CN201360391Y - Heat dissipation structure of enclosure - Google Patents
Heat dissipation structure of enclosure Download PDFInfo
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- CN201360391Y CN201360391Y CNU2009200027066U CN200920002706U CN201360391Y CN 201360391 Y CN201360391 Y CN 201360391Y CN U2009200027066 U CNU2009200027066 U CN U2009200027066U CN 200920002706 U CN200920002706 U CN 200920002706U CN 201360391 Y CN201360391 Y CN 201360391Y
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- 230000017525 heat dissipation Effects 0.000 title claims description 35
- 238000005057 refrigeration Methods 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims description 61
- 230000001681 protective effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型有关于一种机壳散热结构,特别是指一种设有致冷芯片以有效散热的机壳散热结构。The utility model relates to a heat dissipation structure of a casing, in particular to a heat dissipation structure of a casing provided with a cooling chip for effective heat dissipation.
背景技术 Background technique
由于一般计算机机壳内具有多种电路板及电子组件,当计算机运作时,计算机机壳内电路板上的芯片、集成电路等电子组件因运作而产生热能,使得计算机机壳内温度升高,若机壳内的温度超出各电子组件可正常运作的温度上限,则会导致电子组件失效,造成计算机故障,因此计算机机壳均会加装散热风扇,使得计算机运作时,在计算机机壳内部由电子组件所产生的热气,可藉由散热风扇造成的空气对流被排出计算机机壳外。Because there are many kinds of circuit boards and electronic components in the general computer case, when the computer is running, the chips, integrated circuits and other electronic components on the circuit board in the computer case will generate heat due to the operation, which will increase the temperature inside the computer case. If the temperature inside the casing exceeds the upper limit of the normal operation temperature of each electronic component, it will cause the electronic component to fail and cause the computer to malfunction. The heat generated by the electronic components can be exhausted out of the computer case by the air convection caused by the cooling fan.
但,习知的计算机机壳是藉由散热风扇将外部空气导入壳体内,但该外部空气并非都具有较冷的温度,尤其在夏天时其温度便会较高,欲利用具有较高温度的空气达到降温的效果,显然其降温效果亦为有限。But the known computer casing is to introduce the outside air into the casing by the cooling fan, but the outside air does not all have a cooler temperature, especially in summer, its temperature will be higher. Air reaches the effect of cooling, obviously its cooling effect is also limited.
缘是,本创作人有感上述问题的可改善,乃潜心研究并配合学理的运用,而提出一种设计合理且有效改善上述问题的本实用新型。The reason is that the author of this invention feels that the above-mentioned problems can be improved, so he devotes himself to research and cooperates with the application of theories, and proposes a utility model with reasonable design and effective improvement of the above-mentioned problems.
实用新型内容 Utility model content
本实用新型的主要目的,在于提供一种机壳散热结构,其可藉由设置含有致冷芯片的致冷装置而有效降低机壳内部的温度。The main purpose of the present invention is to provide a heat dissipation structure for the casing, which can effectively reduce the temperature inside the casing by arranging a cooling device including a cooling chip.
为了达成上述的目的,本实用新型提供一种机壳散热结构,用以设置于该机壳的侧板,该侧板穿设有一穿孔,该机壳散热结构包括:一致冷装置及一风扇装置,其中该致冷装置包含:一致冷芯片,其设于该侧板的穿孔,该致冷芯片具有一冷端及一热端;一冷排,其连结于该致冷芯片的冷端;及一热排,其连结于该致冷芯片的热端,该热排的表面积大于该侧板的三分之一表面积;该风扇装置设置于该侧板一侧,且与该热排相对应。In order to achieve the above purpose, the utility model provides a heat dissipation structure of the casing, which is used to be arranged on the side plate of the casing. The side plate is pierced with a perforation. The heat dissipation structure of the casing includes: a cooling device and a fan device , wherein the refrigerating device comprises: a refrigerating chip, which is arranged in the through hole of the side plate, and the refrigerating chip has a cold end and a hot end; a cold row, which is connected to the cold end of the refrigerating chip; and A heat row, which is connected to the hot end of the cooling chip, the surface area of the heat row is greater than one-third of the surface area of the side plate; the fan device is arranged on one side of the side plate, and corresponds to the heat row.
本实用新型具有以下有益效果:本实用新型是藉由设置含有致冷芯片的致冷装置而可快速且有效地降低机壳内部的温度。另外,利用设在机壳的侧板的风扇装置,与表面积大于三分之一侧板表面积的热排相互搭配,而将致冷芯片所产生的热量有效地排除。The utility model has the following beneficial effects: the utility model can quickly and effectively reduce the temperature inside the casing by setting a refrigeration device containing a refrigeration chip. In addition, the fan device arranged on the side plate of the casing is used to cooperate with the heat row whose surface area is greater than one-third of the surface area of the side plate, so as to effectively remove the heat generated by the cooling chip.
为使能更进一步了解本实用新型的特征及技术内容,请参阅以下有关本实用新型的详细说明与附图,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.
附图说明 Description of drawings
图1为本实用新型机壳散热结构的立体组合图。Fig. 1 is a three-dimensional combined view of the heat dissipation structure of the casing of the present invention.
图2为本实用新型机壳散热结构的立体分解图,图中将部份的机壳省略而仅显示出侧板。Fig. 2 is a three-dimensional exploded view of the heat dissipation structure of the casing of the present invention, in which part of the casing is omitted and only the side panels are shown.
图3为本实用新型机壳散热结构的前视图。Fig. 3 is a front view of the cooling structure of the casing of the present invention.
图4为图3的4-4剖视图。Fig. 4 is a cross-sectional view along line 4-4 of Fig. 3 .
图5为本实用新型机壳散热结构设有保护罩时的立体分解图。Fig. 5 is a three-dimensional exploded view when the heat dissipation structure of the casing of the present invention is provided with a protective cover.
图6为本实用新型机壳散热结构设有保护罩时的立体组合图。Fig. 6 is a three-dimensional combined view when the heat dissipation structure of the casing of the present invention is provided with a protective cover.
主要组件符号说明Explanation of main component symbols
1 机壳1 chassis
11 侧板11 side panels
111 穿孔111 piercing
2 致冷装置2 refrigeration device
21 致冷芯片21 cooling chip
211 冷端211 cold end
212 热端212 hot end
22 冷排22 cold row
221 导冷片221 Cooling plate
23 导热单元23 heat conduction unit
231 座体231 Seat body
232 凹槽232 grooves
233 板体233 plate body
24 热排24 heat row
241 散热片组241 heat sink group
2411 散热片2411 heat sink
25 壳体25 Shell
251 缺口251 Gap
26 框体26 frame
261 螺座261 screw seat
27 固持结构27 holding structure
271 挡板271 Baffle
272 螺丝272 screws
28 热管28 heat pipes
29 罩板29 cover plate
3 风扇装置3 fan unit
31 护网31 guard net
311 基座311 base
312 固定孔312 Fixing hole
32 扇叶组32 fan blades
4 风扇装置4 fan unit
41 散热风扇41 cooling fan
5 安装架5 mounting bracket
6 保护罩6 protective cover
61 罩体61 cover body
611 开孔611 opening
612 缺口612 Gap
62 保护网62 Protection net
621 散热孔621 cooling holes
具体实施方式 Detailed ways
请参阅图1至图3所示,本实用新型提供一种机壳散热结构,用以设置于机壳1一侧的侧板11,该侧板11穿设有一穿孔111(如图2所示)。该机壳散热结构包括:一致冷装置2及一风扇装置3。其中该致冷装置2包含一致冷芯片21、一冷排22、一框体26、一导热单元23、一热排24、及多数热管28。Please refer to Fig. 1 to Fig. 3, the utility model provides a casing heat dissipation structure, which is used to set the
该致冷芯片21在通电后,会同时产生一冷端211及一相反于冷端211的热端212。该致冷芯片21设于该侧板11的穿孔111。该致冷芯片21与该侧板11为平行的设置。After the
该冷排22是以金属材料制成且设有多数间隔设置的导冷片221,但并不以此为限。该框体26同样以金属材料制成,且包覆贴合于该冷排22外围,该框体26可以螺锁或其它方式固定于侧板11内表面,使得该冷排22设置在该机壳1内部。该框体26前端面贴附于该致冷芯片21的冷端211。因此在本实施例中,该冷排22是藉由该框体26而连结于该致冷芯片21的冷端211,但未有限定。该冷排22也可直接与该致冷芯片21的冷端211连结。The
该导热单元23包含一板体233及一座体231,该板体233贴附于该致冷芯片21的热端212。该座体231后面凹设有多数个供该些热管28容置的凹槽232。The
该热排24在本实施例中包含多数个散热片组241,该些散热片组241呈辐射状排列,且每一散热片组241包含多数散热片2411,该些散热片2411为间隔地设置且与该侧板11外表面呈垂直(如图4所示),但未有限定。该热排24的表面积大于该侧板11的三分之一表面积(如图3所示)。The
每一热管28一端容置于该导热单元23的座体231的凹槽232中且夹置于该板体233与座体231之间,从而连结于该致冷芯片21的热端212,而每一热管28另一端沿平行该侧板11方向延伸且连结于对应的散热片组241,使得该热排24可经由热管28、导热单元23而得以与该致冷芯片21的热端212连结。该热排24位在该机壳1的外侧,并与该侧板11为平行设置。One end of each
该风扇装置3的型式未有限定,其设置于该侧板11一侧,在本实施例中,该风扇装置3包含一护网31及一扇叶组32,其中该护网31为金属或其它材质(如塑料)制成,该护网31中心位置设有一基座311,该基座311上设有复数个固定孔312,能供螺丝穿设。该扇叶组32可转动的设置在该基座311中心位置上。该扇叶组32尺寸未有限定,图中是以直径为18公分的扇叶组32为例。该风扇装置3对应设置在该热排24前侧,且风扇装置3的尺寸大小与该热排24相对应。当然,该风扇装置3也可为一般具有扇框的散热风扇。The type of the
本实用新型使用时,该致冷芯片21的冷端211与该冷排22配合,而在该冷排22的导冷片221间产生冷空气,以大幅降低该机壳1内部温度,达成较佳的散热功效。而该致冷芯片21的热端212与该些热管28及该热排24配合,而将该致冷芯片21所产生的热量传导至该热排24。如此一来,可藉该热排24的大表面积进行散热,同时利用该风扇装置3转动而强制将该热排24的热气抽离并往外排除。When the utility model is used, the
此外,该冷排22一侧可进一步装设一风扇装置4(如图2所示),风扇装置4在本实施例中包含二散热风扇41,但并不以此为限。风扇装置4所产生的气流会直接通过该冷排22的多数导冷片221之间,而强制将该冷空气吹送至该机壳1内部,以进一步提升散热效率。In addition, a fan device 4 (as shown in FIG. 2 ) can be further installed on one side of the
请再参阅图2及图4所示,该致冷装置2可进一步包含一壳体25、多数罩板29、及一固持结构27,该壳体25分别开设有多个与该些热管28对应的缺口251。组装时,该壳体25可以螺锁或其它的固定方式组装于该侧板11,并罩设于该导热单元23与致冷芯片21外部,以保护该导热单元23与致冷芯片21。该些热管28并由该缺口251穿出该壳体25。该些罩板29设置于该热排24与该侧板11之间,且环绕排列为中空圆盘状,以使该热排24不会直接与该侧板11接触。Please refer to Fig. 2 and Fig. 4 again, the refrigerating
该框体26的前端面还可进一步设有四螺座261,该四螺座261位在该致冷芯片21周围的四角落。而该固持结构27包含二呈弧形的挡板271,每一挡板271的两端部分别穿设有一螺丝272,该二挡板271相对地设置在该座体231两侧且位在部份热管28前侧,该四螺丝272分别穿过该板体233而螺锁于该框体26的四螺座261,使得该板体233、框体26可分别紧贴于该致冷芯片21的热端212、冷端211,以进行良好地热传导。The front surface of the
此外,该机壳散热结构可进一步在该风扇装置3与致冷装置2之间设置一安装架5(请配合参阅图2及图4所示),该风扇装置3的护网31的基座311可藉该些固定孔312螺锁于该安装架5前端,该安装架5后端可同样透过螺锁或其它的固定方式结合于该壳体25,以增加风扇装置3与该致冷装置2之间的距离,使得该风扇装置3可抽到较多的热气。In addition, the heat dissipation structure of the casing can be further provided with a mounting
请再参阅图5及图6所示,该机壳散热结构还可进一步包括一保护罩6,该保护罩6包含一罩体61及一保护网62,其中该罩体61呈中空状,其端面具有一开孔611,且该罩体61外侧周缘设有多个缺口612。该保护网62是以金属材料制成,其外形与该罩体61对应,该保护网62表面穿设有多数散热孔621,且该保护网62设置于该罩体61内面,使得该些散热孔621显露于该罩体61的开孔611与缺口612中,以供热气散失。该保护罩6罩设于该风扇装置3外部,且该罩体61可经由螺锁或其它的固定方式组装于该侧板11,以保护使用者不会触碰到扇叶组32,而不致影响该风扇装置3的正常运作。Please refer to Figure 5 and Figure 6 again, the heat dissipation structure of the casing can further include a
是以,透过本实用新型机壳散热结构,具有如下述的特点及功能:Therefore, through the heat dissipation structure of the casing of the utility model, it has the following characteristics and functions:
1、本实用新型是藉由设置含有致冷芯片的致冷装置而可快速且有效地降低机壳内部的温度。1. The utility model can quickly and effectively reduce the temperature inside the casing by setting a refrigeration device containing a refrigeration chip.
2、本实用新型是利用设在机壳的侧板的风扇装置,配合表面积大于三分之一侧板表面积的热排,而可有效地将致冷芯片所产生的热量排除。2. The utility model utilizes the fan device located on the side plate of the casing, and cooperates with the heat row whose surface area is greater than one-third of the surface area of the side plate, so as to effectively remove the heat generated by the cooling chip.
3、本实用新型可与较大尺寸的风扇装置配合设置,利用该风扇装置具有较大排气量的特性,即可快速的将热气排除,且该风扇装置只要以低速运转即可达成具有较大排气量,因此风扇装置运转时所产生的噪音即大幅减低。3. The utility model can be set up in conjunction with a fan device with a larger size. By utilizing the characteristics of a larger exhaust volume of the fan device, the hot air can be quickly discharged, and the fan device can be achieved as long as it operates at a low speed. Large exhaust volume, so the noise generated by the fan unit is greatly reduced when it is running.
但以上所述仅为本实用新型的较佳可行实施例,非因此即局限本实用新型的专利范围,故举凡运用本实用新型说明书及图式内容所为的等效结构变化,均同理皆包含于本实用新型的范围内,合予陈明。But the above description is only the preferred feasible embodiment of the present utility model, and does not limit the patent scope of the present utility model, so all the equivalent structural changes made by using the description of the utility model and the content of the drawings are all the same. Included within the scope of the present utility model, it is stated together.
Claims (15)
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