since the slit plate provided at the entrance opening and / or the exit opening of the duct functions as a reinforcing material, the strength of the duct against vibration and impact is improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an electronic component according to a first exemplary embodiment in which the present invention is preferably implemented.

FIG. 2 is a diagram showing an example in which slit plates are installed in a grid pattern.

FIG. 3 is a schematic diagram showing a rectifying effect by a slit plate applied to the first embodiment.

FIG. 4 is a diagram showing an example in which a slit plate is installed in a honeycomb structure.

FIG. 5 is a diagram showing an example in which slit plates are installed so that cells have a circular shape.

FIG. 6 is a view showing an example in which slit plates are installed in a grid pattern so that cells at the center of the duct are large and cells at the peripheral edge are small.

FIG. 7 is a diagram showing an example in which a slit plate is installed in a honeycomb structure so that cells in a central portion of a duct are large and cells in a peripheral portion are small.

FIG. 8 is a diagram showing an example in which slit plates are installed so that cells at the center of the duct have a large circle and cells at the peripheral edge have a small circle.

FIG. 9 is a diagram showing a configuration of an electronic component according to a second exemplary embodiment in which the present invention is preferably implemented.

FIG. 10 is a schematic diagram showing a rectifying effect by a slit plate applied to the second embodiment.

FIG. 11 is a diagram showing a configuration of an electronic component according to a third exemplary embodiment in which the present invention is preferably implemented.

FIG. 12 is a schematic diagram showing a rectifying effect by a slit plate applied to the third embodiment.

FIG. 13 is a diagram showing a configuration of an electronic component according to a conventional technique.

FIG. 14 is a diagram showing cooling air supplied to the inside of a duct by an electronic component according to a conventional technique.

[Explanation of symbols]

1 PCB 2 LSI 3 heat sink 4, 4a, 4b fan 5 ducts 6, 6a, 6b slit plate

Claims (6)

[Claims] 1. A circuit board, a semiconductor device mounted on the circuit board, a duct having an inlet and an outlet for cooling air and covering the circuit board, and a space between the circuit board and the duct, An electronic component having means for feeding the cooling air, wherein a cell having a predetermined shape is provided in a space between the circuit board and the duct on a duct inlet side of the semiconductor device, in which a direction of the cooling air flows. An electronic component, which is formed by a current plate that is installed in parallel with and is joined to the duct. 2. A circuit board, a semiconductor device mounted on the circuit board, a duct having an inlet and an outlet for cooling air and covering the circuit board, and a space in the space between the circuit board and the duct. An electronic component having means for forcibly discharging air from a duct outlet to supply the cooling air to the space, in a space on the duct outlet side of the semiconductor device between the circuit board and the duct. An electronic component, wherein a cell having a predetermined shape is formed by a current plate installed in parallel with the wind direction of the cooling air and joined to the duct. 3. A circuit board, a semiconductor device mounted on the circuit board, a duct having an inlet and an outlet for cooling air and covering the circuit board, and a space provided between the circuit board and the duct. An electronic component having means for supplying cooling air, and means for forcibly discharging air in a space between the circuit board and the duct from a duct outlet to supply the cooling air to the space. A cell having a predetermined shape is installed in the space between the circuit board and the duct on the duct inlet side and the duct outlet side of the semiconductor device in parallel with the wind direction of the cooling air, and is joined to the duct. An electronic component characterized by being formed by a formed rectifying plate. 4. A circuit board, a semiconductor device mounted on the circuit board, a duct provided with an inlet and an outlet for cooling air and covering the circuit board, and a space between the circuit board and the duct. An electronic component having means for supplying air and means for forcibly discharging air in a space between the circuit board and the duct from a duct outlet to supply the cooling air to the space. A first rectifier in which a cell of a first shape is installed in a space between the circuit board and the duct on the duct inlet side of the semiconductor device in parallel with the direction of the cooling air and joined to the duct. A second shape cell, which is formed by a plate, is installed in parallel with the cooling air and is joined to the duct in a space between the circuit board and the duct on a duct outlet side of the semiconductor device. By the current plate of Electronic component, characterized in that formed Te. 5. The electronic component according to claim 1, wherein a cell formed in a central portion of the duct is larger than a cell formed in a peripheral portion of the duct. 6. The electronic component according to claim 1, wherein the semiconductor device includes a heat sink.