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CN201360391Y - Heat dissipation structure of enclosure - Google Patents

Heat dissipation structure of enclosure Download PDF

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Publication number
CN201360391Y
CN201360391Y CNU2009200027066U CN200920002706U CN201360391Y CN 201360391 Y CN201360391 Y CN 201360391Y CN U2009200027066 U CNU2009200027066 U CN U2009200027066U CN 200920002706 U CN200920002706 U CN 200920002706U CN 201360391 Y CN201360391 Y CN 201360391Y
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heat
heat dissipation
dissipation structure
casing
cooling
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CNU2009200027066U
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Chinese (zh)
Inventor
林君儒
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Enermax Technology Corp
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Enermax Technology Corp
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Abstract

A kind of chassis heat-dissipating structure, for setting up in the lateral plate of the chassis, the lateral plate is worn to have a perforation, the heat-dissipating structure of the chassis includes a cold junction device and a fan unit, wherein the cold junction device includes a refrigeration chip, a cold row, and a hot row, the refrigeration chip locates the perforation of the lateral plate, and have a cold junction and a hot junction, the cold junction of the refrigeration chip is linked to the cold row, and the hot junction is linked to the hot row, the surface area of the hot row is greater than the one third surface area of the lateral plate, the fan unit is set up in one side of the lateral plate, and correspond to the hot row; therefore, the temperature in the shell can be effectively reduced by using the refrigerating device with the refrigerating chip.

Description

机壳散热结构 Chassis cooling structure

技术领域 technical field

本实用新型有关于一种机壳散热结构,特别是指一种设有致冷芯片以有效散热的机壳散热结构。The utility model relates to a heat dissipation structure of a casing, in particular to a heat dissipation structure of a casing provided with a cooling chip for effective heat dissipation.

背景技术 Background technique

由于一般计算机机壳内具有多种电路板及电子组件,当计算机运作时,计算机机壳内电路板上的芯片、集成电路等电子组件因运作而产生热能,使得计算机机壳内温度升高,若机壳内的温度超出各电子组件可正常运作的温度上限,则会导致电子组件失效,造成计算机故障,因此计算机机壳均会加装散热风扇,使得计算机运作时,在计算机机壳内部由电子组件所产生的热气,可藉由散热风扇造成的空气对流被排出计算机机壳外。Because there are many kinds of circuit boards and electronic components in the general computer case, when the computer is running, the chips, integrated circuits and other electronic components on the circuit board in the computer case will generate heat due to the operation, which will increase the temperature inside the computer case. If the temperature inside the casing exceeds the upper limit of the normal operation temperature of each electronic component, it will cause the electronic component to fail and cause the computer to malfunction. The heat generated by the electronic components can be exhausted out of the computer case by the air convection caused by the cooling fan.

但,习知的计算机机壳是藉由散热风扇将外部空气导入壳体内,但该外部空气并非都具有较冷的温度,尤其在夏天时其温度便会较高,欲利用具有较高温度的空气达到降温的效果,显然其降温效果亦为有限。But the known computer casing is to introduce the outside air into the casing by the cooling fan, but the outside air does not all have a cooler temperature, especially in summer, its temperature will be higher. Air reaches the effect of cooling, obviously its cooling effect is also limited.

缘是,本创作人有感上述问题的可改善,乃潜心研究并配合学理的运用,而提出一种设计合理且有效改善上述问题的本实用新型。The reason is that the author of this invention feels that the above-mentioned problems can be improved, so he devotes himself to research and cooperates with the application of theories, and proposes a utility model with reasonable design and effective improvement of the above-mentioned problems.

实用新型内容 Utility model content

本实用新型的主要目的,在于提供一种机壳散热结构,其可藉由设置含有致冷芯片的致冷装置而有效降低机壳内部的温度。The main purpose of the present invention is to provide a heat dissipation structure for the casing, which can effectively reduce the temperature inside the casing by arranging a cooling device including a cooling chip.

为了达成上述的目的,本实用新型提供一种机壳散热结构,用以设置于该机壳的侧板,该侧板穿设有一穿孔,该机壳散热结构包括:一致冷装置及一风扇装置,其中该致冷装置包含:一致冷芯片,其设于该侧板的穿孔,该致冷芯片具有一冷端及一热端;一冷排,其连结于该致冷芯片的冷端;及一热排,其连结于该致冷芯片的热端,该热排的表面积大于该侧板的三分之一表面积;该风扇装置设置于该侧板一侧,且与该热排相对应。In order to achieve the above purpose, the utility model provides a heat dissipation structure of the casing, which is used to be arranged on the side plate of the casing. The side plate is pierced with a perforation. The heat dissipation structure of the casing includes: a cooling device and a fan device , wherein the refrigerating device comprises: a refrigerating chip, which is arranged in the through hole of the side plate, and the refrigerating chip has a cold end and a hot end; a cold row, which is connected to the cold end of the refrigerating chip; and A heat row, which is connected to the hot end of the cooling chip, the surface area of the heat row is greater than one-third of the surface area of the side plate; the fan device is arranged on one side of the side plate, and corresponds to the heat row.

本实用新型具有以下有益效果:本实用新型是藉由设置含有致冷芯片的致冷装置而可快速且有效地降低机壳内部的温度。另外,利用设在机壳的侧板的风扇装置,与表面积大于三分之一侧板表面积的热排相互搭配,而将致冷芯片所产生的热量有效地排除。The utility model has the following beneficial effects: the utility model can quickly and effectively reduce the temperature inside the casing by setting a refrigeration device containing a refrigeration chip. In addition, the fan device arranged on the side plate of the casing is used to cooperate with the heat row whose surface area is greater than one-third of the surface area of the side plate, so as to effectively remove the heat generated by the cooling chip.

为使能更进一步了解本实用新型的特征及技术内容,请参阅以下有关本实用新型的详细说明与附图,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.

附图说明 Description of drawings

图1为本实用新型机壳散热结构的立体组合图。Fig. 1 is a three-dimensional combined view of the heat dissipation structure of the casing of the present invention.

图2为本实用新型机壳散热结构的立体分解图,图中将部份的机壳省略而仅显示出侧板。Fig. 2 is a three-dimensional exploded view of the heat dissipation structure of the casing of the present invention, in which part of the casing is omitted and only the side panels are shown.

图3为本实用新型机壳散热结构的前视图。Fig. 3 is a front view of the cooling structure of the casing of the present invention.

图4为图3的4-4剖视图。Fig. 4 is a cross-sectional view along line 4-4 of Fig. 3 .

图5为本实用新型机壳散热结构设有保护罩时的立体分解图。Fig. 5 is a three-dimensional exploded view when the heat dissipation structure of the casing of the present invention is provided with a protective cover.

图6为本实用新型机壳散热结构设有保护罩时的立体组合图。Fig. 6 is a three-dimensional combined view when the heat dissipation structure of the casing of the present invention is provided with a protective cover.

主要组件符号说明Explanation of main component symbols

1  机壳1 chassis

11  侧板11 side panels

111  穿孔111 piercing

2  致冷装置2 refrigeration device

21  致冷芯片21 cooling chip

211  冷端211 cold end

212  热端212 hot end

22  冷排22 cold row

221  导冷片221 Cooling plate

23  导热单元23 heat conduction unit

231  座体231 Seat body

232  凹槽232 grooves

233  板体233 plate body

24  热排24 heat row

241  散热片组241 heat sink group

2411  散热片2411 heat sink

25  壳体25 Shell

251  缺口251 Gap

26  框体26 frame

261  螺座261 screw seat

27  固持结构27 holding structure

271  挡板271 Baffle

272  螺丝272 screws

28  热管28 heat pipes

29  罩板29 cover plate

3  风扇装置3 fan unit

31  护网31 guard net

311  基座311 base

312  固定孔312 Fixing hole

32  扇叶组32 fan blades

4  风扇装置4 fan unit

41  散热风扇41 cooling fan

5  安装架5 mounting bracket

6  保护罩6 protective cover

61  罩体61 cover body

611  开孔611 opening

612  缺口612 Gap

62  保护网62 Protection net

621  散热孔621 cooling holes

具体实施方式 Detailed ways

请参阅图1至图3所示,本实用新型提供一种机壳散热结构,用以设置于机壳1一侧的侧板11,该侧板11穿设有一穿孔111(如图2所示)。该机壳散热结构包括:一致冷装置2及一风扇装置3。其中该致冷装置2包含一致冷芯片21、一冷排22、一框体26、一导热单元23、一热排24、及多数热管28。Please refer to Fig. 1 to Fig. 3, the utility model provides a casing heat dissipation structure, which is used to set the side plate 11 on one side of the casing 1, and the side plate 11 is perforated with a perforation 111 (as shown in Fig. 2 ). The casing cooling structure includes: a cooling device 2 and a fan device 3 . The refrigeration device 2 includes a cooling chip 21 , a cooling row 22 , a frame 26 , a heat conduction unit 23 , a heat row 24 , and a plurality of heat pipes 28 .

该致冷芯片21在通电后,会同时产生一冷端211及一相反于冷端211的热端212。该致冷芯片21设于该侧板11的穿孔111。该致冷芯片21与该侧板11为平行的设置。After the cooling chip 21 is powered on, a cold end 211 and a hot end 212 opposite to the cold end 211 are generated simultaneously. The cooling chip 21 is disposed in the through hole 111 of the side plate 11 . The cooling chip 21 is arranged parallel to the side plate 11 .

该冷排22是以金属材料制成且设有多数间隔设置的导冷片221,但并不以此为限。该框体26同样以金属材料制成,且包覆贴合于该冷排22外围,该框体26可以螺锁或其它方式固定于侧板11内表面,使得该冷排22设置在该机壳1内部。该框体26前端面贴附于该致冷芯片21的冷端211。因此在本实施例中,该冷排22是藉由该框体26而连结于该致冷芯片21的冷端211,但未有限定。该冷排22也可直接与该致冷芯片21的冷端211连结。The cold row 22 is made of metal material and provided with a plurality of cold guide fins 221 arranged at intervals, but not limited thereto. The frame body 26 is also made of metal material, and is covered and attached to the periphery of the cold row 22. The frame body 26 can be screwed or fixed on the inner surface of the side plate 11, so that the cold row 22 is arranged on the machine. Shell 1 interior. The front surface of the frame body 26 is attached to the cold end 211 of the cooling chip 21 . Therefore, in this embodiment, the cold row 22 is connected to the cold end 211 of the cooling chip 21 through the frame body 26 , but it is not limited thereto. The cold row 22 can also be directly connected to the cold end 211 of the cooling chip 21 .

该导热单元23包含一板体233及一座体231,该板体233贴附于该致冷芯片21的热端212。该座体231后面凹设有多数个供该些热管28容置的凹槽232。The heat conduction unit 23 includes a plate body 233 and a base body 231 , and the plate body 233 is attached to the hot end 212 of the cooling chip 21 . A plurality of grooves 232 for accommodating the heat pipes 28 are recessed on the back of the base body 231 .

该热排24在本实施例中包含多数个散热片组241,该些散热片组241呈辐射状排列,且每一散热片组241包含多数散热片2411,该些散热片2411为间隔地设置且与该侧板11外表面呈垂直(如图4所示),但未有限定。该热排24的表面积大于该侧板11的三分之一表面积(如图3所示)。The heat row 24 includes a plurality of cooling fin groups 241 in this embodiment, and these cooling fin groups 241 are arranged radially, and each cooling fin group 241 includes a plurality of cooling fins 2411, and these cooling fins 2411 are arranged at intervals. And it is perpendicular to the outer surface of the side plate 11 (as shown in FIG. 4 ), but it is not limited thereto. The surface area of the heat row 24 is greater than one-third of the surface area of the side plate 11 (as shown in FIG. 3 ).

每一热管28一端容置于该导热单元23的座体231的凹槽232中且夹置于该板体233与座体231之间,从而连结于该致冷芯片21的热端212,而每一热管28另一端沿平行该侧板11方向延伸且连结于对应的散热片组241,使得该热排24可经由热管28、导热单元23而得以与该致冷芯片21的热端212连结。该热排24位在该机壳1的外侧,并与该侧板11为平行设置。One end of each heat pipe 28 is accommodated in the groove 232 of the base body 231 of the heat conduction unit 23 and sandwiched between the plate body 233 and the base body 231, thereby connecting to the hot end 212 of the cooling chip 21, and The other end of each heat pipe 28 extends parallel to the direction of the side plate 11 and is connected to the corresponding heat sink group 241, so that the heat row 24 can be connected to the hot end 212 of the cooling chip 21 through the heat pipe 28 and the heat conduction unit 23 . The heat row 24 is located outside the casing 1 and is parallel to the side plate 11 .

该风扇装置3的型式未有限定,其设置于该侧板11一侧,在本实施例中,该风扇装置3包含一护网31及一扇叶组32,其中该护网31为金属或其它材质(如塑料)制成,该护网31中心位置设有一基座311,该基座311上设有复数个固定孔312,能供螺丝穿设。该扇叶组32可转动的设置在该基座311中心位置上。该扇叶组32尺寸未有限定,图中是以直径为18公分的扇叶组32为例。该风扇装置3对应设置在该热排24前侧,且风扇装置3的尺寸大小与该热排24相对应。当然,该风扇装置3也可为一般具有扇框的散热风扇。The type of the fan device 3 is not limited, and it is arranged on the side of the side plate 11. In this embodiment, the fan device 3 includes a guard net 31 and a blade set 32, wherein the guard net 31 is made of metal or Made of other materials (such as plastic), the guard net 31 is provided with a base 311 at the center, and a plurality of fixing holes 312 are provided on the base 311 for screws to pass through. The blade set 32 is rotatably disposed on the center of the base 311 . The size of the blade set 32 is not limited. In the figure, the blade set 32 with a diameter of 18 cm is taken as an example. The fan device 3 is correspondingly arranged on the front side of the heat row 24 , and the size of the fan device 3 corresponds to the heat row 24 . Of course, the fan device 3 can also be a cooling fan generally having a fan frame.

本实用新型使用时,该致冷芯片21的冷端211与该冷排22配合,而在该冷排22的导冷片221间产生冷空气,以大幅降低该机壳1内部温度,达成较佳的散热功效。而该致冷芯片21的热端212与该些热管28及该热排24配合,而将该致冷芯片21所产生的热量传导至该热排24。如此一来,可藉该热排24的大表面积进行散热,同时利用该风扇装置3转动而强制将该热排24的热气抽离并往外排除。When the utility model is used, the cold end 211 of the cooling chip 21 cooperates with the cold row 22, and cold air is generated between the cold guide fins 221 of the cold row 22, so as to greatly reduce the internal temperature of the casing 1 and achieve a higher temperature. Good cooling effect. The hot end 212 of the cooling chip 21 cooperates with the heat pipes 28 and the heat row 24 to transfer the heat generated by the cooling chip 21 to the heat row 24 . In this way, the large surface area of the heat row 24 can be used to dissipate heat, and at the same time, the fan device 3 can rotate to forcibly draw away the hot air from the heat row 24 and discharge it to the outside.

此外,该冷排22一侧可进一步装设一风扇装置4(如图2所示),风扇装置4在本实施例中包含二散热风扇41,但并不以此为限。风扇装置4所产生的气流会直接通过该冷排22的多数导冷片221之间,而强制将该冷空气吹送至该机壳1内部,以进一步提升散热效率。In addition, a fan device 4 (as shown in FIG. 2 ) can be further installed on one side of the cold row 22 . In this embodiment, the fan device 4 includes two cooling fans 41 , but it is not limited thereto. The airflow generated by the fan device 4 directly passes between the plurality of cooling fins 221 of the cold row 22 to forcibly blow the cold air to the inside of the casing 1 to further improve the heat dissipation efficiency.

请再参阅图2及图4所示,该致冷装置2可进一步包含一壳体25、多数罩板29、及一固持结构27,该壳体25分别开设有多个与该些热管28对应的缺口251。组装时,该壳体25可以螺锁或其它的固定方式组装于该侧板11,并罩设于该导热单元23与致冷芯片21外部,以保护该导热单元23与致冷芯片21。该些热管28并由该缺口251穿出该壳体25。该些罩板29设置于该热排24与该侧板11之间,且环绕排列为中空圆盘状,以使该热排24不会直接与该侧板11接触。Please refer to Fig. 2 and Fig. 4 again, the refrigerating device 2 may further include a housing 25, a plurality of cover plates 29, and a holding structure 27, and the housing 25 is respectively provided with a plurality of heat pipes 28 corresponding The notch 251. During assembly, the housing 25 can be assembled on the side plate 11 by screw lock or other fixing methods, and is covered outside the heat conduction unit 23 and the cooling chip 21 to protect the heat conduction unit 23 and the cooling chip 21 . The heat pipes 28 pass through the casing 25 through the gap 251 . The cover plates 29 are disposed between the heat row 24 and the side plate 11 , and are arranged around in a hollow disc shape so that the heat row 24 does not directly contact the side plate 11 .

该框体26的前端面还可进一步设有四螺座261,该四螺座261位在该致冷芯片21周围的四角落。而该固持结构27包含二呈弧形的挡板271,每一挡板271的两端部分别穿设有一螺丝272,该二挡板271相对地设置在该座体231两侧且位在部份热管28前侧,该四螺丝272分别穿过该板体233而螺锁于该框体26的四螺座261,使得该板体233、框体26可分别紧贴于该致冷芯片21的热端212、冷端211,以进行良好地热传导。The front surface of the frame body 26 can further be provided with four screw seats 261 , and the four screw seats 261 are located at four corners around the cooling chip 21 . The holding structure 27 includes two arc-shaped baffles 271, and a screw 272 is respectively pierced at both ends of each baffle 271. On the front side of the heat pipe 28, the four screws 272 respectively pass through the plate body 233 and are screwed to the four screw seats 261 of the frame body 26, so that the plate body 233 and the frame body 26 can be closely attached to the cooling chip 21 respectively. The hot end 212 and the cold end 211 for good heat conduction.

此外,该机壳散热结构可进一步在该风扇装置3与致冷装置2之间设置一安装架5(请配合参阅图2及图4所示),该风扇装置3的护网31的基座311可藉该些固定孔312螺锁于该安装架5前端,该安装架5后端可同样透过螺锁或其它的固定方式结合于该壳体25,以增加风扇装置3与该致冷装置2之间的距离,使得该风扇装置3可抽到较多的热气。In addition, the heat dissipation structure of the casing can be further provided with a mounting frame 5 between the fan device 3 and the refrigeration device 2 (please refer to FIG. 2 and FIG. 4 ), the base of the guard net 31 of the fan device 3 311 can be screw-locked to the front end of the mounting frame 5 by means of these fixing holes 312, and the rear end of the mounting frame 5 can also be combined with the housing 25 through screw locks or other fixing methods to increase the fan unit 3 and the refrigeration unit. The distance between the devices 2 enables the fan device 3 to draw more hot air.

请再参阅图5及图6所示,该机壳散热结构还可进一步包括一保护罩6,该保护罩6包含一罩体61及一保护网62,其中该罩体61呈中空状,其端面具有一开孔611,且该罩体61外侧周缘设有多个缺口612。该保护网62是以金属材料制成,其外形与该罩体61对应,该保护网62表面穿设有多数散热孔621,且该保护网62设置于该罩体61内面,使得该些散热孔621显露于该罩体61的开孔611与缺口612中,以供热气散失。该保护罩6罩设于该风扇装置3外部,且该罩体61可经由螺锁或其它的固定方式组装于该侧板11,以保护使用者不会触碰到扇叶组32,而不致影响该风扇装置3的正常运作。Please refer to Figure 5 and Figure 6 again, the heat dissipation structure of the casing can further include a protective cover 6, the protective cover 6 includes a cover body 61 and a protective net 62, wherein the cover body 61 is hollow, its An opening 611 is formed on the end surface, and a plurality of notches 612 are formed on the outer peripheral edge of the cover body 61 . The protective net 62 is made of metal material, and its shape corresponds to the cover body 61. The surface of the protective net 62 is pierced with a plurality of cooling holes 621, and the protective net 62 is arranged on the inner surface of the cover body 61, so that the heat dissipation The holes 621 are exposed in the openings 611 and the notches 612 of the cover 61 for dissipating hot air. The protective cover 6 is set outside the fan device 3, and the cover body 61 can be assembled to the side plate 11 through screw locks or other fixing methods to protect the user from touching the fan blade set 32 and avoid Affect the normal operation of the fan device 3 .

是以,透过本实用新型机壳散热结构,具有如下述的特点及功能:Therefore, through the heat dissipation structure of the casing of the utility model, it has the following characteristics and functions:

1、本实用新型是藉由设置含有致冷芯片的致冷装置而可快速且有效地降低机壳内部的温度。1. The utility model can quickly and effectively reduce the temperature inside the casing by setting a refrigeration device containing a refrigeration chip.

2、本实用新型是利用设在机壳的侧板的风扇装置,配合表面积大于三分之一侧板表面积的热排,而可有效地将致冷芯片所产生的热量排除。2. The utility model utilizes the fan device located on the side plate of the casing, and cooperates with the heat row whose surface area is greater than one-third of the surface area of the side plate, so as to effectively remove the heat generated by the cooling chip.

3、本实用新型可与较大尺寸的风扇装置配合设置,利用该风扇装置具有较大排气量的特性,即可快速的将热气排除,且该风扇装置只要以低速运转即可达成具有较大排气量,因此风扇装置运转时所产生的噪音即大幅减低。3. The utility model can be set up in conjunction with a fan device with a larger size. By utilizing the characteristics of a larger exhaust volume of the fan device, the hot air can be quickly discharged, and the fan device can be achieved as long as it operates at a low speed. Large exhaust volume, so the noise generated by the fan unit is greatly reduced when it is running.

但以上所述仅为本实用新型的较佳可行实施例,非因此即局限本实用新型的专利范围,故举凡运用本实用新型说明书及图式内容所为的等效结构变化,均同理皆包含于本实用新型的范围内,合予陈明。But the above description is only the preferred feasible embodiment of the present utility model, and does not limit the patent scope of the present utility model, so all the equivalent structural changes made by using the description of the utility model and the content of the drawings are all the same. Included within the scope of the present utility model, it is stated together.

Claims (15)

1、一种机壳散热结构,用以设置于该机壳的侧板,该侧板穿设有一穿孔,其特征在于,该机壳散热结构包括:1. A heat dissipation structure of a casing, which is used to be arranged on a side plate of the casing, and a perforation is formed on the side plate, and it is characterized in that the heat dissipation structure of the casing comprises: 一致冷装置,包含:A cooling device, comprising: 一致冷芯片,其设于该侧板的穿孔,该致冷芯片具有一冷端及一热端;a cooling chip, which is arranged in the through hole of the side plate, the cooling chip has a cold end and a hot end; 一冷排,其连结于该致冷芯片的冷端;及a cold row, which is connected to the cold end of the cold chip; and 一热排,其连结于该致冷芯片的热端,该热排的表面积大于该侧板的三分之一表面积;a heat row, which is connected to the hot end of the cooling chip, and the surface area of the heat row is greater than one-third of the surface area of the side plate; 以及as well as 一风扇装置,其设置于该侧板一侧,且该风扇装置与该热排相对应。A fan device is arranged on one side of the side plate, and the fan device corresponds to the heat row. 2、如权利要求1所述的机壳散热结构,其特征在于:该冷排一侧设有一另一风扇装置。2. The heat dissipation structure of the casing according to claim 1, wherein another fan device is provided on one side of the cooling radiator. 3、如权利要求1所述的机壳散热结构,其特征在于:该致冷装置的热排位在该机壳的外侧,而该冷排位在该机壳内部。3. The heat dissipation structure of the casing as claimed in claim 1, wherein the heat discharge of the refrigeration device is arranged outside the casing, and the cold discharge is arranged inside the casing. 4、如权利要求1所述的机壳散热结构,其特征在于:该热排与该侧板为平行设置。4. The heat dissipation structure of the casing according to claim 1, wherein the heat row is arranged parallel to the side plate. 5、如权利要求1所述的机壳散热结构,其特征在于:该风扇装置包含一护网及一扇叶组,该护网中心位置设有一基座,该扇叶组可转动的设置在该基座。5. The heat dissipation structure of the casing according to claim 1, wherein the fan device comprises a guard net and a fan blade set, a base is provided at the center of the guard net, and the fan blade set is rotatably arranged on the base. 6、如权利要求1所述的机壳散热结构,其特征在于:该风扇装置为一散热风扇。6. The heat dissipation structure of the casing as claimed in claim 1, wherein the fan device is a heat dissipation fan. 7、如权利要求1所述的机壳散热结构,其特征在于:该致冷装置更包含多数热管,该热排包含多数个散热片组,该些热管一端均连结于该致冷芯片的热端,该些热管另一端沿平行该侧板方向延伸且分别对应连结于该些散热片组。7. The heat dissipation structure of the casing according to claim 1, wherein the cooling device further includes a plurality of heat pipes, the heat row includes a plurality of heat sink groups, and one end of the heat pipes is connected to the heat sink of the cooling chip. The other ends of the heat pipes extend along the direction parallel to the side plate and are respectively connected to the heat sink groups correspondingly. 8、如权利要求7所述的机壳散热结构,其特征在于:该些散热片组呈辐射状排列。8. The heat dissipation structure of the casing according to claim 7, wherein the groups of heat dissipation fins are arranged radially. 9、如权利要求7所述的机壳散热结构,其特征在于:每一散热片组包含多数间隔设置且垂直于该侧板的散热片。9. The heat dissipation structure of the casing according to claim 7, wherein each heat sink group includes a plurality of heat sinks arranged at intervals and perpendicular to the side plate. 10、如权利要求7所述的机壳散热结构,其特征在于:该致冷装置更包含一导热单元,该导热单元设置于该致冷芯片的热端,该些热管一端连接该导热单元。10. The heat dissipation structure of the casing according to claim 7, wherein the cooling device further comprises a heat conduction unit, the heat conduction unit is disposed at the hot end of the cooling chip, and one end of the heat pipes is connected to the heat conduction unit. 11、如权利要求10所述的机壳散热结构,其特征在于:该导热单元包含一板体及一座体,该板体贴附于该致冷芯片的热端,该些热管一端夹置于该板体与座体之间。11. The heat dissipation structure of the casing according to claim 10, wherein the heat conduction unit comprises a plate body and a base body, the plate body is attached to the hot end of the cooling chip, and one end of the heat pipes is sandwiched between the Between the board and the seat. 12、如权利要求1所述的机壳散热结构,其特征在于:该致冷装置更包含一框体,该框体包覆贴合于该冷排外围,且该框体前端面贴附于该致冷芯片的冷端。12. The heat dissipation structure of the casing according to claim 1, wherein the cooling device further comprises a frame body, the frame body covers and sticks to the periphery of the cold row, and the front surface of the frame body is attached to The cold end of the cooling chip. 13、如权利要求12所述的机壳散热结构,其特征在于:该致冷装置更包含一固持结构,该固持结构包含二挡板,每一挡板的两端部分别穿设有一螺丝,该框体设有四螺座,该二挡板为相对地设置且位在部份热管前侧,该四螺丝分别螺锁于该框体的四螺座。13. The heat dissipation structure of the casing according to claim 12, wherein the cooling device further comprises a holding structure, and the holding structure comprises two baffles, and a screw is respectively pierced at both ends of each baffle, The frame body is provided with four screw seats, the two baffles are arranged oppositely and are located on the front side of some heat pipes, and the four screws are screwed to the four screw seats of the frame body respectively. 14、如权利要求1所述的机壳散热结构,其特征在于:该机壳散热结构更包括一安装架,该安装架设置于该风扇装置与致冷装置之间。14. The heat dissipation structure of the case as claimed in claim 1, further comprising a mounting frame, the mounting frame is disposed between the fan device and the cooling device. 15、如权利要求1所述的机壳散热结构,其特征在于:该机壳散热结构更包括一保护罩,该保护罩罩设于该风扇装置外部,且该保护罩具有多数散热孔。15. The heat dissipation structure of the case as claimed in claim 1, further comprising a protective cover, the protective cover is disposed outside the fan device, and the protective cover has a plurality of cooling holes.
CNU2009200027066U 2009-01-08 2009-01-08 Heat dissipation structure of enclosure Expired - Fee Related CN201360391Y (en)

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