CN103855268B - LED illuminating device manufacture method - Google Patents
LED illuminating device manufacture method Download PDFInfo
- Publication number
- CN103855268B CN103855268B CN201210502018.2A CN201210502018A CN103855268B CN 103855268 B CN103855268 B CN 103855268B CN 201210502018 A CN201210502018 A CN 201210502018A CN 103855268 B CN103855268 B CN 103855268B
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- China
- Prior art keywords
- optical element
- groove
- emitting diode
- light emitting
- adhesive tape
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000002390 adhesive tape Substances 0.000 claims abstract description 34
- 108010010803 Gelatin Proteins 0.000 claims description 2
- 229920000159 gelatin Polymers 0.000 claims description 2
- 239000008273 gelatin Substances 0.000 claims description 2
- 235000019322 gelatine Nutrition 0.000 claims description 2
- 235000011852 gelatine desserts Nutrition 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
Abstract
The manufacture method of a kind of LED illuminating device, including step: the first step, it is provided that one comprises reeded optical element；Second step, fills transparent adhesive tape material in the groove of optical element；3rd step, it is provided that there is the light source of light emitting diode；And the 4th step, the light emitting diode of light source is embedded in the groove of optical element, and discharge the air between light emitting diode and transparent adhesive tape material.The method can reduce the total reflection phenomenon occurred during light is incident to optical element by LED source to reduce light energy losses as far as possible, improves the light utilization ratio of LED illuminating device.
Description
Technical field
The present invention relates to the manufacture method of a kind of light-emitting device, particularly relate to a kind of luminescence with LED source
Device manufacture method.
Background technology
Compared to traditional luminous source, light emitting diode (Light Emitting Diode, LED) has lightweight, body
Long-pending little, pollute the advantages such as low, life-span length, it is as a kind of novel luminous source, is applied to each field more and more
In the middle of, such as street lamp, traffic lights, signal lights, shot-light and ornament lamp etc..
During existing light-emitting device makes, light emitting diode and light guide plate is generally used to build lumination of light emitting diode dress
Put.Described light guide plate includes light entrance face, and the light entrance face of described light emitting diode and light guide plate is relative and interval is arranged.This
Optical diode generally includes package substrates, the light-emitting diode chip for backlight unit being arranged in package substrates, and is arranged on package substrates
Going up and cover the packaging body of this light-emitting diode chip for backlight unit, the surface of the side away from described package substrates of this packaging body is for going out light
Face.The light sent at light-emitting diode chip for backlight unit transmitted through during packaging body directive light guide plate light entrance face, when light from
Packaging body exiting surface outgoing, to time in the air outside packaging body, is just transmitted to optically thinner medium from optically denser medium, therefore part
The light of the interface arriving packaging body exiting surface and air can produce total reflection phenomenon so that the light that light-emitting diode chip for backlight unit sends
Cannot completely outgoing and enter inside light guide plate, thus cause the loss of light energy.
Summary of the invention
In view of this, it is necessary to provide a kind of total reflection phenomenon that reduces to reduce the light-emitting diodes of light energy losses as far as possible
Pipe light-emitting device manufacture method.
The manufacture method of a kind of LED illuminating device, including step: the first step, it is provided that one comprises reeded
Optical element；Second step, fills transparent adhesive tape material in the groove of optical element；3rd step, it is provided that there is the light of light emitting diode
Source；And the 4th step, the light emitting diode of light source is embedded in the groove of optical element, and discharge light emitting diode and transparent adhesive tape
Air between material.
Compared with prior art, above-mentioned manufacture method is when light emitting diode is pressed in the groove of optical element, luminous
Diode can apply pressure to the transparent adhesive tape material in being filled in groove, thus will be located between light emitting diode and transparent adhesive tape material
Air is discharged, thus avoids leaving between light emitting diode and transparent adhesive tape material the air gap, and then reduces owing to leading the air gap
The a large amount of total reflection phenomenons caused, reach to improve light percent of pass, reach the effect of high light utilization rate.
With reference to the accompanying drawings, in conjunction with detailed description of the invention, the invention will be further described.
Accompanying drawing explanation
The first step schematic diagram of the LED illuminating device manufacture method that Fig. 1 provides for embodiment of the present invention.
The second step schematic diagram of the LED illuminating device manufacture method that Fig. 2 provides for embodiment of the present invention.
3rd step schematic diagram of the LED illuminating device manufacture method that Fig. 3 provides for embodiment of the present invention.
4th step signal of the LED illuminating device manufacture method that Fig. 4 and Fig. 5 provides for embodiment of the present invention
Figure.
The light emitting diode made by LED illuminating device manufacture method that Fig. 6 provides for embodiment of the present invention
Light-emitting device schematic diagram.
Main element symbol description
| Optical element | 10 |
| Groove | 11 |
| Incident side | 100 |
| Transparent adhesive tape material | 20 |
| Convex surface | 21 |
| Syringe | 30 |
| Light source | 40 |
| Light emitting diode | 41 |
| Circuit board | 42 |
| Breach | 43 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
The LED illuminating device manufacture method that the embodiment of the present invention provides comprises the following steps.
The first step, sees Fig. 1, it is provided that an optical element 10 including groove 11.
This optical element 10 can be diffuser plate, lens or light guide plate etc., and groove 11 quantity of this optical element 10 can be single
Individual or multiple.Seeing Fig. 1, in the present embodiment, this optical element 10 is the light guide plate including multiple groove 11, and the plurality of
Groove 11 is the multiple blind holes being formed in light guide plate incident side 100.
Second step, sees Fig. 2, fills transparent adhesive tape material 20 in the groove 11 of optical element 10.
Method for dispensing glue can be used at this, utilize the syringe 30 of point gum machine to inject transparent adhesive tape material 20 in groove 11.This reality
Execute in example, this step be transparent adhesive tape material 20 is filled up the groove 11 of optical element 10 and make transparent adhesive tape material 20 overflow groove 11 and
Overthe openings at groove 11 forms the convex surface 21 raised up.Preferably, the refractive index of described transparent adhesive tape material 20 is less than optics
The refractive index of element 10.
3rd step, sees Fig. 3, it is provided that have the light source 40 of light emitting diode 41.
The number of described light emitting diode 41 can be single or multiple.In the present embodiment, described light source 40 includes multiple
Light emitting diode 41 and a circuit board 42, the plurality of light emitting diode 41 is arranged on circuit board 42, and the plurality of
The optical diode 41 position one_to_one corresponding that position and multiple grooves 11 of optical element 10 are set on circuit board 42.
It is additionally provided with on this circuit board 42, corresponding to the position of optical element groove 11 and runs through along circuit board 42 thickness direction
The breach 43 of circuit board.In the present embodiment, the breach 43 of this circuit board 42 is arranged at the opposite sides of light emitting diode 41, and
The breach 43 of each light emitting diode 41 both sides all with optical element 10, to should the groove 11 of light emitting diode 41 relative
Should.
4th step, sees Fig. 4 and Fig. 5, is embedded by the light emitting diode 41 of light source 40 in the groove 11 of optical element 10, and
Discharge the air between light emitting diode 41 and transparent adhesive tape material 20.
In this step, can first by circuit board 42, carry light emitting diode 41 one facing to optical element 10, set
It is equipped with the side of groove 11, then makes the groove 11 of each light emitting diode 41 align optical components 10, then, circuit board 42 is pushed away
To optical element 10, pressing circuit board 42 and optical element 10 after the incident side of circuit board 42 contact optical element 10, thus
Prepare LED illuminating device as shown in Figure 6.
So, when light emitting diode 41 is pressed in the groove 11 of optical element 10, light emitting diode 41 can be to filling
Transparent adhesive tape material 20 in groove 11 applies pressure, thus will be located in the air edge between light emitting diode 41 and transparent adhesive tape material 20
Direction shown in Fig. 5 arrow, breach 43 via circuit board 42 are discharged, thus avoid between light emitting diode 41 and transparent adhesive tape material 20
Leave the air gap, and then reduce a large amount of total reflection phenomenons caused due to the air gap, reach to improve light percent of pass and light
The effect of utilization rate.When being pressed in the groove 11 of optical element 10 due to light emitting diode 41, originally fill up the saturating of groove 11
Gelatin material 20 also squeezed can press to the breach 43 of circuit board 42, so that partially transparent glue material 20 is discharged breach 43 or part
Being retained in breach 43, this has no effect on the normal work of LED illuminating device, does not repeats them here and in the drawings
The most no longer show.
It should be noted that after the 4th step, this transparent adhesive tape material 20 is the most curable after being placed a period of time, from
And light source 40 is combined with optical element 10.Certainly, for accelerating Making programme, after above-mentioned 4th step, this
Optical diode light-emitting device manufacture method can also include the step of one " solidification transparent adhesive tape material 20 ", thus utilizes the modes such as heating
Accelerate transparent adhesive tape material 20 to solidify.
It should be noted that in the second step of said method, transparent adhesive tape material 20 can not also fill up the recessed of optical element 10
Groove.The above-mentioned way that transparent adhesive tape material 20 fills up groove 11 can be at the sky discharged between light emitting diode 41 and transparent adhesive tape material 20
Discharge bubble that may be present in transparent adhesive tape material 20 while gas gap in the lump, reduce to the full extent and lead because of the existence of air
The a large amount of total reflection phenomenons caused.But, when facing special actual production demand, transparent adhesive tape material 20 can not also fill up optical element
The groove of 10, at this point it is possible to the volume of calculated in advance light emitting diode 41 and control the dispensing amount of point gum machine so that light-emitting diodes
After pipe 41 embeds groove 11, transparent adhesive tape material 20 can just fill up groove 11, so can discharge light emitting diode 41 with transparent
The air gap between glue material 20 is also saved transparent adhesive tape material 20 and is reduced cost, but, this way is discharging transparent adhesive tape material 20
The most slightly give a discount in the effect of bubble in inside, be therefore suitable for light utilization ratio is being required be not in extra high product manufacturing
Use.
Additionally, in the 3rd step, on circuit board 42, for providing the breach 43 of gas outlet channels can pass through cutting technique
Directly formed at board edge cut-out circuit board entity, have processor simply, advantage efficiently.Certainly, should
The design of breach 43 only provides a technical example that can implement, when facing other particular process sequence or design requirement
Time, this breach 43 can also be used with other structures and substitutes, as long as the function providing gas outlet channels can be played.Such as, should
Breach 43 can use through hole to replace, for breach 43, although the technique processing through hole on circuit boards is relatively processed and lacked
Mouth 43 is complicated, but the circuit board entity structure that processing through hole is removed is less such that it is able to be that circuit board 42 retains the most just
Property, make the LED illuminating device produced have preferable robustness.
It is understood that for the person of ordinary skill of the art, can conceive according to the technology of the present invention and do
Go out other various corresponding changes and deformation, and all these change all should belong to the protection model of the claims in the present invention with deformation
Enclose.
Claims (7)
1. a LED illuminating device manufacture method, comprises the following steps:
The first step, it is provided that one comprises reeded optical element；
Second step, fills transparent adhesive tape material in the groove of optical element；
3rd step, it is provided that have the light source of light emitting diode, described light source includes that circuit board, described light emitting diode are arranged on electricity
On the plate of road and light emitting diode on circuit boards to arrange position corresponding with the groove location of optical element, described circuit board
Position upper, corresponding to optical element groove is additionally provided with runs through circuit board to keep communicating with the external world along circuit board thickness direction
Breach or through hole；And
4th step, embeds the light emitting diode of light source in the groove of optical element, and discharges light emitting diode and transparent adhesive tape material
Between air.
2. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that the described first step provides
Optical element has multiple groove, and the light source that described 3rd step provides has multiple light emitting diode, described optical element recessed
Groove and the light emitting diode one_to_one corresponding of light source, described 4th step is that each light emitting diode of light source is embedded optical element
A corresponding groove in.
3. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that the described first step provides
Optical element is diffuser plate, lens or light guide plate.
4. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that described second step is with thoroughly
Gelatin material fills up the groove of optical element and makes transparent adhesive tape material overflow groove and formed at the overthe openings of groove and raise up
Convex surface.
5. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that fill in described second step
The groove of the unfilled optical element of transparent adhesive tape material, light emitting diode is embedded by described 4th step in the groove of optical element
After, this transparent adhesive tape material fills up the groove of optical element.
6. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that the breach of described circuit board
Or through hole is arranged at the opposite sides of light emitting diode.
7. LED illuminating device manufacture method as claimed in claim 1, it is characterised in that after described 4th step also
Step including solidification transparent adhesive tape material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210502018.2A CN103855268B (en) | 2012-11-30 | LED illuminating device manufacture method | |
| TW101147396A TW201421749A (en) | 2012-11-30 | 2012-12-14 | Light-emitting diode light-emitting device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210502018.2A CN103855268B (en) | 2012-11-30 | LED illuminating device manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855268A CN103855268A (en) | 2014-06-11 |
| CN103855268B true CN103855268B (en) | 2016-11-30 |
Family
ID=
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200707790A (en) * | 2005-08-09 | 2007-02-16 | Lustrous Technology Ltd | Sealed LED package structure |
| TW200845417A (en) * | 2007-05-11 | 2008-11-16 | Billion Bright Optoelectronics Corp | Method for manufacturing light emitting diode package |
| TW200947764A (en) * | 2009-02-06 | 2009-11-16 | Jin-Han Chen | Lens packaging method of LED chips |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200707790A (en) * | 2005-08-09 | 2007-02-16 | Lustrous Technology Ltd | Sealed LED package structure |
| TW200845417A (en) * | 2007-05-11 | 2008-11-16 | Billion Bright Optoelectronics Corp | Method for manufacturing light emitting diode package |
| TW200947764A (en) * | 2009-02-06 | 2009-11-16 | Jin-Han Chen | Lens packaging method of LED chips |
| CN102569563A (en) * | 2012-01-20 | 2012-07-11 | 吕思远 | Wafer level packaging method of light emitting diode with adjustable lens focus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160711 Address after: 528437 Guangdong province Zhongshan Torch Development Zone, Cheung Hing Road 6 No. 222 north wing trade building room Applicant after: Yun Chuan intellectual property Services Co., Ltd of Zhongshan city Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: Zhanjing Technology (Shenzhen) Co., Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20171130 |