TW200845417A - Method for manufacturing light emitting diode package - Google Patents

Abstract

A method for manufacturing light emitting diode (LED) package first fabricates a silicon submount with at least one groove by wet etching, wherein a reflective layer, a transparent insulation layer and a metal bump are successively formed in the silicon submount. An LED die is mounted in the groove of the silicon submount. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Description

200845417 IX. Description of the Invention: [Technical Field] The present invention provides a method for fabricating a light-emitting diode package, and more particularly to a method for fabricating a light-emitting diode package having a uniform phosphor layer. [Prior Art] Since a light emitting diode (LED) emits light by direct bandgap and can be produced by a semiconductor process, it has advantages of high efficiency and low cost. With the successful development and power improvement of blue light diodes, light-emitting diodes have gradually gained attention in general lighting and backlight applications. Referring to the first figure, a high power light emitting diode package disclosed in U.S. Patent No. 2,050, 274, 959 is incorporated herein by reference. As shown in the figure, the high power LED package mainly comprises a silicon submount 402, a heat sink 409 and a condenser 413. The susceptor susceptor 402 has a recess and an electrode ruthenium (not labeled) in the recess. The illuminating one-pole wafer 401 is flip-chip mounted in the recess of the shixi base 402, and via solder 414a and 414b is electrically connected to the electrodes in the recess. The electrodes in the recesses are connected to the external electrodes 406a and 406b on the heat sink 409 by soldering wires 141a and 41213 to be connected to an external power source to provide power for the far-emission "one body wafer 401. The concentrating cup 413 is mounted on the heat sink 409 so that the light emitted from the illuminating diode wafer 4〇1 can be concentrated. However, the above-mentioned conventional power LED package has the following disadvantages: In this high-power light-emitting diode package, the phosphor is usually

i 200845417

Injecting in the dispensing method in the concave φ I 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍 蛍SUMMARY OF THE INVENTION Therefore, the object of the present invention is to describe a method of fabricating a package of & HA &卩 卩 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供

Use > silk I insect to make a concave selection work I (four) 1 has ^ 9 pedestal; in the groove sequentially formed - reflective layer, a transparent insulating layer and an art / 兮 兮 蜀 , ,, private A light-emitting diode is mounted on the scorpion bump; a protection ^ ^ ^ ^ ^ ^ is used. The groove is filled in to provide a thousand upper surface; and the printing layer is printed on the flat surface, because h, especially due to gold. According to the invention, it can also be pre-made into a camping light sheet. After the color temperature of the light sheet is read, the color of the household is required to be colored, the θ is lost, and the insect is flat. The glazing sheet is applied over the surface of the protective adhesive k ^ to replace the aforementioned printing step. ► [Embodiment] Rate according to the present invention - a preferred embodiment of the high work: a flow chart of the county production method, the method comprises the following step 200 (refer to the third A picture isotropic wet sculpt, to produce Use _ Shi Xi wafer on the use of non-employed (tetramethyl oxychloride : :: formula:: use delete, or 矽 wafer and non-isotropic wet ^ 曰曰 0 can choose insect crystal 1 day hail A 100 -300 mm, concave 6 200845417 The groove angle β is 15-140 degrees. Step 202 (refer to the third figure), the groove array 3 is coated with a light reflecting layer 302 ◦ step '204 (see Third c)), a transparent insulating layer 304 is grown on the light reflecting layer 302. Step Horse + 206 (refer to the third d picture), in the groove of each groove array 3 (8), in the transparent insulating layer 3 A metal bump 3〇6 is formed on 4. The metal bump 3〇6 can be formed on the transparent insulating layer 304 by liftoff or electroplating. Step 208 (refer to the third e-picture) ), the light-emitting diode 31 is disposed on the mother-to-genus bump 306, and the cathode and anode (not shown) of the light-emitting diode 31 are attached One side of the metal bump 3〇6 is opposite. The light-emitting one-pole 310 can be, for example, a gallium nitride-based (GaN-based (j) blue light-emitting diode, and the cathode and the anode are located on one side of the blue light-emitting diode. Step 210, the recessed-slot array 300 in which the light-emitting diode 31 has been mounted in the recess is cut into the cymbal base 300a, wherein each of the cymbal bases 〇〇a may have one or more depending on the lighting demand. Grooves. Step 212 (see Figure 3F for retreading), each pedestal 300a is mounted on a heat conducting plate 360. The heat conducting plate 36 can be a printed circuit board (PCB), copper plate or graphite. a metal composite having a plurality of vias corresponding to the cathode and anode of the light-emitting diode 310 and a plurality of vias. Step 214 (also see FIG. 3F), using a wire bonding process, soldering two metal wires 312 to conduct The electrode of the light-emitting diode 31 is connected to the electrode 364 on the heat-conducting plate 360. 7 200845417 _Step 216 (refer to Figure 4), the structure is added with the protection and the moon is 320 H疋Surface. Among them, 320 cases of the protective rubber (silieQne) layer, and Shixi resin can change the refractive index (4) index by adjusting the composition and process conditions, so the effect of refractive index matching can be achieved. 々"218 (Fucha see third η map), in The resulting structure is printed using a pattern of 'coating a layer of phosphor layer 322. According to one embodiment of the invention, the phosphor layer 322 is placed in a yellow light chamber environment, and the powder solution is applied to the flat surface using a doctor blade. The protective glue 32 is formed on the upper surface. The glare powder solution can be prepared, for example, from silicin and YAG yellow phosphor in a ratio of 1 (10)': 13 and the phosphor layer is formed in a thickness of 2 It is Deng - 2 〇〇 micron, and the distance from the light-emitting diode is about (10) and slightly. Step 220 (refer to the third w), on the resulting structure - a collecting cup 34G 'where the collecting cup 34Q is transparent p = dusty material injection molding, and can provide 3-12Q illumination = or steps 222 (refer to the third j diagram), the heat conduction plate is used to pump the air to form a vacuum ring step 224 in the space covered by the concentrating cup 34 , to close the through hole 362. See the fourth picture, which is a high-power bamboo pole package made according to the above process. Since the light-emitting diode 310 does not use a flip-chip: a Z-bump 306 can be provided between the light-emitting diode 310 and the transparent insulating layer 3〇4 to increase the heat dissipation effect and facilitate high-power illumination. Two pole two: operation. After the protective adhesive 320 is used to provide a flat upper surface, a phosphor layer 322 is formed by the method of the brush 200845417, so that a uniform light conversion effect can be achieved. Furthermore, the internal space between the collecting cup 340 and the heat conducting plate 36A is a vacuum environment, thereby avoiding light loss and aging inside the component.

Fig. 5 is a flow chart showing a method for fabricating a high power light-emitting diode package according to another preferred embodiment of the present invention, which is similar to the flow shown in the second figure. In addition to omitting the steps of making the reflective layer, the transparent insulating layer, and the metal bump, the original step 220 (see the second figure) can be replaced with the / luminescent sheet 323. The luminescent sheet can be first pressed by a steel mold or a glass stencil and cured (step 517A), and then filtered with a moderate color temperature luminescent sheet (step 517B), and then the shovel and the anode are plexiform, μ protection Glue 32 平 flat on the i side ^ good # light film is attached to the dispensing method will be fluorescent powder, the main ί:. =). The conventional technology is used to complete the screening of the color temperature after the completion of the polar package, which will increase the second: the non-reading. In the present embodiment, since the fluorescent sheet has been solidified after being fabricated, it has a fixed day, the box-*J j夂 has a μ coefficient, and can be placed in the fluorescent sheet of the screening color temperature parameter. The glue is flat on the top, which improves the process efficiency. " As far as the right is concerned, it is known that the manufacturing method of the light-emitting diode package of the present invention has been new and progressive' and the structure of the present invention is not: straight πσ and public use, fully comply with the invention patent application requirements and filed according to the patent law . BRIEF DESCRIPTION OF THE DRAWINGS The figure is a side view of a conventional light-emitting diode package. 9 200845417 The second figure is a flow chart of a method for fabricating a light emitting diode package according to a preferred embodiment of the present invention. The third to third J diagrams correspond to the side views of the second diagram. The fourth figure is a side view of the LED package made according to the flow of the second figure. Figure 5 is a flow chart showing a method of fabricating a light emitting diode package in accordance with another preferred embodiment of the present invention. [Main component symbol description] • [Practical] LED chip 401 矽 pedestal 402 External electrode 406a, 406b Welding line 412a, 412b Solder 414a, 414b Condenser 413 Heat sink 409 [Invention] Groove array 300 Substrate 300a Light reflecting layer 302 Transparent insulating layer 304 Metal bump 306 Light emitting diode 310 Protective adhesive 320 Fluorescent layer 322 Condenser 340 Metal wiring 312 Thermal conducting plate 360 Through hole 362 External electrode 364 Steps 200-224 Step 500- 524 10

Claims (1)

200845417, Shen Qing patent scope: 1. Light-emitting diode package Luo Zuogu, 1 provides Μ Included in the following steps: 1 具有 groove array with many grooves; the layer is formed in the groove sequentially located in (4) and located a transparent bump on the transparent insulating layer in the reflective layer forms a metal bump; the χ, a pole body on the metal bump __ the electrode is opposite to the metal bump - Side ^ and 4 first one pole moon bean cut 1J the stone eve groove array into a multi I have at least - groove; the domain eve number of dream base, and each - Jane base with a protective glue to use the stone The phase grooves of the table n are filled in to provide a flat fluorescent layer on the protective adhesive. Including 2: · The light-emitting diode package process of claim i, and mounting the crucible base on a heat-conducting plate. Including: 3: According to the light-emitting diode packaging process of claim 2, a collecting cup is disposed on the heat conducting plate to cover the crucible base. • For example, in the method of applying for the second paragraph of the patent scope, the rprm force of the brush board is 八 远 ¥ ¥ 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热For example, the method of claim 3, wherein the shell is p C plastic or acrylic. Μ 4. First cup material 6' The method of claim 1, wherein the step of forming a phosphor layer using the printing method 200845417 is carried out in a yellow light chamber. 7. If the method of claim 6 is applied, a solution of a phosphor powder is applied by a doctor blade. 〆糸 8. If you apply for the method of item 7 of the patent scope, 1 " smcone 〇〇 : is made. ^ Proportional adjustment 9 · The square of the patent application scope is made by wet etching a wafer: "矽 groove array groove angle is (5) 40 degrees. Concave W degree is 100 mm side, concave 10. If applying for a patent The range of the third item is 50 - 200 μm, and 盥j is the thickness of the phosphor layer. /, Haimao-the distance between the polar bodies is 100 micro-light-emitting diode package manufacturing methods, including, providing one a susceptor base having at least one recess; a light-emitting diode mounted in the recess; a surface; a protective adhesive that fills the recess to provide a flattening surface on the protective adhesive Forming a light layer. 12: The method of claim 11, comprising: mounting the crucible base on a heat conducting plate. 2. The method of claim 12, further comprising: placing the V hot plate A concentrating cup, spoon 舜 14 · as claimed in the scope of the patent item 12 k = earth seat. Printed circuit board _, copper plate or factory two of the heat-conducting plate is strictly chelating material. 200845417 15 · as in Please refer to the method of item 13 of the patent, which is made of PC plastic or acrylic. , w first cup of 16. The method of forming the fluoranium in the way of applying the patent scope range u is carried out in the yellow light room: "using a printing method, using a U t: a method of using a 16-year-old brother" The printing step is carried out by coating a phosphor powder solution with a doctor blade. 18·If the scope of application for patents is 17# ^ ^ The liquid is for the purpose of Shi Xishu. (The basis is called the blending of the light and the color of the camp. The color is firstly powdered with HX): the ratio of U is 19. For example, if the scope of the patent application is the same as that of the wet (four)-cut, the second: = the angle of the middle seat is 15 degrees. The concave degree is · 3G〇 mm, and the groove degree is J? In the method of claim 11, the nun camping layer is one micron thick and the distance from the light emitting diode is 100 micrometers. 1. A method for fabricating a light-emitting diode package, comprising the steps of: providing a dream base having at least one groove; mounting a light-emitting diode in the groove; using the protective glue to the groove Fill in to provide - flatten the top sheet _, and: set the fluorescent sheet with the pre-tank temperature wheat number on the protective gel. Using the method of No. 21 of the ancient patent application range, the fluorescent film is formed by the shank method, and the color temperature parameter is screened after curing. The method of claim 21, wherein the glory film is made of YAG page color phosphor. The method of claim 21, wherein the protective adhesive is a multi-layered resin layer, and each layer of the resin layer has a different refractive index to achieve an index matching effect.