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CN201203841Y - Heat dissipation channel structure of computer case - Google Patents

Heat dissipation channel structure of computer case Download PDF

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Publication number
CN201203841Y
CN201203841Y CNU200820119865XU CN200820119865U CN201203841Y CN 201203841 Y CN201203841 Y CN 201203841Y CN U200820119865X U CNU200820119865X U CN U200820119865XU CN 200820119865 U CN200820119865 U CN 200820119865U CN 201203841 Y CN201203841 Y CN 201203841Y
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plate
heat dissipation
straight
frame
channel structure
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Expired - Fee Related
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CNU200820119865XU
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Chinese (zh)
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林培熙
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Thermaltake Technology Co Ltd
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Thermaltake Technology Co Ltd
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Priority to CNU200820119865XU priority Critical patent/CN201203841Y/en
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Abstract

The utility model relates to a heat dissipation channel structure of a computer casing, which comprises a top plate, a bottom plate, side plates, a front plate and a back plate, wherein the heat dissipation channel structure is arranged in the computer casing and comprises a frame, the plates are respectively arranged on each surface of the frame, and the back plate is provided with a plurality of perforated areas; a first transverse plate arranged at a position near the center in the frame; the first vertical plate is vertically arranged on one side edge of the first transverse plate; the second transverse plate is vertically arranged at one side edge of the first straight plate and corresponds to the first transverse plate; and the second vertical plate is vertically arranged on one side edge of the second transverse plate and is positioned on the same plane with the first vertical plate. Therefore, three space areas for installing the motherboard, the interface card and the power supply are separated from the computer casing, so that the motherboard, the interface card and the power supply will not generate mutual interference of air flows when performing heat dissipation in the respective spaces, thereby achieving better heat dissipation effect.

Description

电脑机壳散热通道结构 Computer case heat dissipation channel structure

技术领域 technical field

本实用新型涉及一种电脑机壳散热通道结构,特别涉及一种可使主机板、介面卡及电源供应器于个别之空间区内进行散热时,不会产生气流相互干扰之情形,进而达到较佳之散热效果的电脑机壳散热通道结构。The utility model relates to a heat dissipation channel structure of a computer casing, in particular to a condition that the main board, the interface card and the power supply can dissipate heat in separate space areas without interfering air flow, thereby achieving better Excellent heat dissipation effect of the computer case heat dissipation channel structure.

背景技术 Background technique

一般习用之电脑主机于设置时,通常是将主机板、介面卡、电源供应器、硬碟机、软碟机与其它相关之设备设于电脑主机内部之同一空间中,而使用时各设备是分别配合其上所设之风扇、或风扇配合散热鳍片组,利用气流之导引而针对所属之设备进行散热。Generally, when setting up a commonly used computer host, the main board, interface card, power supply, hard disk drive, floppy disk drive and other related equipment are usually placed in the same space inside the computer host, and each device is in use. Respectively cooperate with the fan on it, or the fan with the heat dissipation fin group, and use the guidance of the airflow to dissipate heat for the equipment it belongs to.

但是,由于电脑主机内部是属一封闭空间,而电脑运作时,该主机板、介面卡、电源供应器、硬碟机、软碟机是同时将热气排放于同一空间中,使得电脑主机内部空间之气流混乱,造成热气排出电脑主机外部之速度较慢,导致在电脑主机内部之封闭空间中并无法直接将热气排出电脑主机外,而让热气在电脑主机内部循环无法达到完全散热之功能,进而影响电脑主机中各设备之运作。However, since the inside of the computer host is a closed space, and when the computer is running, the motherboard, interface card, power supply, hard disk drive, and floppy disk drive simultaneously discharge heat into the same space, making the internal space of the computer host The air flow of the computer is chaotic, which causes the hot air to be discharged from the outside of the computer mainframe at a slower speed. As a result, the hot air cannot be directly discharged out of the computer mainframe in the closed space inside the computer mainframe, and the heat can not be completely dissipated by circulating the hot air inside the computer mainframe. Affect the operation of each device in the host computer.

实用新型内容Utility model content

本实用新型之主要目的在于,可于机壳中区隔出分别提供主机板、介面卡及电源供应器设置之至少三个空间区,使主机板、介面卡及电源供应器于个别之空间区内进行散热时,不会产生气流相互干扰之情形,进而达到较佳之散热效果的电脑机壳散热通道结构。The main purpose of the present utility model is to separate at least three space areas for providing the main board, interface card and power supply in the casing, so that the main board, interface card and power supply can be placed in individual space areas. When heat dissipation is carried out in the computer case, there will be no mutual interference of air flow, and thus a better heat dissipation effect can be achieved.

本实用新型的目的可以通过以下措施达到:The purpose of this utility model can be achieved through the following measures:

这种电脑机壳散热通道结构,该电脑机壳具有一顶板、一底板、二侧板、一前面板与一背板,该散热通道结构设于该电脑机壳内,其特殊之处在于,它包含:一框架,该电脑机壳具有的这些板分别设于该框架各面,该背板设有复数穿孔区;一第一横板,其设于该框架内近中央之位置处;一第一直板,其垂设于该第一横板之一侧缘;一第二横板,其垂设于该第一直板之一侧缘,且与该第一横板对应;以及一第二直板,其垂设于该第二横板之一侧缘,且该第二直板与该第一直板位于同一平面。This kind of heat dissipation channel structure of the computer case has a top plate, a bottom plate, two side plates, a front panel and a back plate, and the heat dissipation channel structure is arranged in the computer case. The special feature is that, It includes: a frame, the boards of the computer casing are respectively arranged on each side of the frame, and the back board is provided with a plurality of perforated areas; a first horizontal board is arranged at a position near the center of the frame; a a first straight plate, which is vertically installed on a side edge of the first horizontal plate; a second horizontal plate, which is vertically installed on a side edge of the first straight plate, and corresponds to the first horizontal plate; and a The second straight board is vertically arranged on one side edge of the second horizontal board, and the second straight board is on the same plane as the first straight board.

本实用新型的目的还可以通过以下措施达到:The purpose of this utility model can also be achieved through the following measures:

所述第一横板、第一直板、第二横板与所述第二直板之侧缘分别设有至少一扣具扣合于该框架。The side edges of the first horizontal board, the first straight board, the second horizontal board and the second straight board are respectively provided with at least one buckle fastened to the frame.

所述第一直板设有复数长孔。The first straight plate is provided with a plurality of long holes.

本实用新型相比习知技术具有如下优点:Compared with the prior art, the utility model has the following advantages:

可于机壳中区隔出分别提供主机板、介面卡及电源供应器设置之至少三个空间区,使该主机板、介面卡及电源供应器设置于个别之空间区内进行散热时,不会产生气流相互干扰之情形,进而达到较佳之散热效果。At least three space areas for the main board, interface card and power supply can be separated in the casing, so that when the main board, interface card and power supply are arranged in individual space areas for heat dissipation, no There will be a situation where the airflow interferes with each other, thereby achieving a better heat dissipation effect.

附图说明 Description of drawings

图1是本实用新型之立体外观示意图。Fig. 1 is a three-dimensional appearance schematic diagram of the utility model.

图2是本实用新型之立体分解示意图。Fig. 2 is a three-dimensional exploded view of the utility model.

图3是本实用新型之侧视状态示意图。Fig. 3 is a side view schematic diagram of the utility model.

图4是本实用新型之剖面状态示意图。Fig. 4 is a schematic diagram of the sectional state of the utility model.

主要元件符号说明:Explanation of main component symbols:

电脑机壳1            框架11           顶板12         底板13Computer case 1 frame 11 top plate 12 bottom plate 13

侧板14               前面板15         背板16         穿孔区161Side panel 14 Front panel 15 Back panel 16 Perforated area 161

第一空间区17         第二空间区18     第三空间区19   第一横板2First Space Zone 17 Second Space Zone 18 Third Space Zone 19 First Horizontal Board 2

扣具21               第一直板3        扣具31         长孔32Buckle 21 The first straight plate 3 Buckle 31 Long hole 32

第二横板4            扣具41           第二直板5      扣具51Second horizontal board 4 Buckle 41 Second straight board 5 Buckle 51

具体实施方式 Detailed ways

本实用新型下面将结合附图作进一步详述:The utility model will be described in further detail below in conjunction with the accompanying drawings:

请参阅图1~图4所示,本实用新型之一种电脑机壳散热通道结构,其由一框架11、一第一横板2、一第一直板3、一第二横板4以及一第二直板5所构成。Please refer to Fig. 1-Fig. 4, a kind of computer case cooling channel structure of the present utility model, it is made of a frame 11, a first horizontal plate 2, a first straight plate 3, a second horizontal plate 4 and A second straight board 5 constitutes.

电脑机壳1具有一顶板12、一底板13、二侧板14、一前面板15与一背板16,这些板12、13、14、15、16分别设于框架11各面上,背板16上设有复数穿孔区161。The computer casing 1 has a top plate 12, a bottom plate 13, two side plates 14, a front panel 15 and a back plate 16, and these plates 12, 13, 14, 15, 16 are respectively arranged on each surface of the frame 11, and the back plate 16 is provided with a plurality of perforated areas 161 .

第一横板2设于上述框架11内近中央之位置处,且第一横板2之侧缘设有一扣具21以扣合于框架11。The first horizontal plate 2 is disposed near the center of the frame 11 , and a buckle 21 is provided on a side edge of the first horizontal plate 2 to be fastened to the frame 11 .

第一直板3垂设于上述第一横板2之一侧缘,且第一直板3之侧缘设有一扣具31以扣合框架11,并于第一直板3上设有复数长孔32。The first straight plate 3 is vertically arranged on one side edge of the first horizontal plate 2, and the side edge of the first straight plate 3 is provided with a buckle 31 to fasten the frame 11, and a plurality of Long hole 32.

第二横板4垂设于上述第一直板3之一侧缘,且与第一横板2对应,而第二横板4之侧缘设有一扣具体化1以扣合于框架11。The second horizontal plate 4 is vertically arranged on a side edge of the first straight plate 3 and corresponds to the first horizontal plate 2 , and a buckle embodiment 1 is provided on the side edge of the second horizontal plate 4 to fasten to the frame 11 .

第二直板5垂设于上述第二横板4之一侧缘,且第二直板5与第一直板3位于同一平面上,第二直板5侧缘设有一扣具51以扣合于框架11。如是,藉由上述之结构构成一全新之电脑机壳散热通道结构。The second straight plate 5 is vertically arranged on a side edge of the second horizontal plate 4, and the second straight plate 5 is located on the same plane as the first straight plate 3, and a buckle 51 is provided on the side edge of the second straight plate 5 to fasten to the frame 11. If so, a brand-new heat dissipation channel structure of the computer casing is formed by the above-mentioned structure.

当本实用新型组装时,可利用第一横板2、第一直板3、第二横板4与第二直板5侧缘所设之扣具21、31、41、51于上述所提之位置扣合于框架11,当第一横板2、第一直板3、第二横板4与第二直板5设置于后,于电脑机壳1之框架11中至少形成第一空间区17、第二空间区18及第三空间区19,藉以让使用者设置相关之设备时,将主机板(图未示)、介面卡(图未示)及电源供应器(图未示)分别设置于第一、第二及第三空间区17、18、19中,使主机板、介面卡及电源供应器加以区隔,而让主机板之热气由第一空间区17配合背板16上对应之穿孔区161排出,介面卡之热气由第二空间区18配合长孔32与背板16上对应之穿孔区161排出,而电源供应器之热气则由第三空间区19配合背板16上对应之穿孔区161排出,如此,即可使主机板、介面卡及电源供应器于个别之空间风进行散热时,不会产生气流相互干扰之情形,而达到较佳之散热效果。When the utility model is assembled, the buckles 21, 31, 41, 51 provided on the side edges of the first horizontal plate 2, the first straight plate 3, the second horizontal plate 4 and the second straight plate 5 can be used in the above mentioned The position is fastened to the frame 11. When the first horizontal plate 2, the first straight plate 3, the second horizontal plate 4 and the second straight plate 5 are arranged behind, at least a first space area 17 is formed in the frame 11 of the computer case 1 , the second space area 18 and the third space area 19, so as to allow the user to set up the main board (not shown), the interface card (not shown) and the power supply (not shown) when setting up related equipment In the first, second and third space areas 17, 18, 19, the main board, the interface card and the power supply are separated, and the hot air of the main board is matched with the corresponding back plate 16 from the first space area 17. The hot air of the interface card is discharged from the second space area 18 matching the long hole 32 and the corresponding perforated area 161 on the back plate 16, while the hot air of the power supply is discharged from the third space area 19 matching the back plate 16 The corresponding perforated area 161 is exhausted. In this way, when the main board, the interface card and the power supply are dissipated in individual spaces, the airflow will not interfere with each other, and a better heat dissipation effect will be achieved.

以上所述仅为本实用新型的较佳实施例,凡依本实用新型权利要求范围所做的均等变化与修饰,皆应属本实用新型权利要求的涵盖范围。The above descriptions are only preferred embodiments of the present utility model, and all equivalent changes and modifications made according to the claims of the present utility model shall fall within the scope of the claims of the present utility model.

Claims (3)

1、一种电脑机壳散热通道结构,该电脑机壳具有一顶板、一底板、二侧板、一前面板与一背板,该散热通道结构设于该电脑机壳内,其特征在于,它包含:1. A heat dissipation channel structure for a computer case, the computer case has a top plate, a bottom plate, two side plates, a front panel and a back plate, the heat dissipation channel structure is located in the computer case, and it is characterized in that, It contains: 一框架,该电脑机壳具有上述之板分别设于该框架各面,该背板设有复数穿孔区;A frame, the computer case has the above-mentioned boards respectively arranged on each side of the frame, and the back board is provided with a plurality of perforated areas; 一第一横板,其设于该框架内近中央之位置处;A first horizontal plate, which is arranged at a position near the center of the frame; 一第一直板,其垂设于该第一横板之一侧缘;a first straight board, which is vertically installed on one side edge of the first horizontal board; 一第二横板,其垂设于该第一直板之一侧缘,且与该第一横板对应;以及a second horizontal plate, which is vertically installed on one side edge of the first straight plate and corresponds to the first horizontal plate; and 一第二直板,其垂设于该第二横板之一侧缘,且该第二直板与该第一直板位于同一平面。A second straight board is vertically arranged on a side edge of the second horizontal board, and the second straight board is on the same plane as the first straight board. 2、根据权利要求1所述电脑机壳散热通道结构,其特征在于:所述第一横板、第一直板、第二横板与所述第二直板之侧缘分别设有至少一扣具扣合于该框架。2. The heat dissipation channel structure of the computer case according to claim 1, characterized in that: the side edges of the first horizontal plate, the first straight plate, the second horizontal plate and the second straight plate are respectively provided with at least one buckle Fastened to the frame. 3、根据权利要求1所述电脑机壳散热通道结构,其特征在于:所述第一直板设有复数长孔。3. The heat dissipation channel structure of the computer case according to claim 1, wherein the first straight plate is provided with a plurality of long holes.
CNU200820119865XU 2008-06-02 2008-06-02 Heat dissipation channel structure of computer case Expired - Fee Related CN201203841Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU200820119865XU CN201203841Y (en) 2008-06-02 2008-06-02 Heat dissipation channel structure of computer case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU200820119865XU CN201203841Y (en) 2008-06-02 2008-06-02 Heat dissipation channel structure of computer case

Publications (1)

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CNU200820119865XU Expired - Fee Related CN201203841Y (en) 2008-06-02 2008-06-02 Heat dissipation channel structure of computer case

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102467185A (en) * 2010-11-18 2012-05-23 英业达股份有限公司 Server
CN101923886B (en) * 2009-06-15 2015-03-11 杭州海康威视数字技术股份有限公司 Digital video recorder case

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101923886B (en) * 2009-06-15 2015-03-11 杭州海康威视数字技术股份有限公司 Digital video recorder case
CN102467185A (en) * 2010-11-18 2012-05-23 英业达股份有限公司 Server

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C17 Cessation of patent right
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Granted publication date: 20090304

Termination date: 20130602